330 0042

TiWi5 MODULE
DATASHEET
Integrated Transceiver Modules for WLAN 802.11 a/b/g/n,
Bluetooth, Bluetooth Low Energy (BLE), and ANT
FEATURES
DESCRIPTION
IEEE 802.11 a,b,g,n,d,e,I compliant
 Typical WLAN Transmit Power:

o
18.3 dBm, 11 Mbps, CCK (b)
o
14.4 dBm, 54 Mbps, OFDM (g)
o
12.5 dBm, 65 Mbps, OFDM (n)
The TiWi5 module is a high performance 2.4 /5.5 GHz
IEEE 802.11 a/b/g/n, Bluetooth 2.1+EDR, and Bluetooth
Low Energy (BLE) 4.0 radio in a cost effective, precertified footprint.
Typical WLAN Sensitivity:
o
-88 dBm, 8% PER,11 Mbps
o
-74 dBm, 10% PER, 54 Mbps
o
-72 dBm, 10% PER, 65 Mbps

Bluetooth 2.1+EDR, Power Class 1.5

Full support for BLE 4.0 and ANT

Miniature footprint: 18 mm x 13 mm

Low height profile: 1.9 mm

Terminal for PCB/Chip antenna feeds

Worldwide acceptance: FCC (USA), IC (Canada),
and CE (Europe)
The module realizes the necessary PHY/MAC layers to
support WLAN applications in conjunction with a host
processor over a SDIO interface.

Modular certification allows reuse of LSR FCC ID
and ETSI certification without repeating the
expensive testing on your end product

Compact design based on Texas Instruments
WL1273L Transceiver

Seamless integration with TI OMAP™ application
processors

SDIO Host data path interfaces

Bluetooth Advanced Audio Interfaces

Low power operation modes

RoHS compliant

Streamlined development with LSR Design
Services
The module also provides a Bluetooth platform through
the UART or btSPI HCI transport layer. Both WLAN and
Bluetooth share the same antenna port.
TiWi5 is pin for pin compatible with the TiWi-R2 and
TiWi-BLE modules. TiWi5 does not include the on
module U.FL connector.
Need to get to market quickly? Not an expert in 802.11
or Bluetooth? Need a custom antenna? Would you like
to own the design? Would you like a custom design?
Not quite sure what you need? Do you need help with
your host board? LSR Design Services will be happy to
develop custom hardware or software, integrate the
design, or license the design so you can manufacture
yourself. Contact us at [email protected] or call us at 262375-4400.
APPLICATIONS

