STMICROELECTRONICS UPSD3253AV

µPSD325X
Flash Programmable System Devices
with 8032 Microcontroller Core and 256Kbit SRAM
FEATURES SUMMARY
■ The µPSD325X devices combine a Flash PSD
architecture with an 8032 microcontroller core.
The µPSD325X devices of Flash PSDs feature
dual banks of Flash memory, SRAM, general
purpose I/O and programmable logic, supervisory functions and access via USB, I2C, ADC,
DDC and PWM channels, and an on-board
8032 microcontroller core, with two UARTs,
three 16-bit Timer/Counters and two External
Interrupts. As with other Flash PSD families, the
µPSD325X devices are also in-system programmable (ISP) via a JTAG ISP interface.
■ Large 32KByte SRAM with battery back-up
option
■
Figure 1. 52-lead, Thin, Quad, Flat Package
TQFP52 (T)
Dual bank Flash memories
– 128KByte or 256KByte main Flash memory
– 32KByte secondary Flash memory
■
Content Security
Figure 2. 80-lead, Thin, Quad, Flat Package
– Block access to Flash memory
■
Programmable Decode PLD for flexible address
mapping of all memories within 8032 space.
■
High-speed clock standard 8032 core (12-cycle)
■
USB Interface (some devices only)
■
I2C interface for peripheral connections
■
5 Pulse Width Modulator (PWM) channels
■
Analog-to-Digital Converter (ADC)
■
Standalone Display Data Channel (DDC)
■
Six I/O ports with up to 50 I/O pins
■
3000 gate PLD with 16 macrocells
■
Supervisor functions with Watchdog Timer
■
In-System Programming (ISP) via JTAG
■
Zero-Power Technology
■
Single Supply Voltage
TQFP80 (U)
– 4.5 to 5.5V
– 3.0 to 3.6V
November 2002
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µPSD325X DEVICES
TABLE OF CONTENTS
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
µPSD325X Devices Product Matrix (Table 1.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TQFP52 Connections (Figure 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
TQFP80 Connections (Figure 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
80-Pin Package Pin Description (Table 2.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
52 PIN PACKAGE I/O PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ARCHITECTURE OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Memory Map and Address Space (Figure 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8032 MCU Registers (Figure 6.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Configuration of BA 16-bit Registers (Figure 7.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Stack Pointer (Figure 8.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PSW (Program Status Word) Register (Figure 9.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Data memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Interrupt Location of Program Memory (Figure 10.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
XRAM-DDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
XRAM-PSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
RAM Address (Table 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Addressing Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Direct Addressing (Figure 11.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Indirect Addressing (Figure 12.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Indexed Addressing (Figure 13.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Arithmetic Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Arithmetic Instructions (Table 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Logical Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Logical Instructions (Table 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Data Transfers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data Transfer Instructions that Access Internal Data Memory Space (Table 6.) . . . . . . . . . . . . . . 24
Shifting a BCD Number Two Digits to the Right (using direct MOVs: 14 bytes) (Table 7.) . . . . . . . 25
Shifting a BCD Number Two Digits to the Right (using direct XCHs: 9 bytes) (Table 8.) . . . . . . . . 25
Shifting a BCD Number One Digit to the Right (Table 9.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Data Transfer Instruction that Access External Data Memory Space (Table 10.) . . . . . . . . . . . . . . 26
Lookup Table READ Instruction (Table 11.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Boolean Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Boolean Instructions (Table 12.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Relative Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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Jump Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Unconditional Jump Instructions (Table 13.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Machine Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Conditional Jump Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
State Sequence in µPSD325X Devices (Figure 14.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
µPSD325X HARDWARE DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
µPSD325X devices Functional Modules (Figure 15.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
MCU MODULE DISCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Special Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
SFR Memory Map (Table 15.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
List of all SFR (Table 16.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PSD Module Register Address Offset (Table 17.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
INTERRUPT SYSTEM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
External Int0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Timer 0 and 1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Timer 2 Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
I2C Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
External Int1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
DDC Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
USB Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
USART Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Interrupt System (Figure 16.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
SFR Register (Table 18.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Interrupt Priority Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Interrupts Enable Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Priority Levels (Table 19.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Description of the IE Bits (Table 20.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Description of the IEA Bits (Table 21.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Description of the IP Bits (Table 22.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Description of the IPA Bits (Table 23.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
How Interrupts are Handled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Vector Addresses (Table 24.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
POWER-SAVING MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Power-Saving Mode Power Consumption (Table 25.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Power Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Pin Status During Idle and Power-down Mode (Table 26.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Description of the PCON Bits (Table 27.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
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µPSD325X DEVICES
I/O PORTS (MCU Module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I/O Port Functions (Table 28.) . . . . . . . . . . . . . . . . .
P1SFS (91H) (Table 29.) . . . . . . . . . . . . . . . . . . . . .
P3SFS (93H) (Table 30.) . . . . . . . . . . . . . . . . . . . . .
P4SFS (94H) (Table 31.) . . . . . . . . . . . . . . . . . . . . .
PORT Type and Description . . . . . . . . . . . . . . . . . .
PORT Type and Description (Part 1) (Figure 17.) . .
PORT Type and Description (Part 2) (Figure 18.) . .
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OSCILLATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Oscillator (Figure 19.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
SUPERVISORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
RESET Configuration (Figure 20.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Low VDD Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Watchdog Timer Overflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
USB Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
WATCHDOG TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Watchdog Timer Key Register (WDKEY: 0AEH) (Table 32.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Description of the WDKEY Bits (Table 33.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
RESET Pulse Width (Figure 21.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Watchdog Timer Clear Register (WDRST: 0A6H) (Table 34.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Description of the WDRST Bits (Table 35.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2
TIMER/COUNTERS (TIMER0, TIMER1 AND TIMER2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Timer0 and Timer1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Control Register (TCON) (Table 36.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Description of the TCON Bits (Table 37.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
TMOD Register (TMOD) (Table 38.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Description of the TMOD Bits (Table 39.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Timer/Counter Mode 0: 13-bit Counter (Figure 22.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Timer/Counter Mode 2: 8-bit Auto-reload (Figure 23.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Timer/Counter Mode 3: Two 8-bit Counters (Figure 24.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Timer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Timer/Counter 2 Control Register (T2CON) (Table 40.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Description of the T2CON Bits (Table 41.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Timer/Counter2 Operating Modes (Table 42.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Timer 2 in Capture Mode (Figure 25.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Timer 2 in Auto-Reload Mode (Figure 26.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
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µPSD325X DEVICES
STANDARD SERIAL INTERFACE (UART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Multiprocessor Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Serial Port Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Serial Port Control Register (SCON) (Table 43.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Description of the SCON Bits (Table 44.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Timer 1-Generated Commonly Used Baud Rates (Table 45.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Serial Port Mode 0, Block Diagram (Figure 27.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Serial Port Mode 0, Waveforms (Figure 28.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Serial Port Mode 1, Block Diagram (Figure 29.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Serial Port Mode 1, Waveforms (Figure 30.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Serial Port Mode 2, Block Diagram (Figure 31.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Serial Port Mode 2, Waveforms (Figure 32.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Serial Port Mode 3, Block Diagram (Figure 33.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Serial Port Mode 3, Waveforms (Figure 34.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
ANALOG-TO-DIGITAL CONVERTOR (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
ADC Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
A/D Block Diagram (Figure 35.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
ADC SFR Memory Map (Table 46.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Description of the ACON Bits (Table 47.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
ADC Clock Input (Table 48.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
PULSE WIDTH MODULATION (PWM). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4-channel PWM unit (PWM 0-3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Four-Channel 8-bit PWM Block Diagram (Figure 36.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
PWM SFR Memory Map (Table 49.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Programmable Period 8-bit PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Programmable PWM 4 Channel Block Diagram (Figure 37.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
PWM 4 Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
PWM 4 With Programmable Pulse Width and Frequency (Figure 38.) . . . . . . . . . . . . . . . . . . . . . . 76
I2C INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Block Diagram of the I2C Bus Serial I/O (Figure 39.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Serial Control Register (SxCON: S1CON, S2CON) (Table 50.) . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Description of the SxCON Bits (Table 51.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Selection of the Serial Clock Frequency SCL in Master Mode (Table 52.) . . . . . . . . . . . . . . . . . . . 78
Serial Status Register (SxSTA: S1STA, S2STA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Data Shift Register (SxDAT: S1DAT, S2DAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Serial Status Register (SxSTA) (Table 53.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Description of the SxSTA Bits (Table 54.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Data Shift Register (SxDAT: S1DAT, S2DAT) (Table 55.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Address Register (SxADR: S1ADR, S2ADR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Address Register (SxADR) (Table 56.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Start /Stop Hold Time Detection Register (S1SETUP, S2SETUP) (Table 57.) . . . . . . . . . . . . . . . . 80
System Cock of 40MHz (Table 58.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
System Clock Setup Examples (Table 59.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Programmer’s Guide for I2C and DDC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
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DDC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
DDC Interface Block Diagram (Figure 40.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Special Function Register for the DDC Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
DDC SFR Memory Map (Table 60.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Description of the DDCON Register Bits (Table 61.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
SWNEB Bit Function (Table 62.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Host Type Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Host Type Detection (Figure 41.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
DDC1 Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Transmission Protocol in the DDC1 Interface (Figure 42.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
DDC2B Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Conceptual Structure of the DDC Interface (Figure 43.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
USB HARDWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
USB related registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
USB Address Register (UADR: 0EEh) (Table 63.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Description of the UADR Bits (Table 64.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
USB Interrupt Enable Register (UIEN: 0E9h) (Table 65.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Description of the UIEN Bits (Table 66.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
USB Interrupt Status Register (UISTA: 0E8h) (Table 67.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Description of the UISTA Bits (Table 68.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
USB Endpoint0 Transmit Control Register (UCON0: 0EAh) (Table 69.) . . . . . . . . . . . . . . . . . . . . . 93
Description of the UCON0 Bits (Table 70.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
USB Endpoint1 (and 2) Transmit Control Register (UCON1: 0EBh) (Table 71.). . . . . . . . . . . . . . . 94
Description of the UCON1 Bits (Table 72.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
USB Control Register (UCON2: 0ECh) (Table 73.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Description of the UCON2 Bits (Table 74.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
USB Endpoint0 Status Register (USTA: 0EDh) (Table 75.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Description of the USTA Bits (Table 76.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
USB Endpoint0 Data Receive Register (UDR0: 0EFh) (Table 77.) . . . . . . . . . . . . . . . . . . . . . . . . . 95
USB Endpoint0 Data Transmit Register (UDT0: 0E7h) (Table 78.) . . . . . . . . . . . . . . . . . . . . . . . . 95
USB Endpoint1 Data Transmit Register (UDT1: 0E6h) (Table 79.) . . . . . . . . . . . . . . . . . . . . . . . . 95
USB SFR Memory Map (Table 80.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Low Speed Driver Signal Waveforms (Figure 44.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Receiver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Differential Input Sensitivity Over Entire Common Mode Range (Figure 45.) . . . . . . . . . . . . . . . . . 98
External USB Pull-Up Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
USB Data Signal Timing and Voltage Levels (Figure 46.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Receiver Jitter Tolerance (Figure 47.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Differential to EOP Transition Skew and EOP Width (Figure 48.) . . . . . . . . . . . . . . . . . . . . . . . . . 100
Differential Data Jitter (Figure 49.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Transceiver DC Characteristics (Table 81.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Transceiver AC Characteristics (Table 82.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1
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PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
PSD MODULE Block Diagram (Figure 50.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
In-System Programming (ISP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Methods of Programming Different Functional Blocks of the PSD MODULE (Table 83.) . . . . . . . 104
DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
PSDsoft Express Development Tool (Figure 51.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET . . . . . . . . . . . . . . . . . . . . . . . 106
Register Address Offset (Table 84.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
PSD MODULE DETAILED OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
MEMORY BLOCKS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Primary Flash Memory and Secondary Flash memory Description. . . . . . . . . . . . . . . . . . . . . . . . 107
Memory Block Select Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Instructions (Table 85.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Power-down Instruction and Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Status Bit (Table 86.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Data Polling Flowchart (Figure 52.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Data Toggle Flowchart (Figure 53.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Erasing Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Specific Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Sector Protection/Security Bit Definition – Flash Protection Register (Table 87.) . . . . . . . . . . . . . 115
Sector Protection/Security Bit Definition – Secondary Flash Protection Register (Table 88.) . . . . 115
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Sector Select and SRAM Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Priority Level of Memory and I/O Components in the PSD MODULE (Figure 54.) . . . . . . . . . . . . 117
VM Register (Table 89.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Separate Space Mode (Figure 55.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Combined Space Mode (Figure 56.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Page Register (Figure 57.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
DPLD and CPLD Inputs (Table 90.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
The Turbo Bit in PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
PLD Diagram (Figure 58.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Decode PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
DPLD Logic Array (Figure 59.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Macrocell and I/O Port (Figure 60.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Output Macrocell Port and Data Bit Assignments (Table 91.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
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Product Term Allocator . . . . . . . . . . . . . . . .
CPLD Output Macrocell (Figure 61.) . . . . . .
Input Macrocells (IMC) . . . . . . . . . . . . . . . .
Input Macrocell (Figure 62.). . . . . . . . . . . . .
