PHILIPS NX3V1G66GM

NX3V1G66
Low-voltage analog switch
Rev. 02 — 28 July 2008
Product data sheet
1. General description
The NX3V1G66 provides one single-pole single-throw analog switch function. It has two
input/output terminals (Y and Z) and an active HIGH enable input pin (E). When pin E is
LOW, the analog switch is turned off.
Schmitt trigger action at the enable input (E) makes the circuit tolerant to slower input rise
and fall times across the entire VCC range from 1.4 V to 3.6 V.
The NX3V1G66 allows signals with amplitude up to VCC to be transmitted from Y to Z or
from Z to Y. Its ultra-low ON resistance (0.3 Ω) and flatness (0.1 Ω) ensures minimal
attenuation and distortion of transmitted signals.
2. Features
n Wide supply voltage range from 1.4 V to 3.6 V
n Very low ON resistance (peak):
u 0.8 Ω (typical) at VCC = 1.4 V
u 0.5 Ω (typical) at VCC = 1.65 V
u 0.3 Ω (typical) at VCC = 2.3 V
u 0.25 Ω (typical) at VCC = 2.7 V
n High noise immunity
n ESD protection:
u HBM JESD22-A114E Class 3A exceeds 7500 V
u MM JESD22-A115-A exceeds 200 V
u CDM AEC-Q100-011 revision B exceeds 1000 V
n CMOS low-power consumption
n Latch-up performance exceeds 100 mA per JESD78 Class II Level A
n Direct interface with TTL levels at 3.0 V
n Control input accepts voltages above supply voltage
n High current handling capability (500 mA continuous current under 3.3 V supply)
n Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Applications
n Cell phone
n PDA
n Portable media player
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
NX3V1G66GW
−40 °C to +125 °C
TSSOP5 plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
NX3V1G66GM
−40 °C to +125 °C
XSON6
SOT886
plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1.45 × 0.5 mm
5. Marking
Table 2.
Marking
Type number
Marking code
NX3V1G66GW
dL
NX3V1G66GM
dL
6. Functional diagram
Y
E
Z
Z
Y
E
001aah372
001aag487
Fig 1.
Logic symbol
Fig 2.
Logic diagram
7. Pinning information
7.1 Pinning
NX3V1G66
NX3V1G66
Y
Z
GND
1
5
VCC
1
6
VCC
Z
2
5
n.c.
GND
3
4
E
2
3
4
E
001aah832
Transparent top view
001aai328
Fig 3. Pin configuration SOT353-1 (TSSOP5)
Fig 4.
Pin configuration SOT886 (XSON6)
NX3V1G66_2
Product data sheet
Y
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
2 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
SOT353-1
SOT886
Y
1
1
independent input or output
Z
2
2
independent output or input
GND
3
3
ground (0 V)
E
4
4
enable input (active HIGH)
n.c.
-
5
not connected
VCC
5
6
supply voltage
8. Functional description
Table 4.
Function table[1]
Input E
Switch
L
OFF-state
H
ON-state
[1]
H = HIGH voltage level; L = LOW voltage level.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
−0.5
+4.6
V
VI
input voltage
[1]
−0.5
+4.6
V
VSW
switch voltage
[2]
−0.5
VCC + 0.5 V
IIK
input clamping current
VI < −0.5 V
−50
-
mA
ISK
switch clamping current
VI < −0.5 V or VI > VCC + 0.5 V
-
±50
mA
ISW
switch current
VSW > −0.5 V or VSW < VCC + 0.5 V;
source or sink current
-
±500
mA
VSW > −0.5 V or VSW < VCC + 0.5 V;
pulsed at 1 ms duration, < 10 % duty cycle;
peak current
-
±750
mA
−65
+150
°C
-
250
mW
Tstg
Conditions
Min
storage temperature
total power dissipation
Ptot
Tamb = −40 °C to +125 °C
[3]
Max
[1]
The minimum input voltage rating may be exceeded if the input current rating is observed.
[2]
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3]
For TSSOP5 package: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 package: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.
