Page No. : 1/1 RS1117 Series RS1117 Series Pin Assignment 3-Lead Plastic SOT-89 Package Code: M Pin 1: ADJ/GND Pin 2: VOUT Pin 3: VIN 1.0A Low Dropout Positive Voltage Regulator 1 Features 2 3 Tab • Low Dropout Voltage 1.4V (Max.) at 1.0A • Adjustable or Fixed Voltage (1.8V, 2.5V, 3.3V, 5V) • Over Current Protection • Thermal Overload Protection • Maximum Line Regulation 0.2% • Maximum Load Regulation 1.0% • Adjust Pin Current Less Than 120 uA 3-Lead Plastic SOT-223 Package Code: SJ Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 3 1 2 Tab Applications 1 • SCSI-2 Active Termination • High Efficiency Linear Regulators • 5V to 3.3V Voltage Converter • Battery Charger • Battery Management Circuits For Notebook And Palmtop PCs • Core Voltage Supply: FPGA, PLD, DSP, CPU 2 3-Lead Plastic TO-252 Package Code: J Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 3 Tab General Description 3-Lead Plastic TO-220AB Package Code: E Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 1 2 3 The RS1117 is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage versions. Over current and thermal protection are integrated onto the chip. Output current will limit as while it reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.4V Maximum at full rated output current. The RS1117 series provides excellent regulation over line, load and temperature variations. Absolute Maximum Ratings Parameter Symbol Maximum Units Input Voltage VIN 13 V Power Dissipation PD Internally Limited * W Operating Junction Temperature Range TOPR 0 To +125 °C Storage Temperature Range TSTG -65 To +150 °C Lead Temperature (Soldering) 5 Sec TLEAD 260 °C 2 KV/Min HBM (Human Body Mode) *: SOT-223: 0.9W(Max.), SOT-89: 0.6W(Max.), TO-252: 0.9W(Max.), TO-220: 2.1W(Max.) DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 2/2 Electrical Characteristics RS1117-1.8 Parameter Symbol Output Voltage VOUT Line Regulation Load Regulation Dropout Voltage Current Limit Quiescent Current Temp. Coefficient Temp. Stability RMS Output Noise Ripple Rejection Ratio REGLINE REGLOAD VDROPOUT IS IQ TC TS VN RA Test Conditions TJ=25 oC VIN=5V, IO=0A TJ=0 oC to 70 oC VIN=4.75V to 7V, IO=0A TJ=0 oC to 70 oC VIN=5V, IO=0A to 1A TJ=0 oC to 70 oC o o △VO=±3%, IO=1A TJ=0 C to 70 C o VIN=4.75V to 7V TJ=0 C to 70 oC VIN=5V, IO=0A to 1A TJ=0 oC to 70 oC VIN=4.75V to 7V, IO=0A to 1A VIN=5V, IO=100mA TJ=0 oC to 70 oC 10Hz ≦ f ≦ 10KHz TJ=25 oC VIN=5V, IO=1A TJ=0 oC to 70 oC Min. 1.782 1.764 1.0 60 Typ. 1.800 1.800 0.1 1.2 1.5 6.0 0.005 0.5 0.003 72 Max. Units 1.818 V 1.836 0.2 % 1.0 1.4 V A 13 mA %/ oC % %△VO dB Min. 4.950 4.900 1.0 60 Typ. 5.000 5.000 0.1 1.2 1.5 6.0 0.005 0.5 0.003 72 Max. Units 5.050 V 5.100 0.2 % 1.0 1.4 V A 13 mA %/ oC % %△VO dB Min. 3.270 3.234 1.0 60 Typ. 3.300 3.300 0.1 1.2 1.5 6.0 0.005 0.5 0.003 72 Max. Units 3.330 V 3.330 0.2 % 1.0 1.4 V A 13 mA %/ oC % %△VO dB Min. 2.475 2.450 1.0 60 Typ. 2.500 2.500 0.1 1.2 1.5 6.0 0.005 0.5 0.003 72 Max. Units 2.525 V 2.550 0.2 % 1.0 1.4 V A 13 mA %/ oC % %△VO dB RS1117-5.0 Parameter Symbol Test Conditions o Output Voltage VOUT Line Regulation Load Regulation Dropout Voltage Current Limit Quiescent Current Temp. Coefficient Temp. Stability RMS Output Noise Ripple Rejection Ratio REGLINE REGLOAD VDROPOUT IS IQ TC TS VN RA TJ=25 C VIN=7V, IO=0A TJ=0 oC to 70 oC VIN=7V to 9V, IO=0A TJ=0 oC to 70 oC VIN=7V, IO=0A to 1A TJ=0 oC to 70 oC o o △VO=±1%, IO=0A to 1A TJ=0 C to 70 C o VIN=7V to 10V TJ=0 C to 70 oC VIN=7V, IO=0A to 1A TJ=0 oC to 70 oC VIN=7V to 10V, IO=0A to 1A VIN=5V, IO=100mA TJ=0 oC to 70 oC 10Hz ≦ f ≦ 10KHz TJ=25 oC VIN=5V, IO=1A TJ=0 oC to 70 oC RS1117-3.3 Parameter Symbol Output Voltage VOUT Line Regulation Load Regulation Dropout Voltage Current Limit Quiescent Current Temp. Coefficient Temp. Stability RMS Output Noise Ripple Rejection Ratio REGLINE REGLOAD VDROPOUT IS IQ TC TS VN RA Test Conditions TJ=25 oC VIN=5V, IO=0A TJ=0 oC to 70 oC o o VIN=4.75V to 7V, IO=0A TJ=0 C to 70 C o VIN=5V, IO=0A to 1A TJ=0 C to 70 oC o o △VO=±1%, IO=0A to 1A TJ=0 C to 70 C o