PHILIPS TZA1046

INTEGRATED CIRCUITS
DATA SHEET
TZA1046
Photodiode and amplifier IC
for CD and DVD applications
Preliminary specification
2004 May 04
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
CONTENTS
13
PACKAGE OUTLINE
14
SOLDERING
14.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
ORDERING INFORMATION
5
QUICK REFERENCE DATA
6
BLOCK DIAGRAM
7
PINNING
15
ADDITIONAL SOLDERING INFORMATION
8
MODE SELECTION
16
DATA SHEET STATUS
9
MECHANICAL DATA
17
DEFINITIONS
10
LIMITING VALUES
18
DISCLAIMERS
11
CHARACTERISTICS
12
APPLICATION AND TEST INFORMATION
12.1
12.2
Application example
Test mode description
2004 May 04
14.2
14.3
14.4
14.5
2
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
1
TZA1046
The H/L switch is a three level switch that can be used to
adjust the gain for different dye and phase change media.
The third level (high-impedance state) invokes the
power-down mode for standby condition.
FEATURES
• High frequency RF amplifiers
• Power-down mode for standby condition
• Suitable for all CD (785 nm) and DVD (655 nm)
read/write applications
Gain switch R/W is used to reduce the gain during writing.
During CD-R writing with clipping, the high peak signals for
the central and satellite segments are clamped internally
and the output currents of the A, B, C, D, E, F, G and H
segments are folded back to reduce power consumption.
The output currents can be folded back to almost zero,
depending on the light power detected. CD-R writing can
also be done without clipping for applications where
averaging is used.
• Four high-bandwidth central outputs (A, B, C and D);
four satellite outputs (EG, FH, ETST and HTST) and one
high-bandwidth differential RF output (RFP and RFN)
• Internal current clamp and current fold back (power
reduction)
• Versatile programmable gain switches (CD/DVD, H/L
and R/W)
All outputs are current outputs that can supply a maximum
of 8 mA. In CD-R write clip mode, the clipping level of the
output currents is between 5 mA and 8 mA.
• Single 5 V supply
• Current outputs for optimum signal transport over flex
cable
The HTSSON16T package has a low spread on the
Z tolerance. The Z tolerance is measured between the
diodes (chip surface) and the bottom of the leads. The
diodes have an offset of 54 µm the y direction with respect
to the leadframe centre and a tolerance of 50µm in both
x- and y-directions.
• Small outline package HTSSON16T with good
positional tolerance.
2
APPLICATIONS
• CD and DVD read/write applications.
3
In normal operation the satellite outputs F and H are
combined as one output FH and the satellite outputs
E and G are combined as one output EG. In normal mode
the ETST and HTST outputs are not used (high ohmic).
When pulling the R/W pin above the supply or is left open
the device comes into a testing mode where all four
separate satellite channels are directed to the outputs.
This mode is used for Optical Pick-up Unit (OPU)
alignment of the diodes where all satellite channels must
be available.
GENERAL DESCRIPTION
The TZA1046 is a single optical pick-up IC for read/write
systems and is suitable for CD and DVD applications.
The device contains eight RF amplifiers for the central and
satellite diodes and one differential RF amplifier (RFP and
RFN) which handles the sum of the four A, B, C and D
central diode signals.
Programming the gain is a very versatile way to optimize
interfacing between the TZA1046 and the preamplifier.
The gain can be programmed for CD or DVD media with
the gain switch CD/DVD.
