KTFRDM-MC12XSFUG, FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards - User's guide

KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB
and FRDM-40XSF5-EVB evaluation boards
Rev. 1 — 5 May 2016
1
FRDM-17XSF5-EVB
User guide
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
2
Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a
printed circuit board to make it easier to access inputs, outputs, and supply terminals.
This evaluation board may be used with any development system or other source of
I/O signals by simply connecting it to the host MCU or computer board via off-theshelf cables. This evaluation board is not a Reference Design and is not intended to
represent a final design recommendation for any particular application. Final device in
an application will be heavily dependent on proper printed circuit board layout and heat
sinking design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The goods provided may not be complete in terms of required design, marketing, and
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user's responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customers applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.
Should this evaluation kit not meet the specifications indicated in the kit, it may be
returned within 30 days from the date of delivery and will be replaced by a new kit.
NXP reserves the right to make changes without further notice to any products herein.
NXP makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does NXP assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters
can and do vary in different applications and actual performance may vary over time.
All operating parameters, including “Typical”, must be validated for each customer
application by customer’s technical experts.
NXP does not convey any license under its patent rights nor the rights of others. NXP
products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the NXP product could
create a situation where personal injury or death may occur.
Should the Buyer purchase or use NXP products for any such unintended or
unauthorized application, the Buyer shall indemnify and hold NXP and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges NXP was negligent regarding the design
or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective owners. © 2016 NXP B.V.
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
3
Getting started
3.1 Kit contents/packing list
The FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and
FRDM-40XSF5-EVB contents include:
•
•
•
•
•
Assembled and tested evaluation board/module in anti-static bag
Connector 1x2 for power supply
Connector 1x6 for loads
Quick start guide
Warranty card
3.2 Jump start
NXP’s analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal and power
solutions. They incorporate monolithic ICs and system-in-package devices that use
proven high-volume SMARTMOS technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost and improved performance in
powering state of the art systems.
1. Go to http://www.nxp.com/FRDM-MC12XSF.
2. Review your Tools Summary Page.
3. Locate and click:
4. Download the documents, software, and other information.
Once the files are downloaded, review the user guide in the bundle. The user guide
includes setup instructions, BOM and schematics. Jump start bundles are available on
each tool summary page with the most relevant and current information. The information
includes everything needed for design.
3.3 Required equipment
This kit requires the following items:
• Power supply 7.0 to 18 V
• Typical loads (DC motor, LED, bulb)
• One of the following MCU boards:
– FRDM-KL25Z
– FRDM-K64F
– FRDM-KV10Z
• SPIGen
• CodeWarrior 10.6 or higher, Kinetis Design Studio 3.0.0 or higher, Driver Suite 10.4 or
higher, Processor Expert version RT6 or higher
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
3.4 System requirements
The kit requires the following to function properly with the software:
• USB-enabled PC with Windows® XP or higher
4
Understanding the Freedom platform
The NXP Freedom development platform is a small, low-power, cost-effective evaluation
and development system for quick application prototyping and demonstration of Kinetis
MCU families.
Figure 1. Freedom platform – MCU Freedom board with analog Freedom shield
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
5
Getting to know the hardware
5.1 Board overview
The FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and
FRDM-40XSF5-EVB evaluation boards feature one of the ICs belonging to NXP’s 12XSF
high-side switch products family.
The board incorporates up to 5 outputs with freewheeling diode protection and LED
indication, external smart power switch control output, on-board voltage regulator and
level shifter (from 3.3 V to 5.0 V logic) and switch to enable operation of up to four boards
in parallel with separate chip-select pins (parallel SPI operation).
5.2 Device features
12XSF family of eXtreme switch products is the latest achievement in DC motors and
automotive/industrial lighting drivers. The products belong to an expanding family to
control and diagnose various types of loads, such as incandescent bulbs or light emitting
diodes (LEDs), with enhanced precision.
The products combine flexibility through daisy-chainable SPI at 5.0 MHz, extended digital
and analog feedbacks, which supports safety and robustness.
This fourth generation of NXP's high-side switch products family facilitates electronic
control unit designs supported by the use of compatible MCU software and PCB
footprints, for each device variant.
Common features of 12XSF family:
• Operating voltage range of 7.0 V to 18 V, with sleep current < 5.0 µA
• 5.0 MHz 16-bit SPI control of overcurrent profiles, channel control including 8-bit PWM
duty-cycles, output ON and OFF open load detections, thermal shutdown and prewarning and fault reporting
• Output current monitoring with programmable synchronization signal and supply
voltage feedback
• Programmable overcurrent trip levels
• Watchdog and limp home mode
• External smart power switch control (output 6)
• −16 V reverse polarity and ground disconnect protections
• Compatible PCB foot print and SPI software driver among the family
The 12XSF family products differ in number of available outputs and its RDS(on)
resistance. The ICs present on one of the Freedom evaluation boards are in Table 1.
Table 1. Device features
Product number
No. of
outputs
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
MC08XSF421
4+1
21 mΩ
21 mΩ
8 mΩ
8 mΩ
N.C
Yes
MC17XSF400
4+1
17 mΩ
17 mΩ
17 mΩ
17 mΩ
N.C
Yes
MC17XSF500
5+1
17 mΩ
17 mΩ
17 mΩ
17 mΩ
17 mΩ
Yes
MC40XSF500
5+1
40 mΩ
40 mΩ
40 mΩ
40 mΩ
40 mΩ
Yes
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
5.3 Board description
Figure 2 describes the main blocks of the evaluation board.
