PHILIPS SA57026

INTEGRATED CIRCUITS
SA57026
300 mA LDO with ON/OFF control and
independent delayed RESET function
Product data
Supersedes data of 2001 Oct 03
2003 Oct 13
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
GENERAL DESCRIPTION
The SA57026 has an extremely precise fixed output with a typical
accuracy of ±2%. It is designed to provide very low dropout and low
noise in CD-ROM drives, battery-operated systems, and portable
computers applications. This regulator consists of an internal
voltage reference, an error amplifier, a driver with current limiter, and
a thermal shut-down mechanism.
An Active-LOW RESET is assered when the detected voltage
(VDET) falls below the reset voltage threshold. The RESET output
remains low for 30 µs (typical) when zero capacitance connected to
Cd pin. The reset time delay can be adjusted by replacing
cpacitance values from Cd pin to Ground.
The device is available in the 7-pin small outline package (SOP002).
FEATURES
APPLICATIONS
• Very low dropout voltage: 500 mV typ. (Iout = 50 mA)
• High precision output voltage: ±2%
• Output current capacity: 300 mA
• Low noise: 40 mVrms typ. @ 20 Hz to 80 KHz and for Cn = 10 nF
• Extremely good line regulation: 10 mV typical
• Extremely good load regulation: 20 mV typical
• Low temperature drift co-efficient to Vout: ±100 ppm/°C
• Internal current limit and thermal shut-down circuits
• Adjustment-free reset detection voltage: 4.2 V typ.
• Delay time can be adjusted by external capacitor
• Wide operating temperature range: –40 °C to +85 °C
• CD-ROM drives
• Electronic notebooks, PDAs and palmtop computers
• Cameras, VCRs and camcorders
• PCMCIA cards
• Modems
• Battery-operated or hand-held instruments
BLOCK DIAGRAM
4
VIN
5
VOUT
2
RESET
1
GND
ON/OFF
3
THERMAL
PROTECT
7
Cd
SL01528
Figure 1. Block diagram.
2003 Oct 13
2
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
SA57026
DESCRIPTION
VERSION
TEMPERATURE
RANGE
small outline 7-pin surface mount (see dimensional drawing)
SOP002
–40 to +85 °C
NOTE:
The device has two reset threshold options.
Part number marking
XX
Output voltage (Typ.)
Reset threshold (Typ.)
SA57026D
3.3 V
4.20 V
SA57026F
3.3 V
3.90 V
PIN CONFIGURATION
GND
1
RESET
2
ON/OFF
3
VIN
4
Part number
Marking
SA57026DD
ALU
SA57026FD
ALV
PIN DESCRIPTION
7
SA57026
Cd
6
GND
5
VOUT
PIN
SYMBOL
1
GND
2
RESET
RESET signal output pin. The output remains
low while VDET is below the reset voltage
threshold, and for an extnerl set time delay
Cd pin after VDET rises above reset
threshold.
3
ON/OFF
Output voltage on/off control pin. Connect to
VIN if not used.
ON/OFF = LOW: Voltage output (Pin 5) OFF
ON/OFF = HIGH: Voltage output (Pin 5) ON
4
VIN
5
VOUT
Regulated voltage output pin.
6
GND
Ground pin and heat sink.
7
Cd
SL01529
Figure 2. Pin configuration.
DESCRIPTION
Ground.
Voltage supply input pin.
Reset delay time capacitor pin.
RESET pin output delay time can be set by
capacitance connected to the Cd pin.
tPLH = 100000 x C
tPLH: transmission delay time (s).
C: capacitor value (F).
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
–0.3
+10
V
VIN
Supply voltage
IOUT
Output current
0
400
mA
Toper
Operating temperature
–40
+85
°C
Tstg
Storage temperature
–40
+125
°C
PD
Power dissipation (Note 1)
–
800
mW
NOTE:
1. When mounted on a 25 × 40 × 1 mm glass epoxy board.
2003 Oct 13
3
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C; VON/OFF = 1.6 V, unless otherwise specified.