4
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
TZA1046TM
HTSSON16T plastic thermal enhanced thin shrink small outline package/transparent;
no leads; 16 terminals; body 6.6 × 5.2 × 1.1 mm
2004 May 04
3
VERSION
SOT814-1
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
5
TZA1046
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD1
supply voltage
front-end
4.5
5.0
5.5
V
VDD2
supply voltage
back-end
4.5
5.0
5.5
V
IDD1
supply current
front-end
writing DVD+R
−
13
−
mA
writing CDR clipping
−
27
−
mA
writing DVD+RW or CDR no-clip
−
13
−
mA
writing CDRW
−
12
−
mA
reading DVD
−
27
−
mA
reading CD
−
28
−
mA
reading DVD+RW
−
27
−
mA
reading CDRW
−
27
−
mA
power-down mode
−
0.4
−
mA
writing DVD+R
−
5.3
−
mA
writing CDR clipping
−
5.3
−
mA
writing DVD+RW or CDR no-clip
−
5.3
−
mA
writing CDRW
−
5.3
−
mA
reading DVD
−
5.3
−
mA
reading CD
−
5.3
−
mA
reading DVD+RW
−
5.3
−
mA
reading CDRW
−
6.6
−
mA
power-down mode
−
0.1
−
mA
0
−
70
°C
130
165
−
MHz
reading CD
100
142
−
MHz
reading DVD+RW
130
162
−
MHz
reading CDRW
80
124
−
MHz
130
175
−
MHz
reading CD
100
130
−
MHz
reading DVD+RW
130
166
−
MHz
reading CDRW
80
114
−
MHz
IDD2
supply current
back-end
dark conditions; 6-channel mode
dark conditions; 6-channel mode
Temperature range
Tamb
ambient temperature
RF bandwidth
B−3dB(cen)
B−3dB(RF)
2004 May 04
bandwidth of central
Io = 1.0 mA; 6-channel mode
channels A, B, C and D
reading DVD
bandwidth of differential Io = 1.0 mA
channels RFP and RFN
reading DVD
4
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
SYMBOL
PARAMETER
TZA1046
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Settling time
tst
settling time
CD-R write mode (all channels);
Iset > 300 µA; accuracy set level
within ±5 %; write peak level to set
level factor < 50
−
−
22
ns
CD-RW and DVD+RW write modes
(all channels); Iset > 100 µA;
accuracy set level within ±5 %; write
peak level to set level factor 2; peak
current ≤ Io(max)
−
−
10
ns
DVD+R write mode (all channels);
Iset > 100 µA; accuracy set level
within ±5 %; write peak level to set
level factor 20; peak current ≤ Io(max)
−
−
12
ns
reading DVD
−
0.2
−
ns
reading CD
−
0.3
−
ns
reading DVD+RW
−
0.25
−
ns
reading CDRW
−
0.5
−
ns
reading DVD
−
0.4
−
ns
reading CD
−
0.6
−
ns
reading DVD+RW
−
0.4
−
ns
reading CDRW
−
1
−
ns
−
−
−
A/W
Phase delay and group delay variation
∆td(p)(RF)
∆td(g)(RF)
phase delay variation
differential channels
RFP and RFN
group delay variation
differential channels
RFP and RFN
Io = 1.0 mA; fi = 2 to 104 MHz
Io = 1.0 mA; fi = 2 to 104 MHz
Sensitivity
s
2004 May 04
output current
sensitivity
values depend on operating mode;
see Table 1
5
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
Table 1
TZA1046
Output current sensitivity; typical values
OUTPUT CURRENT SENSITIVITY (A/W)(1)
MODE
CENTRAL
SATELLITE
DIFFERENTIAL
(RFP AND RFN)
Writing DVD+R with averaging
0.72
1.44
0.27
Reading high reflective DVD media: single layer DVD
and DVD+R
21.6
43.2
8.10
Writing DVD+RW with averaging
2.88
5.76
1.08
Reading low reflective DVD media: dual layer DVD and
DVD+RW
43.2
86.4
16.2
Writing CDR with sampling
43.2
86.4
1.08
Reading high reflective CD media
86.4
173
32.4
Writing CDR with averaging
1.44
2.88
0.54
Writing CDRW with averaging
5.76
11.5
2.16
Reading low reflective CD media: CDRW
173
346
64.8
Note
1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram (see
Fig.6) the resistors of 150 Ω convert the currents into voltages. The maximum absolute spread is ±20 %.