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I/O PORTS (PSD MODULE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
General Port Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
General I/O Port Architecture (Figure 63.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
MCU I/O Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Peripheral I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Peripheral I/O Mode (Figure 64.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Port Operating Modes (Table 92.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Port Operating Mode Settings (Table 93.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
I/O Port Latched Address Output Assignments (Table 94.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Port Configuration Registers (PCR) (Table 95.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Port Pin Direction Control, Output Enable P.T. Not Defined (Table 96.) . . . . . . . . . . . . . . . . . . . . 130
Port Pin Direction Control, Output Enable P.T. Defined (Table 97.) . . . . . . . . . . . . . . . . . . . . . . . 130
Port Direction Assignment Example (Table 98.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Drive Register Pin Assignment (Table 99.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Ports A and B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Port A and Port B Structure (Figure 65.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Port C Structure (Figure 66.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Port D Structure (Figure 67.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Port D External Chip Select Signals (Figure 68.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
APD Unit (Figure 69.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Enable Power-down Flow Chart (Figure 70.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Power-down Mode’s Effect on Ports (Table 101.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
PLD Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Input Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Power Management Mode Registers PMMR01 (Table 102.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Power Management Mode Registers PMMR21 (Table 103.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
APD Counter Operation (Table 104.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
8/176
µPSD325X DEVICES
RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Warm RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
I/O Pin, Register and PLD Status at RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Reset of Flash Memory Erase and Program Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Reset (RESET) Timing (Figure 71.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Status During Power-on RESET, Warm RESET and Power-down Mode (Table 105.). . . . . . . . . 141
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . 142
Standard JTAG Signals . . . . . . . . . . . . . . . .
JTAG Port Signals (Table 106.). . . . . . . . . .
JTAG Extensions . . . . . . . . . . . . . . . . . . . . .
Security and Flash memory Protection . . . .
......
......
......
......
.......
.......
.......
.......
......
......
......
......
.......
.......
.......
.......
......
......
......
......
. . . . . . . . . 142
. . . . . . . . . 142
. . . . . . . . . 142
. . . . . . . . . 142
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
PLD ICC /Frequency Consumption (5V range) (Figure 72.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
PLD ICC /Frequency Consumption (3V range) (Figure 73.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
PSD MODULE Example, Typ. Power Calculation at VCC = 5.0V (Turbo Mode Off) (Table 107.) . 144
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
Absolute Maximum Ratings (Table 108.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Operating Conditions (5V Devices) (Table 109.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Operating Conditions (3V Devices) (Table 110.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
AC Symbols for Timing (Table 111.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Switching Waveforms – Key (Figure 74.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
DC Characteristics (5V Devices) (Table 112.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
DC Characteristics (3V Devices) (Table 113.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
External Program Memory READ Cycle (Figure 75.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
External Program Memory AC Characteristics (with the 5V MCU Module) (Table 114.) . . . . . . . 152
External Program Memory AC Characteristics (with the 3V MCU Module) (Table 115.) . . . . . . . 153
External Clock Drive (with the 5V MCU Module) (Table 116.) . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
External Clock Drive (with the 3V MCU Module) (Table 117.) . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
External Data Memory READ Cycle (Figure 76.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
External Data Memory WRITE Cycle (Figure 77.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
External Data Memory AC Characteristics (with the 5V MCU Module) (Table 118.). . . . . . . . . . . 155
External Data Memory AC Characteristics (with the 3V MCU Module) (Table 119.). . . . . . . . . . . 156
A/D Analog Specification (Table 120.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Input to Output Disable / Enable (Figure 78.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
CPLD Combinatorial Timing (5V Devices) (Table 121.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
CPLD Combinatorial Timing (3V Devices) (Table 122.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
Synchronous Clock Mode Timing – PLD (Figure 79.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
CPLD Macrocell Synchronous Clock Mode Timing (5V Devices) (Table 123.) . . . . . . . . . . . . . . . 158
CPLD Macrocell Synchronous Clock Mode Timing (3V Devices) (Table 124.) . . . . . . . . . . . . . . . 159
Asynchronous RESET / Preset (Figure 80.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
9/176
µPSD325X DEVICES
Asynchronous Clock Mode Timing (product term clock) (Figure 81.) . . . . . . . . . . . . . . . . . . . . . . 160
CPLD Macrocell Asynchronous Clock Mode Timing (5V Devices) (Table 125.) . . . . . . . . . . . . . . 160
CPLD Macrocell Asynchronous Clock Mode Timing (3V Devices) (Table 126.) . . . . . . . . . . . . . . 161
Input Macrocell Timing (product term clock) (Figure 82.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Input Macrocell Timing (5V Devices) (Table 127.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Input Macrocell Timing (3V Devices) (Table 128.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
Program, WRITE and Erase Times (5V Devices) (Table 129.) . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Program, WRITE and Erase Times (3V Devices) (Table 130.) . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Peripheral I/O READ Timing (Figure 83.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
Port A Peripheral Data Mode READ Timing (5V Devices) (Table 131.) . . . . . . . . . . . . . . . . . . . . 164
Port A Peripheral Data Mode READ Timing (3V Devices) (Table 132.) . . . . . . . . . . . . . . . . . . . . 164
Peripheral I/O WRITE Timing (Figure 84.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
Port A Peripheral Data Mode WRITE Timing (5V Devices) (Table 133.) . . . . . . . . . . . . . . . . . . . 165
Port A Peripheral Data Mode WRITE Timing (3V Devices) (Table 134.) . . . . . . . . . . . . . . . . . . . 165
Reset (RESET) Timing (Figure 85.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
Reset (RESET) Timing (5V Devices) (Table 135.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
Reset (RESET) Timing (3V Devices) (Table 136.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
VSTBYON Definitions Timing (5V Devices) (Table 137.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
VSTBYON Timing (3V Devices) (Table 138.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
ISC Timing (Figure 86.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
ISC Timing (5V Devices) (Table 139.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
ISC Timing (3V Devices) (Table 140.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
MCU Module AC Measurement I/O Waveform (Figure 87.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
PSD MODULE AC Float I/O Waveform (Figure 88.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
External Clock Cycle (Figure 89.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
Recommended Oscillator Circuits (Figure 90.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
PSD MODULE AC Measurement I/O Waveform (Figure 91.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
PSD MODULE AC Measurement Load Circuit (Figure 92.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
Capacitance (Table 141.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
10/176
µPSD325X DEVICES
SUMMARY DESCRIPTION
■ Dual bank Flash memories
– Concurrent operation, read from memory
while erasing and writing the other. In-Application Programming (IAP) for remote updates
■
4-channel, 8-bit Analog-to-Digital Converter
(ADC) with analog supply voltage (VREF)
■
Standalone Display Data Channel (DDC)
– For use in monitor, projector, and TV applications
– Large 128KByte or 256KByte main Flash
memory for application code, operating systems, or bit maps for graphic user interfaces
– Large 32KByte secondary Flash memory divided in small sectors. Eliminate external EEPROM with software EEPROM emulation
– Secondary Flash memory is large enough for
sophisticated communication protocol (USB)
during IAP while continuing critical system
tasks
■
– Compliant with VESA standards DDC1 and
DDC2B
– Eliminate external DDC PROM
■
– Multifunction I/O: GPIO, DDC, I2C, PWM,
PLD I/O, supervisor, and JTAG
– Eliminates need for external latches and logic
■
Programmable Decode PLD for flexible address
mapping of all memories
– Eliminate external PALs, PLDs, and 74HCxx
– Simple PSDsoft Express software ...Free
■
– Place individual Flash and SRAM sectors on
any address boundary
■
■
– RESET Input pin; Reset output via PLD
■
– Program entire chip in 10 - 25 seconds with
no involvement of 8032
– Allows efficient manufacturing, easy product
testing, and Just-In-Time inventory
– 40MHz operation at 5V, 24MHz at 3.3V
– Eliminate sockets and pre-programmed parts
– 2 UARTs with independent baud rate, three
16-bit Timer/Counters and two External Interrupts
– Program with FlashLINKTM cable and any PC
■
I2C interface for peripheral connections
– Capable of master or slave operation
5 Pulse Width Modulator (PWM) channels
– Four 8-bit PWM units
– One 8-bit PWM unit with programmable period
Content Security
– Programmable Security Bit blocks access of
device programmers and readers
USB Interface (some devices only)
■
– Control endpoint 0 and interrupt endpoints 1
and 2
■
In-System Programming (ISP) via JTAG
High-speed clock standard 8032 core (12-cycle)
– Supports USB 1.1 Slow Mode (1.5Mbit/s)
■
Supervisor functions
– Generates reset upon low voltage or watchdog time-out. Eliminate external supervisor
device
– Built-in page register breaks restrictive 8032
limit of 64KByte address space
– Special register swaps Flash memory segments between 8032 “program” space and
“data” space for efficient In-Application Programming
3000 gate PLD with 16 macrocells
– Create glue logic, state machines, delays,
etc.
Large SRAM with battery back-up option
– 32KByte SRAM for RTOS, high-level languages, communication buffers, and stacks
■
Six I/O ports with up to 50 I/O pins
Zero-Power Technology
– Memories and PLD automatically reach
standby current between input changes
■
Packages
– 52-pin TQFP
– 80-pin TQFP: allows access to 8032 address/
data/control signals for connecting to external
peripherals
11/176
µPSD325X DEVICES
Table 1. µPSD325X Devices Product Matrix
Part
No.
Main Sec.
ADC
SRAM Macro I/O PWM Timer UART 2
Flash Flash
I C Ch.
(bit)
-Cells Pins Ch.
/ Ctr
Ch.
(bit)
(bit)
DDC
USB
VCC
yes
5V
40
52 or
80
MHz Pins
uPSD
3254
A-40
2M
256K
256K
16
41 or
50
5
3
2
1
4
yes
uPSD
3254
BV-24
2M
256K
256K
16
50
5
3
2
1
4
yes
3V
24
80
uPSD
3253
B-40
1M
256K
256K
16
41
5
3
2
1
4
yes
5V
40
52
uPSD
3253
BV-24
1M
256K
256K
16
41
5
3
2
1
4
yes
3V
24
52
40 ADC2
41 ADC3
42 PB7
43 PB6
44 RESET
45 GND
46 VREF
47 PB5
48 PB4
49 PB3
50 PB2
51 PB1
52 PB0
Figure 3. TQFP52 Connections
PD1 1
39 P1.5 / ADC1
PC7 2
38 P1.4 / ADC0
PC6 3
37 P1.3 / TXD1
PC5 4
36 P1.2 / RXD1
USB– 5(1)
35 P1.1 / T2X
34 P1.0 / T2
PC4 6
USB+ 7
33 VCC
P3.3 / EXINT1 26
P3.2 / EXINT0 25
P3.1 / TXD 24
P3.0 / RXD 23
P4.0 / DDC SDA 22
P4.1 / DDC SCL 21
P4.2 / DDC VSYNC 20
27 P3.4 / T0
GND 19
28 P3.5 / T1
PC0 13
P4.3 / PWM0 18
29 P3.6 / SDA1
PC1 12
P4.4 / PWM1 17
30 P3.7 / SCL1
PC2 11
P4.5 / PWM2 16
31 XTAL1
PC3 10
P4.6 / PWM3 15
32 XTAL2
GND 9
P4.7 / PWM4 14
VCC 8
AI05790C
Note: 1. Pull-up resistor required on pin 5 (2kΩ for 3V devices, 7.5kΩ for 5V devices) for all 52-pin devices, with or without USB function.
12/176
µPSD325X DEVICES
61 P1.6 / ADC2
62 WR, CNTL0
63 PSEN, CNTL2
64 P1.7 / ADC3
65 RD, CNTL1
66 PB7
67 PB6
68 RESET
69 GND
70 VREF
71 NC
72 PB5
73 PB4
74 PB3
75 P3.0 / RXD
76 PB2
77 P3.1 / TXD
78 PB1
79 P3.2 / EXINT0
80 PB0
Figure 4. TQFP80 Connections
PD2 1
60 P1.5 / ADC1
P3.3 /EXINT1 2
59 P1.4 / ADC0
PD1 3
58 P1.3 / TXD1
57 P2.3, A11
PD0, ALE 4
PC7 5
56 P1.2 / RXD1
PC6 6
55 P2.2, A10
PC5 7
54 P1.1 / T2X
USB- 8(1)
53 P2.1, A9
PC4 9
52 P1.0 / T2
USB+ 10
51 P2.0, A8
50 VCC
NC 11
VCC 12
49 XTAL2
GND 13
48 XTAL1
PC3 14
47 P0.7, AD7
PC2 15
46 P3.7 / SCL1
PC1 16
45 P0.6, AD6
NC 17
44 P3.6 / SDA1
P4.7 / PWM4 18
43 P0.5, AD5
P4.6 / PWM3 19
42 P3.5 / T1
41 P0.4, AD4
P3.4 / T0 40
AD3, P0.3 39
AD2, P0.2 38
AD1, P0.1 37
PA0 35
AD0, P0.0 36
PA1 34
P4.0 / DDC SDA 33
PA2 32
P4.1 / DDC SCL 31
P4.2 / DCC VSYNC 30
PA3 28
GND 29
P4.3 / PWM0 27
PA4 26
P4.4 / PWM1 25
PA5 24
P4.5 / PWM2 23
PA6 22
PA7 21
PC0 20
AI05791B
Note: NC = Not Connected
1. Pull-up resistor required on pin 8 (2kΩ for 3V devices, 7.5kΩ for 5V devices) for all 82-pin devices, with or without USB function.
13/176
µPSD325X DEVICES
Table 2. 80-Pin Package Pin Description
Function
Signal
Name
Pin No.
