FUJI K246

2SK2469-01MR
N-channel MOS-FET
FAP-II Series
300V
> Features
-
1Ω
5A
30W
> Outline Drawing
High Speed Switching
Low On-Resistance
No Secondary Breakdown
Low Driving Power
High Voltage
VGS = ± 30V Guarantee
Avalanche Proof
> Applications
-
Switching Regulators
UPS
DC-DC converters
General Purpose Power Amplifier
> Maximum Ratings and Characteristics
> Equivalent Circuit
- Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item
Drain-Source-Voltage
Drain-Gate-Voltage(RGS=20KΩ)
Continous Drain Current
Pulsed Drain Current
Gate-Source-Voltage
Max. Power Dissipation
Operating and Storage Temperature Range
Symbol
V DS
V DGR
ID
I D(puls)
V GS
PD
T ch
T stg
Rating
300
300
5
20
±30
30
150
-55 ~ +150
Unit
V
V
A
A
V
W
°C
°C
- Electrical Characteristics (TC=25°C), unless otherwise specified
Item
Drain-Source Breakdown-Voltage
Gate Threshhold Voltage
Zero Gate Voltage Drain Current
Symbol
V (BR)DSS
V GS(th)
I DSS
Gate Source Leakage Current
Drain Source On-State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On-Time ton (ton=td(on)+tr)
I
R
g
C
C
C
t
t
t
t
I
V
t
Q
Turn-Off-Time toff (ton=td(off)+tf)
Avalanche Capability
Diode Forward On-Voltage
Reverse Recovery Time
Reverse Recovery Charge
- Thermal Characteristics
Item
Thermal Resistance
GSS
DS(on)
fs
iss
oss
rss
d(on)
r
d(off)
f
AV
SD
rr
rr
Symbol
R th(ch-a)
R th(ch-c)
Test conditions
ID=1mA
VGS=0V
ID=1mA
VDS=VGS
VDS=300V
Tch=25°C
VGS=0V
Tch=125°C
VGS=±30V
VDS=0V
ID=2,5A
VGS=10V
ID=2,5A
VDS=25V
VDS=25V
VGS=0V
f=1MHz
VCC=150V
ID=5A
VGS=10V
RGS=10 Ω
L=100µH
Tch=25°C
IF=2xIDR VGS=0V Tch=25°C
IF=IDR VGS=0V
-dIF/dt=100A/µs Tch=25°C
Min.
300
3,5
Test conditions
channel to air
channel to case
Min.
1,5
Typ.
4,0
10
0,2
10
0,6
3
500
120
60
10
20
30
15
Max.
4,5
500
1,0
100
1,0
750
180
90
15
30
45
25
5
1,1
180
1,5
Typ.
1,7
Max.
62,5
4,17
Unit
V
V
µA
mA
nA
Ω
S
pF
pF
pF
ns
ns
ns
ns
A
V
ns
µC
Unit
°C/W
°C/W
2SK2469-01MR
N-channel MOS-FET
300V
1Ω
5A
FAP-II Series
30W
> Characteristics
Typical Output Characteristics
Drain-Source On-State Resistance
ID=f(VDS); 80µs pulse test; TC=25°C
ID [A]
↑
RDS(ON) [Ω]
1
VDS [V]
2
→
Tch [°C]
→
VGS [V]
→
Typical Transconductance
Gate Threshold Voltage
RDS(on)=f(ID); 80µs pulse test; TC=25°C
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
VGS(th)=f(Tch); ID=1mA; VDS=VGS
4
5
→
ID [A]
Typical Capacitances
VGS(th) [V]
↑
gfs [S]
↑
Tch [°C]
Typical Gate Charge Characteristics
IF=f(VSD); 80µs pulse test
↑
VDS [V]
↑
7
8
→
Qg [nC]
Power Dissipation
Safe Operation Area
VDS [V]
ID=f(VDS): D=0,01, Tc=25°C
↑
↑
9
VSD [V]
→
↑
Transient Thermal impedance
Zthch-c=f(t) parameter:D=t/T
12
PD[W]
ID [A]
10
↑
→
Zth(ch-c) [K/W]
PD=f(Tc)
→
Forward Characteristics of Reverse Diode
VGS=f(Qg); ID=5A
IF [A]
C=f(VDS); VGS=0V; f=1MHz
6
→
VGS [V]
ID [A]
↑
3
Typical Drain-Source On-State-Resistance
↑
RDS(ON) [Ω]
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C
↑
ID [A]
↑
C [pF]
Typical Transfer Characteristics
RDS(on) = f(Tch); ID=2,5A; VGS=10V
Tc [°C]
→
VDS [V]
→
t [s]
→
Collmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - www.collmer.com - 11/98