Security

HVAC Control, Smart Energy

Sensor Networks

Medical
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 1 of 59
TiWi5 MODULE
DATASHEET
ORDERING INFORMATION
Order Number
Description
450-0053
TiWi5 Module (Tray, SPQ = 100)
450-0053R
TiWi5 Module (Tape and Reel, SPQ = 1000)
Table 1 Orderable TiWi5 Part Numbers
MODULE ACCESSORIES
Order Number
Description
001-0009
2.4/5.5 GHz Dual-Band Dipole Antenna with
Reverse Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
Table 2 Module Accessories
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 2 of 59
TiWi5 MODULE
DATASHEET
BLOCK DIAGRAM
Figure 1 TiWi5 Module Block Diagram – Top-Level
The information in this document is subject to change without notice.
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Copyright © 2011-2016 LSR
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TiWi5 MODULE
DATASHEET
TABLE OF CONTENTS
FEATURES ................................................................................................................................... 1
APPLICATIONS ............................................................................................................................ 1
DESCRIPTION .............................................................................................................................. 1
ORDERING INFORMATION .......................................................................................................... 2
MODULE ACCESSORIES................................................................................................................ 2
BLOCK DIAGRAM ........................................................................................................................ 3
PIN DESCRIPTIONS ...................................................................................................................... 8
BT_FUNC2 and BT_FUNC5 Pins ............................................................................................................................ 10
BT_FUNC4 Pin ...................................................................................................................................................... 10
WL_UART_DBG Pin .............................................................................................................................................. 10
WL_RS232_RX and WL_RS232_TX Pins ................................................................................................................ 10
INI FILE RADIO PARAMETERS..................................................................................................... 11
5 GHZ AP MODE ........................................................................................................................ 12
ELECTRICAL SPECIFICATIONS ..................................................................................................... 13
Absolute Maximum Ratings ................................................................................................................................. 13
Recommended Operating Conditions .................................................................................................................. 13
General Characteristics ........................................................................................................................................ 14
WLAN RF Characteristics ...................................................................................................................................... 17
Bluetooth RF Characteristics ................................................................................................................................ 20
Bluetooth Low Energy RF Characteristics ............................................................................................................. 21
WLAN POWER-UP SEQUENCE .................................................................................................... 22
WLAN POWER-DOWN SEQUENCE.............................................................................................. 24
BLUETOOTH POWER-UP SEQUENCE........................................................................................... 25
BLUETOOTH POWER-DOWN SEQUENCE .................................................................................... 26
ENABLE SCHEME ....................................................................................................................... 27
IRQ OPERATION ........................................................................................................................ 27
The information in this document is subject to change without notice.
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TiWi5 MODULE
DATASHEET
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ........................................................................ 28
BLUETOOTH HCI UART .............................................................................................................. 29
BLUETOOTH AUDIO CODEC INTERFACE...................................................................................... 31
Overview ............................................................................................................................................................. 31
PCM Hardware Interface ..................................................................................................................................... 31
Data Format......................................................................................................................................................... 31
Frame-Idle Period ................................................................................................................................................ 32
Clock-Edge Operation .......................................................................................................................................... 33
Two Channel PCM Bus Example ........................................................................................................................... 33
Audio Encoding .................................................................................................................................................... 34
Improved Algorithm for Lost Packets ................................................................................................................... 34
BLUETOOTH PCM CLOCK MISMATCH HANDLING ....................................................................... 35
BLUETOOTH INTER-IC SOUND (I2S) ............................................................................................ 36
UDI SUPPORT ............................................................................................................................ 37
ADVANCED AUDIO FEATURES ................................................................................................... 38
Wideband (WB) Speech ....................................................................................................................................... 38
Assisted A2DP ...................................................................................................................................................... 39
SDIO INTERFACE TIMING ........................................................................................................... 40