19
18
17
16
1
15
14
2
13
12
3
11
10
4
5
6
7
8
9
Figure 2. Freedom board overview (without load)
Table 2. Freedom board overview
Number
Description
1
SW2 CS pin selection
2
Connector J8 (Power supply)
3
Connector J1 (Power supply)
4
Connector J2 (OUT6)
5
5.0 V power supply LED
6
LIMP button
7
Connector J4
8
Connector J6
9
Output LEDs
10
Connector J7 (OUT2)
11
Connector J7 (OUT4)
12
Connector J7 (OUT5)
13
Connector J7 (OUT3)
14
Connector J7 (OUT1)
15
Connector J7 (GND)
16
MC17XSF500 IC
17
Connector J5
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Number
Description
18
Connector J3
19
SW1 Direct control inputs
5.3.1 LEDs
The following LEDs are provided as visual output devices for the board:
Table 3. LED description
LED identifier
Description
D7
5 V power supply present (voltage regulator output)
D8
Output 1
D9
Output 2
D10
Output 3
D11
Output 4
D12
Output 5
5.3.2 Connectors
Input/output connectors provide the following signals:
Table 4. Connectors description
Connector identifier
KTFRDM–MC12XSFUG
User guide
Description
J1
VBAT Power (and AGND) connector
J2
External smart power switch control output (and AGND)
connector
J3
2x10 Freedom board header
J4
2x8 Freedom board header
J5
2x8 Freedom board header
J6
2x6 Freedom board header
J7
Output 1 to 5 (and AGND) connector
J8
VBAT Power (and AGND) 5.5/2.1 mm socket
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KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
5.3.3 Switches definition
The following table defines the evaluation board switches and explains their functions:
Table 5. Switches definition
Switch
Description
SW1
Setting
Direct control inputs for
outputs 1 to 4
SW2
Chip-select pin selection
Connection
ON
Corresponding channel is on
when direct inputs are used
and no level on MCU pin is
set
OFF
Corresponding channel is off
when direct inputs are used
and no level on MCU pin is
set
1 ON, other OFF
CSB3 used as chip-select pin
2 ON, other OFF
CSB2 used as chip-select pin
3 ON, other OFF
CSB1 used as chip-select pin
4 ON, other OFF
CSB0 used as chip-select pin
5.3.4 Test point definition
The following test point provides access to various signals to and from the board:
Table 6. Test point definition
Test point
Signal name
TP1
AGND
Description
Common ground for both MCU and analog Freedom board
5.3.5 Freedom board headers
Table 7 contains information about compatibility with selected MCU Freedom boards:
Table 7. Compatibility with selected MCU Freedom boards
FRDM-12XSF-EVB
FRDM-KL25Z
Pin description
FRDM-K64F
FRDM-KV10Z
J3 1
RSTB_FRDM
eXtreme Switch reset
J2 1
PTC12
J2 1
PTE26
J2 1
J3 3
IN1
Direct control input 1
J2 3
PTC13
J2 3
X
J2 3
PTB1
J3 5
IN2
Direct control input 2
J2 5
PTC16
J2 5
X
J2 5
PTE19
J3 6
CSB0
Chip-select 0
J2 6
PTD0
J2 6
PTD0
J2 6
PTD6
J3 7
IN3
Direct control input 3
J2 7
PTC17
J2 7
X
J2 7
PTE17
J3 8
MOSI
SPI MOSI data
J2 8
PTD2
J2 8
PTD2
J2 8
PTC6
J3 9
IN4
Direct control input 4
J2 9
PTA16
J2 9
X
J2 9
PTE30
J3 10
MISO
SPI MISO data
J2 10
PTD3
J2 10
PTD3
J2 10
PTD3
J3 12
CLK
SPI clock
J2 12
PTD1
J2 12
PTD1
J2 12
PTC5
J3 13
CSB1
Chip-select 1
J2 13
PTE31
J2 13
X
J2 13
X
J3 18
CSB3
Chip-select 3
J2 18
PTE0
J2 18
X
J2 18
X
J3 19
CSB2
Chip-select 2
J2 19
PTD7
J2 19
X
J2 19
X
J5 5
CLK_FRDM
External clock for PWM
J1 5
PTC3
J1 5
PTC1
J1 5
PTE25
J5 6
CSNS_SYNC
Monitoring synchronization
J1 6
PTD4
J1 6
PTB9
J1 6
X
J6 6
CSNS
Monitoring output
J10 6
PTB2
J4 6
PTB10
J4 6
X
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FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
6
Installing the software and setting up the hardware
6.1 Using SPIGen software
6.1.1 Installing SPIGen freeware on your computer
The latest version of SPIGen is designed to run on Windows 8, Windows 7, Vista or XPbased operating systems.
To install the software, go to http://www.nxp.com/FRDM-MC12XSF. Locate and click
Jump Start Your Design.
1. Download the SPIGen software as well as the associated configuration file.
2. Run the install program from the desktop. The Installation Wizard conducts the rest of
the process.
3. To use SPIGen, go to the Windows Start menu, Programs, SPIGen, and then click
on the SPIGen icon. The SPIGen Graphic User Interface (GUI) appears.