2004 May 04
6
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
6
TZA1046
BLOCK DIAGRAM
handbook, full pagewidth
GND
6
VDD2
3
VDD1
14
VDD1
VDD2
1
A
VDD1
VDD2
7
B
VDD1
8
2
16
VDD1
10
FH
VDD2
15
G
VDD1
ETST
VDD2
F
VDD1
D
VDD2
E
VDD1
C
VDD2
D
VDD1
B
VDD2
C
VDD1
A
EG
VDD2
9
H
HTST
VDD2
4
H/L
CD/DVD
R/W
12
13
CODER (1)
11
5
TZA1046
VDD2
MDB573
(1) The coder translates the three digital inputs into the appropriate gain level of each amplifier. The limiter
is switched to a high level for other modes than the CD-R writing mode for all segment outputs.
Fig.1 Block diagram.
2004 May 04
RFP
7
RFN
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
7
TZA1046
PINNING
SYMBOL
PIN
DESCRIPTION
A
1
central segment output A
D
2
central segment output D
VDD2
3
supply voltage back-end
RFP
4
positive RF output
RFN
5
negative RF output
GND
6
ground
C
8
9
HTST
B
7
central segment output B
B
7
10
FH
C
8
central segment output C
GND
6
11
R/W
HTST
9
satellite segment output H in test
mode; note 1
RFN
5
12
H/L
13
CD/DVD
FH
R/W
H/L
10
11
12
sum of satellite segment F and
segment H output, segment F output
in test mode; note 1
gain select switch for reading or
writing and to select the test mode
CD/DVD
13
gain select switch for CD or DVD
VDD1
14
supply voltage front-end
EG
15
Sum of satellite segment E and
segment G output, satellite output G
in test mode; note 1
ETST
16
segment E output in test mode;
note 1
4
3
14
VDD1
D
2
15
EG
A
1
16
ETST
001aaa407
Fig.2 Pin configuration.
Note
1. In test mode all separate satellite signals are available.
In normal mode HTST and ETST are high ohmic, FH
is the sum of F and H and EG is the sum of E and G.
2004 May 04
RFP
VDD2
terminal 1
index area
gain select switch for low reflective
(H/L = 1) and high reflective (H/L = 0)
media
TZA1046TM
8
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
8
TZA1046
MODE SELECTION
Table 2
Coder switching
PIN LEVEL
MODE
R/W
H/L
CD/DVD
6-channel mode
don’t care
open
LOW
Power-down
LOW
LOW
LOW
writing DVD+R no-clip or averaging mode
LOW
LOW
HIGH
writing CDR write-clip or sample mode
LOW
open
HIGH
writing CDR no-clip or averaging mode
LOW
HIGH
LOW
writing DVD+RW no-clip mode; either sampling or averaging mode
LOW
HIGH
HIGH
writing CDRW no-clip mode, either sampling or averaging mode
HIGH
LOW
LOW
reading DVD+R; DVD-SL
HIGH
LOW; open
HIGH
reading CD and CDR
HIGH
HIGH
LOW
reading DVD+RW; DVD-DL
HIGH
HIGH
HIGH
reading CDRW
LOW
reading DVD+R and DVD-SL
8-channel test mode; note 1
test mode
LOW
LOW; open
HIGH
reading CD and CDR
HIGH
LOW
reading DVD+RW and DVD-DL
HIGH
HIGH
reading CDRW
Note
1. The 8-channel test mode is activated when VI(test-on) or II(test-on) is applied to pin R/W or if pin R/W is left open. The
values of VI(test-on) or II(test-on) can be found in Chapter 11.
9
MECHANICAL DATA
115
handbook, full pagewidth
E
F
50
50
A
B
115
G
H
100
145
D
C
150
150
Dimensions in µm.
Space between central segments: < 1 µm.
Space between satellite segments: < 1 µm.
Fig.3 Photodiode configuration.
2004 May 04
9
MGU616
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
handbook, full pagewidth
16
15
14
13
TZA1046
12
11
10
9
y
E
+ 54 µm offset
x
45° ± 1°
package
centre
see detail X
1
2
3
4
5
6
7
8
MGU617
DETAIL X
45° angle is with respect to the leadframe.