SDIO CLOCK TIMING .................................................................................................................. 41
SOLDERING RECOMMENDATIONS ............................................................................................. 42
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 42
CLEANING ................................................................................................................................. 43
OPTICAL INSPECTION ................................................................................................................ 43
REWORK ................................................................................................................................... 43
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 43
Shipping ............................................................................................................................................................... 43
Handling .............................................................................................................................................................. 43
Moisture Sensitivity Level (MSL) .......................................................................................................................... 43
Storage ................................................................................................................................................................ 43
The information in this document is subject to change without notice.
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TiWi5 MODULE
DATASHEET
Repeating Reflow Soldering ................................................................................................................................. 44
AGENCY CERTIFICATIONS .......................................................................................................... 45
AGENCY STATEMENTS ............................................................................................................... 45
Federal Communication Commission Interference Statement ............................................................................. 45
Industry Canada Statements ................................................................................................................................ 47
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 49
OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 49
OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 51
EUROPE .................................................................................................................................... 52
CE Notice ............................................................................................................................................................. 52
Declaration of Conformity (DOC) ......................................................................................................................... 52
MECHANICAL DATA................................................................................................................... 53
PCB FOOTPRINT ........................................................................................................................ 54
TAPE AND REEL SPECIFICATION ................................................................................................. 55
DEVICE MARKINGS .................................................................................................................... 56
Rev 1 Devices ....................................................................................................................................................... 56
Rev 2 Devices ....................................................................................................................................................... 56
Rev 3 Devices ....................................................................................................................................................... 57
CONTACTING LSR ...................................................................................................................... 58
The information in this document is subject to change without notice.
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TiWi5 MODULE
DATASHEET
TIWI5 MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the TiWi5 module, it is important to use the module pins in your application as they are designated in
below and in the corresponding pin definition table found on pages 8 and 9. Not all the pins on the TiWi5
module may be used, as some are reserved for future functionality.
Figure 2 TiWi5 Pinout (Top View)
The information in this document is subject to change without notice.
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TiWi5 MODULE
DATASHEET
PIN DESCRIPTIONS
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
1
VBAT
PI
-
-
2
BT_FUNC5
DO
4 mA
1.8 VDC HOST_WU (*)
3
WL_UART_DBG
DIO
4 mA
1.8 VDC WL_UART_DBG
4
WLAN_IRQ
DO
4 mA
1.8 VDC WLAN Interrupt Request
5
BT_EN
DI
-
1.8 VDC Bluetooth Enable
6
FM_EN
DI
-
1.8 VDC NOT SUPPORTED, CONNECT TO GND
7
WL_RS232_RX
DI
-
1.8 VDC WLAN TEST UART RX (*)
8
WL_RS232_TX
DO
4 mA
1.8 VDC WLAN TEST UART TX (*)
9
FM_I2S_FSYNC
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
10
WL_EN
DI
-
11
VIO
PI
-
-
POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN
12
GND
GND
-
-
Ground
13
SDIO_D3
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
14
SDIO_D2
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
15
SDIO_D1
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
16
SDIO_D0
DIO
8 mA
1.8 VDC SDIO INTERFACE, HOST PULL UP
17
SDIO_CMD
DIO
8 mA
1.8 VDC HOST PULL UP
18
SDIO_CLK
DI
-
1.8 VDC HOST PULL UP
19
SLOW_CLK
DI
-
1.8 VDC SLEEP CLOCK (32 kHz)
20
FM_IRQ
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
21
FM_SDA
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
22
FM_SCL
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
23
FM_I2S_CLK
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
24
FM_I2S_DI
DI
4 mA
1.8 VDC NOT SUPPORTED, CONNECT TO GND
25
FM_I2S_DO
DO
4 mA
1.8 VDC NOT SUPPORTED, NO CONNECT
26
FM_AUD_RIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
27
FM_AUD_LIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
28
FMRFOUT
AO
-
-
NOT SUPPORTED, NO CONNECT
29
FMRFIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
30
GND
GND
-
-
Ground
Description
Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)
1.8 VDC WLAN Enable
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 8 of 59
TiWi5 MODULE
DATASHEET
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
31
FM_AUD_ROUT
AO
-
-
NOT SUPPORTED, NO CONNECT
32
FM_AUD_LOUT
AO
-
-
NOT SUPPORTED, NO CONNECT
33
AUD_FSYNC
DIO
4 mA
1.8 VDC PCM I/F
34
HCI_RX
DI
8 mA
1.8 VDC Bluetooth HCI UART RX (*)
35
HCI_RTS
DO
4 mA
1.8 VDC Bluetooth HCI UART RTS (*)
36
HCI_TX
DIO
8 mA
1.8 VDC Bluetooth HCI UART TX
37
AUD_CLK
DO
4 mA
1.8 VDC PCM I/F (*)
38
AUD_OUT
DO
4 mA
1.8 VDC PCM I/F (*)
39
HCI_CTS
DI
4 mA
1.8 VDC Bluetooth HCI UART CTS (*)
40
AUD_IN
DI
4 mA
1.8 VDC PCM I/F (*)
41
BT_FUNC2
DI
4 mA
1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*)
42
BT_FUNC4
DO
4 mA
1.8 VDC BT_UARTD (DEBUG) (*)
43
VDD_LDO_CLASS_1P5
NC
-
-
VBAT VOLTAGE PRESENT, NO CONNECT
44
GND
GND
-
-
Ground
45
GND