P0.0
AD0
36
I/O
External Bus
Multiplexed Address/Data bus A1/D1
P0.1
AD1
37
I/O
Multiplexed Address/Data bus A0/D0
P0.2
AD2
38
I/O
Multiplexed Address/Data bus A2/D2
P0.3
AD3
39
I/O
Multiplexed Address/Data bus A3/D3
P0.4
AD4
41
I/O
Multiplexed Address/Data bus A4/D4
P0.5
AD5
43
I/O
Multiplexed Address/Data bus A5/D5
P0.6
AD6
45
I/O
Multiplexed Address/Data bus A6/D6
P0.7
AD7
47
I/O
Multiplexed Address/Data bus A7/D7
P1.0
T2
52
I/O
General I/O port pin
Timer 2 Count input
P1.1
T2EX
54
I/O
General I/O port pin
Timer 2 Trigger input
P1.2
RxD2
56
I/O
General I/O port pin
2nd UART Receive
P1.3
TxD2
58
I/O
General I/O port pin
2nd UART Transmit
P1.4
ADC0
59
I/O
General I/O port pin
ADC Channel 0 input
P1.5
ADC1
60
I/O
General I/O port pin
ADC Channel 1 input
P1.6
ADC2
61
I/O
General I/O port pin
ADC Channel 2 input
P1.7
ADC3
64
I/O
General I/O port pin
ADC Channel 3 input
P2.0
A8
51
I/O
External Bus, Address A8
P2.1
A9
53
I/O
External Bus, Address A9
P2.2
A10
55
I/O
External Bus, Address A10
P2.3
A11
57
I/O
External Bus, Address A11
P3.0
RxD1
75
I/O
General I/O port pin
UART Receive
P3.1
TxD1
77
I/O
General I/O port pin
UART Transmit
P3.2
INTO
79
I/O
General I/O port pin
Interrupt 0 input / timer0 gate
control
P3.3
INT1
2
I/O
General I/O port pin
Interrupt 1 input / timer1 gate
control
P3.4
T0
40
I/O
General I/O port pin
Counter 0 input
P3.5
T1
42
I/O
General I/O port pin
Counter 1 input
P3.6
SDA1
44
I/O
General I/O port pin
I2C Bus serial data I/O
P3.7
SCL1
46
I/O
General I/O port pin
I2C Bus clock I/O
P4.0
SDA2
33
I/O
General I/O port pin
I2C serial data I/O for DDC
interface
P4.1
SCL2
31
I/O
General I/O port pin
I2C clock I/O for DDC interface
P4.2
VSYNC
30
I/O
General I/O port pin
VSYNC input for DDC interface
Port Pin
14/176
In/Out
Basic
Alternate
µPSD325X DEVICES
Function
Signal
Name
Pin No.
P4.3
PWM0
27
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 0
P4.4
PWM1
25
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 1
P4.5
PWM2
23
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 2
P4.6
PWM3
19
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 3
P4.7
PWM4
18
I/O
General I/O port pin
Programmable 8-bit Pulse Width
modulation output 4
Port Pin
In/Out
Basic
USB-
8
I/O
USB Pin Pull-up resistor required
(2kΩ for 3V devices, 7.5kΩ for 5V
devices) for all devices, with or
without USB function.
USB+
10
I/O
USB Pin
AVREF
70
O
Reference Voltage input for ADC
RD_
65
O
READ signal, external bus
WR_
62
O
WRITE signal, external bus
PSEN_
63
O
PSEN signal, external bus
ALE
4
O
Address Latch signal, external bus
RESET_
68
I
Active low RESET input
XTAL1
48
I
Oscillator input pin for system clock
XTAL2
49
O
Oscillator output pin for system clock
PA0
35
I/O
General I/O port pin
PA1
34
I/O
General I/O port pin
PA2
32
I/O
General I/O port pin
PA3
28
I/O
General I/O port pin
PA4
26
I/O
General I/O port pin
PA5
24
I/O
General I/O port pin
PA6
22
I/O
General I/O port pin
PA7
21
I/O
General I/O port pin
Alternate
1.
2.
3.
4.
PLD Macro-cell outputs
PLD inputs
Latched Address Out (A0-A7)
Peripheral I/O Mode
15/176
µPSD325X DEVICES
Port Pin
Signal
Name
Function
Pin No.
In/Out
Basic
PB0
80
I/O
General I/O port pin
PB1
78
I/O
General I/O port pin
PB2
76
I/O
General I/O port pin
PB3
74
I/O
General I/O port pin
PB4
73
I/O
General I/O port pin
PB5
72
I/O
General I/O port pin
PB6
67
I/O
General I/O port pin
PB7
66
I/O
General I/O port pin
PC0
TMS
20
I
JTAG pin
PC1
TCK
16
I
JTAG pin
PC2
VSTBY
15
I/O
General I/O port pin
PC3
TSTAT
14
I/O
General I/O port pin
PC4
TERR
9
I/O
General I/O port pin
PC5
TDI
7
I
JTAG pin
PC6
TDO
6
O
JTAG pin
5
I/O
General I/O port pin
PC7
1. PLD Macro-cell outputs
2. PLD inputs
3. Latched Address Out (A0-A7)
1. PLD Macro-cell outputs
2. PLD inputs
3. SRAM stand by voltage input
(VSTBY)
4. SRAM battery-on indicator
(PC4)
5. JTAG pins are dedicated pins
PD1
CLKIN
3
I/O
General I/O port pin
1. PLD I/O
2. Clock input to PLD and APD
PD2
CSI
1
I/O
General I/O port pin
1. PLD I/O
2. Chip select to PSD Module
Vcc
12
Vcc
50
GND
13
GND
29
GND
69
NC
11
NC
17
NC
71
52 PIN PACKAGE I/O PORT
The 52-pin package members of the µPSD325X
devices have the same port pins as those of the
80-pin package except:
■ Port 0 (P0.0-P0.7, external address/data bus
AD0-AD7)
■
Alternate
Port 2 (P2.0-P2.3, external address bus A8A11)
16/176
■
Port A (PA0-PA7)
■
Port D (PD2)
■
Bus control signal (RD,WR,PSEN,ALE)
Pin 5 requires a pull-up resistor (2kΩ for 3V devices, 7.5kΩ for 5V devices) for all devices, with
or without USB function.
µPSD325X DEVICES
ARCHITECTURE OVERVIEW
Memory Organization
The µPSD325X devices’ standard 8032 Core has
separate 64KB address spaces for Program memory and Data Memory. Program memory is where
the 8032 executes instructions from. Data memory
is used to hold data variables. Flash memory can
be mapped in either program or data space. The
Flash memory consists of two flash memory
blocks: the main Flash (1 or 2Mbit) and the Secondary Flash (256Kbit). Except during flash memory programming or update, Flash memory can
only be read, not written to. A Page Register is
used to access memory beyond the 64K bytes address space. Refer to the PSD Module for details
on mapping of the Flash memory.
The 8032 core has two types of data memory (internal and external) that can be read and written.
The internal SRAM consists of 256 bytes, and includes the stack area.
The SFR (Special Function Registers) occupies
the upper 128 bytes of the internal SRAM, the registers can be accessed by Direct addressing only.
There are two separate blocks of external SRAM
inside the µPSD325X devices: one 256 bytes
block is assigned for DDC data storage. Another
32K bytes resides in the PSD Module that can be
mapped to any address space defined by the user.
Figure 5. Memory Map and Address Space
MAIN
FLASH
EXT. RAM
INT. RAM
SFR
Indirect
Addressing
Direct
Addressing
FF
SECONDARY
FLASH
128KB
EXT. RAM
(DDC)
FFFF
256B
32KB
OR
7F
32KB
256KB
Indirect
or
Direct
Addressing
0
Flash Memory Space
FF00
Internal RAM Space
(256 Bytes)
External RAM Space
(MOVX)
AI07422
Registers
The 8032 has several registers; these are the Program Counter (PC), Accumulator (A), B Register
(B), the Stack Pointer (SP), the Program Status
Word (PSW), General purpose registers (R0 to
R7), and DPTR (Data Pointer register).
Figure 6. 8032 MCU Registers
A
Accumulator
B
B Register
SP
PCH
PCL
Program Counter
PSW
Program Status Word
General Purpose
Register (Bank0-3)
Data Pointer Register
R0-R7
DPTR(DPH)
Stack Pointer
DPTR(DPL)
AI06636
17/176
µPSD325X DEVICES
Accumulator. The Accumulator is the 8-bit general purpose register, used for data operation such
as transfer, temporary saving, and conditional
tests. The Accumulator can be used as a 16-bit
register with B Register as shown below.
Figure 7. Configuration of BA 16-bit Registers
B
B
A
A
Two 8-bit Registers can be used as a "BA" 16-bit Registers
AI06637
B Register. The B Register is the 8-bit general
purpose register, used for an arithmetic operation
such as multiply, division with Accumulator
Stack Pointer. The Stack Pointer Register is 8
bits wide. It is incremented before data is stored
during PUSH and CALL executions. While the
stack may reside anywhere in on-chip RAM, the
Stack Pointer is initialized to 07h after reset. This
causes the stack to begin at location 08h.
Figure 8. Stack Pointer
Stack Area (30h-FFh)
Bit 15
Bit 8 Bit 7
00h
Hardware Fixed
Bit 0
SP
00h-FFh
SP (Stack Pointer) could be in 00h-FFh
AI06638
18/176
Program Counter. The Program Counter is a 16bit wide which consists of two 8-bit registers, PCH
and PCL. This counter indicates the address of the
next instruction to be executed. In RESET state,
the program counter has reset routine address
(PCH:00h, PCL:00h).
Program Status Word. The Program Status
Word (PSW) contains several bits that reflect the
current state of the CPU and select Internal RAM
(00h to 1Fh: Bank0 to Bank3). The PSW is described in Figure 9, page 19. It contains the Carry
flag, the Auxiliary carry flag, the Half Carry (for
BCD operation), the general purpose flag, the
Register bank select flags, the Overflow flag, and
Parity flag.
[Carry Flag, CY]. This flag stores any carry or not
borrow from the ALU of CPU after an arithmetic
operation and is also changed by the Shift Instruction or Rotate Instruction.
[Auxiliary Carry Flag, AC]. After operation, this is
set when there is a carry from Bit 3 of ALU or there
is no borrow from Bit 4 of ALU.
[Register Bank Select Flags, RS0, RS1]. This flags
select one of
four bank(00~07H:bank0,
08~0Fh:bank1, 10~17h:bank2, 17~1Fh:bank3) in
Internal RAM.
[Overflow Flag, OV]. This flag is set to ’1’ when an
overflow occurs as the result of an arithmetic operation involving signs. An overflow occurs when the
result of an addition or subtraction exceeds +127
(7Fh) or -128 (80h). The CLRV instruction clears
the overflow flag. There is no set instruction. When
the BIT instruction is executed, Bit 6 of memory is
copied to this flag.
[Parity Flag, P]. This flag reflect on number of Accumulator’s 1. If number of Accumulator’s 1 is odd,
P=0. otherwise P=1. Sum of adding Accumulator’s
1 to P is always even.
R0~R7. General purpose 8-bit registers that are
locked in the lower portion of internal data area.
Data Pointer Register. Data Pointer Register is
16-bit wide which consists of two-8bit registers,
DPH and DPL. This register is used as a data
pointer for the data transmission with external data
memory in the PSD Module.
µPSD325X DEVICES
Figure 9. PSW (Program Status Word) Register
MSB
PSW
CY AC FO RS1 RS0 OV
Carry Flag
LSB
P Reset Value 00h
Parity Flag
Auxillary Carry Flag
Bit not assigned
General Purpose Flag
Overflow Flag
Register Bank Select Flags
(to select Bank0-3)
AI06639
Program Memory
The program memory consists of two Flash memory: 128 KByte (or 256 KByte) Main Flash and 32
KByte of Secondary Flash. The Flash memory can
be mapped to any address space as defined by
the user in the PSDsoft Tool. It can also be
mapped to Data memory space during Flash
memory update or programming.
After reset, the CPU begins execution from location 0000h. As shown in Figure 10, each interrupt
is assigned a fixed location in Program Memory.
The interrupt causes the CPU to jump to that location, where it commences execution of the service
routine. External Interrupt 0, for example, is assigned to location 0003h. If External Interrupt 0 is
going to be used, its service routine must begin at
location 0003h. If the interrupt is not going to be
used, its service location is available as general
purpose Program Memory.
The interrupt service locations are spaced at 8byte intervals: 0003h for External Interrupt 0,
000Bh for Timer 0, 0013h for External Interrupt 1,
001Bh for Timer 1 and so forth. If an interrupt service routine is short enough (as is often the case
in control applications), it can reside entirely within
that 8-byte interval. Longer service routines can
use a jump instruction to skip over subsequent interrupt locations, if other interrupts are in use.
Data memory
The internal data memory is divided into four physically separated blocks: 256 bytes of internal RAM,
128 bytes of Special Function Registers (SFRs)
areas, 256 bytes of external RAM (XRAM-DDC)
and 32K bytes (XRAM-PSD) in the PSD Module.
RAM
Four register banks, each 8 registers wide, occupy
locations 0 through 31 in the lower RAM area.
Only one of these banks may be enabled at a time.
The next 16 bytes, locations 32 through 47, contain 128 directly addressable bit locations. The
stack depth is only limited by the available internal
RAM space of 256 bytes.
Figure 10. Interrupt Location of Program
Memory
Interrupt
Location
•
•
•
•
•
008Bh
•
•
•
•
0013h
8 Bytes
000Bh
0003h
Reset
0000h
AI06640
XRAM-DDC
The 256 bytes of XRAM-DDC used to support
DDC interface is also available for system usage
by indirect addressing through the address pointer
DDCADR and data I/O buffer RAMBUF. The address pointer (DDCADR) is equipped with the post
increment capability to facilitate the transfer of
data in bulk (for details refer to DDC Interface
part). However, it is also possible to address the
RAM through MOVX command as normally used
in the internal RAM extension of 80C51 derivatives. XRAM-DDC FF00 to FFFF is directly addressable as external data memory locations
FF00 to FFFF via MOVX-DPTR instruction or via
MOVX-Ri instruction. When XRAM-DDC is disabled, the address space FF00 to FFFF can be assigned to other resources.
XRAM-PSD
The 32K bytes of XRAM-PSD resides in the PSD
Module and can be mapped to any address space
through the DPLD (Decoding PLD) as defined by
the user in PSDsoft Development tool. The XRAMPSD has a battery backup feature that allow the
data to be retained in the event of a power lost.
The battery is connected to the Port C PC2 pin.
This pin must be configured in PSDSoft to be battery back-up.
19/176
µPSD325X DEVICES
SFR
The SFRs can only be addressed directly in the
address range from 80h to FFh. Table 15, page 32
gives an overview of the Special Function Registers. Sixteen address in the SFRs space are bothbyte and bit-addressable. The bit-addressable
SFRs are those whose address ends in 0h and 8h.
The bit addresses in this area are 80h to FFh.