4. Go to the file menu in the upper left hand corner of the GUI, and select Open. Browse
for the configuration file that was saved on the desktop earlier with the Jump start and
select it (“12XSF_SPIGEN_eval.spi”), then click Open.
5. The GUI shown in Figure 3 presents some basic SPI commands for quick evaluation
of 12XSF devices in addition with access to I/Os with Extra pins. The commands are
sent once (single command) or continuously in a loop (batch command).
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KTFRDM–MC12XSFUG
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FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Figure 3. SPIGen GUI
6.1.2 Connecting FRDM-KL25Z Freedom Development Platform
FRDM-17XSF5-EVB can be used with KL25Z Freedom board using SPIGEN software.
An USB cable from a USB host connected to KL25Z mini-B USB connector, SPIGEN (7.x
and above) and a power supply are needed to use the kit.
Installing the drivers
To flash the Freedom board using drag and drop from Windows Explorer, USB Drivers
and OpenSDA Firmware (MSD & Debug) from P&E Micro http://www.pemicro.com/
opensda must be loaded on the board.
1. Enter OpenSDA Bootloader Mode
Unplug the USB cable if attached. Press and hold the Reset button (SW1). Plug in
a USB cable between a USB host and the OpenSDA USB connector. Release the
Reset button. A removable drive is visible in the host file system with a volume label of
BOOTLOADER. You are now in OpenSDA Bootloader mode.
2. Load an OpenSDA Application
Locate the OpenSDA Applications folder from the downloaded zip file. Copy and
paste or drag and drop the MSD Flash Programmer Application (MSD-FRDMKTFRDM–MC12XSFUG
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KL25Z_vXYZ_Pemicro.SDA) to the BOOTLOADER drive (Make sure to unzip the file
before doing the paste or drop). Unplug the USB cable and plug it again into the SDA
USB Connector. The new OpenSDA Application is now running and a FRDM-KL25Z
drive visible in the host file system.
3. Enter OpenSDA Bootloader Mode
Locate SPIGEN UsbSpiDongleKL25Z_XXX.srec image folder in SPIGEN folder (C:
\Program Files (x86)\SPIGen\SPI Dongle Firmware). Copy and paste or drag and
drop the .srec files to the FRDM-KL25Z drive. Unplug the USB cable for the open
SDA USB Connector and plug it to the USB_KL25Z.
6.1.3 Setting up the hardware using SPIGen
To perform the examples included in the software bundle, the following connections and
setup must be performed:
1. Attach the +12 VDC supply to the VBAT input connector on the FRDM-17XSF5-EVB
on J8 or J1 (making sure to observe the GND and +12 V terminals). The current
capability of the +12 V supply should exceed the maximum total current that the
number of simultaneously ON loads require.
2. Attach loads to the output terminals (OUT1..5).
3. Turn on the +12 V supply. Verify all is working correctly by observing the +5.0 V LED
D7, which should be illuminated. .
4. Connect the KL25Z to the PC using the USB KL25Z port (left side of SW1). The
hardware connection is shown in Figure 4. A window pops up on the SPIGEN GUI as
shown in Figure 5.
Figure 4. Hardware setup
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KTFRDM–MC12XSFUG
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FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Figure 5. FRDM-KL25Z connected
6.1.4 Running the example batch files
1. Make sure that bundle 12XSF_SPIGEN_eval.spi is loaded on your SPIGEN interface.
2. Go to the Batch commands page and select the batch file you want to run. There are
some choices that allows to Turn ON some outputs, simply refresh the Watchdog and
read register, or root the IC’s temperature to the analog pin CSNS. Click on the Send
Continuously button.
3. Observe the desire effect on the outputs or on analog feedback pin CSNS. Note that
we can force Fail-safe mode during the SPI communication by pushing LIMP button
on board (SW3).
6.2 Using Kinetis Design Studio and Processor Expert
The Gen4eXtremeSwitch component for 12XSF and 12XS6 handles initialization, runtime configuration and diagnosis of the device via SPI, feedback measurement and direct
input control.
The component package contains various examples showing features of both the
component and the device. The component and some examples in the component
package are intended for Kinetis Design Studio 3.2.0. For more information about
Gen4eXtremeSwitch component, Processor Expert and installation of Kinetis
Design Studio, see Gen4eXtremeSwitch component user guide available at http://
www.nxp.com/GEN4-EXTREMESWITCH-PEXPERT.
