INTEGRATED CIRCUITS 74LV365 Hex buffer/line driver (3-State) Product specification Supersedes data of 1997 Mar 04 IC24 Data Handbook 1998 May 29 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 FEATURES DESCRIPTION • Optimized for Low Voltage applications: 1.0 to 3.6V • Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V • Typical VOLP (output ground bounce) 0.8V @ VCC = 3.3V, The 74LV365 is a low-voltage CMOS device and is pin and function compatible 74HC/HCT365. Tamb = 25°C The 74LV365 is a hex non-inverting buffer/line driver with 3-State outputs. The 3-State outputs (nY) are controlled by the output enable inputs (OE1, OE2). Tamb = 25°C A HIGH on OEn, causes the outputs to assume a high impedance OFF-state. • Typical VOHV (output VOH undershoot) 2V @ VCC = 3.3V, • Non-inverting outputs • Output capability: bus driver • ICC category: MSI QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr = tf 2.5 ns SYMBOL PARAMETER tPHL/tPLH Propagation delay nA to nY CI Input capacitance CPD Power dissipation capacitance per buffer CONDITIONS CL = 15pF VCC = 3.3V Notes 1 and 2 TYPICAL UNIT 9 ns 3.5 pF 40 pF NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in µW) PD = CPD × VCC2 × fi (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; (CL × VCC2 × fo) = sum of the outputs. 2. The condition is VI = GND to VCC ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. # 16-Pin Plastic DIL –40°C to +125°C 74LV365 N 74LV365 N SOT38-4 16-Pin Plastic SO –40°C to +125°C 74LV365 D 74LV365 D SOT109-1 16-Pin Plastic SSOP Type II –40°C to +125°C 74LV365 DB 74LV365 DB SOT338-1 16-Pin Plastic TSSOP Type I –40°C to +125°C 74LV365 PW 74LV365PW DH SOT403-1 PIN DESCRIPTION PIN NUMBER 1, 15 FUNCTION TABLE SYMBOL OE1, OE2 Output enable inputs (active-LOW) 2, 4, 6, 10, 12, 14 1A to 6A 3, 5, 7, 9, 11, 13 1Y to 6Y Data outputs 8 GND Ground (0V) 16 VCC Positive supply voltage 1998 May 29 INPUTS FUNCTION Data inputs OUTPUT OE1 OE2 nA nY L L L L L L H H X H X Z H X X H = HIGH voltage level L = LOW voltage level X = Don’t care Z = High impedance OFF-state 2 Z 853–1932 19466 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 PIN CONFIGURATION LOGIC SYMBOL (IEEE/IEC) 1 OE1 1 16 VCC 1A 2 15 OE2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y & EN 15 2 3 4 5 6 7 10 9 12 11 14 13 SV00646 SV00644 LOGIC SYMBOL FUNCTIONAL DIAGRAM 1A 2A 2Y 3A 3Y 2A 2Y 5 6 3A 3Y 7 10 4A 4Y 9 12 5A 5Y 11 14 6A 6Y 13 3 7 4A 4Y 9 10 5A 5Y 12 11 6A 6Y 13 14 OE1 OE2 1 OE1 15 OE2 SV00647 SV00645 1998 May 29 4 1Y 5 6 15 1A 3 4 1 2 1Y 2 3 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage CONDITIONS MIN TYP MAX UNIT See Note 1 1.0 3.3 3.6 V VI Input voltage 0 – VCC V VO Output voltage 0 – VCC V +85 +125 °C 500 200 100 ns/V Tamb Operating ambient temperature range in free air tr, tf Input rise and fall times See DC and AC characteristics VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V –40 –40 – – – – – – – NOTE: 1. The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V. ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V). SYMBOL PARAMETER CONDITIONS RATING UNIT –0.5 to +4.6 V VCC DC supply voltage ±IIK DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA ±IOK DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA ±IO DC output source or sink current – bus driver outputs –0.5V < VO < VCC + 0.5V 35 mA 70 mA –65 to +150 °C ±IGND, ±ICC DC VCC or GND current for types with –bus driver outputs Tstg Storage temperature range Ptot t t Power dissipation per package –plastic DIL –plastic mini-pack (SO) –plastic shrink mini-pack (SSOP and TSSOP) for temperature range: –40 to +125°C above +70°C derate linearly with 12mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K 750 500 400 mW NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 May 29 4 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 DC CHARACTERISTICS FOR