Addressing Modes
The addressing modes in µPSD325X devices instruction set are as follows
■ Direct addressing
Table 3. RAM Address
Byte Address
(in Hexadecimal)
Byte Address
(in Decimal)
↓
↓
FFh
255
30h
48
msb
Bit Address (Hex)
lsb
2Fh
7F
7E
7D
7C
7B
7A
79
78
47
2Eh
77
76
75
74
73
72
71
70
46
2Dh
6F
6E
6D
6C
6B
6A
69
68
45
2Ch
67
66
65
64
63
62
61
60
44
2Bh
5F
5E
5D
5C
5B
5A
59
58
43
2Ah
57
56
55
54
53
52
51
50
42
29h
4F
4E
4D
4C
4B
4A
49
48
41
28h
47
46
45
44
43
42
41
40
40
27h
3F
3E
3D
3C
3B
3A
39
38
39
26h
37
36
35
34
33
32
31
30
38
25h
2F
2E
2D
2C
2B
2A
29
28
37
24h
27
26
25
24
23
22
21
20
36
23h
1F
1E
1D
1C
1B
1A
19
18
35
22h
17
16
15
14
13
12
11
10
34
21h
0F
0E
0D
0C
0B
0A
09
08
33
20h
07
06
05
04
03
02
01
00
32
1Fh
■
Indirect addressing
■
Register addressing
■
Register-specific addressing
■
Immediate constants addressing
■
Indexed addressing
(1) Direct addressing. In a direct addressing the
operand is specified by an 8-bit address field in the
instruction. Only internal Data RAM and SFRs
(80~FFH RAM) can be directly addressed.
Example:
mov A, 3EH ; A <----- RAM[3E]
Figure 11. Direct Addressing
Program Memory
3Eh
04
A
AI06641
(2) Indirect addressing. In indirect addressing
the instruction specifies a register which contains
the address of the operand. Both internal and external RAM can be indirectly addressed. The address register for 8-bit addresses can be R0 or R1
of the selected register bank, or the Stack Pointer.
The address register for 16-bit addresses can only
be the 16-bit “data pointer” register, DPTR.
Example:
mov @R1, #40 H ;[R1] <-----40H
31
Register Bank 3
18h
24
17h
23
Figure 12. Indirect Addressing
Program Memory
Register Bank 2
10h
16
0Fh
15
55h
40h
R1
55
Register Bank 1
08h
8
07h
7
Register Bank 0
00h
20/176
0
AI06642
µPSD325X DEVICES
(3) Register addressing. The register banks,
containing registers R0 through R7, can be accessed by certain instructions which carry a 3-bit
register specification within the opcode of the instruction. Instructions that access the registers
this way are code efficient, since this mode eliminates an address byte. When the instruction is executed, one of four banks is selected at execution
time by the two bank select bits in the PSW.
Example:
mov PSW, #0001000B ; select Bank0
mov A, #30H
mov R1, A
(4) Register-specific addressing. Some
instructions are specific to a certain register. For example, some instructions always operate on the
Accumulator, or Data Pointer, etc., so no address
byte is needed to point it. The opcode itself does
that.
(5) Immediate constants addressing. The value of a constant can follow the opcode in Program
memory.
Example:
mov A, #10H.
(6) Indexed addressing. Only Program memory
can be accessed with indexed addressing, and it
can only be read. This addressing mode is intended for reading look-up tables in Program memory.
A 16-bit base register (either DPTR or PC) points
to the base of the table, and the Accumulator is set
up with the table entry number. The address of the
table entry in Program memory is formed by adding the Accumulator data to the base pointer.
Example:
movc A, @A+DPTR
Figure 13. Indexed Addressing
ACC
3Ah
DPTR
1E73h
Arithmetic Instructions
The arithmetic instructions is listed in Table 4,
page 22. The table indicates the addressing
modes that can be used with each instruction to
access the <byte> operand. For example, the
ADD A, <byte> instruction can be written as:
ADD a, 7FH (direct addressing)
ADD A, @R0 (indirect addressing)
ADD a, R7 (register addressing)
ADD A, #127 (immediate constant)
Note: Any byte in the internal Data Memory space
can be incremented without going through the Accumulator.
One of the INC instructions operates on the 16-bit
Data Pointer. The Data Pointer is used to generate
16-bit addresses for external memory, so being
able to increment it in one 16-bit operations is
a useful feature.
The MUL AB instruction multiplies the Accumulator by the data in the B register and puts the 16-bit
product into the concatenated B and Accumulator
registers.
The DIV AB instruction divides the Accumulator by
the data in the B register and leaves the 8-bit quotient in the Accumulator, and the 8-bit remainder in
the B register.
In shift operations, dividing a number by 2n shifts
its “n” bits to the right. Using DIV AB to perform the
division completes the shift in 4?s and leaves the
B register holding the bits that were shifted out.
The DAA instruction is for BCD arithmetic operations. In BCD arithmetic, ADD and ADDC instructions should always be followed by a DAA
operation, to ensure that the result is also in BCD.
Note: DAA will not convert a binary number to
BCD. The DAA operation produces a meaningful
result only as the second step in the addition of
two BCD bytes.
Program Memory
3Eh
AI06643
21/176
µPSD325X DEVICES
Table 4. Arithmetic Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
ADD A,<byte>
A = A + <byte>
X
X
X
X
ADDC A,<byte>
A = A + <byte> + C
X
X
X
X
SUBB A,<byte>
A = A – <byte> – C
X
X
X
X
INC
A=A+1
INC <byte>
<byte> = <byte> + 1
INC DPTR
DPTR = DPTR + 1
Data Pointer only
DEC
A=A–1
Accumulator only
DEC <byte>
<byte> = <byte> – 1
MUL AB
B:A = B x A
Accumulator and B only
DIV AB
A = Int[ A / B ]
B = Mod[ A / B ]
Accumulator and B only
DA A
Decimal Adjust
Accumulator only
Logical Instructions
Table 5, page 23 shows list of µPSD325X devices
logical instructions. The instructions that perform
Boolean operations (AND, OR, Exclusive OR,
NOT) on bytes perform the operation on a bit-bybit basis. That is, if the Accumulator contains
00110101B and byte contains 01010011B, then:
ANL A, <byte>
will leave the Accumulator holding 00010001B.
The addressing modes that can be used to access
the <byte> operand are listed in Table 5.
The ANL A, <byte> instruction may take any of the
forms:
ANL A,7FH(direct addressing)
ANL A, @R1 (indirect addressing)
ANL A,R6 (register addressing)
ANL A,#53H (immediate constant)
Note: Boolean operations can be performed on
any byte in the internal Data Memory space without going through the Accumulator. The XRL
<byte>, #data instruction, for example, offers a
quick and easy way to invert port bits, as in
XRL P1, #0FFH.
22/176
Accumulator only
X
X
X
X
X
X
If the operation is in response to an interrupt, not
using the Accumulator saves the time and effort to
push it onto the stack in the service routine.
The Rotate instructions (RL A, RLC A, etc.) shift
the Accumulator 1 bit to the left or right. For a left
rotation, the MSB rolls into the LSB position. For a
right rotation, the LSB rolls into the MSB position.
The SWAP A instruction interchanges the high
and low nibbles within the Accumulator. This is a
useful operation in BCD manipulations. For example, if the Accumulator contains a binary number
which is known to be less than 100, it can be quickly converted to BCD by the following code:
MOVE B,#10
DIV AB
SWAP A
ADD A,B
Dividing the number by 10 leaves the tens digit in
the low nibble of the Accumulator, and the ones
digit in the B register. The SWAP and ADD instructions move the tens digit to the high nibble of the
Accumulator, and the ones digit to the low nibble.
µPSD325X DEVICES
Table 5. Logical Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
X
X
X
X
X
X
X
X
X
ANL A,<byte>
A = A .AND. <byte>
X
ANL <byte>,A
A = <byte> .AND. A
X
ANL <byte>,#data
A = <byte> .AND. #data
X
ORL A,<byte>
A = A .OR. <byte>
X
ORL <byte>,A
A = <byte> .OR. A
X
ORL <byte>,#data
A = <byte> .OR. #data
X
XRL A,<byte>
A = A .XOR. <byte>
X
XRL <byte>,A
A = <byte> .XOR. A
X
XRL <byte>,#data
A = <byte> .XOR. #data
X
CRL A
A = 00h
Accumulator only
CPL A
A = .NOT. A
Accumulator only
RL A
Rotate A Left 1 bit
Accumulator only
RLC A
Rotate A Left through Carry
Accumulator only
RR A
Rotate A Right 1 bit
Accumulator only
RRC A
Rotate A Right through Carry
Accumulator only
SWAP A
Swap Nibbles in A
Accumulator only
23/176
µPSD325X DEVICES
Data Transfers
Internal RAM. Table 6 shows the menu of instructions that are available for moving data
around within the internal memory spaces, and the
addressing modes that can be used with each
one. The MOV <dest>, <src> instruction allows
data to be transferred between any two internal
RAM or SFR locations without going through the
Accumulator. Remember, the Upper 128 bytes of
data RAM can be accessed only by indirect addressing, and SFR space only by direct addressing.
Note: In µPSD325X devices, the stack resides in
on-chip RAM, and grows upwards. The PUSH instruction first increments the Stack Pointer (SP),
then copies the byte into the stack. PUSH and
POP use only direct addressing to identify the byte
being saved or restored, but the stack itself is accessed by indirect addressing using the SP register. This means the stack can go into the Upper
128 bytes of RAM, if they are implemented, but not
into SFR space.
The Data Transfer instructions include a 16-bit
MOV that can be used to initialize the Data Pointer
(DPTR) for look-up tables in Program Memory.
The XCH A, <byte> instruction causes the Accumulator and ad-dressed byte to exchange data.
The XCHD A, @Ri instruction is similar, but only
the low nibbles are involved in the exchange. To
see how XCH and XCHD can be used to facilitate
data manipulations, consider first the problem of
shifting and 8-digit BCD number two digits to the
right. Table 8 shows how this can be done using
XCH instructions. To aid in understanding how the
code works, the contents of the registers that are
holding the BCD number and the content of the
Accumulator are shown alongside each instruction
to indicate their status after the instruction has
been executed.
After the routine has been executed, the Accumulator contains the two digits that were shifted out
on the right. Doing the routine with direct MOVs
uses 14 code bytes. The same operation with
XCHs uses only 9 bytes and executes almost
twice as fast. To right-shift by an odd number of
digits, a one-digit must be executed. Table 9
shows a sample of code that will right-shift a BCD
number one digit, using the XCHD instruction.
Again, the contents of the registers holding the
number and of the accumulator are shown alongside each instruction.
Table 6. Data Transfer Instructions that Access Internal Data Memory Space
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
X
MOV A,<src>
A = <src>
X
X
X
MOV <dest>,A
<dest> = A
X
X
X
MOV <dest>,<src>
<dest> = <src>
X
X
X
MOV DPTR,#data16
DPTR = 16-bit immediate constant
PUSH <src>
INC SP; MOV “@SP”,<src>
X
POP <dest>
MOV <dest>,”@SP”; DEC SP
X
XCH A,<byte>
Exchange contents of A and <byte>
X
XCHD A,@Ri
Exchange low nibbles of A and @Ri
24/176
X
X
X
X
X
µPSD325X DEVICES
First, pointers R1 and R0 are set up to point to the
two bytes containing the last four BCD digits. Then
a loop is executed which leaves the last byte, location 2EH, holding the last two digits of the shifted
number. The pointers are decremented, and the
loop is repeated for location 2DH. The CJNE instruction (Compare and Jump if Not equal) is a
loop control that will be described later. The loop
executed from LOOP to CJNE for R1 = 2EH, 2DH,
2CH, and 2BH. At that point the digit that was originally shifted out on the right has propagated to location 2AH. Since that location should be left with
0s, the lost digit is moved to the Accumulator.
Table 7. Shifting a BCD Number Two Digits to
the Right (using direct MOVs: 14 bytes)
2A
2B
2C
2D
2E
ACC
MOV
A,2Eh
00
12
34
56
78
78
MOV
2Eh,2Dh
00
12
34
56
56
78
MOV
2Dh,2Ch
00
12
34
34
56
78
MOV
2Ch,2Bh
00
12
12
34
56
78
MOV
2Bh,#0
00
00
12
34
56
78
Table 8. Shifting a BCD Number Two Digits to
the Right (using direct XCHs: 9 bytes)
2A
2B
2C
2D
2E
ACC
CLR
A
00
12
34
56
78
00
XCH
A,2Bh
00
00
34
56
78
12
XCH
A,2Ch
00
00
12
56
78
34
XCH
A,2Dh
00
00
12
34
78
56
XCH
A,2Eh
00
00
12
34
56
78
Table 9. Shifting a BCD Number One Digit to the Right
2A
2B
2C
2D
2E
ACC
MOV
R1,#2Eh
00
12
34
56
78
xx
MOV
R0,#2Dh
00
12
34
56
78
xx
; loop for R1 = 2Eh
LOOP:
MOV
A,@R1
00
12
34
56
78
78
XCHD
A,@R0
00
12
34
58
78
76
SWAP
A
00
12
34
58
78
67
MOV
@R1,A
00
12
34
58
67
67
DEC
R1
00
12
34
58
67
67
DEC
R0
00
12
34
58
67
67
CNJE
R1,#2Ah,LOOP
00
12
34
58
67
67
; loop for R1 = 2Dh
00
12
38
45
67
45
; loop for R1 = 2Ch
00
18
23
45
67
23
; loop for R1 = 2Bh
08
01
23
45
67
01
CLR
A
08
01
23
45
67
00
XCH
A,2Ah
00
01
23
45
67
08
25/176
µPSD325X DEVICES
External RAM. Table 10 shows a list of the Data
Transfer instructions that access external Data
Memory. Only indirect addressing can be used.
The choice is whether to use a one-byte address,
@Ri, where Ri can be either R0 or R1 of the selected
register
bank,
or
a
two-byte
address, @DTPR.
Note: In all external Data RAM accesses, the Accumulator is always either the destination or
source of the data.
Lookup Tables. Table 11 shows the two instructions that are available for reading lookup tables in
Program Memory. Since these instructions access
only Program Memory, the lookup tables can only
be read, not updated.