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A
B
C
D
1
2
3
AGND
VBAT
SPI0_CSB2
SPI0_CSB1
RSTB_FRDM
IN1
IN2
IN3
IN4
CLK_FRDM
5
1
3
5
7
9
11
13
15
17
19
1
3
5
7
9
11
13
15
J5
2
4
6
8
10
12
14
16
NC1
NC2
6A
5A
4A
3A
2A
1A
2
4
6
8
10
12
14
16
18
20
CON_2X10
J3
GND
15
12
10
6
4
2
HEF4050BT
6Y
5Y
4Y
3Y
2Y
1Y
AGND
4
SPI0_CSB3
AGND
AGND
TP1
SPI0_CSB0
SPI0_MOSI_FRDM
SPI0_MISO_FRDM
SPI0_CLK_FRDM
CSNS_SYNCB
AGND
AGND
AGND
U3
CON_2X8
13
16
14
CLK_FRDM
9
11
RSTB_FRDM
SPI0_CLK_FRDM
5
SPI0_MOSI_FRDM
7
3
SPI0_CSB_FRDM
AGND
Level Shifter
DC_POWER_JACK
J8
C1
10uF
J7
CON_1X6
2
SPI0_MISO
AGND
GND
4
5
AGND
1
2
CON_1X2
J1
0.1UF
2
4
6
8
10
12
14
16
4
1
2
CON_2X8
J4
CON_2X6
2
4
6
8
10
12
CSNS
AGND
P3_3V
PLUG_1X2
J2
SPI0_MISO_FRDM
J6
AGND
P3_3V
FRDM
C15
AGND
OUT_6
1
3
5
7
9
11
13
15
1
3
5
7
9
11
74LVC1G125GW-Q100
VCC
AGND
0.1UF
C14
5V
D7
GREEN
R1
220
AGND
U4
VBAT
3
1
CLK
RSTB
SPI0_CLK
SPI0_MOSI
AGND
C2
10uF
SPI0_CSB
AGND
5V
A
C
U1
LP2950ACDT-5.0G
1
3
IN
OUT
D8
GREEN
R2
10.0K
AGND
OUT_1
C
R12
R13
R14
IN3
IN4
3
SPI0_CSB0
SPI0_CSB1
SPI0_CSB2
SPI0_CSB3
R7
IN2
4
1
SW3
5V
5
6
7
8
10.0K
10.0K
10.0K
10.0K
4
3
2
1
SW_DIP-4/SM
SW2
5V
2
SPI0_CSB_FRDM
15
16
27
28
29
30
31
2
3
32
4
5
1
NC1
NC2
IN1
IN2
IN3
IN4
LIMP
5V
VBAT
D4
1N4002
SO
C4
2
OUT6
OUT5_1
OUT5_2
OUT4_1
OUT4_2
OUT4_3
OUT3_1
OUT3_2
OUT3_3
OUT2_1
OUT2_2
OUT1_1
OUT1_2
CSNS
CSNS_SYNC
AGND
RST
CS
CLK
SCLK
SI
CP
U2
C12
0.1UF
0.1UF
2
8
17
18
12
13
14
19
20
21
10
11
22
23
25
26
7
OUT_6
R11
1K
AGND
0.022UF
C11
OUT_5
D11
GREEN
R5
10.0K
SPI0_MISO
AGND
AGND
AGND
OUT_4
0.1UF
10uF
C3
SOLDER SHORT
SH3
AGND
MC17XSF500BEK
C5
D10
GREEN
R4
10.0K
RSTB
SPI0_CSB
CLK
SPI0_CLK
SPI0_MOSI
AGND
AGND
OUT_3
LIGHT TOUCH PUSH BUTTON
3
D3
1N4002
SOLDER SHORT
SH2
AGND
SW1
SW_DIP-4/SM
LIMP
D9
GREEN
R3
10.0K
AGND
OUT_2
IN1
D2
1N4002
SOLDER SHORT
SH1
AGND
A
C
A
C
CMMR1U-02
3
C
A
D1
4
A
C
A
1
VDD
VSS
8
C
A
VBAT
1
2
3
4
5
6
OUT_2
OUT_4
OUT_5
OUT_3
OUT_1
A
C
A
C
5
8
7
6
5
1
2
3
4
33
VPWR
6
VCC
GND1
Rev. 1 — 5 May 2016
GND2
All information provided in this document is subject to legal disclaimers.
9
C
R9
AGND
0.022UF
C10
OUT_4
AGND
R8
3K
D5
1N4002
SOLDER SHORT
SH4
AGND
A
User guide
1
CP: ___
5V
IUO:
AGND
X
0.022UF
C7
OUT_1
Friday, March 04, 2016
1
Sheet
3
SCH-28522 PDF: SPF-28522
FRDM-17XSF5-EVB
Document Number
Date:
of
PUBI: ___
CSNS_SYNCB
R10
5.0K
CSNS
D6
1N4002
SOLDER SHORT
SH5
FRDM-17XSF5-EVB
Size
C
Page Title:
AGND
0.022UF
C8
C
AGND
OUT_2
0.01UF
C6
D12
GREEN
R6
10.0K
AGND
ICAP Classification:
Drawing Title:
AGND
0.022UF
C9