VIN=4.75V to 7V TJ=0 C to 70 oC VIN=5V, IO=0A to 1A TJ=0 oC to 70 oC VIN=4.75V to 7V, IO=0A to 1A VIN=5V, IO=100mA TJ=0 oC to 70 oC 10Hz ≦ f ≦ 10KHz TJ=25 oC VIN=5V, IO=1A TJ=0 oC to 70 oC RS1117-2.5 Parameter Symbol Output Voltage VOUT Line Regulation Load Regulation Dropout Voltage Current Limit Quiescent Current Temp. Coefficient Temp. Stability RMS Output Noise Ripple Rejection Ratio REGLINE REGLOAD VDROPOUT IS IQ TC TS VN RA DS-RS1117-04 Dec, 2007 Test Conditions TJ=25 oC VIN=5V, IO=0A o o TJ=0 C to 70 C o VIN=4.75V to 7V, IO=0A TJ=0 C to 70 oC VIN=5V, IO=0A to 1A TJ=0 oC to 70 oC o o △VO=±1%, IO=0A to 1A TJ=0 C to 70 C o VIN=4.75V to 7V TJ=0 C to 70 oC VIN=5V, IO=0A to 1A TJ=0 oC to 70 oC VIN=4.75V to 7V, IO=0A to 1A VIN=5V, IO=100mA TJ=0 oC to 70 oC 10Hz ≦ f ≦ 10KHz TJ=25 oC VIN=5V, IO=1A TJ=0 oC to 70 oC www.Orister.com Page No. : 3/3 RS1117-ADJ Parameter Symbol Reference Voltage VREF Line Regulation Load Regulation Dropout Voltage Current Limit Temp. Coefficient Adjust Pin Current Adjust Pin Current Change Temp. Stability Minimum Load Current RMS Output Noise Ripple Rejection Ratio REGLINE REGLOAD VDROPOUT IS TC IADJ △IADJ TS IO VN RA Test Conditions TJ=25 oC VIN=5V, IO=10mA o o TJ=0 C to 70 C o VIN=4.75V to 7V, IO=10mA TJ=0 C to 70 oC VIN=5V, IO=10mA to 1A TJ=0 oC to 70 oC o o △VO=±1%, IO=10mA to 1A TJ=0 C to 70 C o VIN=2.7V to 7V TJ=0 C to 70 oC VIN=2.75V to 7V, IO=10mA to 1A VIN=2.75V to 7V, IO=10mA to 1A TJ=0 oC to 70 oC VIN=2.75V to 7V, IO=10mA to 1A TJ=0 oC to 70 oC VIN=5V, IO=100mA TJ=0 oC to 70 oC VIN=5V 10Hz ≦ f ≦ 10KHz TJ=25 oC VIN=5V, IO=1A TJ=0 oC to 70 oC Min. 1.238 1.225 1.0 60 Typ. 1.250 1.250 0.1 1.2 1.5 0.005 55 0.2 0.5 5.0 0.003 72 Max. Units 1.262 V 1.275 0.2 % 1.0 1.4 V A %/ oC 120 uA 5.0 % 10 mA %△VO dB Line Regulation test circuit DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 4/4 Characteristics Curve DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 5/5 Applications Description • Output Voltage Adjustment Like most regulators, RS1117 series regulate the output by comparing the output voltage to an internally generated reference voltage. On the adjustable version, the VREF is available externally as 1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2 should be set to conduct 10mA (minimum output load). The output voltage is given by the following equation: VOUT =VREF (1+R2/R1) + IADJ R2 On fixed versions of RS1117 series, the voltage divider is provided internally. In V IN Out V OUT ADJ V REF R1 I ADJ 10uA R2 • Thermal Protection RS1117 series have thermal protection which limits junction temperature to 150°C. However, device functionality is only guaranteed to a maximum junction temperature of +125°C. The power dissipation and junction temperature for RS1117 in all packages given by PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note: TJUNCTION must not exceed 125°C VOUT =VREF (1+R2/R1) + IADJ R2 • Current Limit Protection RS1117 series are protected against overload conditions. Current protection is triggered at typically 1.5A. • Stability And Load Regulation RS1117 series require a capacitor from VOUT to GND to provide compensation feedback to the internal gain stage. This is to ensure stability at the output terminal. Typically, a 47uF tantalum or 100uF aluminum electrolytic is sufficient. Note : It is important that the ESR for this capacitor does not exceed 0.5Ω. The output capacitor does not have a theoretical upper limit and increasing its value will increase stability. COUT = 100 uF or more is typical for high current regulator design. RS1117 series load regulation are limited by the resistance of the wire connecting it to the load(RP). For the adjustable version, the best load regulation is accomplished when the top of the resistor divider(R1) is connected directly to the output pin of the RS1117 series. When so connected, RP is not multiplied by the divider ratio. For fixed output versions, the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as a negative side sense if, so desired. In V IN Adj Out