The mnemonic is MOVC for “move constant.” The
first MOVC instruction in Table 11 can accommodate a table of up to 256 entries numbered 0
through 255. The number of the desired entry is
loaded into the Accumulator, and the Data Pointer
is set up to point to the beginning of the table.
Then:
MOVC A, @A+DPTR
copies the desired table entry into the Accumulator.
The other MOVC instruction works the same way,
except the Program Counter (PC) is used as the
table base, and the table is accessed through a
subroutine. First the number of the desired en-try
is loaded into the Accumulator, and the subroutine
is called:
MOV A , ENTRY NUMBER
CALL TABLE
The subroutine “TABLE” would look like this:
TABLE: MOVC A , @A+PC
RET
The table itself immediately follows the RET (return) instruction is Program Memory. This type of
table can have up to 255 entries, numbered 1
through 255. Number 0 cannot be used, because
at the time the MOVC instruction is executed, the
PC contains the address of the RET instruction.
An entry numbered 0 would be the RET opcode itself.
Table 10. Data Transfer Instruction that Access External Data Memory Space
Address Width
Mnemonic
Operation
8 bits
MOVX A,@Ri
READ external RAM @Ri
8 bits
MOVX @Ri,A
WRITE external RAM @Ri
16 bits
MOVX A,@DPTR
READ external RAM @DPTR
16 bits
MOVX @DPTR,a
WRITE external RAM @DPTR
Table 11. Lookup Table READ Instruction
26/176
Mnemonic
Operation
MOVC A,@A+DPTR
READ program memory at (A+DPTR)
MOVC A,@A+PC
READ program memory at (A+PC)
µPSD325X DEVICES
Boolean Instructions
The µPSD325X devices contain a complete Boolean (single-bit) processor. One page of the internal RAM contains 128 address-able bits, and the
SFR space can support up to 128 addressable bits
as well. All of the port lines are bit-addressable,
and each one can be treated as a separate singlebit port. The instructions that access these bits are
not just conditional branches, but a complete
menu of move, set, clear, complement, OR and
AND instructions. These kinds of bit operations
are not easily obtained in other architectures with
any amount of byte-oriented software.
The instruction set for the Boolean processor is
shown in Table 12. All bits accesses are by direct
addressing.
Bit addresses 00h through 7Fh are in the Lower
128, and bit ad-dresses 80h through FFh are in
SFR space.
Note how easily an internal flag can be moved to
a port pin:
MOV C,FLAG
MOV P1.0,C
In this example, FLAG is the name of any addressable bit in the Lower 128 or SFR space. An I/O
line (the LSB of Port 1, in this case) is set or
cleared depending on whether the Flag Bit is '1' or
'0.'
The Carry Bit in the PSW is used as the single-bit
Accumulator of the Boolean processor. Bit instructions that refer to the Carry Bit as C assemble as
Carry-specific instructions (CLR C, etc.). The Carry Bit also has a direct address, since it resides in
the PSW register, which is bit-addressable.
Note: The Boolean instruction set includes ANL
and ORL operations, but not the XRL (Exclusive
OR) operation. An XRL operation is simple to implement in software. Suppose, for example, it is required to form the Exclusive OR of two bits:
C = bit 1 .XRL. bit2
The software to do that could be as follows:
MOV C , bit1
JNB bit2, OVER
CPL C
OVER: (continue)
First, Bit 1 is moved to the Carry. If bit2 = 0, then
C now contains the correct result. That is, Bit 1
.XRL. bit2 = bit1 if bit2 = 0. On the other hand, if
bit2 = 1, C now contains the complement of the
correct result. It need only be inverted (CPL C) to
complete the operation.
This code uses the JNB instruction, one of a series
of bit-test instructions which execute a jump if the
addressed bit is set (JC, JB, JBC) or if the addressed bit is not set (JNC, JNB). In the above
case, Bit 2 is being tested, and if bit2 = 0, the CPL
C instruction is jumped over.
JBC executes the jump if the addressed bit is set,
and also clears the bit. Thus a flag can be tested
and cleared in one operation. All the PSW bits are
directly addressable, so the Parity Bit, or the general-purpose flags, for example, are also available
to the bit-test instructions.
Table 12. Boolean Instructions
Mnemonic
Operation
ANL C,bit
C = A .AND. bit
ANL C,/bit
C = C .AND. .NOT. bit
ORL C,bit
C = A .OR. bit
ORL C,/bit
C = C .OR. .NOT. bit
MOV C,bit
C = bit
MOV bit,C
bit = C
CLR C
C=0
CLR bit
bit = 0
SETB C
C=1
SETB bit
bit = 1
CPL C
C = .NOT. C
CPL bit
bit = .NOT. bit
JC rel
Jump if C =1
JNC rel
Jump if C = 0
JB bit,rel
Jump if bit =1
JNB bit,rel
Jump if bit = 0
JBC bit,rel
Jump if bit = 1; CLR bit
Relative Offset
The destination address for these jumps is specified to the assembler by a label or by an actual address in Program memory. How-ever, the
destination address assembles to a relative offset
byte. This is a signed (two’s complement) offset
byte which is added to the PC in two’s complement
arithmetic if the jump is executed.
The range of the jump is therefore -128 to +127
Program Memory bytes relative to the first byte following the instruction.
27/176
µPSD325X DEVICES
Jump Instructions
Table 13 shows the list of unconditional jump instructions. The table lists a single “JMP add” instruction, but in fact there are three SJMP, LJMP,
and AJMP, which differ in the format of the destination address. JMP is a generic mnemonic which
can be used if the programmer does not care
which way the jump is en-coded.
The SJMP instruction encodes the destination address as a relative offset, as described above. The
instruction is 2 bytes long, consisting of the opcode and the relative offset byte. The jump distance is limited to a range of -128 to +127 bytes
relative to the instruction following the SJMP.
The LJMP instruction encodes the destination address as a 16-bit constant. The instruction is 3
bytes long, consisting of the opcode and two address bytes. The destination address can be anywhere in the 64K Program Memory space.
The AJMP instruction encodes the destination address as an 11-bit constant. The instruction is 2
bytes long, consisting of the opcode, which itself
contains 3 of the 11 address bits, followed by another byte containing the low 8 bits of the destination address. When the instruction is executed,
these 11 bits are simply substituted for the low 11
bits in the PC. The high 5 bits stay the same.
Hence the destination has to be within the same
2K block as the instruction following the AJMP.
In all cases the programmer specifies the destination address to the assembler in the same way: as
a label or as a 16-bit constant. The assembler will
put the destination address into the correct format
for the given instruction. If the format required by
the instruction will not support the distance to the
specified destination address, a “Destination out
of range” message is written into the List file.
The JMP @A+DPTR instruction supports case
jumps. The destination address is computed at execution time as the sum of the 16-bit DPTR register and the Accumulator. Typically. DPTR is set up
with the address of a jump table. In a 5-way
branch, for ex-ample, an integer 0 through 4 is
loaded into the Accumulator. The code to be executed might be as follows:
MOV DPTR,#JUMP TABLE
MOV A,INDEX_NUMBER
RL A
JMP @A+DPTR
28/176
The RL A instruction converts the index number (0
through 4) to an even number on the range 0
through 8, because each entry in the jump table is
2 bytes long:
JUMP TABLE:
AJMP CASE 0
AJMP CASE 1
AJMP CASE 2
AJMP CASE 3
AJMP CASE 4
Table 13 shows a single “CALL addr” instruction,
but there are two of them, LCALL and ACALL,
which differ in the format in which the subroutine
address is given to the CPU. CALL is a generic
mnemonic which can be used if the programmer
does not care which way the address is encoded.
The LCALL instruction uses the 16-bit address format, and the subroutine can be anywhere in the
64K Program Memory space. The ACALL instruction uses the 11-bit format, and the subroutine
must be in the same 2K block as the instruction following the ACALL.
In any case, the programmer specifies the subroutine address to the assembler in the same way: as
a label or as a 16-bit constant. The assembler will
put the address into the correct format for the given instructions.
Subroutines should end with a RET instruction,
which returns execution to the instruction following
the CALL.
RETI is used to return from an interrupt service
routine. The only difference between RET and
RETI is that RETI tells the interrupt control system
that the interrupt in progress is done. If there is no
interrupt in progress at the time RETI is executed,
then the RETI is functionally identical to RET.
Table 13. Unconditional Jump Instructions
Mnemonic
Operation
JMP addr
Jump to addr
JMP @A+DPTR
Jump to A+DPTR
CALL addr
Call Subroutine at addr
RET
Return from subroutine
RETI
Return from interrupt
NOP
No operation
µPSD325X DEVICES
Table 14 shows the list of conditional jumps available to the µPSD325X device user. All of these
jumps specify the destination address by the relative offset method, and so are limited to a jump distance of -128 to +127 bytes from the instruction
following the conditional jump instruction. Important to note, however, the user specifies to the assembler the actual destination address the same
way as the other jumps: as a label or a 16-bit constant.
There is no Zero Bit in the PSW. The JZ and JNZ
instructions test the Accumulator data for that condition.
The DJNZ instruction (Decrement and Jump if Not
Zero) is for loop control. To execute a loop N
times, load a counter byte with N and terminate the
loop with a DJNZ to the beginning of the loop, as
shown below for N = 10:
MOV COUNTER,#10
LOOP: (begin loop)
•
•
•
(end loop)
DJNZ COUNTER, LOOP
(continue)
The CJNE instruction (Compare and Jump if Not
Equal) can also be used for loop control as in Table 9. Two bytes are specified in the operand field
of the instruction. The jump is executed only if the
two bytes are not equal. In the example of Table 9
Shifting a BCD Number One Digits to the Right,
the two bytes were data in R1 and the constant
2Ah. The initial data in R1 was 2Eh.
Every time the loop was executed, R1 was decremented, and the looping was to continue until the
R1 data reached 2Ah.
Another application of this instruction is in “greater
than, less than” comparisons. The two bytes in the
operand field are taken as unsigned integers. If the
first is less than the second, then the Carry Bit is
set (1). If the first is greater than or equal to the
second, then the Carry Bit is cleared
Machine Cycles
A machine cycle consists of a sequence of six
states, numbered S1 through S6. Each state time
lasts for two oscillator periods. Thus, a machine
cycle takes 12 oscillator periods or 1µs if the oscillator frequency is 12MHz. Refer to Figure 14, page
30.
Each state is divided into a Phase 1 half and a
Phase 2 half. State Sequence in µPSD325X devices shows that retrieve/execute sequences in
states and phases for various kinds of instructions.
Normally two program retrievals are generated
during each machine cycle, even if the instruction
being executed does not require it. If the instruction being executed does not need more code
bytes, the CPU simply ignores the extra retrieval,
and the Program Counter is not incremented.
Execution of a one-cycle instruction (Figure 14,
page 30) begins during State 1 of the machine cycle, when the opcode is latched into the Instruction
Register. A second retrieve occurs during S4 of
the same machine cycle. Execution is complete at
the end of State 6 of this machine cycle.
The MOVX instructions take two machine cycles
to execute. No program retrieval is generated during the second cycle of a MOVX instruction. This
is the only time program retrievals are skipped.
The retrieve/execute sequence for MOVX instruction is shown in Figure 14, page 30 (d).
Table 14. Conditional Jump Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
JZ rel
Jump if A = 0
Accumulator only
JNZ rel
Jump if A ≠ 0
Accumulator only
DJNZ <byte>,rel
Decrement and jump if not zero
X
CJNE A,<byte>,rel
Jump if A ≠ <byte>
X
CJNE <byte>,#data,rel
Jump if <byte> ≠ #data
Imm
X
X
X
X
29/176
µPSD325X DEVICES
Figure 14. State Sequence in µPSD325X Devices
Osc.
(XTAL2)
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2
Read next
opcode and
discard
Read opcode
S1
S2
S3
S4
S5
Read next
opcode
S6
a. 1-Byte, 1-Cycle Instruction, e.g. INC A
S1
S2
Read next
opcode
Read 2nd
Byte
Read opcode
S3
S4
S5
S6
b. 2-Byte, 1-Cycle Instruction, e.g. ADD A, adrs
Read next
opcode and
discard
Read opcode
S1
S2
S3
S4
S5
Read next
opcode and
discard
Read next
opcode and
discard
S6
S1
S2
S3
S4
S5
Read next
opcode
S6
c. 1-Byte, 2-Cycle Instruction, e.g. INC DPTR
S1
S2
No Fetch
Read next
opcode and
discard
Read opcode
(MOVX)
S3
d. 1-Byte, 2-Cycle MOVX Instruction
S4
S5
S6
Addr
No Fetch
Read next
opcode
No ALE
S1
S2
S3
S4
S5
S6
Data
Access External Memory
AI06822
30/176
µPSD325X DEVICES
µPSD325X HARDWARE DESCRIPTION
The µPSD325X devices have a modular architecture with two main functional modules: the MCU
Module and the PSD Module. The MCU Module
consists of a standard 8032 core, peripherals and
other system supporting functions. The PSD Module provides configurable Program and Data memories to the 8032 CPU core. In addition, it has its
own set of I/O ports and a PLD with 16 macrocells
for general logic implementation. Ports A,B,C, and
D are general purpose programmable I/O ports
that have a port architecture which is different from
Ports 0-4 in the MCU Module.
The PSD Module communicates with the CPU
Core through the internal address, data bus (A0A15, D0-D7) and control signals (RD_, WR_,
PSEN_ , ALE, RESET_). The user defines the Decoding PLD in the PSDsoft Development Tool and
can map the resources in the PSD Module to any
program or data address space.