OUT_3
10.0K
AGND
OUT_5
A
C
KTFRDM–MC12XSFUG
A
3
Rev
F1
A
B
C
D
7
24
NXP Semiconductors
KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Schematics
7.1 FRDM-17XSF5-EVB
Figure 6. FRDM-17XSF5-EVB
© NXP B.V. 2016. All rights reserved
13 / 23
A
B
C
D
1
2
3
AGND
VBAT
SPI0_CSB2
SPI0_CSB1
RSTB_FRDM
IN1
IN2
IN3
IN4
CLK_FRDM
5
1
3
5
7
9
11
13
15
17
19
1
3
5
7
9
11
13
15
J5
2
4
6
8
10
12
14
16
NC1
NC2
6A
5A
4A
3A
2A
1A
2
4
6
8
10
12
14
16
18
20
CON_2X10
J3
GND
15
12
10
6
4
2
HEF4050BT
6Y
5Y
4Y
3Y
2Y
1Y
AGND
4
SPI0_CSB3
AGND
AGND
TP1
SPI0_CSB0
SPI0_MOSI_FRDM
SPI0_MISO_FRDM
SPI0_CLK_FRDM
CSNS_SYNCB
AGND
AGND
AGND
U3
CON_2X8
13
16
14
CLK_FRDM
9
11
RSTB_FRDM
SPI0_CLK_FRDM
5
SPI0_MOSI_FRDM
7
3
SPI0_CSB_FRDM
AGND
Level Shifter
DC_POWER_JACK
J8
C1
10uF
J7
CON_1X6
AGND
GND
4
5
AGND
1
2
CON_1X2
J1
0.1UF
2
4
6
8
10
12
14
16
4
1
2
CON_2X8
J4
CON_2X6
2
4
6
8
10
12
CSNS
AGND
P3_3V
PLUG_1X2
J2
SPI0_MISO_FRDM
J6
AGND
P3_3V
FRDM
C15
AGND
OUT_6
1
3
5
7
9
11
13
15
1
3
5
7
9
11
74LVC1G125GW-Q100
VCC
AGND
0.1UF
C14
5V
D7
GREEN
R1
220
AGND
U4
VBAT
3
2
SPI0_MISO
AGND
1
CLK
RSTB
SPI0_CLK
SPI0_MOSI
SPI0_CSB
AGND
C2
10uF
A
C
5V
D8
GREEN
R2
10.0K
AGND
OUT_1
C
R12
R13
R14
IN3
IN4
3
SPI0_CSB0
SPI0_CSB1
SPI0_CSB2
SPI0_CSB3
R7
IN2
4
1
SW3
5V
5
6
7
8
10.0K
10.0K
10.0K
10.0K
4
3
2
1
SW_DIP-4/SM
SW2
5V
2
SPI0_CSB_FRDM
15
16
27
28
29
30
31
2
3
32
4
5
1
NC1
NC2
IN1
IN2
IN3
IN4
LIMP
5V
VBAT
D4
1N4002
SO
C4
2
OUT6
NC3
NC4
OUT4_1
OUT4_2
OUT4_3
OUT3_1
OUT3_2
OUT3_3
OUT2_1
OUT2_2
OUT1_1
OUT1_2
CSNS
CSNS_SYNC
AGND
RST
CS
CLK
SCLK
SI
CP
U2
C12
0.1UF
0.1UF
2
8
17
18
12
13
14
19
20
21
10
11
22
23
25
26
7
OUT_6
R11
1K
AGND
0.022UF
DNP
C11
OUT_5
D11
GREEN
R5
10.0K
SPI0_MISO
AGND
AGND
AGND
OUT_4
0.1UF
10uF
C3
SOLDER SHORT
SH3
AGND
MC17XSF400EK
C5
D10
GREEN
R4
10.0K
RSTB
SPI0_CSB
CLK
SPI0_CLK
SPI0_MOSI
AGND
AGND
OUT_3
LIGHT TOUCH PUSH BUTTON
3
D3
1N4002
SOLDER SHORT
SH2
AGND
SW1
SW_DIP-4/SM
LIMP
D9
GREEN
R3
10.0K
AGND
OUT_2
IN1
D2
1N4002
SOLDER SHORT
SH1
AGND
A
U1
LP2950ACDT-5.0G
1
3
IN
OUT
A
C
C
C
A
CMMR1U-02
3
A
C
D1
4
C
A
A
1
VDD
VSS
8
A
C
VBAT
OUT_2 1
OUT_4 2
OUT_5 3
OUT_3 4
OUT_1 5
6
A
C
C
R9
AGND
0.022UF
C10
OUT_4
AGND
R8
3K
D5
1N4002
SOLDER SHORT
SH4
AGND
A
5
8
7
6
5
1
2
3
4
33
VPWR
6
VCC
GND1
Rev. 1 — 5 May 2016
GND2
All information provided in this document is subject to legal disclaimers.
9
1
CP: ___
5V
IUO:
AGND
X
0.022UF
C7
OUT_1
Friday, March 04, 2016
1
Sheet
3
SCH-29222 PDF: SPF-29222
FRDM-17XSF4-EVB
Document Number
Date:
of
PUBI: ___
CSNS_SYNCB
R10
5.0K
CSNS
D6