NX3V1G66_2
Product data sheet
Unit
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
3 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol Parameter
VCC
supply voltage
VI
input voltage
Conditions
enable input E
[1]
VSW
switch voltage
Tamb
ambient temperature
∆t/∆V
input transition rise and fall rate
[2]
VCC = 1.4 V to 3.6 V
Min
Max
Unit
1.4
3.6
V
0
3.6
V
0
VCC
V
−40
+125
°C
-
200
ns/V
[1]
To avoid sinking GND current from terminal Z when switch current flows in terminal Y, the voltage drop across the bidirectional switch
must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Y. In this case, there is no limit
for the voltage drop across the switch.
[2]
Applies to control signal levels.
11. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
VIH
VIL
HIGH-level
input voltage
LOW-level
input voltage
Tamb = 25 °C
Conditions
Tamb = −40 °C to +125 °C
Unit
Min
Typ
Max
Min
Max
Max
(85 °C) (125 °C)
VCC = 1.4 V to 1.95 V
0.65VCC
-
-
0.65VCC
-
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
2.0
-
-
V
VCC = 1.4 V to 1.95 V
-
-
0.35VCC
-
VCC = 2.3 V to 2.7 V
-
-
0.7
-
0.7
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
0.8
V
0.35VCC 0.35VCC V
II
input leakage
current
enable input E;
VI = GND to 3.6 V;
VCC = 1.4 V to 3.6 V
-
-
-
-
±0.5
±1
µA
IS(OFF)
OFF-state
leakage
current
Y port; see Figure 5;
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
IS(ON)
ON-state
leakage
current
Z port; see Figure 6;
VCC = 1.4 V to 3.6 V
-
-
±5
-
±50
±500
nA
ICC
supply current VI = VCC or GND;
VCC = 3.6 V;
VSW = GND or VCC; IO = 0 A
-
-
±100
-
690
6000
nA
CI
input
capacitance
-
1.0
-
-
-
-
pF
CS(OFF)
OFF-state
capacitance
-
70
-
-
-
-
pF
CS(ON)
ON-state
capacitance
-
205
-
-
-
-
pF
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
4 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
11.1 Test circuits
VCC
VCC
E
VIL
IS
Z
VI
E
VIH
Y
IS
IS
GND
VO
Z
Y
GND
VI
001aag488
001aag489
VI = 0.3 V or VCC − 0.3 V; VO = VCC − 0.3 V or 0.3 V.
Fig 5.
VO
VI = 0.3 V or VCC − 0.3 V; VO = open circuit.
Test circuit for measuring OFF-state leakage
current
Fig 6.
Test circuit for measuring ON-state leakage
current
11.2 ON resistance
Table 8.
Resistance RON
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 13.
Symbol
RON(peak)
RON(flat)
Parameter
ON resistance
(peak)
ON resistance
(flatness)
Tamb = −40 °C to +85 °C Tamb = −40 °C to +125 °C Unit
Conditions
Min
Typ[1]
Max
Min
Max
VCC = 1.4 V
-
0.8
1.9
-
2.1
Ω
VCC = 1.65 V
-
0.5
0.8
-
0.9
Ω
VCC = 2.3 V
-
0.3
0.5
-
0.6
Ω
VCC = 2.7 V
-
0.25
0.45
-
0.5
Ω
VI = GND to VCC;
ISW = 100 mA; see Figure 7
VI = GND to VCC;
ISW = 100 mA
[2]
VCC = 1.4 V
-
0.5
1.7
-
1.8
Ω
VCC = 1.65 V
-
0.25
0.6
-
0.7
Ω
VCC = 2.3 V
-
0.1
0.2
-
0.2
Ω
VCC = 2.7 V
-
0.1
0.2
-
0.2
Ω
[1]
Typical values are measured at Tamb = 25 °C.
[2]
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and
temperature.
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
5 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
11.3 ON resistance test circuit and graphs
001aah800
0.8
RON
(Ω)
0.6
VSW
(1)
0.4
VCC
(2)
E
VIH
(3)
Z
0.2
Y
GND
VI
(4)
(5)
ISW
0
0
1
2
3
RON = VSW / ISW.