Not drawn to scale.
Package window is not shown.
Fig.4 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
4.55
0.1 C
C
1.50 min
0.3
1.00
min
0° ± 1°
rotation
tolerance
F
3.0 ± 0.12
0.30 ± 0.025
pin 1
mark
2.275 ± 0.12
0.1
0.33 (16×)
0.23
001aaa035
Fig.5 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
2004 May 04
10
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD1
supply voltage front-end
−0.3
+5.5
V
VDD2
supply voltage back-end
−0.3
+5.5
V
∆VDD1
supply voltage difference with respect to VDD2
VDD2 − 0.3
VDD2 + 0.3
V
∆VDD2
supply voltage difference with respect to VDD1
VDD1 − 0.3
VDD1 + 0.3
V
Vn
voltage at pins
A, B, C, D, ETST, FH, EG, HTST, RFP and RFN
−0.3
VDD2 + 0.3
V
CD/DVD and H/L
−0.3
VDD1 + 0.3
V
R/W
−0.3
VDD1 + 2.5
V
11 CHARACTERISTICS
VDD1 = VDD2 = 2.0 V; pin R/W = LOW; pin H/L = LOW; pin CD/DVD = HIGH; VA = VB = VC = VD = 2.0 V;
VEG = VFH = VETST = VHTST = 2.0 V; VRFP = VRFN = 2.0 V; measured in dark conditions; Tamb = 25 °C; 6-channel mode;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD1
supply voltage
front-end
note 1
4.5
5.0
5.5
V
VDD2
supply voltage
back-end
note 1
4.5
5.0
5.5
V
IDD1
supply current
front-end
dark conditions; 6-channel mode;
note 2
writing DVD+R
−
13
−
mA
writing CDR clipping
−
27
−
mA
writing DVD+RW or CDR no-clip
−
13
−
mA
writing CDRW
−
12
−
mA
reading DVD
−
27
−
mA
reading CD
−
28
−
mA
reading DVD+RW
−
27
−
mA
reading CDRW
−
27
−
mA
power-down mode
−
0.4
−
mA
2004 May 04
11
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
SYMBOL
IDD2
PARAMETER
supply current
back-end
TZA1046
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dark conditions; 6-channel mode;
note 2
writing DVD+R
−
5.3
−
mA
writing CDR clipping
−
5.3
−
mA
writing DVD+RW or CDR no-clip
−
5.3
−
mA
writing CDRW
−
5.3
−
mA
reading DVD
−
5.3
−
mA
reading CD
−
5.3
−
mA
reading DVD+RW
−
5.3
−
mA
reading CDRW
−
6.6
−
mA
power-down mode
−
0.1
−
mA
0
−
70
°C
writing DVD+R
−
172
−
MHz
writing CDR clipping
−
206
−
MHz
writing DVD+RW or CDR no-clip
−
211
−
MHz
writing CDRW
−
125
−
MHz
reading DVD
130
165
−
MHz
reading CD
100
142
−
MHz
reading DVD+RW
130
162
−
MHz
reading CDRW
80
124
−
MHz
reading DVD
−
0.25
−
ns
reading CD
−
0.15
−
ns
reading DVD+RW
−
0.2
−
ns
reading CDRW
−
0.3
−
ns
0
−
5
%
Temperature range
Tamb
ambient temperature
Central segment output channels: pins A, B, C and D
B−3dB
∆td(p)
bandwidth
phase delay variation
Io = 1.0 mA
Io = 1mA; fi = 2 to 104 MHz
Msens
channel matching
sensitivity
note 3
Vo
output voltage range
1
−
VDD2 − 1
V
Io
output current
0
−
8
mA
Io(offset)
output offset current
reading CDRW
−14
−1.5
+11
µA
other modes
−14
−0.9
+12
µA
5
−
8
mA
reading CD
−
1.2
−
nA/√Hz
reading DVD+RW
−
0.4
−
nA/√Hz
reading CDRW
−
2.0
−
nA/√Hz
dark conditions; Tamb = 0 to 70 °C
Io(clip)
output current clipping
level
CD-R writing; note 4
In(o)
spot noise output
current
Io = 1.0 mA; fo = 50 MHz; note 5
2004 May 04
12
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
SYMBOL
PARAMETER
TZA1046
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Differential RF outputs channel: pins RFP and RFN