SYMBOL
PARAMETER
Iccq1
No-load input current 1
Iccq2
No-load input current 2
Iccq3
Input current (OFF)
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VIN = 5 V; IOUT = 0 mA
–
3
8
mA
VIN = 4 V; IOUT = 0 mA
–
4
–
mA
VIN = 5 V; VON/OFF = 0.4 V
–
250
–
µA
VIN = 5 V; IOUT = 30 mA
SA57026D
SA57025F
3.25
3.25
3.30
3.30
3.35
3.35
V
V
VIN = 3.2 V; IOUT = 150 mA
–
0.15
0.3
V
Regulator
VOUT
Output voltage
VIO
Input/output differential voltage
V1
Line regulation
VIN = 4.4 to 5.5 V; IOUT = 30 mA
–
10
20
mV
V2
Load regulation
VIN = 5 V; IOUT = 0 to 300 mA
–
20
120
mV
∆VOUT/∆T
VOUT Temperature coefficient
(Note 1)
Tj = –20 to +85 °C; VIN = 5 V
–
100
–
ppm/°C
RR
Ripple rejection (Note 1)
VIN = 5 V; f = 120 Hz; Vripple = 1 Vp–p;
IOUT = 30 mA
–
50
80
dB
Vn
Output noise voltage (Note 1)
VIN = 5 V; f = 20 to 80 kHz;
Vripple = 1 Vp–p; IOUT = 30 mA
–
40
120
µVrms
ION
ON/OFF terminal current
VON/OFF = 1.6 V
–
5
10
µA
Vth(H)
HIGH threshold voltage
1.6
–
VIN+0.3
V
Vth(L)
LOW threshold voltage
–0.3
–
0.4
V
VIN = HIGH-to-LOW
SA57026D
SA57025F
4.11
3.81
4.20
3.90
4.29
3.99
V
V
Tj = –20 to +85 °C
–
100
–
ppm/°C
VIN = HIGH-to-LOW-to-HIGH
100
–
200
mV
VIN = 3.9 V; RL = 4.7 kΩ
–
100
200
mV
VIN = 5 V
–
–
±0.1
µA
Reset
VDET
Detection voltage
∆VS/∆T
VS temperature coefficient (Note 1)
∆VS
Hysteresis voltage
VOL
LOW-level output voltage
ILO
Output leakage current
IOL1
LOW-level output current 1
VIN = 3.9 V; RL = 0 Ω
5
–
–
mA
IOL2
LOW-level output current 2 (Note 1)
VIN = 3.9 V; RL = 0 Ω;
Tamb = –20 to +80 °C
3
–
–
mA
tPLH
LOW-to-HIGH transmission delay
time (Note 1)
Cd = 0.0 µF
–
30
90
µs
tPLH1
Reset delay time
VIN = 4 V to 5 V; Cd = 0.1 µF
5
10
20
ms
tPHL
HIGH-to-LOW transmission delay
time (Note 1)
–
30
90
µs
VOPL
Threshold operating voltage
–
0.65
0.85
V
VOL = 0.4 V
NOTE:
1. The parameter is guaranteed by design.
2003 Oct 13
4
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
APPLICATION INFORMATION
RESET output delay operation with an external capacitor from
Cd pin to GND
When the supply voltage crosses the release voltage (VDET) from a
low value to a value higher than the released voltage (VDET), the Cd
pin voltage starts to increase (charges up the external capacitor).
While the RESET output remains at LOW state condition until the
Cd pin voltage reaches the threshold operating voltage (VOPL) 0.4 V
typical; after that, the RESET output is reversed to HIGH state
condition.
Input capacitor
An input capacitor of ≥1 µF is required to eliminate the AC coupling
noise. This capacitor must be located as close as possible to VIN or
GND pin (not more than 1 cm) and returned to a clean analog
ground. Any good quality ceramic, tantalum or film capacitor will
work.
Output capacitor
Phase compensation is made for securing stable operation, even if
the load current varies. For this reason, an output capacitor with
good frequency characteristics is needed. Set it as close to the
circuit as possible, with wires as short as possible.
The transmission delay time (tPLH) can be set with the capacitance
Cd of an external cpacitor as shown in Equation (1):
t PLH + 10 6
Tha value of the output capacitance has to be at least 47 µF
connected from VOUT to GND. When operating from sources other
than batteries, supply-noise rejection and transient response can be
improved by increasing the value of the input and output capacitors
and employing passive filtering techniques.
Eqn. (1)
C
(Time is expressed in seconds; capacitance in Farads.)
PCB layout
The component placement around the LDO should be done carefully
to achieve good dynamic line and load response. The input and
noise capacitors should be kept close to the LDO.
ON/OFF
The regulator is fully enabled when a logic HIGH is applied to this
input. The regulator enters shutdown when a logic LOW is appplied
to this input. During shutdown, regulator output voltage falls to zero,
RESET remains valid and supply current is reduced to 5 µA (typ). If
the function is not to be used, the ON/OFF pin should be tied to VIN.
The rise in junction temperature depends on how efficiently the heat
is carried away from the junction to ambient. The junction to lead
thermal impedance is a characteristic of the package and fixed. The
thermal impedance between lead to ambient can be reduced by
increasing the copper area on the PCB. Increase the input, output
and ground trace area to reduce the junction-to-ambient impedance.
RESET output
The SA57066 has an Active-LOW RESET output. The RESET
output is driven Active-LOW within 30 µs typical (when Cd is zero
capacitance). The time delay can be adjusted up to 10 ms typical
(when Cd is 0.1 µF) of VDET falling through the reset voltage
threshold. RESET is maintained Active-HIGH after VDET rises above
thre reset threshold.
VIN
4
C
1 µF
5
R
4.7 kΩ
VOUT
SA57026
2
7
COUT
47 µF
Cd
RESET
3
1
6
R
C
0.1 µF
ON/OFF
SL01530
Figure 3. Typical application circuit.
2003 Oct 13
5
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
PACKING METHOD
The SA57026 is packed in reels, as shown in Figure 4.
GUARD
BAND
TAPE
REEL
ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 4. Tape and reel packing method
2003 Oct 13
6
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
Plastic small outline package; 7 leads; body width 4.4 mm
2003 Oct 13
7
SOP002
Philips Semiconductors
Product data
300 mA LDO with ON/OFF control and
independent delayed RESET function
SA57026
REVISION HISTORY
Rev
Date
Description
_2
20031013
Product data (9397 750 12113). ECN 853-2292 30327 of 09 September 2003.
Modifications:
• Change package name from SOP-7B to SOP002 in Ordering information and Package outline sections.
_1
20011003
Product data (9397 750 08968). ECN 853-2292 27197 of 03 October 2001.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
 Koninklijke Philips Electronics N.V. 2003
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-03
For sales offices addresses send e-mail to:
[email protected]
Document order number:
2003 Oct 13
8
9397 750 12113