THE LV FAMILY Over recommended operating conditions. Voltages are referenced to GND (ground = 0V). LIMITS SYMBOL PARAMETER -40°C to +85°C TEST CONDITIONS MIN HIGH level l l Input I t voltage VIH LOW level l l Input I t voltage VIL HIGH level output voltage; all outputs VOH HIGH level output voltage; BUS driver outputs -40°C to +125°C MAX MIN VCC = 1.2V 0.9 0.9 VCC = 2.0V 1.4 1.4 VCC = 2.7 to 3.6V 2.0 2.0 UNIT MAX V VCC = 1.2V 0.3 0.3 VCC = 2.0V 0.6 0.6 VCC = 2.7 to 3.6V 0.8 0.8 VCC = 1.2V; VI = VIH or VIL; –IO = 100µA VOH O TYP1 V 1.2 VCC = 2.0V; VI = VIH or VIL; –IO = 100µA 1.8 2.0 1.8 VCC = 2.7V; VI = VIH or VIL; –IO = 100µA 2.5 2.7 2.5 VCC = 3.0V; VI = VIH or VIL; –IO = 100µA 2.8 3.0 2.8 VCC = 3.0V; VI = VIH or VIL; –IO = 8mA 2.40 2.82 2.20 V V VCC = 1.2V; VI = VIH or VIL; IO = 100µA 0 VCC = 2.0V; VI = VIH or VIL; IO = 100µA 0 0.2 0.2 VCC = 2.7V; VI = VIH or VIL; IO = 100µA 0 0.2 0.2 VCC = 3.0V; VI = VIH or VIL; IO = 100µA 0 0.2 0.2 0.20 0.40 0.50 V 1.0 1.0 µA 5 10 µA VOL O LOW level output voltage; all outputs VOL LOW level output voltage; BUS driver outputs VCC = 3.0V; VI = VIH or VIL; IO = 8mA Input leakage current VCC = 3.6V; VI = VCC or GND IOZ 3-State output OFF-state current VCC = 3.6V; VI = VIH or VIL; VO = VCC or GND ICC Quiescent supply current; MSI VCC = 3.6V; VI = VCC or GND; IO = 0 20.0 160 µA ∆ICC Additional quiescent supply current per input VCC = 2.7V to 3.6V; VI = VCC – 0.6V 500 850 µA II NOTE: 1. All typical values are measured at Tamb = 25°C. 1998 May 29 5 V Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 AC CHARACTERISTICS GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF; RL = 1KW LIMITS SYMBOL PARAMETER Propagation delay g y nA to nY tPHL//tPLH tPHZ//tPLZ VCC(V) MIN 1.2 – 2.0 – 2.7 –40 to +125 °C MAX MIN 55 – – – 19 36 – 44 – 14 26 – 33 3.0 to 3.6 – 102 21 – 26 1.2 – 85 – – – 2.0 – 29 56 – 66 2.7 – 21 41 – 49 3.0 to 3.6 – 162 33 – 39 1.2 – 100 – – – 2.0 – 36 66 – 78 2.7 – 27 48 – 58 3.0 to 3.6 – 212 39 – 47 Figure 2 3-State output disable time OEn to nY –40 to +85 °C TYP1 Figure 1 3-State output enable time OEn to nY tPZH//tPZL CONDITION WAVEFORM Figure 2 UNIT MAX ns ns ns NOTES: 1. All typical values are measured at Tamb = 25°C 2. Typical values are measured at VCC = 3.3V AC WAVEFORMS VM = 1.5V at VCC 2.7V VM = 0.5V * VCC at VCC 2.7V VOL and VOH are the typical output voltage drop that occur with the output load. VX = VOL + 0.3V at VCC 2.7V VX = VOL + 0.1VCC at VCC < 2.7V VY = VOH – 0.3V at VCC 2.7V VY = VOH – 0.1VCC at VCC < 2.7V VCC OEn INPUT GND tPLZ tPZL VCC OUTPUT LOW–to–OFF OFF–to–LOW VOL VCC nA INPUT VM VM VM VX tPZH tPHZ GND tPHL VCC tPLH VY OUTPUT VOH nY OUTPUT VM HIGH–to–OFF OFF–to–HIGH GND VM outputs enabled VOL outputs disabled outputs enabled SV00648 SV00649 Figure 1. Input (nA) to output (nY) propagation delays. Figure 2. 3-State enable and disable times. 1998 May 29 6 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 TEST CIRCUIT S1 VCC RL = 1k VO VI PULSE GENERATOR 2 * VCC Open GND D.U.T. 50pF RT CL RL = 1k Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SWITCH POSITION TEST tPLH/tPHL S1 Open tPLZ/tPZL 2 VCC tPHZ/tPZH GND VCC VI < 2.7V VCC 2.7–3.6V 2.7V SV00895 Figure 3. Load circuitry for switching times 1998 May 29 7 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 DIP16: plastic dual in-line package; 16 leads (300 mil) 1998 May 29 8 SOT38-4 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 SO16: plastic small outline package; 16 leads; body width 3.9 mm 1998 May 29 9 SOT109-1 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm 1998 May 29 10 SOT338-1 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm 1998 May 29 11 SOT403-1 Philips Semiconductors Product specification Hex buffer/line driver (3-State) 74LV365 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: 1998 May 29 12 Date of release: 05-96 9397-750-04444