B−3dB
∆td(p)
∆td(g)
bandwidth
phase delay variation
group delay variation
Io = 1.0 mA
writing DVD+R
−
120
−
MHz
writing CDR clipping
−
205
−
MHz
writing DVD+RW or CDR no-clip
−
375
−
MHz
writing CDRW
−
118
−
MHz
reading DVD
130
175
−
MHz
reading CD
100
130
−
MHz
reading DVD+RW
130
166
−
MHz
reading CDRW
80
114
−
MHz
reading DVD
−
0.2
−
ns
reading CD
−
0.3
−
ns
reading DVD+RW
−
0.25
−
ns
reading CDRW
−
0.5
−
ns
reading DVD
−
0.4
−
ns
reading CD
−
0.6
−
ns
reading DVD+RW
−
0.4
−
ns
reading CDRW
−
1
−
ns
−20
−
−
dB
Io = 1.0 mA; fi = 2 to 104 MHz
Io = 1.0 mA; fi = 2 to 104 MHz
CMR
common mode ripple
Vo
output voltage range
1
−
VDD2 − 1
V
Io
output current
0
−
8
mA
Io(offset)
output offset current
pin RFP
7
22
40
µA
pin RFN
−7
−20
−35
µA
In(o)
2004 May 04
spot noise output
current
Io = 2 mA (peak); fo up to 104 MHz;
note 6
dark conditions; Tamb = 0 to 70 °C
pin RFP; reading CDRW
14
43
79
µA
pin RFN; reading CDRW
−13
−39
−70
µA
reading CD
−
0.9
−
nA/√Hz
reading DVD+RW
−
0.3
−
nA/√Hz
reading CDRW
−
1.5
−
nA/√Hz
Io = 1.0 mA; fo = 50 MHz; note 5
13
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
SYMBOL
PARAMETER
TZA1046
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Satellite segment output channels: pins ETST, FH, EG and HTST; note 7
B−3dB
bandwidth
Io = 1.0 mA; 6-channel mode
writing DVD+R
−
93
−
MHz
writing CDR clipping
−
81
−
MHz
writing DVD+RW or CDR no-clip
−
107
−
MHz
writing CDRW
−
66
−
MHz
reading DVD
10
75
−
MHz
reading CD
10
61
−
MHz
reading DVD+RW
10
66
−
MHz
reading CDRW
10
56
−
MHz
0
−
5
%
Msens
channel matching
sensitivity
note 8
Vo
output voltage range
1
−
VDD2 − 1
V
Io
output current
0
−
8
mA
Io(offset)
output offset current
reading CDRW
−25
−4
17
µA
other modes
−23
−5.4
12
µA
5
−
8
mA
reading CD
−
2.2
−
nA/√Hz
reading DVD+RW
−
0.8
−
nA/√Hz
reading CDRW
−
4.3
−
nA/√Hz
−
−
22
ns
CD-RW and DVD+RW write modes; −
Iset > 100 µA; accuracy set level
within ±5 %; write peak level to set
level factor 2; peak current ≤ Io(max)
−
10
ns
DVD+R write mode; Iset > 100 µA;
accuracy set level within ±5 %;
write peak level to set level
factor 20; peak current ≤ Io(max)
−
−
12
ns
dark conditions; Tamb = 0 to 70 °C
Io(clip)
current clipping level
CD-R writing; note 4
In(o)
spot noise output
current
Io = 1.0 mA; fo = 25 MHz; note 5
Settling time, all channels; note 9
tst
settling time
CD-R write mode; Iset > 300 µA;
accuracy set level within ±5 %;
write peak level to set level
factor < 50
Control inputs: pins R/W, H/L and CD/DVD
VIL
LOW-level input voltage note 10
0
−
0.6
V
VIH
HIGH-level input
voltage
note 10
2.5
−
VDD1
V
ZI(pd)
pull-down input
impedance
only pin CD/DVD
−
200
−
kΩ
2004 May 04
14
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
SYMBOL
PARAMETER
TZA1046
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Test mode: pin R/W
VI(test-on)
input voltage to activate note 11
the test mode
VDD1 + 2
−
8
V
II(test-on)
force current into pin to
activate the test mode
800
−
1200
µA
−
−
−
A/W
Sensitivity
s
output current
sensitivity
values depend on operating mode;