4
VI (V)
001aah375
(1) VCC = 1.5 V.
(2) VCC = 1.8 V.
(3) VCC = 2.5 V.
(4) VCC = 2.7 V.
(5) VCC = 3.3 V.
Measured at Tamb = 25 °C.
Fig 7.
Test circuit for measuring ON resistance
001aah805
0.8
Fig 8.
Typical ON resistance as a function of input
voltage
001aah801
0.6
RON
(Ω)
RON
(Ω)
0.6
0.4
(1)
0.4
(2)
(1)
(3)
(2)
0.2
(3)
0.2
(4)
(4)
0
0
0
1
2
3
0
(1) Tamb = 125 °C.
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
(4) Tamb = −40 °C.
Fig 9.
ON resistance as a function of input voltage;
VCC = 1.5 V
2
3
Fig 10. ON resistance as a function of input voltage;
VCC = 1.8 V
NX3V1G66_2
Product data sheet
1
VI (V)
VI (V)
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
6 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
001aah802
0.6
001aah803
0.6
RON
(Ω)
RON
(Ω)
0.4
0.4
(1)
(1)
(2)
(2)
(3)
0.2
(3)
0.2
(4)
0
(4)
0
0
1
2
3
0
1
VI (V)
2
3
VI (V)
(1) Tamb = 125 °C.
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
(4) Tamb = −40 °C.
Fig 11. ON resistance as a function of input voltage;
VCC = 2.5 V
Fig 12. ON resistance as a function of input voltage;
VCC = 2.7 V
001aah804
0.6
RON
(Ω)
0.4
(1)
(2)
(3)
0.2
(4)
0
0
1
2
3
4
VI (V)
(1) Tamb = 125 °C.
(2) Tamb = 85 °C.
(3) Tamb = 25 °C.
(4) Tamb = −40 °C.
Fig 13. ON resistance as a function of input voltage; VCC = 3.3 V
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
7 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
12. Dynamic characteristics
Table 9.
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit Figure 15.
Symbol Parameter
enable time
ten
disable time
tdis
[1]
Tamb = 25 °C
Conditions
Tamb = −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
(85 °C)
Max
(125 °C)
VCC = 1.4 V to 1.6 V
-
28
42
-
45
49
ns
VCC = 1.65 V to 1.95 V
-
23
35
-
38
41
ns
VCC = 2.3 V to 2.7 V
-
17
27
-
29
31
ns
VCC = 2.7 V to 3.6 V
-
15
24
-
25
28
ns
VCC = 1.4 V to 1.6 V
-
12
22
-
23
26
ns
VCC = 1.65 V to 1.95 V
-
9
16
-
17
19
ns
VCC = 2.3 V to 2.7 V
-
6
10
-
11
12
ns
VCC = 2.7 V to 3.6 V
-
5
9
-
10
11
ns
E to Y; see Figure 14
E to Y; see Figure 14
Typical values are measured at Tamb = 25 °C and VCC = 1.5 V, 1.8 V, 2.5 V and 3.3 V respectively.
12.1 Waveform and test circuits
VI
E input
VM
GND
ten
Y output
OFF to HIGH
HIGH to OFF
VOH
tdis
VX
VX
GND
switch
disabled
switch
enabled
switch
disabled
001aah875
Measurement points are given in Table 10.
Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 14. Enable and disable times
Table 10.
Measurement points
Supply voltage
Input
Output
VCC
VM
VX
1.4 V to 3.6 V
0.5VCC
0.9VOH
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
8 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
VCC
E
Y/Z
G
VI
V
VO
RL
Z/Y
CL
VEXT = 1.5 V
001aah377
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 15. Load circuit for switching times
Table 11.
Test data
Supply voltage
Input
Load
VCC
VI
tr, tf
CL
RL
1.4 V to 3.6 V
VCC
≤ 2.5 ns
35 pF
50 Ω
12.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf ≤ 2.5 ns; Tamb = 25 °C.