GND
-
-
Ground
46
GND
GND
-
-
Ground
47
GND
GND
-
-
Ground
48
ANT
RF
-
Antenna terminal for WLAN and Bluetooth (note [1])
49
GND
GND
-
-
Ground
50
GND
GND
-
-
Ground
51
GND
GND
-
-
Ground
52
GND
GND
-
-
Ground
PI = Power Input
AI = Analog Input
PO = Power Output
AO = Analog Output
Description
DI = Digital Input (1.8 VDC Logic Level)
DO = Digital Output (1.8 VDC Logic Level)
AIO = Analog Input/Output
RF = RF Port
GND = Ground
Note[1]: Antenna terminal presents DC short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.
Table 3 TiWi5 Module Pin Descriptions
All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V logic, then
level shifters MUST be used.
The information in this document is subject to change without notice.
330-0042-R2.8
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TiWi5 MODULE
DATASHEET
BT_FUNC2 and BT_FUNC5 Pins
When BT is awake and active, BT_WU (BT_FUNC2) is high (from host to module). This is an active high signal.
The host puts the BT section to sleep by de-asserting (logic low level) the BT_WU signal (input to the module).
The module then drives HOST_WU (BT_FUNC5) low to acknowledge to the host that it is has been put into sleep
mode.
Using these pins is optional.
BT_FUNC4 Pin
The BT_FUNC4 (BT_UARTD) pin is a debug pin. It is a 1.8V logic UART TX line. This pin should never need to be
used in normal operation. It may be useful to terminate this pin to a test point or header in case it is needed.
WL_UART_DBG Pin
The WL_UART_DBG pin is a debug pin. It is a 1.8V logic UART TX line. This pin should never need to be used in
normal operation. It may be useful to terminate this pin to a test point or header in case it is needed.
WL_RS232_RX and WL_RS232_TX Pins
This pins are used for a WLAN test mode interface. Both pins are 1.8V logic level UART pins. These pins should
be brought out to a header on the host PCB. The WLAN test interface can be used to place the module into
constant packet transmit and constant packet receive modes. These modes can be useful for antenna and
sensitivity testing.
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 10 of 59
TiWi5 MODULE
DATASHEET
INI FILE RADIO PARAMETERS
There is an ini file that contains WLAN radio parameters which are critical to both the RF performance and EMC
compliance of the module.
The ini file available on the LSR wiki is only intended to be used with the LSR WLAN Eval Tool. Note that this ini
file will not work when using the TiWi5 module in normal operation which typically involves an operating
system. To use the TiWi5 module in normal operation, refer to specifics contained in the TiWi Family INI File
Radio Parameter User Guide which is also available for download on the LSR website.
The settings specified in the appropriate ini file must be used to operate the module in compliance with the
modular certification for FCC or ETSI. There is a unique ini file for operating the module in compliance with FCC
regulations, and a different ini file for operating the module in compliance with the ETSI regulations.
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 11 of 59
TiWi5 MODULE
DATASHEET
5 GHZ AP MODE
The TiWi5 module was not certified as a DFS Master, and therefore the AP mode is not allowed in the 5 GHz
bands. The AP mode is allowed to be used in the 2.4 GHz band. Software cannot prevent the usage of the AP
mode in the 5 GHz band, so it is the module-integrators responsibility to ensure the 5 GHz AP mode is not used.
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 12 of 59
TiWi5 MODULE
DATASHEET
ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the TiWi5 control
software application. Other control conditions may require these values to be re-characterized by the customer.
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Power supply voltage (VBAT)(4)(5)
-0.5
+5.5
V
Digital supply voltage (VIO)
-0.5
2.1
V
Voltage on any GPIO
-0.5
VIO + 0.5
V
Voltage on any Analog Pins(3)
-0.5
2.1
V
+10
dBm
RF input power, antenna port
Operating temperature(6)
-40
+85
ºC
Storage temperature
-55
+125
ºC
1.
2.
3.
4.
5.
6.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not covered by
the warranty. These are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended
periods may affect device reliability.
All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V, VDD_LDO_CLASS1P5=3.6V
Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM, FMRFINM, FMAUDLIN,
FMAUDRIN, FMAUDLOUT, FMAUDROUT
The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is used).
Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC.
Table 4 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
VBAT
3.0
3.6
4.8
V
VIO
1.62
1.8
1.92
V
VIH
0.65 x VIO
-
VIO
V
VIL
0
-
0.35 x VIO
V
VOH @ 4, 8 mA
VIO - 0.45
-
VIO
V
VOL @ 4, 8 mA
0
-
0.45
V
-40
25
85
ºC
Ambient temperature range
Table 5 Recommended Operating Conditions
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 13 of 59
TiWi5 MODULE
DATASHEET
General Characteristics
Parameter
Min
Typ
Max
Unit
WLAN RF frequency range 1
2412
2472
MHz
WLAN RF frequency range 2
4910
5835
MHz
65
Mbps
2480
MHz
WLAN RF data rate
1
BT RF frequency Range
802.11 a/b/g/n
rates supported
2402
Table 6 General Characteristics
Power Consumption – WLAN 2.4 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
CCK (802.11b)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.3 dBm, 11 Mbps CCK
L=1200 bytes, tdelay
-
247
-
mA
OFDM (802.11g)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=14.4 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4
-
180
-
mA
OFDM (802.11n)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=12.5 dBm, 65 Mbps OFDM
L=1200 bytes, tdelay (idle)=4
-
166
-
mA
CCK (802.11b)
RX Current
-
93
-
mA
OFDM (802.11g)
RX Current
-
93
-
mA
OFDM (802.11n)
RX Current
-
93
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in
Listen Mode.
Table 7 2.4 GHz WLAN Power Consumption
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 14 of 59
TiWi5 MODULE
DATASHEET
Power Consumption – WLAN 5 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
OFDM 9 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=17.6 dBm, 9 Mbps OFDM
L=1200 bytes, tdelay
-
296
-
mA
OFDM 54 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=15.0 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay
-
235
-
mA
MCS0 6.5 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.0 dBm, MCS0 OFDM
L=1200 bytes, tdelay
-
298
-
mA
MCS7 65 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=13.2 dBm, MCS7 OFDM
L=1200 bytes, tdelay
-
219
-
mA
54/65 Mbps (802.11a/n) RX
Current
-
100
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in
Listen Mode.
Table 8 5 GHz WLAN Power Consumption
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 15 of 59
TiWi5 MODULE
DATASHEET
Power Consumption - Bluetooth
Parameter
Test Conditions
Min
Typ
Max
Unit
GFSK TX Current
Constant Transmit, 1DH5, PRBS9
-
45
-
mA
EDR TX Current
Constant Transmit, 2DH5,3DH5, PRBS9
-
43
-
mA
GFSK RX Current
Constant Receive, 1DH1
-
35
-
mA
EDR RX Current
Constant Receive, 2DH5, 3DH5
-
41
-
mA
Deep Sleep Current
Deep Sleep Mode
-
70
-
µA
Typ
Max
Unit
-
16
mA
Table 9 Bluetooth Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
VIO Current
Logic input low, VIL
0
-
0.35 x VIO
V
Logic input high, VIH
0.65 x VIO
-
VIO
V
Logic output low, VOL
(Full Drive)
Iout = 8 mA
0
-
0.45
V
Iout = 4 mA
0
-
0.45