Figure 15. µPSD325X devices Functional Modules
Port 1, Timers and
2nd UART and ADC
Port 3, UART,
Intr, Timers,I2C
Port 3
Interrupt
Dedicated
USB Pins
Port 1
8032 Core
2 UARTs
Port 4 PWM
and DDC
I2C
3 Timer /
Counters
256 Byte SRAM
4
Channel
ADC
PWM
5
Channels
USB
DDC
Reset Logic
&
w/ 256 Byte
LVD & WDT
Transceiver
SRAM
MCU MODULE
Port 0, 2
Ext. Bus
8032 Internal Bus
A0-A15
RD,PSEN
WR,ALE
D0-D7 Reset
PSD MODULE
Page Register
Decode PLD
1Mb or 2Mb
Main Flash
256Kb
Secondary
Flash
256Kb
SRAM
Bus
Interface
PSD Internal Bus
JTAG ISP
CPLD - 16 MACROCELLS
Port C,
JTAG, PLD I/O
and GPIO
Port A & B, PLD
I/O and GPIO
Port D
GPIO
VCC, GND,
XTAL
Dedicated
Pins
AI07802
31/176
µPSD325X DEVICES
MCU MODULE DISCRIPTION
This section provides a detail description of the
MCU Module system functions and Peripherals,
including:
– Special Function Registers
– Timers/Counter
– Interrupts
– PWM
– Supervisory Function (LVD and Watchdog)
– USART
– Power Saving Modes
– I2C Bus
– On-chip Oscillator
– ADC
– I/O Ports
– USB
Special Function Registers
A map of the on-chip memory area called the Special Function Register (SFR) space is shown in Table 15.
Note: In the SFRs not all of the addresses are occupied. Unoccupied addresses are not implemented on the chip. READ accesses to these
addresses will in general return random data, and
WRITE accesses will have no effect. User software should write '0s' to these unimplemented locations.
Table 15. SFR Memory Map
F8
FF
F0
B1
E8
UISTA1
UIEN
E0
ACC1
USCL
D8
S1CON1
S1STA
S1DAT
D0
PSW1
S1SETUP
S2SETUP
C8
T2CON1
T2MOD
RCAP2L
C0
P41
C7
B8
IP1
BF
B0
P31
A8
IE1
A0
P21
98
F7
PSCL0L
UCON0
UCON1
S1ADR
RCAP2H
PSCL0H
PSCL1L
PWM4P
PWM4W
PWMCON
PWM0
PWM1
SCON
SBUF
SCON2
SBUF2
90
P11
P1SFS
88
TCON1
TMOD
80
P01
SP
Note: 1. Register can be bit addressing
32/176
UCON2
USTA
S2CON
S2STA
RAMBUF
DDCDAT
TL2
TH2
UADR
UDR0
EF
UDT1
UDT0
E7
S2DAT
S2ADR
DF
DDCADR DDCCON
CF
IPA
PSCL1H
WDKEY
PWM2
PWM3
D7
WDRST
B7
AF
IEA
A7
9F
P3SFS
P4SFS
ASCL
TL0
TL1
TH0
TH1
DPL
DPH
ADAT
ACON
97
8F
PCON
87
µPSD325X DEVICES
Table 16. List of all SFR
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
80
P0
FF
Port 0
81
SP
07
Stack Ptr
82
DPL
00
Data Ptr Low
83
DPH
00
Data Ptr
High
87
PCON
SMOD
SMOD1
88
TCON
TF1
TR1
TF0
TR0
89
TMOD
Gate
C/T
M1
M0
8A
LVREN ADSFINT RCLK1
TCLK1
PD
IDLE
00
Power Ctrl
IE1
IT1
IE0
IT0
00
Timer / Cntr
Control
Gate
C/T
M1
M0
00
Timer / Cntr
Mode
Control
TL0
00
Timer 0 Low
8B
TL1
00
Timer 1 Low
8C
TH0
00
Timer 0 High
8D
TH1
00
Timer 1 High
90
P1
FF
Port 1
91
P1SFS
P1S7
P1S6
00
Port 1 Select
Register
93
P3SFS
P3S7
P3S6
00
Port 3 Select
Register
94
P4SFS
P4S7
P4S6
00
Port 4 Select
Register
95
ASCL
00
8-bit
Prescaler for
ADC clock
96
ADAT
97
ACON
98
SCON
99
SBUF
9A
SCON2
9B
A0
P1S5
P4S5
P1S4
P4S4
P4S3
P4S2
P4S1
P4S0
ADAT3
ADAT2
ADAT1
ADAT0
00
ADC Data
Register
ADS1
ADS0
ADST
ADSF
00
ADC Control
Register
TB8
RB8
TI
RI
00
Serial
Control
Register
00
Serial Buffer
00
2nd UART
Ctrl Register
SBUF2
00
2nd UART
Serial Buffer
P2
FF
Port 2
00
PWM
Control
Polarity
A1 PWMCON
ADAT7
ADAT6
ADAT5
ADAT4
ADEN
SM0
SM0
PWML
SM1
SM1
PWMP
SM2
SM2
PWME
REN
REN
CFG4
TB8
CFG3
RB8
CFG2
TI
CFG1
RI
CFG0
33/176
µPSD325X DEVICES
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
A2
PWM0
00
PWM0
Output Duty
Cycle
A3
PWM1
00
PWM1
Output Duty
Cycle
A4
PWM2
00
PWM2
Output Duty
Cycle
A5
PWM3
00
PWM3
Output Duty
Cycle
A6
WDRST
00
Watch Dog
Reset
A7
IEA
EDDC
A8
IE
EA
ES2
-
ET2
ES
ET1
EX1
EI2C
EUSB
00
Interrupt
Enable (2nd)
ET0
EX0
00
Interrupt
Enable
A9
AA
PWM4P
00
PWM 4
Period
AB
PWM4W
00
PWM 4
Pulse Width
AE
WDKEY
00
Watch Dog
Key Register
B0
P3
FF
Port 3
B1
PSCL0L
00
Prescaler 0
Low (8-bit)
B2
PSCL0H
00
Prescaler 0
High (8-bit)
B3
PSCL1L
00
Prescaler 1
Low (8-bit)
B4
PSCL1H
00
Prescaler 1
High (8-bit)
B7
IPA
B8
IP
C0
P4
C8
T2CON
C9
T2MOD
34/176
PDDC
PS2
PT2
TF2
EXF2
RCLK
PS
TCLK
PT1
EXEN2
PX1
TR2
PI2C
PUSB
00
Interrupt
Priority (2nd)
PT0
PX0
00
Interrupt
Priority
FF
New Port 4
CP/RL2
00
Timer 2
Control
DCEN
00
Timer 2
Mode
C/T2
µPSD325X DEVICES
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
CA
RCAP2L
00
Timer 2
Reload low
CB
RCAP2H
00
Timer 2
Reload High
CC
TL2
00
Timer 2 Low
byte
CD
TH2
00
Timer 2 High
byte
D0
PSW
00
Program
Status Word
D1 S1SETUP
00
DDC I2C
(S1) Setup
D2 S2SETUP
00
I2C (S2)
Setup
D4
RAMBUF
XX
DDC Ram
Buffer
D5
DDCDAT
00
DDC Data
xmit register
D6
DDCADR
00
Addr pointer
register
D7
DDCCON
—
M0
00
DDC Control
Register
D8
S1CON
CR2
ENI1
STA
STO
ADDR
AA
CR1
CR0
00
DDC I2C
Control Reg
D9
S1STA
GC
Stop
Intr
TX-Md
Bbusy
Blost
ACK_R
SLV
00
DDC I2C
Status
DA
S1DAT
00
Data Hold
Register
DB
S1ADR
00
DDC I2C
address
DC
S2CON
CR2
EN1
STA
STO
ADDR
AA
CR1
CR0
00
I2C Bus
Control Reg
DD
S2STA
GC
Stop
Intr
TX-Md
Bbusy
Blost
ACK_R
SLV
00
I2C Bus
Status
DE
S2DAT
00
Data Hold
Register
DF
S2ADR
00
I2C address
E0
ACC
00
Accumulator
E1
USCL
00
8-bit
Prescaler for
USB logic
E6
UDT1
00
USB Endpt1
Data Xmit
CY
UDT1.7
AC
FO
RS1
RS0
OV
P
EX_DAT SWENB DDC_AX DDCINT DDC1EN SWHINT
UDT1.6 UDT1.5 UDT1.4
UDT1.3 UDT1.2 UDT1.1
UDT1.0
35/176
µPSD325X DEVICES
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
2
1
0
Reset
Comments
Value
00
USB Endpt0
Data Xmit
EOPF RESUMF
00
USB
Interrupt
Status
RESUMI
E
00
USB
Interrupt
Enable
TP0SIZ3 TP0SiZ2 TP0SIZ1 TP0SIZ0
00
USB Endpt0
Xmit Control
FRESUM TP1SIZ3 TP1SiZ2 TP1SIZ1 TP1SIZ0
00
USB Endpt1
Xmit Control
STALL2 STALL1
00
USB Control
Register
RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0
00
USB Endpt0
Status
UADD0
00
USB
Address
Register
UDR0.6 UDR0.5 UDR0.4 UDR0.3 UDR0.2 UDR0.1 UDR0.0
00
USB Endpt0
Data Recv
00
B Register
E7
UDT0
UDT0.7
E8
UISTA
SUSPND
—
E9
UIEN
SUSPNDI
E
RSTE
EA
UCON0
TSEQ0
STALL0
TX0E
EB
UCON1
TSEQ1
EP12SEL
—
EC
UCON2
—
—
—
SOUT
ED
USTA
RSEQ
SETUP
IN
OUT
EE
UADR
USBEN
UADD6
EF
UDR0
UDR0.7
F0
B
36/176
3
UDT0.6 UDT0.5 UDT0.4
RSTF
TXD0F
UDT0.3 UDT0.2 UDT0.1
RXD0F
RXD1F
RSTFIE TXD0IE RXD0IE TXD1IE
RX0E
UADD5 UADD4
EP2E
EP1E
UADD3 UADD2
EOPIE
UADD1
UDT0.0
µPSD325X DEVICES
Table 17. PSD Module Register Address Offset
CSIOP
Addr
Offset
Register Name
Bit Register Name
00
Data In (Port A)
Reads Port pins as input
02
Control (Port A)
Configure pin between I/O or Address Out Mode. Bit = 0 selects I/
O
00
04
Data Out (Port A)
Latched data for output to Port pins, I/O Output Mode
00
06
Direction (Port A)
Configures Port pin as input or output. Bit = 0 selects input
00
08
Drive (Port A)
Configures Port pin between CMOS, Open Drain or Slew rate. Bit
= 0 selects CMOS
00
0A
Input Macrocell
(Port A)
Reads latched value on Input Macrocells
0C
Enable Out
(Port A)
Reads the status of the output enable control to the Port pin driver.
Bit = 0 indicates pin is in input mode.
01
Data In (Port B)
03
Control (Port B)
00
05
Data Out (Port B)
00
07
Direction (Port B)
00
09
Drive (Port B)
00
0B
Input Macrocell
(Port B)
0D
Enable Out
(Port B)
10
Data In (Port C)
12
Data Out (Port C)
00
14
Direction (Port C)
00
16
Drive (Port C)
00
18
Input Macrocell
(Port C)
1A
Enable Out
(Port C)
11
Data In (Port D)
*
*
*
*
*
*
13
Data Out (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
15
Direction (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
17
Drive (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
1B
Enable Out
(Port D)
*
*
*
*
*
*
20
Output
Macrocells AB
7
6
5
4
3
2
1
0
Reset
Value
Comments
Only Bit 1 and
2 are used
Only Bit 1 and
2 are used
37/176
µPSD325X DEVICES
CSIOP
Addr
Offset
Register Name
21
Output
Macrocells BC
22
Mask Macrocells
AB
23
Mask Macrocells
BC
C0
Primary Flash
Protection
C2
Bit Register Name
7
Sec7_
Prot
Secondary Flash Security
Protection
_Bit
B0
PMMR0
*
B4
PMMR2
*
E0
Page
E2
VM
Periphmode
6
5
4
3
2
1
0
Comments
Sec6_ Sec5_ Sec4_ Sec3_ Sec2_ Sec1_
Prot
Prot
Prot
Prot
Prot
Prot
Sec0_
Prot
Bit = 1 sector
is protected
Sec3_ Sec2_ Sec1_
Prot
Prot
Prot
Sec0_
Prot
Security Bit =
1 device is
secured
*
*
*
*
PLD
PLD
PLD
Mcells arrayTurbo
clk
clk
PLD
PLD
PLD
arrayAl
array
array
e
WRh
Cntl2
*
*
PLD
array
Cntl1
*
PLD
array
Cntl0
APD
enable
*
00
Control PLD
power
consumption
*
*
00
Blocking
inputs to PLD
array
00
Page Register
FL_da Boot_ FL_co Boot_c SR_co
ta
data
de
ode
de
Note: (Register address = csiop address + address offset; where csiop address is defined by user in PSDsoft)
* indicates bit is not used and need to set to ’0.’
38/176
Reset
Value
Configure
8032 Program
and Data
Space
µPSD325X DEVICES
INTERRUPT SYSTEM
There are interrupt requests from 10 sources as
follows.
■ INT0 external interrupt
■
2nd USART interrupt
■
Timer0 interrupt
■
I2C interrupt
■
INT1 external interrupt (or ADC interrupt)
■
DDC interrupt
■
Timer1 interrupt
■
USB interrupt
■
USART interrupt
■
Timer2 interrupt
External Int0
■ The INT0 can be either level-active or transitionactive depending on Bit IT0 in register TCON.
The flag that actually generates this interrupt is
Bit IE0 in TCON.
■ When an external interrupt is generated, the
corresponding request flag is cleared by the
hardware when the service routine is vectored
to only if the interrupt was transition activated.
■ If the interrupt was level activated then the
interrupt request flag remains set until the
requested interrupt is actually generated. Then
it has to deactivate the request before the
interrupt service routine is completed, or else
another interrupt will be generated.
Timer 0 and 1 Interrupts
■ Timer0 and Timer1 interrupts are generated by
TF0 and TF1 which are set by an overflow of
their respective Timer/Counter registers (except
for Timer0 in Mode 3).
■ These flags are cleared by the internal
hardware when the interrupt is serviced.
Timer 2 Interrupt
■ Timer2 interrupt is generated by TF2 which is
set by an overflow of Timer2. This flag has to be
cleared by the software - not by hardware.