Symbol Parameter
Conditions
THD
fi = 20 Hz to 20 kHz; RL = 32 Ω; see Figure 16
total harmonic
distortion
Min
0.05
-
%
VCC = 1.65 V; VI = 1.2 V (p-p)
-
0.03
-
%
VCC = 2.3 V; VI = 1.5 V (p-p)
-
0.01
-
%
-
0.01
-
%
-
25
-
MHz
-
−90
-
dB
-
0.32
-
V
−3 dB frequency
response
RL = 50 Ω; see Figure 17
αiso
isolation (OFF-state)
fi = 100 kHz; RL = 50 Ω; see Figure 18
[1]
VCC = 1.4 V to 3.6 V
VCC = 1.4 V to 3.6 V
[1]
between digital input and switch;
fi = 1 MHz; CL = 50 pF; RL = 50 Ω; see Figure 19
VCC = 1.4 V to 3.6 V
NX3V1G66_2
Product data sheet
Unit
-
f(−3dB)
crosstalk voltage
Max
VCC = 1.4 V; VI = 1 V (p-p)
VCC = 2.7 V; VI = 2 V (p-p)
Vct
Typ
[1]
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
9 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
Table 12. Additional dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf ≤ 2.5 ns; Tamb = 25 °C.
Symbol Parameter
Conditions
Qinj
fi = 1 MHz; CL = 0.1 nF; RL = 1 MΩ; Vgen = 0 V;
Rgen = 0 Ω; see Figure 20
[1]
charge injection
Min
Typ
Max
Unit
VCC = 1.5 V
-
6.5
-
pC
VCC = 1.8 V
-
6.5
-
pC
VCC = 2.5 V
-
6.5
-
pC
VCC = 3.3 V
-
6.5
-
pC
fi is biased at 0.5VCC.
12.3 Test circuits
VCC
0.5VCC
E
VIH
RL
Y/Z
Z/Y
D
fi
001aah378
Fig 16. Test circuit for measuring total harmonic distortion
VCC
0.5VCC
E
VIH
Y/Z
RL
Z/Y
dB
fi
001aah379
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads −3 dB.
Fig 17. Test circuit for measuring the frequency response when switch is in ON-state
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
10 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
0.5VCC
VCC
VIL
RL
0.5VCC
E
RL
Y/Z
Z/Y
dB
fi
001aah380
Adjust fi voltage to obtain 0 dBm level at input.
Fig 18. Test circuit for measuring isolation (OFF-state)
VCC
E
Y/Z
G
VI
Z/Y
RL
RL
0.5VCC
0.5VCC
CL
V
VO
001aah383
a. Test circuit
logic
input (E)
off
on
VO
off
Vct
001aah381
b. Input and output pulse definitions
Fig 19. Test circuit for measuring crosstalk voltage between digital input and switch
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
11 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
VCC
E
Y/Z
G
VI
V
VO
RL
Z/Y
Rgen
CL
Vgen
GND
001aah385
a. Test circuit.
logic
input (E)
off
on
VO
off
VO
001aah384
b. Input and output pulse definitions.
Definition: Qinj = ∆VO × CL.
∆VO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
Fig 20. Test circuit for measuring charge injection
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
12 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Fig 21. Package outline SOT353-1 (TSSOP5)
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
13 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L1
e
6
5
e1
4
e1
6×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT886
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
MO-252
Fig 22. Package outline SOT886 (XSON6)
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
14 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
14. Abbreviations
Table 13.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PDA
Personal Digital Assistant
TTL
Transistor-Transistor Logic
15. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NX3V1G66_2
20080728
Product data sheet
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NX3V1G66_1
Modifications:
NX3V1G66_1
•
Added type number NX3V1G66GW (TSSOP5 / SOT353-1 package)
20080421
Product data sheet
NX3V1G66_2
Product data sheet
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© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
15 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NX3V1G66_2
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 02 — 28 July 2008
16 of 17
NX3V1G66
NXP Semiconductors
Low-voltage analog switch
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
11.2
11.3
12
12.1
12.2
12.3
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ON resistance test circuit and graphs. . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveform and test circuits . . . . . . . . . . . . . . . . 8
Additional dynamic characteristics . . . . . . . . . . 9
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 28 July 2008
Document identifier: NX3V1G66_2