1N4002
DNP
SOLDER SHORT
SH5
FRDM-17XSF4-EVB
Size
C
Page Title:
AGND
0.022UF
C8
C
AGND
OUT_2
0.01UF
C6
D12
GREEN
DNP
R6
10.0K
DNP
AGND
ICAP Classification:
Drawing Title:
AGND
0.022UF
C9
OUT_3
10.0K
AGND
OUT_5
A
C
User guide
A
KTFRDM–MC12XSFUG
24
3
Rev
F1
A
B
C
D
NXP Semiconductors
KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
7.2 FRDM-17XSF4-EVB
Figure 7. FRDM-17XSF4-EVB
© NXP B.V. 2016. All rights reserved
14 / 23
A
B
C
D
1
2
3
AGND
VBAT
SPI0_CSB2
SPI0_CSB1
RSTB_FRDM
IN1
IN2
IN3
IN4
CLK_FRDM
5
1
3
5
7
9
11
13
15
17
19
1
3
5
7
9
11
13
15
J5
2
4
6
8
10
12
14
16
NC1
NC2
6A
5A
4A
3A
2A
1A
2
4
6
8
10
12
14
16
18
20
CON_2X10
J3
GND
15
12
10
6
4
2
HEF4050BT
6Y
5Y
4Y
3Y
2Y
1Y
AGND
4
SPI0_CSB3
AGND
AGND
TP1
SPI0_CSB0
SPI0_MOSI_FRDM
SPI0_MISO_FRDM
SPI0_CLK_FRDM
CSNS_SYNCB
AGND
AGND
AGND
U3
CON_2X8
13
16
14
CLK_FRDM
9
11
RSTB_FRDM
SPI0_CLK_FRDM
5
SPI0_MOSI_FRDM
7
3
SPI0_CSB_FRDM
AGND
Level Shifter
DC_POWER_JACK
J8
C1
10uF
J7
CON_1X6
AGND
GND
4
5
AGND
1
2
CON_1X2
J1
0.1UF
2
4
6
8
10
12
14
16
4
1
2
CON_2X8
J4
CON_2X6
2
4
6
8
10
12
CSNS
AGND
P3_3V
PLUG_1X2
J2
SPI0_MISO_FRDM
J6
AGND
P3_3V
FRDM
C15
AGND
OUT_6
1
3
5
7
9
11
13
15
1
3
5
7
9
11
74LVC1G125GW-Q100
VCC
AGND
0.1UF
C14
5V
D7
GREEN
R1
220
AGND
U4
VBAT
3
2
SPI0_MISO
AGND
1
CLK
RSTB
SPI0_CLK
SPI0_MOSI
SPI0_CSB
AGND
C2
10uF
A
C
5V
D8
GREEN
R2
10.0K
AGND
OUT_1
C
R12
R13
R14
IN3
IN4
SPI0_CSB0
SPI0_CSB1
SPI0_CSB2
SPI0_CSB3
R7
IN2
3
5
6
7
8
10.0K
10.0K
10.0K
10.0K
4
3
2
1
SW_DIP-4/SM
SW2
4
1
SW3
5V
5V
2
SPI0_CSB_FRDM
15
16
27
28
29
30
31
2
3
32
4
5
1
NC1
NC2
IN1
IN2
IN3
IN4
LIMP
5V
VBAT
D4
1N4002
SO
C4
2
OUT6
NC3
NC4
OUT4_1
OUT4_2
OUT4_3
OUT3_1
OUT3_2
OUT3_3
OUT2_1
OUT2_2
OUT1_1
OUT1_2
CSNS
CSNS_SYNC
AGND
RST
CS
CLK
SCLK
SI
CP
U2
C12
0.1UF
2
8
17
18
12
13
14
19
20
21
10
11
22
23
25
26
7
OUT_6
R11
1K
AGND
0.022UF
DNP
C11
OUT_5
D11
GREEN
R5
10.0K
SPI0_MISO
AGND
AGND
AGND
OUT_4
0.1UF
10uF
C3
SOLDER SHORT
SH3
AGND
0.1UF
MC08XSF421EK
C5
D10
GREEN
R4
10.0K
RSTB
SPI0_CSB
CLK
SPI0_CLK
SPI0_MOSI
AGND
AGND
OUT_3
LIGHT TOUCH PUSH BUTTON
3
D3
1N4002
SOLDER SHORT
SH2
AGND
SW1
SW_DIP-4/SM
LIMP
D9
GREEN
R3
10.0K
AGND
OUT_2
IN1
D2
1N4002
SOLDER SHORT
SH1
AGND
A
U1
LP2950ACDT-5.0G
1
3
IN
OUT
A
C
C
C
A
CMMR1U-02
3
A
C
D1
4
C
A
A
1
VDD
VSS
8
A
C
VBAT
OUT_2 1
OUT_4 2
OUT_5 3
OUT_3 4
OUT_1 5
6
A
C
C
R9
AGND
0.022UF
C10
OUT_4
AGND
R8
3K
D5
1N4002
SOLDER SHORT
SH4
AGND
A
5
8
7
6
5
1
2
3
4
33
VPWR
6
VCC
GND1
Rev. 1 — 5 May 2016
GND2
All information provided in this document is subject to legal disclaimers.
