LX5514M_PB.pdf

LX5514M
®
TM
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
P RODUCTION D ATA S HEET
KEY FEATURES
DESCRIPTION
LX5514M also features an on-chip
power detector at the output port of
the PA to help reduce BOM cost and
PCB space for implementation of
power control in a typical wireless
system.
The LX5514M is available in a 6pin 1.5mm x 1.5mm dual flat no lead
package (DFN 1.51.5mm2-6L). The
compact footprint, low profile, and
excellent thermal capability make the
LX5514M an ideal solution for
802.11b/g/n applications.
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Advanced InGaP HBT
2.4-2.5GHz Operation
Single-Polarity 3.3V Supply
Quiescent Current ~ 84mA
Power Gain ~ 27dB
19dBm @3% EVM/3.3V
Total Ic ~ 130mA @19dBm/3.3V
Complete On-Chip Input Match
Simple Output Match
2
Small Footprint: 1.5x1.5mm
Low Profile: 0.4mm
W W W. Microsemi .CO M
The LX5514M is a power amplifier
optimized for WLAN(802.11b/g/n)
applications in the 2.4-2.5 GHz
frequency
range.
The
PA
is
implemented as a two-stage monolithic
microwave integrated circuit (MMIC)
with active bias, on-chip input
matching, and output pre-matching.
The device is manufactured with an
InGaP/GaAs Heterojunction Bipolar
Transistor
(HBT)
IC
process
(MOCVD). It operates with a single
positive voltage supply of 3.3V, and
provides power gain of 27dB and output
powers of 19dBm at 3.3V for 3% EVM
in the 2.4-2.5GHz.
APPLICATIONS
 802.11b/g/n
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
BLOCK DIAGRAM
1.5X1.5MM MLP PACKAGE
PACKAGE ORDER INFO
LL
Plastic DFN 1.51.5-6L
RoHS Compliant / Pb-free
LX5514MLL
LX5514M
Note: XX is a date code.
Note: Available in Tape & Reel. Append the letters “TR”
to the part number. (i.e. LX5514MLL-TR)
Copyright  2010
Rev.1.0, 2010-07-02
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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LX5514M
®
TM
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
VCC 6
1
VB
5
2 DET
VC1 4
3 OUT
IN
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
W W W. Microsemi .CO M
DC Supply Voltage, RF off............................................................................................ 5 V
Collector Current .....................................................................................................500 mA
Total Power Dissipation.................................................................................................2 W
RF Input Power (With 50 Ohm Load at Output)................................................... +10 dBm
Maximum Junction Temperature (TJ max) ............................................................... +150°C
Operation Ambient Temperature (TA) .............................................................-40 to +85°C
Storage Temperature ......................................................................................-65 to +150°C
Peak Package Temp. for Solder Reflow (40 seconds max exposure) ......... +260°C (+0,-5)
LQ PACKAGE
(Bottom View)
RoHS / Pb-free NiPdAu Lead Finish
THERMAL DATA
LQ
Plastic QFN 33 16-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, JC
8.4 C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA
86.1 C/W
Junction Temperature Calculation : TJ=TA+(PDJA).
The JA numbers are guidelines for the thermal performance of the device/pc-board system. The 4
layers PCB is constructed based on JESD 51-7 specification and via based on JESD 51-5. All of the
above assume no ambient airflow.
FUNCTIONAL PIN DESCRIPTION
Name
Pin
Description
RF IN
5
RF input into the power amplifier. This pin is RF-matched to 50 Ohm, and shorted to
ground at DC.
VB
1
Bias current control voltage for the first and second stage.
VCC
6
Supply voltage for the bias reference and control circuits.
RF OUT
3
RF output and power supply for the second stage amplifier.
VC1
4
Power supply for the first stage amplifier.
DET
2
DETECTOR output.
PACKAGE DATA
Copyright  2010
Rev.1.0, 2010-07-02
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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