PDF: 2002 Jun 07 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X A 33 23 34 22 ZE e E HE A A2 (A 3) A1 w M pin 1 index θ bp 44 Lp 12 L detail X 11 1 w M bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.45 0.30 0.20 0.12 10.1 9.9 10.1 9.9 0.8 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1 0.75 0.45 0.2 0.2 0.1 Z D (1) Z E (1) 1.14 0.85 1.14 0.85 θ o 7 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT389-1 136E08 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 02-06-07