PHILIPS UAA3540TS

INTEGRATED CIRCUITS
DATA SHEET
UAA3540TS
DECT receiver
Product specification
File under Integrated Circuits, IC17
2000 Feb 15
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
FEATURES
GENERAL DESCRIPTION
• Single-chip RF plus IF
The UAA3540TS is a low-power, highly integrated circuit,
for Digital Enhanced Cordless Telecommunication (DECT)
applications.
• Integrated channel filter
• Low component count
It features a fully integrated channel selection filter, an
analog Received Signal Strength Indicator (RSSI) and a
switched demodulator output to interface to Philips
Semiconductors ABC baseband chip. The circuit can be
fully powered down during the idle locked state.
• No production trimming
• High dynamic range
• Low power
• 3.2 V operation
• Built-in power-down mode.
QUICK REFERENCE DATA
VCC = 3.2 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCC
supply voltage
3.0
3.2
3.6
V
ICC
supply current
−
34
45
mA
ICC(pd)
power-down mode supply current
−
10
50
µA
Tamb
ambient temperature
−10
−
+60
°C
over Tamb
ORDERING INFORMATION
TYPE
NUMBER
UAA3540TS
2000 Feb 15
PACKAGE
NAME
DESCRIPTION
VERSION
SSOP20
plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
2
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
BLOCK DIAGRAM
LOA
handbook, full pagewidth
LOB
17
18
MIXER
×
RFA
RFB
5
6
LIMITER
D
E
M
O
D
U
L
A
T
O
R
0°
90°
×
LIMITER
UAA3540TS
13
DATA+
11
DATA−
1 kΩ
MIXER
8
RSET
15
10
RSSI
SLCCTR
Fig.1 Block diagram.
2000 Feb 15
3
FCA040
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
PINNING
SYMBOL
PIN
DESCRIPTION
GND(LO)
1
local oscillator ground
PD
2
power-down control input (logic 1
disables the chip)
VCC(RF)
3
RF positive supply voltage
GND(RF)
4
RF ground
RFA
5
RF balanced input A
RFB
6
RF balanced input B
GND(IF)
7
IF ground
RSET
8
set filter (connect to external
resistor)
TEST1
9
GND(LO) 1
10
slicer threshold switch control input
(logic 1 closes the switch)
DATA−
11
switched demodulator output
TEST2
12
test 2 (connect to GND)
DATA+
13
demodulator digital signal output
TEST3
14
test 3 (connect to VCC)
RSSI
15
received signal strength intensity
voltage output
VCC(IF)
16
IF positive supply
LOA
17
local oscillator balanced input A
LOB
18
local oscillator balanced input B
VCC(LO)
19
local oscillator positive supply
TEST4
20
test 4 (connect to GND)
20 TEST4
PD 2
test 1 (connect to GND)
SLCCTR
2000 Feb 15
handbook, halfpage
19 VCC(LO)
VCC(RF) 3
18 LOB
GND(RF) 4
17 LOA
RFA 5
UAA3540TS
RFB 6
16 VCC(IF)
15 RSSI
GND(IF) 7
14 TEST3
RSET 8
13 DATA+
TEST1 9
12 TEST2
SLCCTR 10
11 DATA−
FCA039
Fig.2 Pin configuration.
4
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
FUNCTIONAL DESCRIPTION
Limiter and RSSI
General
The main purpose of the limiter circuit is to reduce the
dynamic range of the signals presented to the
demodulator; these have a dynamic range greater than
60 dB.
The UAA3540TS is a fully integrated RF plus IF strip and
demodulator for DECT applications. It provides all the
required channel filtering over the DECT band and
generates analog RSSI and a data output for the
baseband chip. Very few off-chip components are required
and should not require trimming in normal applications.
The chip is designed to operate from a power supply
voltage which can fall to 3.0 V, and features full
power-down capabilities.
The limiter also provides the RSSI output voltage.
The RSSI output has very little filtering applied, and it is
assumed that external circuits will be used to provide the
time constant and peak holding required by the DECT
specification.
Demodulator
The inputs are an RF antenna signal and a Local
Oscillator (LO) signal. The RF antenna signal is from a
band filter or antenna switch. The higher frequency
LO signal is from an external Voltage Controlled
Oscillator (VCO).
The demodulator produces an output voltage directly
proportional to the instantaneous frequency of the
received signal. The output stage of the demodulator
contains a data filter to remove high frequencies from the
signal, prior to data slicing.