9
1
CP: ___
5V
IUO:
AGND
X
0.022UF
C7
OUT_1
Friday, March 04, 2016
1
Sheet
3
SCH-29224 PDF: SPF-29224
FRDM-08XSF4-EVB
Document Number
Date:
of
PUBI: ___
CSNS_SYNCB
R10
5.0K
CSNS
D6
1N4002
DNP
SOLDER SHORT
SH5
FRDM-08XSF4-EVB
Size
C
Page Title:
AGND
0.022UF
C8
C
AGND
OUT_2
0.01UF
C6
D12
GREEN
DNP
R6
10.0K
DNP
AGND
ICAP Classification:
Drawing Title:
AGND
0.022UF
C9
OUT_3
10.0K
AGND
OUT_5
A
C
User guide
A
KTFRDM–MC12XSFUG
24
3
Rev
F1
A
B
C
D
NXP Semiconductors
KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
7.3 FRDM-08XSF4-EVB
Figure 8. FRDM-08XSF4-EVB
© NXP B.V. 2016. All rights reserved
15 / 23
A
B
C
D
1
2
3
AGND
VBAT
SPI0_CSB2
SPI0_CSB1
RSTB_FRDM
IN1
IN2
IN3
IN4
CLK_FRDM
5
1
3
5
7
9
11
13
15
17
19
1
3
5
7
9
11
13
15
J5
14
CLK_FRDM
2
4
6
8
10
12
14
16
NC1
NC2
6A
5A
4A
3A
2A
1A
2
4
6
8
10
12
14
16
18
20
CON_2X10
J3
SPI0_MOSI
SPI0_CSB3
SPI0_CSB0
SPI0_MOSI_FRDM
SPI0_MISO_FRDM
SPI0_CLK_FRDM
J7
CON_1X6
CLK
SPI0_MISO
15
AGND
2
RSTB
12
AGND
GND
4
5
AGND
1
2
CON_1X2
J1
0.1UF
2
4
6
8
10
12
14
16
4
1
2
CON_2X8
J4
CON_2X6
2
4
6
8
10
12
CSNS
AGND
P3_3V
PLUG_1X2
J2
SPI0_MISO_FRDM
J6
AGND
P3_3V
FRDM
C15
AGND
OUT_6
1
3
5
7
9
11
13
15
1
3
5
7
9
11
74LVC1G125GW-Q100
VCC
AGND
0.1UF
C14
5V
D7
GREEN
R1
220
AGND
U4
VBAT
3
1
SPI0_CLK
10
6
SPI0_CSB
AGND
4
AGND
AGND
TP1
C2
10uF
2
HEF4050BT
6Y
5Y
4Y
3Y
2Y
1Y
AGND
CSNS_SYNCB
AGND
AGND
AGND
U3
CON_2X8
13
16
11
RSTB_FRDM
9
7
5
SPI0_MOSI_FRDM
SPI0_CLK_FRDM
3
SPI0_CSB_FRDM
AGND
Level Shifter
DC_POWER_JACK
J8
C1
10uF
GND
4
CMMR1U-02
A
C
5V
D8
GREEN
R2
10.0K
AGND
OUT_1
C
R12
R13
R14
IN2
IN3
IN4
3
SPI0_CSB0
SPI0_CSB1
SPI0_CSB2
SPI0_CSB3
R7
3
4
1
SW3
5V
5
6
7
8
10.0K
10.0K
10.0K
10.0K
4
3
2
1
SW_DIP-4/SM
SW2
5V
2
SPI0_CSB_FRDM
1
15
16
27
28
29
30
31
2
3
32
4
5
NC1
NC2
IN1
IN2
IN3
IN4
LIMP
5V
VBAT
D4
1N4002
SO
C4
2
OUT6
OUT5_1
OUT5_2
OUT4_1
OUT4_2
OUT4_3
OUT3_1
OUT3_2
OUT3_3
OUT2_1
OUT2_2
OUT1_1
OUT1_2
CSNS
CSNS_SYNC
AGND
RST
CS
CLK
SCLK
SI
CP
U2
C12
0.1UF
0.1UF
2
8
17
18
12
13
14
19
20
21
10
11
22
23
25
26
7
AGND
OUT_6
R11
1K
0.022UF
C11
OUT_5
D11
GREEN
R5
10.0K
SPI0_MISO
AGND
AGND
AGND
OUT_4
0.1UF
10uF
C3
SOLDER SHORT
SH3
AGND
MC40XSF500EK
C5
D10
GREEN
R4
10.0K
RSTB
SPI0_CSB
CLK
SPI0_CLK
SPI0_MOSI
AGND
AGND
OUT_3
LIGHT TOUCH PUSH BUTTON
3
D3
1N4002
SOLDER SHORT
SH2
AGND
SW1
SW_DIP-4/SM
LIMP
D9
GREEN
R3
10.0K
AGND
OUT_2
IN1
D2
1N4002
SOLDER SHORT
SH1
AGND
A
U1
LP2950ACDT-5.0G
1
3
IN
OUT
A
C
C
4
C
A
D1
8
A
C
A
1
VDD
VSS
C
A
VBAT
1
2
3
4
5
6
OUT_2
OUT_4
OUT_5
OUT_3
OUT_1
A
C
A
C
C
R9
AGND
0.022UF
C10
OUT_4
AGND
R8
3K
D5
1N4002
SOLDER SHORT
SH4
AGND
A
5
8
7
6
5
1
2
3
4
33
VPWR
6
VCC
GND1
Rev. 1 — 5 May 2016
GND2
All information provided in this document is subject to legal disclaimers.
9
1
CP: ___
5V
IUO:
AGND
X
0.022UF
C7
OUT_1
Friday, March 04, 2016
1
Sheet
3
SCH-29221 PDF: SPF-29221
FRDM-40XSF5-EVB
Document Number
Date:
of
PUBI: ___
CSNS_SYNCB
R10
5.0K
CSNS
D6
1N4002
SOLDER SHORT
SH5
FRDM-40XSF5-EVB
Size
C
Page Title:
AGND
0.022UF
C8
C
AGND
OUT_2
0.01UF
C6
D12
GREEN
R6
10.0K
AGND
ICAP Classification:
Drawing Title:
AGND
0.022UF
C9
OUT_3
10.0K
AGND
OUT_5
A
C
User guide
A
KTFRDM–MC12XSFUG
24
3
Rev
F1
A
B
C
D
NXP Semiconductors
KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
7.4 FRDM-40XSF5-EVB
Figure 9. FRDM-40XSF5-EVB
© NXP B.V. 2016. All rights reserved
16 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
8
Board layout
Figure 10. Top layout
KTFRDM–MC12XSFUG
User guide
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
© NXP B.V. 2016. All rights reserved
17 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Figure 11. Bottom layout
KTFRDM–MC12XSFUG
User guide
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
© NXP B.V. 2016. All rights reserved
18 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
9
Bill of Materials
Bill of materials for FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and
FRDM-40XSF5-EVB are available in the Download section of the FRDM-MC12XSF Tool
Summary page at the following url: http://www.nxp.com/FRDM-MC12XSF.