RP Parasitic Line Resistance R1 Connect R1 to Case RL R2 Connect R2 to Load • Thermal Consideration The RS1117 series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive spacer can be used, as long its thermal resistance is considered. • Protection Diode (The figure is shown as Regulator with Reverse Diode Protection in advanced applications) In general operation, RS1117 series don’t need any protection diodes. From the cross-section structure of RS1117 series, the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously shorted to ground, can damage occur. A crowbar circuit at the input of the RS1117 series can generate those kinds of currents, and a diode from output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate currents large enough to do any damage. DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 6/6 SOT-223 Dimension Marking: A Pb Free Mark Pb-Free: " . " Normal: None (Note) R S 1 1 1 7 - S J Product Series (ADJ,1.8,2.5,3.3,5) B 1 2 Control Code Date Code C 3 Note: Green label is used for Pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN D E F H G Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 a1 I DIM A B C D E F G H I a1 a2 Min. 2.90 6.70 3.30 0.60 *2.30 6.30 1.40 0.25 0.02 o *13 o 0 Max. 3.10 7.30 3.70 0.80 6.70 1.80 0.35 0.10 o 10 *: Typical, Unit: mm a2 3-Lead SOT-223 Plastic Surface Mounted Package Package Code: SJ SOT-89 Dimension C Marking: H Date Code Control Code Pb Free Mark B RS 1 1 1 7 D 1 2 F Product Series 3 ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) I E G A Pb-Free: " . " (Note) Normal: None Note: Green label is used for Pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35 Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41 *: Typical, Unit: mm 3-Lead SOT-89 Plastic Surface Mounted Package Package Code: M DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 7/7 TO-252 Dimension C A Marking: Pb Free Mark Pb-Free: ". " (Note) Normal: None D B J Product Series ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) Date Code G F L RS 1 1 1 7 Control Code Note: Green label is used for Pb-free packing 3 Pin Style: 1.ADJ/GND 2.VOUT 3.VIN H E Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 2 K I DIM A B C D E F G H I J K L Min. 0.45 1.70 0.90 0.45 6.40 5.40 2.20 0.70 5.20 1.40 Max. 0.55 1.90 1.50 0.60 6.80 5.80 2.80 *2.30 0.90 0.90 5.50 1.60 *: Typical, Unit: mm 1 J 3-Lead TO-252 Plastic Surface Mount Package Package Code: J TO-220AB Dimension Marking: F B A Pb Free Mark E Pb-Free: ". " (Note) Normal: None C D Date Code RS 1117 E Product Series ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) Control Code H M I K 3 G N 2 1 Tab O P J L Note: Green label is used for Pb-free packing Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package Package Code: E DS-RS1117-04 Dec, 2007 www.Orister.com Page No. : 8/8 Ordering Information Part Number Output Voltage Part Number Output Voltage RS1117M-A ADJ Package RS1117J-A ADJ RS1117M-B 1.8V RS1117J-B 1.8V RS1117M-C 2.5V RS1117J-C 2.5V RS1117M-D 3.3V RS1117J-D 3.3V RS1117M-E 5.0V RS1117J-E 5.0V SOT-89 RS1117SJ-A ADJ RS1117E-A ADJ RS1117SJ-B 1.8V RS1117E-B 1.8V RS1117SJ-C 2.5V RS1117E-C 2.5V RS1117SJ-D 3.3V RS1117E-D 3.3V RS1117SJ-E 5.0V RS1117E-E 5.0V DS-RS1117-04 Dec, 2007 SOT-223 Package TO-252 TO-220AB www.Orister.com Page No. : 9/9 Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature o o 60~150 sec 240 C +0/-5 C 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 245oC ±5oC 5sec ±1sec 3. Flow (wave) soldering (solder dipping) Products Pb devices. o Pb-Free devices. DS-RS1117-04 o 260 C +0/-5 C Dec, 2007 5sec ±1sec www.Orister.com Page No. : 10/10 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of Orister Corporation. • Orister Corporation reserves the right to make changes to its products without notice. • Orister Corporation products are not warranted to be suitable for use in Life-Support Applications, or systems. • Orister Corporation assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DS-RS1117-04 Dec, 2007 www.Orister.com