see Table 3
Notes
1. The supplies are connected internally by diodes. Differences between the supply voltages should not exceed 0.3 V.
2. Estimated average power consumption (6 channel mode):
P = IDD1 × VDD1 + IDD2 × VDD2 +
11/ × I
8
3
o(RF) × VDD2 × K2 − /3 × Io(RF) × Vref +
(Io(EG) + Io(FH)) × (VDD2 × K1 − Vref) −
2 × Io(RF)2 × RL2 − 16/9 × Io(RF)2 × RL1 −
Io(EG)2 × RL1 − Io(FH)2 × RL1, where:
RL2 is the load resistance on each of the differential RF outputs RFP and RFN and RL1 is the load resistance on all
other outputs.
K1 = 1.35 and K2 = 1.6 for CD-RW reading; K1 = 1.50 and K2 = 1.40 for other modes.
Vref = Vref1 = Vref2; see Fig.6.
I o(max) – I o(min)
3. Outputs A, B, C, and D: Io = 3 mA output current. Definition of matching: -----------------------------------------------------1
( I A + I B + I C + I D ) × --4
4. The clipping function is active in the CD-R write mode for the segment outputs (not for outputs RFP and RFN) and
in the read mode for all outputs. In the read mode, the clipping level is increased above Io(max).
5. The S/N ratio improves significantly when the sensitivity is lowered.
I RFP + I RFN
6. Definition: 20 log ----------------------------I RFP – I RFN
7. In test mode all channels are active, in normal mode channels EG and FH are active and channels ETST and HTST
are off.
8. Outputs ETST, FH, EG, and HTST: Io = 1.5 mA output current; Msens = ±7 % for reading CD-RW, CD-ROM,
DVD+RW and writing CD-R.
I o ( max ) – I o ( min )
Definition of matching in normal mode: --------------------------------------1
( I FH + I EG ) × --2
I o(max) – I o(min)
Definition of matching in test mode: -------------------------------------------------------------------------------1
( I ETST + I FH + I EG + I HTST ) × --4
9. The settling time includes the recovery time.
10. Pins R/W and H/L are three-level switches. When these pins are left open-circuit two internal resistors (150 kΩ to
GND and 350 kΩ to VDD) will keep them between 1.3 and 1.7 V.
11. The test mode is also activated when the R/W pin is left open-circuit.
2004 May 04
15
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
Table 3
TZA1046
Output current sensitivity; typical values
OUTPUT CURRENT SENSITIVITY (A/W)(1)
MODE
CENTRAL
SATELLITE
DIFFERENTIAL
(RFP AND RFN)
Writing DVD+R with averaging
0.72
1.44
0.27
Reading high reflective DVD media: single layer DVD
and DVD+R
21.6
43.2
8.10
Writing DVD+RW with averaging
2.88
5.76
1.08
Reading low reflective DVD media; dual layer DVD and
DVD+RW
43.2
86.4
16.2
Writing CDR with sampling
43.2
86.4
1.08
Reading high reflective CD media
86.4
173
32.4
Writing CDR with averaging
1.44
2.88
0.54
Writing CDRW with averaging
5.76
11.5
2.16
Reading low reflective CD media: CDRW
173
346
64.8
Note
1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram
(see Fig.6) the resistors of 150 Ω convert the currents into voltages. The maximum absolute spread is ±20 %.