■ It is also generated by the T2EX signal (timer 2
external interrupt P1.1) which is controlled by
EXEN2 and EXF2 Bits in the T2CON register.
This is the definition of Timer 2 as per 90C320
definition.
I2C Interrupt
2
■ The interrupt of the I C is generated by Bit INTR
in the register S2STA.
■ This flag is cleared by hardware.
External Int1
■ The INT1 can be either level active or transition
active depending on Bit IT1 in register TCON.
The flag that actually generates this interrupt is
Bit IE1 in TCON.
■ When an external interrupt is generated, the
corresponding request flag is cleared by the
hardware when the service routine is vectored
to only if the interrupt was transition activated.
■ If the interrupt was level activated then the
interrupt request flag remains set until the
requested interrupt is actually generated. Then
it has to deactivate the request before the
interrupt service routine is completed, or else
another interrupt will be generated.
■ The ADC can take over the External INT1 to
generate an interrupt on conversion being
completed
DDC Interrupt
■ The DDC interrupt is generated either by Bit
INTR in the S1STA register for DC2B protocol
or by Bit DDC interrupt in the DDCCON register
for DDC1 protocol or by Bit SWHINT Bit in the
DDCCON register when DDC protocol is
changed from DDC1 to DDC2.
■ Flags except the INTR have to be cleared by the
software. INTR flag is cleared by hardware.
USB Interrupt
■ The USB interrupt is generated when endpoint0
has transmitted a packet or received a packet,
when endpoint1 or endpoint2 has transmitted a
packet, when the suspend or resume state is
detected and every EOP received.
■ When the USB interrupt is generated, the
corresponding request flag must be cleared by
software. The interrupt service routine will have
to check the various USB registers to determine
the source and clear the corresponding flag.
■ Please see the dedicated interrupt control
registers for the USB peripheral for more
information.
39/176
µPSD325X DEVICES
USART Interrupt
■ The USART interrupt is generated by RI
(receive interrupt) OR TI (transmit interrupt).
■ When the USART interrupt is generated, the
corresponding request flag must be cleared by
software. The interrupt service routine will have
to check the various USART registers to
■
determine the source and clear the
corresponding flag.
Both USART’s are identical, except for the
additional interrupt controls in the Bit 4 of the
additional interrupt control registers (A7H, B7H)
Figure 16. Interrupt System
Interrupt
Sources
IP / IPA Priority
IE /
High
INT0
Low
USART
Timer
0
I2C
Interrupt Polling
INT1
DDC
Timer
1
USB
2nd
USART
Timer
2
Global
Enable
AI06646
40/176
µPSD325X DEVICES
Table 18. SFR Register
Bit Register Name
SFR
Addr
Reg
Name
7
6
5
4
3
2
1
0
A7
IEA
EDDC
—
—
ES2
—
—
EI2C
EUSB
00
Interrupt
Enable (2nd)
A8
IE
EA
—
ET2
ES
ET1
EX1
ET0
EX0
00
Interrupt
Enable
B7
IPA
PDDC
—
—
PS2
—
—
PI2C
PUSB
00
Interrupt
Priority (2nd)
B8
IP
—
—
PT2
PS
PT1
PX1
PT0
PX0
00
Interrupt
Priority
Interrupt Priority Structure
Each interrupt source can be assigned one of two
priority levels. Interrupt priority levels are defined
by the interrupt priority special function register IP
and IPA.
0 = low priority
1 = high priority
A low priority interrupt may be interrupted by a
high priority interrupt level interrupt. A high priority
interrupt routine cannot be interrupted by any other interrupt source. If two interrupts of different priority occur simultaneously, the high priority level
request is serviced. If requests of the same priority
are received simultaneously, an internal polling
sequence determines which request is serviced.
Thus, within each priority level, there is a second
priority structure determined by the polling sequence.
Interrupts Enable Structure
Each interrupt source can be individually enabled
or disabled by setting or clearing a bit in the interrupt enable special function register IE and IEA. All
Reset
Comments
Value
interrupt source can also be globally disabled by
clearing Bit EA in IE.
Table 19. Priority Levels
Source
Priority with Level
Int0
0 (highest)
2nd USART
1
Timer0
2
I²C
3
Int1
4
DDC
5
Timer1
6
USB
7
1st USART
8
Timer2+EXF2
9 (lowest)
Table 20. Description of the IE Bits
Bit
Symbol
Function
7
EA
Disable all interrupts:
0: no interrupt with be acknowledged
1: each interrupt source is individually enabled or disabled by setting or clearing its
enable bit
6
—
Reserved
5
ET2
Enable Timer2 interrupt
4
ES
Enable USART interrupt
3
ET1
Enable Timer1 interrupt
2
EX1
Enable external interrupt (Int1)
1
ET0
Enable Timer0 interrupt
0
EX0
Enable external interrupt (Int0)
41/176
µPSD325X DEVICES
Table 21. Description of the IEA Bits
Bit
Symbol
Function
7
EDDC
6
—
Not used
5
—
Not used
4
ES2
3
—
Not used
2
—
Not used
1
EI2C
Enable I²C interrupt
0
EUSB
Enable USB interrupt
Enable DDC interrupt
Enable 2nd USART interrupt
Table 22. Description of the IP Bits
Bit
Symbol
Function
7
—
Reserved
6
—
Reserved
5
PT2
Timer2 interrupt priority level
4
PS
USART interrupt priority level
3
PT1
Timer1 interrupt priority level
2
PX1
External interrupt (Int1) priority level
1
PT0
Timer0 interrupt priority level
0
PX0
External interrupt (Int0) priority level
Table 23. Description of the IPA Bits
Bit
Symbol
7
PDDC
6
—
Not used
5
—
Not used
4
PS2
3
—
Not used
2
—
Not used
1
PI2C
I²C interrupt priority level
0
PUSB
USB interrupt priority level
42/176
Function
DDC interrupt priority level
2nd USART interrupt priority level
µPSD325X DEVICES
How Interrupts are Handled
The interrupt flags are sampled at S5P2 of every
machine cycle. The samples are polled during following machine cycle. If one of the flags was in a
set condition at S5P2 of the preceding cycle, the
polling cycle will find it and the interrupt system will
generate an LCALL to the appropriate service routine, provided this H/W generated LCALL is not
blocked by any of the following conditions:
■ An interrupt of equal priority or higher priority
level is already in progress.
■
The current machine cycle is not the final cycle
in the execution of the instruction in progress.
■
The instruction in progress is RETI or any
access to the interrupt priority or interrupt
enable registers.
The polling cycle is repeated with each machine
cycle, and the values polled are the values that
were present at S5P2 of the previous machine cycle.
Note: If an interrupt flag is active but being responded to for one of the above mentioned conditions, if the flag is still inactive when the blocking
condition is removed, the denied interrupt will not
be serviced. In other words, the fact that the interrupt flag was once active but not serviced is not remembered. Every polling cycle is new.
The processor acknowledges an interrupt request
by executing a hardware generated LCALL to the
appropriate service routine. The hardware generated LCALL pushes the contents of the Program
Counter on to the stack (but it does not save the
PSW) and reloads the PC with an address that de-
pends on the source of the interrupt being vectored to as shown in Table 24.
Execution proceeds from that location until the
RETI instruction is encountered. The RETI instruction informs the processor that the interrupt routine
is no longer in progress, then pops the top two
bytes from the stack and reloads the Program
Counter. Execution of the interrupted program
continues from where it left off.
Note: A simple RET instruction would also return
execution to the interrupted program, but it would
have left the interrupt control system thinking an
interrupt was still in progress, making future interrupts impossible.
Table 24. Vector Addresses
Source
Vector Address
Int0
0003h
2nd USART
004Bh
Timer0
000Bh
I²C
0043h
Int1
0013h
DDC
003Bh
Timer1
001Bh
USB
0033h
1st USART
0023h
Timer2+EXF2
002Bh
43/176
µPSD325X DEVICES
POWER-SAVING MODE
Two software selectable modes of reduced power
consumption are implemented.
Idle Mode
The following Functions are Switched Off.
– CPU (Halted)
The following Function Remain Active During Idle
Mode.
– External Interrupts
– Timer0, Timer1, Timer2
– DDC Interface
– PWM Units
– USB Interface
– USART
– 8-bit ADC
– I2C Interface
Note: Interrupt or RESET terminates the Idle
Mode.
Power-Down Mode
– System Clock Halted
– LVD Logic Remains Active
– SRAM contents remains unchanged
– The SFRs retain their value until a RESET is asserted
Note: The only way to exit Power-down Mode is a
RESET.
Table 25. Power-Saving Mode Power Consumption
Mode
Addr/Data
Ports1,3,4
PWM
I2C
DDC
USB
Idle
Maintain Data
Maintain Data
Active
Active
Active
Active
Power-down
Maintain Data
Maintain Data
Disable
Disable
Disable
Disable
Power Control Register
The Idle and Power-down Modes are activated by
software via the PCON register.
Table 26. Pin Status During Idle and Power-down Mode
Bit Register Name
SFR
Addr
Reg
Name
7
6
87
PCON
SMOD
SMOD1
5
4
3
LVREN ADSFINT RCLK1
2
1
0
TCLK1
PD
IDLE
Table 27. Description of the PCON Bits
Bit
Symbol
Function
7
SMOD
6
SMOD1
Double baud data rate bit 2nd UART
5
LVREN
LVR disable bit (active High)
4
ADSFINT
3
RCLK11
Received clock flag (UART 2)
2
TCLK11
Transmit clock flag (UART 2)
1
PD
Activate Power-down Mode (High enable)
0
IDL
Activate Idle Mode (High enable)
Double baud data rate bit UART
Enable ADC interrupt
Note: 1. See the T2CON register for details of the flag description
44/176
Reset
Comments
Value
00
Power Ctrl
µPSD325X DEVICES
Idle Mode
The instruction that sets PCON.0 is the last instruction executed in the normal operating mode
before Idle Mode is activated. Once in the Idle
Mode, the CPU status is preserved in its entirety:
Stack pointer, Program counter, Program status
word, Accumulator, RAM and All other registers
maintain their data during Idle Mode.
There are three ways to terminate the Idle Mode.
■ Activation of any enabled interrupt will cause
PCON.0 to be cleared by hardware terminating
Idle mode. The interrupt is serviced, and
following return from interrupt instruction RETI,
the next instruction to be executed will be the
one which follows the instruction that wrote a
logic ’1’ to PCON.0.
■
External hardware reset: the hardware reset is
required to be active for two machine cycle to
complete the RESET operation.
■
Internal reset: the microcontroller restarts after
3 machine cycles in all cases.
Power-Down Mode
The instruction that sets PCON.1 is the last executed prior to going into the Power-down Mode.
Once in Power-down Mode, the oscillator is
stopped. The contents of the on-chip RAM and the
Special Function Register are preserved.
The Power-down Mode can be terminated by an
external RESET.
45/176
µPSD325X DEVICES
I/O PORTS (MCU MODULE)
The MCU Module has five ports: Port0, Port1,
Port2, Port3 and Port 4. (Refer to the PSD Module
section on I/O ports A,B,C and D). Ports P0 and
P2 are dedicated for the external address and data
bus and is not available in the 80 pin package devices.
Port1 - Port3 are the same as in the standard 8032
micro-controllers, with the exception of the additional special peripheral functions. All ports are bidirectional. Pins of which the alternative function is
not used may be used as normal bi-directional I/O.
The use of Port1- Port4 pins as alternative functions are carried out automatically by the
µPSD325X devices provided the associated SFR
Bit is set HIGH.
The following SFR registers (Tables 29, 30, and
31) are used to control the mapping of alternate
functions onto the I/O port bits. Port 1 alternate
functions are controlled using the P1SFS register,
except for Timer 2 and the 2nd UART which are
enabled by their configuration registers. P1.0 to
P1.3 are default to GPIO after reset.
Port 3 pins 6 and 7 have been modified from the
standard 8032. These pins that were used for
READ and WRITE control signals are now GPIO
or I2C bus pins. The READ and WRITE pins are
assigned to dedicated pins.
Port 3 and Port 4 alternate functions are controlled
using the P3SFS and P4SFS Special Function Selection registers. After a reset, the I/O pins default
to GPIO. The alternate function is enabled if the
corresponding bit in the PXSFS register is set to
'1.'
Table 28. I/O Port Functions
Port Name
Main Function
Alternate
Port 1
GPIO
Timer 2 - Bits 0,1
2nd UART - Bits 2,3
ADC - Bits 4..7
Port 3
GPIO
UART - Bits 0,1
Interrupt - Bits 2,3
Timers - Bits 4,5
I2C - Bits 6,7
Port 4
GPIO
DDC - Bits 0..2
PWM - Bits 3..7
USB +/-
USB +/- Only
Table 29. P1SFS (91H)
7
6
5
4
0=Port 1.7
1=ACH3
0=Port 1.6
1=ACH2
0=Port 1.5
1=ACH1
0=Port 1.4
1=ACH0
5
4
3
2
Bits Reserved
1
0
Bits Reserved
Table 30. P3SFS (93H)
7
6
0 = Port 1.7
1 = SCL
from I2C unit
0 = Port 1.6
1 = SDA
from I2C unit
3
2
1
0
Bits are reserved.
Table 31. P4SFS (94H)
7
6
5
4
3
2
1
0
0=Port 4.7
1=PWM 4
0=Port 4.6
1=PWM 3
0=Port 4.5
1=PWM 2
0=Port 4.4
1=PWM 1
0=Port 4.3
1=PWM 0
0=Port 4.2
1=VSYNC
0=Port 4.1
1=DDC SCL
0=Port 4.0
1=DDC SDA
46/176
µPSD325X DEVICES
PORT Type and Description
Figure 17. PORT Type and Description (Part 1)
Symbol
In /
Out
RESET
I
Circuit
Description
• Schmitt input with internal pull-up
CMOS compatible interface
NFC : 400ns
NFC
WR, RD,ALE,
PSEN
O
Output only
Sink current : 5mA
.