10 References
Following are URLs where you can obtain information on related NXP products and
application solutions:
NXP.com support pages
Description
URL
Freedom development boards
Freedom development platform
http://www.nxp.com/freedom
Freedom evaluation board
Freedom evaluation board for eXtreme
switch 12XSF family
http://www.nxp.com/FRDM-MC12XSF
FRDM-KL25Z
Freedom development platform for
Kinetis KL14, KL15, KL24, KL25 MCUs
http://www.nxp.com/FRDM-KL25Z
SPIGen
SPI generator software
http://www.nxp.com/SPIGEN
Kinetis Design Studio
Integrated development environment
with Processor Expert
http://www.nxp.com/KDS
11 Revision history
Revision
Date
1.0
5/2016
Description of changes
Initial release
12 Contact information
Visit http://www.nxp.com/support for a list of phone numbers within your region.
Visit http://www.nxp.com/warranty to submit a request for tool warranty.
KTFRDM–MC12XSFUG
User guide
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
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19 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
13 Legal information
13.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
provided in NXP data sheets and/ or specifications can and do vary in
different applications, and actual performance may vary over time. All
operating parameters, including “typicals,” must be validated for each
customer application by customer's technical experts. NXP does not
convey any license under its patent rights nor the rights of others. NXP sells
products pursuant to standard terms and conditions of sale, which can be
found at the following address: nxp.com/salestermsandconditions.
13.3 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
13.2 Disclaimers
Information in this document is provided solely to enable system and
software implementers to use NXP products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any
integrated circuits based on the information in this document. NXP reserves
the right to make changes without further notice to any products herein.
NXP makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does NXP assume
any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. “Typical” parameters that may be
KTFRDM–MC12XSFUG
User guide
NXP — is a trademark of NXP B.V.
the NXP logo — is a trademark of NXP B.V.
Freescale — is a trademark of NXP B.V.
the Freescale logo — is a trademark of NXP B.V.
CodeWarrior — is a trademark of NXP B.V.
Kinetis — is a trademark of NXP B.V.
Processor Expert — is a trademark of NXP B.V.
SMARTMOS — is a trademark of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
© NXP B.V. 2016. All rights reserved
20 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Device features ................................................. 5
Freedom board overview .................................. 6
LED description .................................................7
Connectors description ......................................7
KTFRDM–MC12XSFUG
User guide
Tab. 5.
Tab. 6.
Tab. 7.
Switches definition ............................................ 8
Test point definition ...........................................8
Compatibility with selected MCU Freedom
boards ............................................................... 8
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
© NXP B.V. 2016. All rights reserved
21 / 23
KTFRDM–MC12XSFUG
NXP Semiconductors
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Freedom platform – MCU Freedom board
with analog Freedom shield .............................. 4
Freedom board overview (without load) ............ 6
SPIGen GUI .................................................... 10
Hardware setup ...............................................11
FRDM-KL25Z connected .................................12
KTFRDM–MC12XSFUG
User guide
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
FRDM-17XSF5-EVB ........................................13
FRDM-17XSF4-EVB ........................................14
FRDM-08XSF4-EVB ........................................15
FRDM-40XSF5-EVB ........................................16
Top layout ....................................................... 17
Bottom layout .................................................. 18
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2016
© NXP B.V. 2016. All rights reserved
22 / 23
NXP Semiconductors
KTFRDM–MC12XSFUG
FRDM-17XSF5-EVB, FRDM-17XSF4-EVB, FRDM-08XSF4-EVB and FRDM-40XSF5-EVB evaluation boards
Contents
1
2
3
3.1
3.2
3.3
3.4
4
5
5.1
5.2
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
6
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.2
7
7.1
7.2
7.3
7.4
8
9
10
11
12
13
FRDM-17XSF5-EVB ............................................. 1
Important notice .................................................. 2
Getting started .................................................... 3
Kit contents/packing list ..................................... 3
Jump start ..........................................................3
Required equipment .......................................... 3
System requirements .........................................4
Understanding the Freedom platform ............... 4
Getting to know the hardware ........................... 5
Board overview ..................................................5
Device features ..................................................5
Board description ...............................................6
LEDs .................................................................. 7
Connectors .........................................................7
Switches definition ............................................. 8
Test point definition ........................................... 8
Freedom board headers .................................... 8
Installing the software and setting up the
hardware .............................................................. 9
Using SPIGen software ..................................... 9
Installing SPIGen freeware on your
computer ............................................................ 9
Connecting
FRDM-KL25Z
Freedom
Development Platform ..................................... 10
Setting up the hardware using SPIGen ............11
Running the example batch files ..................... 12
Using Kinetis Design Studio and Processor
Expert ...............................................................12
Schematics ........................................................ 13
FRDM-17XSF5-EVB ........................................ 13
FRDM-17XSF4-EVB ........................................ 14
FRDM-08XSF4-EVB ........................................ 15
FRDM-40XSF5-EVB ........................................ 16
Board layout ...................................................... 17
Bill of Materials ................................................. 19
References ......................................................... 19
Revision history ................................................ 19
Contact information .......................................... 19
Legal information .............................................. 20
© NXP B.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Released on 5 May 2016