The outputs are an RSSI voltage, representing the
instantaneous signal strength, and DATA− and DATA+
which are two high-level demodulator output signals.
DATA− is switched by SLCCTR to generate a threshold
voltage for the internal slicer, and DATA+ is the
comparator digital output.
The demodulator provides a continuous output timing
signal that is applied to an internal data slicer. The same
signal is also switched to generate the threshold voltage of
the slicer during the initial DECT bit sequence.
Power-down
Filter
The power-down control input (pin 2) allows the current
consumption of the chip to be reduced to a very low level
when it is connected to VCC. In this state, some voltages in
the chip become indeterminate requiring time for the
receiver to stabilize after power-up.
The integrated filter provides all the channel selectivity
required for the DECT receiver. An external resistor of
18 kΩ must be connected to RSET (pin 8).
2000 Feb 15
5
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC
supply voltage
−0.3
+3.6
V
Vi(PD);
Vi(SLCCTR)
input voltage on pins PD and SLCCTR
−0.3
+3.6
V
Pi(max)
maximum input power
−
15
dBm
Tj(max)
maximum operating junction temperature
−
150
°C
P(max)
maximum power dissipation in quiet air
−
180
mW
Tstg
storage temperature
−55
+125
°C
HANDLING
All pins withstand 1500 V ESD test in accordance with “EIA/JESD22-A114 Class1 (Feb. 96)”.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
152
K/W
in free air
DC CHARACTERISTICS
VCC = 3.2 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (Pins VCC(LO), VCC(RF) and VCC(IF))
VCC
supply voltage
ICC
ICC(pd)
Tamb ≥ 25 °C
3.0
3.2
3.6
V
supply current
−
34
45
mA
power-down mode supply current
−
10
50
µA
1.4
−
VCC
V
−0.3
−
+0.4
V
−5
−
+5
µA
Interface logic input signal levels (Pins PD and SLCCTR)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Ii(bias)
input bias current
2000 Feb 15
logic 1 or 0
6
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
AC CHARACTERISTICS
VCC = 3.2 V; Tamb = 25 °C; modulation deviation ∆f = 288 kHz; measured on Philips Semiconductors characterization
board at the RF balun input; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX.
UNIT
Pin RSSI
VRSSI
RSSI output voltage monotonic over range
−96 to −36 dBm
with −36 dBm at RF input
−
1.7
2
V
with −96 dBm at RF input
−
0.3
−
V
twake
period between power-up signal and valid
RSSI output (wake-up time)
no external capacitor on
the RSSI output
−
25
40
µs
SB.3
sensitivity of RF input
BER ≤ 10−3; note 1
−
−95
−93
dBm
SB.5
sensitivity of RF input
BER ≤ 10−5; note 1
−
−92
−76
dBm
IM3
intermodulation rejection
unwanted interferers level 33
in channels N + 2 and
N + 4 referred to wanted
at −83 dBm in channel 5
for BER < 10−3; note 1
40
−
dBc
Rco
co-channel rejection
co-channel interferer level −10
referred to wanted at
−76 dBm both in
channel 5 for BER < 10−3;
note 1
−8
−
dBc
Rj(N + 1)
adjacent channel rejection
adjacent channel
13
interferer level referred to
wanted at −76 dBm in
channel 5 for BER < 10−3;
note 1
19
−
dBc
Rj(N + 2)
bi-adjacent channel rejection
bi-adjacent channel
34
interferer level referred to
wanted at −76 dBm in
channel 5 for BER < 10−3;
note 1
40
−
dBc
Rj(N + ≥3)
≥3 channels rejection
40
N ≥ 3 adjacent channel
interferer level referred to
wanted at −76 dBm in
channel 5 for BER < 10−3;
note 1
44
−
dBc
Bl∆f > 6 MHz
rejection of a blocking signal in the range
lf − fcl > 6 MHz
unwanted CW level
37
referred to wanted at
−83 dBm in channel 5 for
BER < 10−3; note 1
55
−
dBc
Blnear1
rejection of a blocking signal in the ranges:
f(RF)(min) − 100 MHz < f < f(RF)(min) − 5 MHz;
f(RF)(max) + 5 MHz < f < f(RF)(max) + 100 MHz
52
58
−
dBc
Blnear2
rejection of a blocking signal in the ranges:
f(RF)(min) − 300 MHz < f < f(RF)(min) − 100 MHz;
f(RF)(max) + 100 MHz < f < f(RF)(max) + 300 MHz
52
58
−
dBc
Systems
2000 Feb 15
7
Philips Semiconductors
Product specification
DECT receiver
SYMBOL
UAA3540TS
PARAMETER
CONDITIONS
MIN.
