PHILIPS 74AHC245D

74AHC245; 74AHCT245
Octal bus transceiver; 3-state
Rev. 03 — 25 September 2007
Product data sheet
1. General description
The 74AHC/AHCT245 is a high-speed Si-gate CMOS device.
The 74AHC/AHCT245 is an octal transceiver featuring non-inverting 3-state bus
compatible outputs in both send and receive directions.
The 74AHC245/74AHCT245 features an Output Enable (OE) input for easy cascading
and a send/receive (DIR) input for direction control.
OE controls the outputs so that the buses are effectively isolated.
2. Features
■
■
■
■
■
■
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than VCC
For 74AHC245 only: operates with CMOS input levels
For 74AHCT245 only: operates with TTL input levels
ESD protection:
◆ HBM JESD22-A114E exceeds 2000 V
◆ MM JESD22-A115-A exceeds 200 V
◆ CDM JESD22-C101C exceeds 1000 V
■ Multiple package options
■ Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Ordering information
Table 1:
Ordering information
Type number
74AHC245D
Package
Temperature range
Name
Description
Version
−40 °C to +125 °C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
−40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
−40 °C to +125 °C
DHVQFN20
plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
SOT764-1
74AHCT245D
74AHC245PW
74AHCT245PW
74AHC245BQ
74AHCT245BQ
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
4. Functional diagram
1
DIR
OE
2
B0
3
19
1
14
2
18
3
17
4
16
5
15
6
14
7
13
8
12
A5
13
A6
B6
9
3EN1
3EN2
2
B5
8
G3
15
A4
B4
7
1
16
A3
B3
6
17
A2
B2
5
18
A1
B1
4
19
A0
12
A7
B7
11
9
Fig 1. Logic symbol
Fig 2. IEC logic symbol
74AHC_AHCT245_3
Product data sheet
11
mna175
mna174
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
2 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
5. Pinning information
1
terminal 1
index area
1
20 VCC
A0
2
19 OE
A1
3
18 B0
A2
4
17 B1
A0
2
19 OE
A1
3
18 B0
A3
5
17 B1
A4
6
16 B2
A5
7
4
A3
5
A4
6
A5
7
245
15 B3
A6
8
A7
9
15 B3
14 B4
GND(1)
13 B5
14 B4
A6
8
13 B5
A7
9
12 B6
GND 10
11 B7
12 B6
GND 10
A2
16 B2
245
B7 11
DIR
20 VCC
DIR
5.1 Pinning
001aac432
Transparent top view
001aac431
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 3. Pin configuration SO20, TSSOP20
Fig 4. Pin configuration DHVQFN20
5.2 Pin description
Table 2:
Pin description
Symbol
Pin
Description
DIR
1
direction control
A[0:7]
2, 3, 4, 5, 6, 7, 8, 9
data input/output
B[0:7]
18, 17, 16, 15, 14, 13, 12, 11
data input/output
GND
10
ground (0 V)
OE
19
output enable input (active LOW)
VCC
20
supply voltage
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
3 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
6. Functional description
Table 3:
Function table[1]
Input
Input/output
OE
DIR
An
Bn
L
L
A=B
input
L
H
input
B=A
H
X
Z
Z
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
7. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < −0.5 V
[1]
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
VO = −0.5 V to (VCC + 0.5 V)
Min
Max
Unit
−0.5
+7.0
V
−0.5
+7.0
V
−20
-
mA
-
±20
mA
-
±25
mA
ICC
supply current
-
75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
Tamb = −40 °C to +125 °C
SO20 package
[2]
-
500
mW
TSSOP20 package
[3]
-
500
mW
DHVQFN20 package
[4]
-
500
mW
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
Ptot derates linearly with 8 mW/K above 70 °C.
[3]
Ptot derates linearly with 5.5 mW/K above 60 °C.
[4]
Ptot derates linearly with 4.5 mW/K above 60 °C.