2004 May 04
16
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
12 APPLICATION AND TEST INFORMATION
12.1
Application example
An application example for the TZA1046 is shown in Fig.6. The satellite segment pins are cross-coupled to be suitable
for rewritable applications.
VDD
handbook, full pagewidth
150
Ω
150
Ω
150
Ω
150
Ω
CD/DVD H/L R/W
ETST
HTST
FH
EG
16
15
14
12
13
11
10
9
6
7
8
TZA1046
2
1
3
4
5
B
D
C
A
150
Ω
75
Ω
150
Ω
75
Ω
150
Ω
150
Ω
Vref1
Vref2
MDB575
RFP
RFN
Fig.6 Application example.
2004 May 04
17
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
12.2
TZA1046
Test mode description
Alignment of the diodes during OPU manufacturing requires the availability of all satellite outputs. In normal mode the
F and H channels are combined to a single output FH and the E and G channels are combined to a single output EG.
This is done to switch off two channels in the normal mode (application usage) which saves power consumption. For
alignment of the diodes each individual satellite output must be available and therefore the TZA1046 can be put in a test
mode where all satellite channels are available. The test mode is activated by pulling the R/W digital input pin above the
supply (2 to 2.5 V higher than VDD1), by forcing an input current into this pin (800 to 1200 µA) or by leaving the pin
open-circuit. Fig.7 shows the R/W input configuration.
handbook, full pagewidth
VDD2
3
VDD1
14
6 kΩ
100 Ω
300
kΩ
350
kΩ
1 kΩ
11
R/W input
1
+1
GND
+1
1
100
kΩ
1
150
kΩ
8-channel
test mode
1
100
kΩ
R/W internal
40 kΩ
6
MDB576
Fig.7 R/W input configuration.
2004 May 04
18
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
13 PACKAGE OUTLINE
HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads;
16 terminals; body 6.6 x 5.2 x 1.1 mm
SOT814-1
X
B
D
D1
D2
A
A
E2 E1 E
c
detail X
terminal 1
index area
C
e1
e
1
y1 C
v M C A B
w M C
b
8
y
L
terminal 1
index area
Eh
16
9
0
Dh
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
max.
mm
1.1
b
c
D
D1
D2
min.
Dh
E
E1
E2
min.
Eh
e
e1
L
v
w
y
y1
0.33
0.23
0.5
0.3
5.3
5.1
4.5
4.0
1.50
5.15
4.95
6.7
6.5
4.2
3.7
1.00
5.4
5.2
0.65
4.55
0.3
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT814-1
---
---
---
2004 May 04
19
EUROPEAN
PROJECTION
ISSUE DATE
03-10-10
03-11-19
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
To overcome these problems the double-wave soldering
method was specifically developed.
14 SOLDERING
14.1
Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
14.2
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA, HTSSON-T and SSOP-T packages
14.4
– for packages with a thickness 2.5 mm
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
14.3
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2004 May 04
Manual soldering
20
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
14.5
TZA1046
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
15 ADDITIONAL SOLDERING INFORMATION
• Reflow peak temperature for TZA1046TM should be no higher than 215 °C ± 5 °C.
• Manual soldering for TZA1046TM is not encouraged. In case of touch-up desolder the defective device manually and
use reflow soldering for the assembly of the replacing device.
2004 May 04
21
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
16 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17 DEFINITIONS
18 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 May 04
22
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
ICs with CD functionality  Purchase of a Philips IC with
CD functionality does not convey an implied license under
any patent right to use this IC in any CD application.
A license under the Philips CD patents can be obtained via
Philips Intellectual Property & Standards
(Internet at URL http://www.ip.philips.com;
e-mail [email protected]).
2004 May 04
ICs with DVD functionality  Purchase of a Philips IC
with DVD functionality does not convey an implied license
under any patent right to use this IC in any DVD
application. A license under the Philips DVD patents can
be obtained via Philips Intellectual Property & Standards
(Internet at URL http://www.ip.philips.com;
e-mail [email protected]).
23
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R04/01/pp24
Date of release: 2004
May 04
Document order number:
9397 750 11525