TYP. MAX.
UNIT
Blfarlow
rejection of a blocking signal in the range:
25 MHz < f <f(RF)(min) − 300 MHz
unwanted CW level
referred to wanted at
−83 dBm in channel 5 for
BER < 10−3; note 1
37
58
−
dBc
Blfarhigh
rejection of a blocking signal in the range:
f(RF)(max) + 300 MHz < f < 4.32 GHz
unwanted CW level
referred to wanted at
−83 dBm in channel 5 for
BER < 10−3; note 1;
except 3 occurrences at
FG1, FG2 and FG3 as
defined in TBR6
47
58
−
dBc
BFG1
rejection of a blocking signal in occurrence
around: FG1 = 2835.648 MHz
unwanted CW level
referred to wanted at
−83 dBm in channel 5 for
BER < 10−3; note 1
37
45
−
dBc
BFG2
rejection of a blocking signal in occurrence
around: FG1 = 3150.144 MHz
37
49
−
dBc
BFG3
rejection of a blocking signal in occurrence
around: FG1 = 3779.136 MHz
20
30
−
dBc
−
70
−
Ω
pF
Receive section
Ri(RF)
RF input resistance (real part of the parallel
input impedance)
balanced; at 1890 MHz
Ci(RF)
RF input capacitance (imaginary part of the
parallel input impedance)
−
0.8
−
f(RF)(max)
maximum RF input frequency
−
−
1930 MHz
f(RF)(min)
minimum RF input frequency
1880 −
−
MHz
RLi(RF)(m)
return loss on matched RF input
balanced; note 1
11
15
−
dB
balanced; at 1890 MHz
−
140
−
Ω
−
0.3
−
pF
9
12
−
dB
−
−15
−
dBm
−
1.5
−
V/MHz
Local oscillator section
Ri(lo)
LO input resistance (real part of the parallel
input impedance)
Ci(lo)
LO input capacitance (imaginary part of the
parallel input impedance)
RLi(lo)
return loss on matched LO input
Pi(lo)
LO input power level
balanced; note 2
Demodulator section
Gdem
demodulator gain
Notes
1. Measured on the Philips Semiconductors characterisation board at the RF balun input.
2. Measured on the Philips Semiconductors characterisation board at the LO balun input.
2000 Feb 15
8
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
FCA090
2.4
handbook, full pagewidth
VRSSI
(V)
2.0
1.6
1.2
0.8
0.4
0
−102 −96
−90
−84
−78
−72
−66
−60
−54
−48
−42
−36
−30
−24
−18
−12
−6
0
6
12
18
Pi(RF) (dBm)
VCC = 3.2 V; Tamb = 25oC.
Fig.3 RSSI output voltage as a function of RF input power.
APPLICATION INFORMATION
GND(LO)
handbook, full pagewidth
PD
power down
control signal
VCC
GND(RF)
L = 6.8 nH
1.2 pF
RF input
2.7 pF
RFA
L = 6.8 nH
L = 6.8 nH
1.2 pF
VCC(RF)
2.7 pF
RFB
GND(IF)
RSET
18 kΩ
slicer control
input signal
TEST1
SLCCTR
1
20
2
19
3
18
4
17
5
16
UAA3540TS
6
15
7
14
8
13
9
12
10
11
TEST4
VCC(LO)
8.2 pF
symmetrical
LO signal
from VCO
LOA
VCC(IF)
8.2 pF
VCC
RSSI
TEST3
RSSI output
27 pF
VCC
digital
data
output
DATA+
TEST2
DATA−
4.7 nF
FCA041
Fig.4 Application diagram.
2000 Feb 15
VCC
LOB
9
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
D
SOT266-1
E
A
X
c
y
HE
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.5
0.15
0
1.4
1.2
0.25
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.45
0.65
0.45
0.2
0.13
0.1
0.48
0.18
10
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT266-1
2000 Feb 15
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-22
99-12-27
MO-152
10
o
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
2000 Feb 15
11
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3), SO, SOJ
suitable
suitable(2)
suitable
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Feb 15
12
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
NOTES
2000 Feb 15
13
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
NOTES
2000 Feb 15
14
Philips Semiconductors
Product specification
DECT receiver
UAA3540TS
NOTES
2000 Feb 15
15
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Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 69
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
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Printed in The Netherlands
403506/02/pp16
Date of release: 2000
Feb 15
Document order number:
9397 750 06422