V
Logic output low, VOL
(Reduced Drive)
Iout = 1 mA
0
-
0.112
V
Iout = 0.09 mA
0
-
0.01
V
Logic output high, VOH
(Full Drive)
Iout = -8 mA
VIO - 0.45
-
VIO
V
Iout = -4 mA
VIO - 0.45
-
VIO
V
Logic output high, VOH
(Reduced Drive)
Iout = -1 mA
VIO - 0.112
-
VIO
V
Iout = -0.3 mA
VIO - 0.033
-
VIO
V
Table 10 DC Characteristics General Purpose I/O
The information in this document is subject to change without notice.
330-0042-R2.8
Copyright © 2011-2016 LSR
Page 16 of 59
TiWi5 MODULE
DATASHEET
WLAN RF Characteristics
WLAN Transmitter Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V)
Test Conditions
Typ
EVM
Min
Typ
Max
Unit
11 Mbps CCK (802.11b) TX
Output Power
11 Mbps CCK , 802.11(b) Mask
Compliance, 35% EVM
RMS power over TX packet
1.1
-
18.3
-
dBm
9 Mbps OFDM (802.11g) TX
Output Power
9 Mbps OFDM , 802.11(g) Mask
Compliance, -8 dB EVM
RMS power over TX packet
-24
-
18.0
-
dBm
54 Mbps OFDM (802.11g) TX
Output Power
54 Mbps OFDM, 802.11(g) Mask
Compliance, -25 dB EVM
RMS power over TX packet
-34
-
14.4
-
dBm
-24
-
18.2
-
dBm
-35
-
12.5
-
dBm
End
Freq
Unit
Parameter
6.5 Mbps OFDM (802.11n) TX
Output Power
65 Mbps OFDM (802.11n) TX
Output Power
6.5 Mbps OFDM, 802.11(n) Mask
Compliance, -5 dB EVM
RMS power over TX packet
65 Mbps OFDM, 802.11(n) Mask
Compliance, -28 dB EVM
RMS power over TX packet
Table 11 WLAN 2.4 GHz Transmitter RF Characteristics
WLAN Transmitter Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V)
Parameter
9 Mbps
TX Output Power
54 Mbps
TX Output Power
MCS0 6.5 Mbps
TX Output Power
MCS7 65 Mbps
TX Output Power
Test Conditions
9 Mbps OFDM , 802.11(a) Mask
Compliance, -8 dB EVM RMS power
over TX packet
54 Mbps OFDM , 802.11(a) Mask
Compliance, -25 dB EVM RMS
power over TX packet
MCS0 OFDM , 802.11(a) Mask
Compliance, -5 dB EVM RMS power
over TX packet
MCS7 OFDM , 802.11(a) Mask
Compliance, -27 dB EVM RMS
power over TX packet
Typ
EVM
Start
Freq
-31
5170
-28
5260
-21
5745
17.8
5825
-31
5170
13.0
5240
-30
5260
-28
5745
15.2
5825
-31
5170
13.1
5240
-28
5260
-21
5745
18.2
5825
-31
5170
12.5
5240
-31
5260
-29
5745
Min
Typ
Max
13.0
-
-
-
-
15.6
14.6
15.7
12.8
13.5
5240
-
-
-
-
5700
5700
5700
5700
dBm
dBm
dBm
dBm
5825
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DATASHEET
Table 12 WLAN 5 GHz Transmitter RF Characteristics
WLAN Receiver Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-97
-
dBm
11 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-88
-
dBm
9 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-
-89
-
dBm
54 Mbps OFDM (802.11g) RX
Sensitivity
10% PER
-
-74
-
dBm
6.5 Mbps OFDM (802.11n) RX
Sensitivity
10% PER
-
-89
-
dBm
65 Mbps OFDM (802.11n) RX
Sensitivity
10% PER
-
-72
-
dBm
11 Mbps CCK (802.11b)
RX Overload Level
8% PER
-
-
-10
dBm
9 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-
-
-17
dBm
54 Mbps OFDM (802.11g) RX
Overload Level
10% PER
-
-
-17
dBm
65 Mbps OFDM (802.11n) RX
Overload Level
10% PER
-
-
-17
dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.
Table 13 2.4 GHz WLAN Receiver RF Characteristics
WLAN Receiver Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
9 Mbps (802.11a)
RX Sensitivity
10% PER
-
-87
-
dBm
54 Mbps (802.11a)
RX Sensitivity
10% PER
-
-72
-
dBm
MCS0 6.5 Mbps (802.11a)
RX Sensitivity
10% PER
-
-88
-
dBm
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DATASHEET
MCS7 65 Mbps (802.11a)
RX Sensitivity
10% PER
-
-70
-
dBm
Max Input Level (3)
OFDM (11a or 11n)
<10% PER
-
-
-17
dBm
Table 14 5 GHz WLAN Receiver RF Characteristics
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DATASHEET
Bluetooth RF Characteristics
Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Parameter
Min
Typ
Max
Bluetooth Spec
Unit
GFSK RF Output Power
-
9.5
-
-
dBm
EDR RF Output Power
-
7.3
-
Power Control Step Size
2
5
8
2-8
dB
EDR Relative Power
-2
1
-4/+1
dB
dBm
Table 15 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK Sensitivity
BER=0.1%
-
-91
-
-70
dBm
EDR 2 Mbps Sensitivity
BER=0.01%
-
-90
-
-70
dBm
EDR 3 Mbps Sensitivity
BER=0.01%
-
-83
-
-70
dBm
GFSK Maximum Input Level
BER=0.1%
-
-
-5
-20
dBm
EDR 2 Maximum Input Level
BER=0.1%
-
-
-10
-
dBm
EDR 3 Maximum Input Level
BER=0.1%
-
-
-10
-
dBm
Parameter
Table 16 Bluetooth Receiver RF Characteristics
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DATASHEET
Bluetooth Low Energy RF Characteristics
Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK RF Output Power
-
10
-
-
dBm
Power Control Step Size
2
5
8
2-8
dB
(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS
command.
Table 17 Bluetooth Low Energy Transmitter RF Characteristics
Bluetooth BLE Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK Sensitivity
PER = 30.8%
-
-90
-
-70
dBm
GMSK Maximum Input Level
PER = 30.8%
-
-5
-
-20
dBm
Parameter
Table 18 Bluetooth Low Energy Receiver RF Characteristics
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TiWi5 MODULE
DATASHEET
WLAN POWER-UP SEQUENCE
The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.
Figure 3 TiWi5 Power-up Sequence Requirements
1.
No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’. Exceptions
are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with
no VDDS and DC2DC.
2.
VBAT, VIO, and SLOWCLK must be available before WL_EN.
3.
Twakeup = T1 + T2
The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms
The duration of T2 depends on:
– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
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– Firmware initialization
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WLAN POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 TiWi5 Module Power-down Sequence Requirements
1.
DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will
stay high.
2.
CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the
FREF (e.g BT) it will stay high.
3.
If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64 sec before it is reasserted.
The information in this document is subject to change without notice.
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DATASHEET
BLUETOOTH POWER-UP SEQUENCE
The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled; the WLAN
core is disabled.
Notes:
1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown
2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power-up Sequence
Power up requirements:
1.
No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions
are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with
no VDDS and DC2DC.
2.
VDDS and SLOWCLK must be stable before releasing BT_EN.
3.
Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
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DATASHEET
BLUETOOTH POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power-down Sequence
The TiWi5 module indicates completion of Bluetooth power-up sequence by asserting HCI_RTS low. This occurs up
to 100 ms after BT_EN goes high.
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ENABLE SCHEME
The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active
operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM
section. It is also recommended that the FM section be disabled by Bluetooth HCI commands.
1.
Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to control each
core asynchronously and independently.
2.
Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of Bluetooth.
IRQ OPERATION
1.
The default state of the WLAN_IRQ prior to firmware initialization is 0.