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
4 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74AHC245
Min
Typ
74AHCT245
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
5.5
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
0
-
5.5
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
−40
+25
+125
°C
∆t/∆V
input transition rise
and fall rate
VCC = 3.3 V ± 0.3 V
-
-
100
-
-
-
ns/V
VCC = 5.0 V ± 0.5 V
-
-
20
-
-
20
ns/V
9. Static characteristics
Table 6.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = −8.0 mA; VCC = 4.5 V
For type 74AHC245
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
3.94
-
-
3.8
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
IOZ
OFF-state
VI = VIH or VIL;
output current VO = VCC or GND;
VCC = 5.5 V
-
-
±0.25
-
±2.5
-
±10.0
µA
II
input leakage
current
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
VI = VCC or GND; VCC =
5.5 V
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
5 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
Table 6.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
CI
input
capacitance
-
3.0
10
-
10
-
10
pF
CO
output
capacitance
-
4.0
-
-
-
-
-
pF
For type 74AHCT245
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = −50 µA
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
±0.25
-
±2.5
-
±10.0
µA
IO = −8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
IOZ
OFF-state
per input pin; VI = VIH or VIL;
output current VCC = 5.5 V; IO = 0 A
VO = VCC or GND;
other pins at VCC or GND
II
input leakage
current
VI = VIH or VIL; VCC = 5.5 V
-
-
0.1
-
1.0
-
2.0
µA
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
∆ICC
additional
per input pin;
supply current VI = VCC − 2.1 V; IO = 0 A;
other pins at VCC or GND;
VCC = 4.5 V to 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
3
10
-
10
-
10
pF
CO
output
capacitance
-
4.0
-
-
-
-
-
pF
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
6 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
10. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V. For test circuit see Figure 7.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
CL = 15 pF
-
5.0
8.4
1.0
10.0
1.0
10.5
ns
CL = 50 pF
-
6.5
11.9
1.0
13.5
1.0
15.0
ns
-
3.5
5.5
1.0
6.5
1.0
7.0
ns
5.0
7.5
1.0
8.5
1.0
9.5
ns
For type 74AHC245
tpd
propagation
delay
nAn to nYn; see Figure 5
[2]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
ten
enable time
nOE to nYn; see Figure 6
[2]
VCC = 3.0 V to 3.6 V
CL = 15 pF
-
6.5
13.2
1.0
15.5
1.0
16.5
ns
CL = 50 pF
-
9.0
16.7
1.0
19.0
1.0
21.0
ns
-
4.0
8.5
1.0
10.0
1.0
11.0
ns
-
5.0
10.6
1.0
12.0
1.0
13.5
ns
CL = 15 pF
-
7.5
12.5
1.0
15.5
1.0
16.0
ns
CL = 50 pF
-
10.0
15.8
1.0
18.0
1.0
20.0
ns
CL = 15 pF
-
4.5
7.8
1.0
9.2
1.0
10.0
ns
CL = 50 pF
-
6.0
9.7
1.0
11.0
1.0
12.5
ns
-
12
-
-
-
-
-
pF
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
tdis
disable time
nOE to nYn; see Figure 6
[2]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CPD
power
CL = 50 pF; fi = 1 MHz;
dissipation
VI = GND to VCC
capacitance
[3]
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
7 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
Table 7.
Dynamic characteristics …continued
GND = 0 V. For test circuit see Figure 7.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
CL = 15 pF
-
3.5
7.7
1.0
8.5
1.0
10.0
ns
CL = 50 pF
-
4.5
8.7
1.0
9.5
1.0
11.0
ns
-
5.0
13.8
1.0
15.0
1.0
17.5
ns
-
6.0
14.8
1.0
16.0
1.0
18.5
ns
-
5.0
14.4
1.0
15.5
1.0
18.0
ns
-
6.0
15.4
1.0
16.5
1.0
19.5
ns
-
15
-
-
-
-
-
pF
For type 74AHCT245
tpd
ten
propagation
delay
enable time
nAn to nYn; see Figure 5
[2]
VCC = 4.5 V to 5.5 V
nOE to nYn; see Figure 6
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
tdis
disable time
nOE to nYn; see Figure 6
[2]
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
CPD
[3]
power
per buffer;
dissipation
CL = 50 pF; f = 1 MHz;
capacitance VI = GND to VCC
[1]
Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2]
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[3]
CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
11. Waveforms
VI
An, Bn input
VM
VM
GND
tPLH
tPHL
VOH
VM
Bn, An output
VOL
VM
mna176
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 5. Propagation delay input (An, Bn) to output (Bn, An)
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
8 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
VI
OE input
VM
GND
t PLZ
t PZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
t PHZ
t PZH
VOH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna367
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. enable and disable times
Table 8:
Measurement points
Type
Input
Output
VM
VM
VX
VY
74AHC245
0.5VCC
0.5VCC
VOL + 0.3 V
VOH − 0.3 V
74AHCT245
1.5 V
0.5VCC
VOL + 0.3 V
VOH − 0.3 V
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
9 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
PULSE
GENERATOR
VI
VO
RL
S1
open
DUT
RT
CL
001aad983
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistor
S1 = Test selection switch
Fig 7. Load circuitry for switching times
Table 9:
Test data
Type
Input
Load
S1 position
VI
tr, tf
CL
RL
tPHL, tPLH
tPZH, tPHZ
tPZL, tPLZ
74AHC245
VCC
3.0 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHCT245
3.0 V
3.0 ns
15 pF, 50 pF
1 kΩ
open
GND
VCC
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
10 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT163-1 (SO20)
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
11 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT360-1 (TSSOP20)
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
12 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT764-1
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
9
y
y1 C
v M C A B
w M C
b
L
1
10
Eh
e
20
11
19
12
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
mm
c
D (1)
Dh
E (1)
Eh
0.2
4.6
4.4
3.15
2.85
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
3.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT764-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 10. Package outline SOT764-1 (DHVQFN20)
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
13 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
13. Abbreviations
Table 10:
Abbreviations
Acronym
Description
CDM
Charge Device Model
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11:
Revision history
Document ID
Release date
Data sheet status
74AHC_AHCT245_3
20070925
Product data sheet
Modifications:
Change notice
Doc. number
Supersedes
-
74AHC_AHCT245_2
•
The format of this data sheet has been redesigned to comply with the
new identity guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name when
appropiate.
•
•
•
Section 3: DHVQFN20 package added.
Section 8: derating values added for DHVQFN20 package.
Section 12: outline drawing added for DHVQFN20 package.
74AHC_AHCT245_2
19990928
Product specification -
939775006297
74AHC_AHCT245_1
74AHC_AHCT245_1
19980921
Product specification -
939775004255
-
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
14 of 16
74AHC245; 74AHCT245
NXP Semiconductors
Octal bus transceiver; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
74AHC_AHCT245_3
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 03 — 25 September 2007
15 of 16
NXP Semiconductors
74AHC245; 74AHCT245
Octal bus transceiver; 3-state
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 September 2007
Document identifier: 74AHC_AHCT245_3