2.
During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to
1.
3.
A WLAN firmware interrupt is handled as follows:
a.
The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the
WLAN_IRQ line (host must be configured as active-low or falling-edge detect).
b.
After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware
interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).
c.
The host reads the internal register status to determine the interrupt sources - the register is cleared after
the read.
d.
The host processes in sequence all the interrupts read from this register
e.
The host unmasks the firmware interrupts.
4. The host is ready to receive another interrupt from the WLAN device.
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TiWi5 MODULE
DATASHEET
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the
range of VIO only. For slow clock frequency and accuracy refer to Table 19. The external slow clock must be stable before
the system exits from shut down mode.
Parameter [1]
Condition
Symbol
Min
Input slow clock frequency
Input slow clock accuracy
Max
32768
WLAN, BT
Input transition time Tr/Tf – 10% to 90%
Tr/Tf
Frequency input duty cycle
Input voltage limits
Typ
30
Square wave,
DC coupled
50
Hz
+/-250
ppm
100
ns
70
%
VIH
0.65 x VIO
VIO
VIL
0
0.35 x VIO
Input impedance
Unit
1
Vpeak
MΩ
Input capacitance
5
pF
Rise and fall time
100
ns
-125
dBc/Hz
Phase noise
1 kHz
[1] Slow clock is a fail safe input
Table 19 Slow Clock Source Requirements
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TiWi5 MODULE
DATASHEET
BLUETOOTH HCI UART
Figure 7 Bluetooth UART Timing
Table 20 Bluetooth UART Timing
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Figure 8 Bluetooth UART Data Frame
Table 21 Bluetooth UART Data Frame
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TiWi5 MODULE
DATASHEET
BLUETOOTH AUDIO CODEC INTERFACE
Overview
The CODEC interface is a fully dedicated programmable serial port that provides the logic to interface to several kinds of
PCM or I2S codecs. The interface supports:
 Two voice channels
 Master / slave modes
 Coding schemes: μ-Law, A-Law, Linear, Transparent
 Long & short frames
 Different data sizes, order and positions
 UDI profile
 High rate PCM interface for EDR
 Enlarged interface options to support a wider variety of Codecs
 PCM bus sharing
PCM Hardware Interface
The PCM interface is one implementation of the codec interface. It contains the following four lines:
 Clock--configurable direction (input or output)
 Frame Sync--configurable direction (input or output)
 Data In--Input
 Data Out--Output/Hi-Z
The WL1273L device can be either the master of the interface where it generates the clock and the framesync signals, or
slave where it receives these two signals. The PCM interface is fully configured by means of a VS command.
For slave mode, clock input frequencies of up to 16MHz are supported. At clock rates above 12MHz, the maximum data
burst size is 32 bits.
For master mode, the WL1273L can generate any clock frequency between 64kHz and 4.096MHz.
Data Format
The data format is fully configurable:
 The data length can be from 8 to 320 bits, in 1-bit increments, when working with two channels, or up to 640 bits
when using 1 channel. The data length can be set independently for each channel.
 The data position within a frame is also configurable with 1-clock (bit) resolution, and can be set independently
(relative to the edge of the Frame Sync signal) for each channel.
 The Data_In and Data_Out bit order can be configured independently. For example; Data_In can start with MSB
while Data_Out starts with LSB. Each channel is separately configurable. The inverse bit order (i.e. LSB first) is
supported only for sample sizes up to 24 bits.
 The data in and data out size do not necessarily have to be the same length.
 The Data_Out line is configured as a ‘high-Z’ output between data words. Data_Out can also be set for permanent
high-Z, irrespective of data out. This allows the WL1273L to be a bus slave in a multi-slave PCM environment. At
power up, Data_Out is configured as high-Z.
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DATASHEET
Frame-Idle Period
The CODEC interface has the capability for frame-idle periods, where the PCM clock can “take a break” and become ‘0’ at
the end of the PCM frame, after all data has been transferred.
The WL1273L supports frame-idle periods both as master and slave of the PCM bus.
When WL1273L is the master of the interface, the frame-idle period is configurable. There are 2 configurable parameters:
 Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame till the beginning of the
idle period. After Clk_Idle_Start clock cycles, the clock becomes ‘0’.
 Clk_Idle_End – Indicates the time from the beginning of the frame till the end of the idle period. This time is given
in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
e.g. For PCM clock rate = 1MHz, frame sync period = 10kHz, Clk_Idle_Start = 60, Clk_Idle_End = 90.
Between each two-frame sync there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after
the beginning of the frame and lasts 90-60=30 clock cycles. This means that the idle period ends 100-90=10 clock cycles
before the end of the frame. The data transmission must end prior to the beginning of the idle period.
Figure 9 Frame Idle Period
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Clock-Edge Operation
The CODEC interface of the WL1273L can work on the rising or the falling edge of the clock. It also has the ability to sample
the frame sync and the data at inversed polarity.
The following diagram shows the operation of a falling-edge-clock type of codec. The codec is the master of the PCM bus.
The frame-sync signal is updated (by the codec) on the falling clock edge and therefore is sampled (by the WL1273L) on the
next rising clock. The data from the codec is sampled (by the WL1273L) on the clock falling edge.
Figure 10 Negative Clock Edge PCM Operation
Two Channel PCM Bus Example
In the following figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary
positions in the bus’ frame. (FT stands for Frame Timer)
Figure 11 2 Channels PCM Bus Timing
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Audio Encoding
The WL1273L CODEC interface can use one of four audio coding patterns:
 A-Law (8-bit)
 μ-Law (8-bit)
 Linear (8 or 16-bit)
 Transparent
Improved Algorithm for Lost Packets
The WL1273L features an improved algorithm for improving voice quality when received voice data packets go missing.
There are two options:
 Repeat the last sample – possible only for sample sizes up to 24 bits. For sample sizes >24 bits, the last byte is
repeated.
 Repeat a configurable sample of 8-24 bits (depends on the real sample size), in order to simulate silence (or
anything else) in the PCM bus. The configured sample is written in a specific register for each channel.
The choice between those two options is configurable separately for each channel.
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BLUETOOTH PCM CLOCK MISMATCH HANDLING
In BT RX, the WL1273L receives RF voice packets and writes these to the CODEC I/F. If the WL1273L receives data faster
than the CODEC I/F output allows, an overflow occurs. In this case, the WL1273L BT function has 2 possible behavior
modes: ‘allow overflow’ and ‘don’t allow overflow’.


If overflow is allowed, the WL1273L BT function continues receiving data and overwrites any data not yet sent to
the CODEC.
If overflow is not allowed, RF voice packets received when buffer is full, are discarded
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BLUETOOTH INTER-IC SOUND (I2S)
The WL1273L can be configured as an Inter-IC Sound (I2S) serial interface to an I2S CODEC device. In this mode, the
WL1273L audio CODEC interface is configured as a bi-directional, full duplex interface, with two time slots per frame: Time
slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable
up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length.
The information in this document is subject to change without notice.
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DATASHEET
UDI SUPPORT
The UDI profile defines the protocols and procedures that are used by devices implementing UDI for the 3G mobile phone
systems, such as devices with Bluetooth connections to a 3G Handset, communicating via video phone over a 3G network.
Up to 2 channels of UDI data can be supported. The data is transferred via the CODEC interface using transparent mode,
and is sent out using eSCO EV4 Bluetooth packets (EV5 is also selectable).
The information in this document is subject to change without notice.
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ADVANCED AUDIO FEATURES
The WL1273L supports an embedded SBC encoder/decoder (codec) and sample rate converter to achieve enhanced
audio/voice options. BLE and ANT are not supported when advanced audio features are active.
Wideband (WB) Speech
Normal (e)SCO voice links are 8ksamples/s. Proposed enhancements to Bluetooth profiles HFP, HSP, CTP, and ICP profiles
and the TCS-Binary protocol, require the capability of 16ksamples/s voice and SBC encoding/decoding, necessary for WB
speech.
The WL1273L Audio Processor can perform as an SBC codec to support wide-band speech with no additional Bluetooth
voice-processing requirements from the Host.
Figure 12 WL1273L WB Speech Support
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Assisted A2DP
A2DP profile requires the following:
 SBC encoding
 44.1kHz or 48kHz audio sampling rate
 L2CAP encapsulation for up to 512kbps ACL link
If done in the host, this will put a significant load on host processing power.
The WL1273L can accept a standard I2S audio stream at any of the standard rates and perform all above requirements
internally to achieve full A2DP, thus offloading host.
Figure 13 WL1273L Assisted A2DP
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SDIO INTERFACE TIMING
Table 22 SDIO Interface Read (see Figure 14)
Figure 14 SDIO Single Block Read
Table 23 SDIO Interface Write (see Figure 15)
Figure 15 SDIO Single Block Write
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SDIO CLOCK TIMING
Table 24 SDIO Timing
Figure 16 SDIO Timing
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board
should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic
Assemblies, section 8.2.4 Castellated Terminations.”
Figure 17 Reflow Profile
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CLEANING
SHIPPING, HANDLING, AND STORAGE
In general, cleaning the populated modules is
strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning
process.
Shipping



Bulk orders of the TiWi5 modules are delivered in
trays of 100 or reels of 1,000.
Cleaning with water can lead to capillary effects
where water is absorbed into the gap between
the host board and the module. The
combination of soldering flux residuals and
encapsulated water could lead to short circuits
between neighboring pads. Water could also
damage any stickers or labels.
Handling
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux residuals
into the RF shield, which is not accessible for
post-washing inspection. The solvent could also
damage any stickers or labels.
Moisture Sensitivity Level (MSL)
Ultrasonic cleaning could damage the module
permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the following:

Proper alignment and centering of the module
over the pads.

Proper solder joints on all pads.

Excessive solder or contacts to neighboring
pads, or vias.
The TiWi5 modules contain a highly sensitive
electronic circuitry. Handling without proper ESD
protection may destroy or damage the module
permanently.
Per J-STD-020, devices rated as MSL 4 and not
stored in a sealed bag with desiccant pack should be
baked prior to use.
Devices are packaged in a Moisture Barrier Bag with
a desiccant pack and Humidity Indicator Card (HIC).
Devices that will be subjected to reflow should
reference the HIC and J-STD-033 to determine if
baking is required.
If baking is required, refer to J-STD-033 for bake
procedure.
Storage
REWORK
Per J-STD-033, the shelf life of devices in a Moisture
Barrier Bag is 12 months at <40ºC and <90% room
humidity (RH).
The module can be unsoldered from the host board
if the Moisture Sensitivity Level (MSL) requirements
are met as described in this datasheet.
Do not store in salty air or in an environment with a
high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
Never attempt a rework on the module
itself,
e.g.
replacing
individual
components. Such actions will terminate
warranty coverage.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice.
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AGENCY CERTIFICATIONS
FCC ID: TFB-TIWI501, 15.247
IC ID: 5969A-TIWI501, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, EN 301 489, and EN 301 893
SAR: This wireless mobile and/or portable device has been shown to be compliant for localized specific
absorption rate (SAR) for uncontrolled environment/general exposure limits specified in ANSI/IEEE Std. C95.11999 and had been tested in accordance with the measurement procedures specified in IEEE 1528-2003, OET
Bulletin 65 Supp. C, RSS-102 and Safety Code 6.
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
UNII devices operating within 5.15-5.25 GHz are to be restricted to indoor operations to reduce any potential for
harmful interference to co-channel MSS operations.
FCC 15.407(c) states: The device shall automatically discontinue transmission in case of either absence of
information to transmit or operational failure. These provisions are not intended to preclude transmission of
control or signaling information or the use of repetitive codes used by certain digital technologies to complete
frame or burst intervals. Applicants shall include in their application for equipment authorization a description
of how this requirement is met.
Description to meet FCC 15.407(c):
Data transmission is always initiated by software, which is then passed down through the MAC, through the
digital and analog baseband, and finally to the RF transceiver. Several special packets (ACKs, CTS, PSPoll, etc) are
The information in this document is subject to change without notice.
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initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter,
which it then turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets are being transmitted.
FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
The information in this document is subject to change without notice.
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Industry Canada Statements
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0
dBi (LSR Dipole) and 1.0 dBi (Johanson Chip). Antennas not included in this list or having a gain greater than 2.0
dBi and 1.0 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LSR 001-0009 dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA cable.
2) Johanson 2450AD46A5400E chip antenna.
UNII devices operating within 5.15-5.25 GHz are to be restricted to indoor operations to reduce any potential for
harmful interference to co-channel MSS operations.
IC RSS-210 A9.4 (4) states: The device shall automatically discontinue transmission in case of absence of
information to transmit, or operational failure. A description of how this is done shall accompany the
application for equipment certification. Note that this is not intended to prohibit transmission of control or
signaling information or the use of repetitive codes where required by the technology.
Description to meet IC RSS-210 A9.4(4):
Data transmission is always initiated by software, which is then passed down through the MAC, through the
digital and analog baseband, and finally to the RF transceiver. Several special packets (ACKs, CTS, PSPoll, etc) are
initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter,
which it then turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets are being transmitted.
The information in this document is subject to change without notice.
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L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences
et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais
fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une
communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
2,0 dBi (LSR dipôle) et 1,0 dBi (Chip Johanson). Antennes pas inclus danscette liste ou d'avoir un gain supérieur
à 2,0 dBi et 1,0 dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance d'antenne
requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilization avec l'émetteur
1) LSR 001-0009 antenne dipôle et LSR 080-0001 U. FL à Reverse SMA à polarité du câble.
2) Antenne Johanson puce 2450AD46A5400E.
Dispositifs UNII opérant dans 5.15-5.25 GHz doivent être limitées à des opérations à l'intérieur afin de réduire tout risque
d'interférences nuisibles à la co-canal exploitation du MSS.
IC RSS-210 A9.4 (4): le dispositif doit automatiquement cesser d'émettre en cas d'absence d'informations à
transmettre, ou l'échec opérationnel. Une description de la façon dont cela est fait doit accompagner la
demande d'homologation du matériel. Notez que ce n'est pas pour objet d'interdire la transmission de contrôle
ou de signalisation d'informations ou l'utilisation de codes répétitifs requis par la technologie.
Description de rencontrer IC RSS-210 A9.4 (4):
La transmission de données est toujours initiée par le logiciel, qui est ensuite transmis à travers la MAC, à
travers la bande de base numérique et analogique et, enfin, à l'émetteur-récepteur RF. Plusieurs paquets
spéciaux (ACK, CTS, PSPoll, etc) sont initiées par le MAC. Ce sont les seuls moyens de la partie bande de base
numérique se met en marche l'émetteur RF, ce qui lui puis s'éteint à la fin du paquet. Par conséquent,
l'émetteur sera sur que lorsque l'un des paquets ci-dessus sont transmises.
The information in this document is subject to change without notice.
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The TiWi5 Module has been certified for integration into products only by OEM integrators under the following
conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co-located with any
other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or colocation with another transmitter), then the FCC and Industry Canada authorizations are no longer
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In
these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi5 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la
FCC et de l'Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil
numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines
configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada
l'autorisation.
OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi5 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification
numbers are not visible when the module is installed inside another device, as such the end device into which
The information in this document is subject to change without notice.
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the module is installed must display a label referring to the enclosed module. The final end product must be
labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-TIWI501”
“Contains Transmitter Module IC: 5969A-TIWI501”
or
“Contains FCC ID: TFB-TIWI501”
“Contains IC: 5969A-TIWI501”
The OEM of the TiWi5 Module must only use the approved antenna(s) listed above, which have been certified
with this module.
Le module de TiWi5 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC
et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil,
comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence
au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-TIWI501"
“Contient Module émetteur IC: 5969A-TIWI501"
ou
“Contient FCC ID: TFB-TIWI501"
“Contient IC: 5969A-TIWI501"
Les OEM du module TiWi5 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce
module.
The information in this document is subject to change without notice.
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OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not to provide information to the end user regarding how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co-located with any
other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en
vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité
avec FCC et Industrie Canada, multi-émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice.
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EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of Conformity
(DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Wiki.
The information in this document is subject to change without notice.
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MECHANICAL DATA
Figure 18 Module Mechanical Dimensions (Maximum Module Height = 1.9mm)
The information in this document is subject to change without notice.
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PCB FOOTPRINT
Figure 19 TiWi5 Recommended PCB Footprint (Top View)
The information in this document is subject to change without notice.
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TAPE AND REEL SPECIFICATION
(Module Must Be in this Orientation when Feeding Tape)
Figure 20 TiWi5 Tape and Reel Specification
The information in this document is subject to change without notice.
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DEVICE MARKINGS
Rev 1 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002

Pre-production devices.
LS RESEARCH
TiWi5 450-0053
2D
Bar
Code
1-XXXXXX
Where 1 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
Rev 2 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002




LSR logo changed from red to black.
Added FCC and IC numbers to the label.
Revision number is no longer part of the serial number.
Minor label format changes.
LS RESEARCH
XXXXXX
Model: TiWi5
P/N: 450-0053
FCC: TFB-TIWI501
IC: 5969A-TIWI501
REV 2
2D
Bar
Code
Where 2 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
The information in this document is subject to change without notice.
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Rev 3 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002

Incorporated PCB DFM improvements.
LS RESEARCH
XXXXXX
Model: TiWi5
P/N: 450-0053
FCC: TFB-TIWI501
IC: 5969A-TIWI501
REV 3
2D
Bar
Code
Where 3 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
The information in this document is subject to change without notice.
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CONTACTING LSR
Headquarters
LSR
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: (262) 375-4400
Fax: (262) 375-4248
Website
www.lsr.com
Sales Contact
[email protected]
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No
license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in
connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON
LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR
ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT
LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE
USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR
makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and
reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not
make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products
The information in this document is subject to change without notice.
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are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or
warranted for use as components in applications intended to support or sustain life.
The information in this document is subject to change without notice.
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