XTAL1,
XTAL2
I
On-chip oscillator
On-chip feedback resistor
Stop in the power down mode
External clock input available
CMOS compatible interface
xon
O
PORT0
I/O
Bidirectional I/O port
Schmitt input
Open-drain output(5V)
Address Output ( Push-Pull )
Sink current : 5mA
CMOS compatible interface
Source current: 5mA
AI06653
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µPSD325X DEVICES
Figure 18. PORT Type and Description (Part 2)
Symbol
In/
Out
Circuit
Function
PORT1 <3:0>, I/O
PORT3,
PORT4<7:3,1:0>
Bidirectional I/O port with
internal pull-ups
Schmitt input
Sink current : 5mA
CMOS compatible interface
Source current =5mA when push-pull
output mode.
PORT2
PORT1 < 7:4 >
Bidirectional I/O port with
internal pull-ups
Schmitt input
Sink current : 5mA
CMOS compatible interface
Analog input option
Source current =5mA
I/O
an_enb
PORT4.2
Bidirectional I/O port with internal
I/O
pull-ups
Schmitt input.
Sink current : 5mA
TTL compatible interface
Pull-up when reset
Address Latch Enable
Program Strobe Enable
Source current =5mA
USB - ,
USB +
Bidirectional I/O port
Schmitt input
TTL compatible interface
I/O
+
-
AI06654
48/176
µPSD325X DEVICES
OSCILLATOR
The oscillator circuit of the µPSD325X devices is a
single stage inverting amplifier in a Pierce oscillator configuration. The circuitry between XTAL1
and XTAL2 is basically an inverter biased to the
transfer point. Either a crystal or ceramic resonator
can be used as the feedback element to complete
the oscillator circuit. Both are operated in parallel
resonance.
XTAL1 is the high gain amplifier input, and XTAL2
is the output. To drive the µPSD325X devices externally, XTAL1 is driven from an external source
and XTAL2 left open-circuit.
Figure 19. Oscillator
XTAL1
XTAL2
XTAL1
XTAL2
8 to 40 MHz
External Clock
AI06620
SUPERVISORY
There are four ways to invoke a reset and initialize
the µPSD325X devices.
■ Via the external RESET pin
■
■
Via USB bus reset signaling.
■
Via Watch Dog timer
The RESET mechanism is illustrated in Figure 20.
Via the internal LVR Block.
Figure 20. RESET Configuration
Reset
Noise
Cancel
CPU
Clock
Sync
CPU
&
PERI.
WDT
S
LVR
Q
R
RSTE
USB Reset
10ms
Timer
10ms at 40Mhz
50ms at 8Mhz
PSD_RST
“Active Low
AI06621
49/176
µPSD325X DEVICES
Each RESET source will cause an internal reset
signal active. The CPU responds by executing an
internal reset and puts the internal registers in a
defined state. This internal reset is also routed as
an active low reset input to the PSD Module.
External Reset
The RESET pin is connected to a Schmitt trigger
for noise reduction. A RESET is accomplished by
holding the RESET pin LOW for at least 1ms at
power up while the oscillator is running. Refer to
AC spec on other RESET timing requirements.
Low VDD Voltage Reset
An internal reset is generated by the LVR circuit
when the VDD drops below the reset threshold. After V DD reaching back up to the reset threshold,
the RESET signal will remain asserted for 10ms
before it is released. On initial power-up the LVR
is enabled (default). After power-up the LVR can
be disabled via the LVREN Bit in the PCON Register.
50/176
Note: The LVR logic is still functional in both the
Idle and Power-down Modes.
The reset threshold:
■ 5V operation:
4V +/- 0.25V
■
3.3V operation: 2.5V +/-0.2V
This logic supports approximately 0.1V of hysteresis and 1µs noise-cancelling delay.
Watchdog Timer Overflow
The Watchdog timer generates an internal reset
when its 22-bit counter overflows. See Watchdog
Timer section for details.
USB Reset
The USB reset is generated by a detection on the
USB bus RESET signal. A single-end zero on its
upstream port for 4 to 8 times will set RSTF Bit in
UISTA register. If Bit 6 (RSTE) of the UIEN Register is set, the detection will also generate the
RESET signal to reset the CPU and other peripherals in the MCU.
µPSD325X DEVICES
WATCHDOG TIMER
The hardware watchdog timer (WDT) resets the
µPSD325X devices when it overflows. The WDT is
intended as a recovery method in situations where
the CPU may be subjected to a software upset. To
prevent a system reset the timer must be reloaded
in time by the application software. If the processor
suffers a hardware/software malfunction, the software will fail to reload the timer. This failure will result in a reset upon overflow thus preventing the
processor running out of control.
In the Idle Mode the watchdog timer and reset circuitry remain active. The WDT consists of a 22-bit
counter, the Watchdog Timer RESET (WDRST)
SFR and Watchdog Key Register (WDKEY).
Since the WDT is automatically enabled while the
processor is running. the user only needs to be
concerned with servicing it.
The 22-bit counter overflows when it reaches
4194304 (3FFFFFH). The WDT increments once
every machine cycle.
This means the user must reset the WDT at least
every 4194304 machine cycles (1.258 seconds at
40MHz). To reset the WDT the user must write a
value between 00-7EH to the WDRST register.
The value that is written to the WDRST is loaded
to the 7MSB of the 22-bit counter. This allows the
user to pre-loaded the counter to an initial value to
generate a flexible Watchdog time out period.
Writing a “00” to WDRST clears the counter.
The watchdog timer is controlled by the watchdog
key register, WDKEY. Only pattern 01010101
(=55H), disables the watchdog timer. The rest of
pattern combinations will keep the watchdog timer
enabled. This security key will prevent the watchdog timer from being terminated abnormally when
the function of the watchdog timer is needed.
In Idle Mode, the oscillator continues to run. To
prevent the WDT from resetting the processor
while in Idle, the user should always set up a timer
that will periodically exit Idle, service the WDT, and
re-enter Idle Mode.
Table 32. Watchdog Timer Key Register (WDKEY: 0AEH)
7
6
5
4
3
2
1
0
WDKEY7
WDKEY6
WDKEY5
WDKEY4
WDKEY3
WDKEY2
WDKEY1
WDKEY0
Table 33. Description of the WDKEY Bits
Bit
Symbol
7 to 0
WDKEY7 to
WDKEY0
Function
Enable or disable watchdog timer.
01010101 (=55h): disable watchdog timer. Others: enable watchdog timer
51/176
µPSD325X DEVICES
Watchdog reset pulse width depends on the clock
frequency. The reset period is Tfosc x 12 x 2 22
The RESET pulse width is Tfosc x 12 x 215.
Figure 21. RESET Pulse Width
Reset pulse width (about 10ms at 40Mhz, about 50ms at 8Mhz)
Reset period
(1.258 second at 40Mhz)
(about 6.291 seconds at 8Mhz)
AI06823
Table 34. Watchdog Timer Clear Register (WDRST: 0A6H)
7
6
5
4
3
2
1
0
Reserved
WDRST6
WDRST5
WDRST4
WDRST3
WDRST2
WDRST1
WDRST0
Table 35. Description of the WDRST Bits
Bit
Symbol
7
—
6 to 0
WDRST6 to
WDRST0
Function
Reserved
To reset watchdog timer, write any value beteen 00h and 7Eh to this register.
This value is loaded to the 7 most significant bits of the 22-bit counter.
For example: MOV WDRST,#1EH
Note: The Watchdog Timer (WDT) is enabled at power-up or reset and must be served or disabled.
52/176
µPSD325X DEVICES
TIMER/COUNTERS (TIMER0, TIMER1 AND TIMER2)
The µPSD325X devices has three 16-bit Timer/
tected. Since it takes 2 machine cycles (12 CPU
Counter registers: Timer 0, Timer 1 and Timer2.
clock periods) to recognize a 1-to-0 transition, the
All of them can be configured to operate either as
maximum count rate is 1/12 of the CPU clock fretimers or event counters and are compatible with
quency. There are no restrictions on the duty cycle
standard 8032 architecture.
of the external input signal, but to ensure that a
given level is sampled at least once before it
In the “Timer” function, the register is incremented
changes, it should be held for at least one full cyevery machine cycle. Thus, one can think of it as
cle. In addition to the “Timer” or “Counter” seleccounting machine cycles. Since a machine cycle
tion, Timer0 and Timer1 have four operating
consists of 6 CPU clock periods, the count rate is
modes from which to select.
1/6 of the CPU clock frequency.
Timer0 and Timer1
In the “Counter” function, the register is incremented in response to a 1-to-0 transition at its correThe “Timer” or “Counter” function is selected by
sponding external input pin, T0 or T1. In this
control bits C/ T in the Special Function Register
function, the external input is sampled during
TMOD. These Timer/Counters have four operatS5P2 of every machine cycle. When the samples
ing modes, which are selected by bit-pairs (M1,
show a high in one cycle and a low in the next cyM0) in TMOD. Modes 0, 1, and 2 are the same for
cle, the count is incremented. The new count value
Timers/ Counters. Mode 3 is different. The four opappears in the register during S2P1 of the cycle
erating modes are de-scribed in the following text.
following the one in which the transition was deTable 36. Control Register (TCON)
7
6
5
4
3
2
1
0
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
Table 37. Description of the TCON Bits
Bit
Symbol
Function
7
TF1
Timer 1 overflow flag. Set by hardware on Timer/Counter overflow. Cleared by hardware
when processor vectors to interrupt routine
6
TR1
Timer 1 run control bit. Set/cleared by software to turn Timer/Counter on or off
5
TF0
Timer 0 overflow flag. Set by hardier on Timer/Counter overflow. Cleared by hardware
when processor vectors to interrupt routine
4
TR0
Timer 0 run control bit. Set/cleared by software to turn Timer/Counter on or off
3
IE1
Interrupt 1 Edge flag. Set by hardware when external interrupt edge detected. Cleared
when interrupt processed
2
IT1
Interrupt 1 Type control bit. Set/cleared by software to specify falling-edge/low-level
triggered external interrupt
1
IE0
Interrupt 0 Edge flag. Set by hardware when external interrupt edge detected. Cleared
when interrupt processed
0
IT0
Interrupt 0 Type control bit. Set/cleared by software to specify falling-edge/low-level
triggered external interrupt
53/176
µPSD325X DEVICES
Mode 0. Putting either Timer into Mode 0 makes
it look like an 8048 Timer, which is an 8-bit Counter
with a divide-by-32 prescaler. Figure 22 shows the
Mode 0 operation as it applies to Timer1.
In this mode, the Timer register is configured as a
13-bit register. As the count rolls over from all ’1s’
to all ’0s,’ it sets the Timer interrupt flag TF1. The
counted input is enabled to the Timer when TR1 =
1 and either GATE = 0 or /INT1 = 1. (Setting GATE
= 1 allows the Timer to be controlled by external input /INT1, to facilitate pulse width measurements).
TR1 is a control bit in the Special Function Regis-
ter TCON (TCON Control Register). GATE is in
TMOD.
The 13-bit register consists of all 8 bits of TH1 and
the lower 5 bits of TL1. The upper 3 bits of TL1 are
indeterminate and should be ignored. Setting the
run flag does not clear the registers.
Mode 0 operation is the same for the Timer0 as for
Timer1. Substitute TR0, TF0, and /INT0 for the
corresponding Timer1 signals in Figure 22. There
are two different GATE Bits, one for Timer1 and
one for Timer0.
Mode 1. Mode 1 is the same as Mode 0, except
that the Timer register is being run with all 16 bits.
Table 38. TMOD Register (TMOD)
7
6
5
4
3
2
1
0
Gate
C/T
M1
M0
Gate
C/T
M1
M0
Table 39. Description of the TMOD Bits
Bit
Symbol
7
Gate
Gating control when set. Timer/Counter 1 is enabled only while INT1 pin is High and
TR1 control pin is set. When cleared, Timer 1 is enabled whenever TR1 control bit is set
6
C/T
Timer or Counter selector, cleared for timer operation (input from internal system clock);
set for counter operation (input from T1 input pin)
5
M1
4
M0
3
Gate
Gating control when set. Timer/Counter 0 is enabled only while INT0 pin is High and
TR0 control pin is set. When cleared, Timer 0 is enabled whenever TR0 control bit is set
2
C/T
Timer or Counter selector, cleared for timer operation (input from internal system clock);
set for counter operation (input from T0 input pin)
1
M1
0
M0
54/176
Timer
Timer1
Timer0
Function
(M1,M0)=(0,0): 13-bit Timer/Counter, TH1, with TL1 as 5-bit prescaler
(M1,M0)=(0,1): 16-bit Timer/Counter. TH1 and TL1 are cascaded. There is no prescaler.
(M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH1 holds a value which is to be
reloaded into TL1 each time it overflows
(M1,M0)=(1,1): Timer/Counter 1 stopped
(M1,M0)=(0,0): 13-bit Timer/Counter, TH0, with TL0 as 5-bit prescaler
(M1,M0)=(0,1): 16-bit Timer/Counter. TH0 and TL0 are cascaded. There is no prescaler.
(M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH0 holds a value which is to be
reloaded into TL0 each time it overflows
(M1,M0)=(1,1): TL0 is an 8-bit Timer/Counter controlled by the standard TImer 0 control
bits. TH0 is an 8-bit timer only controlled by Timer 1 control bits
µPSD325X DEVICES
Figure 22. Timer/Counter Mode 0: 13-bit Counter
fOSC
÷ 12
C/T = 0
C/T = 1
T1 pin
TL1
(5 bits)
TH1
(8 bits)
TF1
Interrupt
Control
TR1
Gate
INT1 pin
AI06622
Figure 23. Timer/Counter Mode 2: 8-bit Auto-reload
fOSC
÷ 12
C/T = 0
C/T = 1
T1 pin
TL1
(8 bits)
TF1
Interrupt
Control
TR1
Gate
INT1 pin
TH1
(8 bits)
AI06623
55/176
µPSD325X DEVICES
Figure 24. Timer/Counter Mode 3: Two 8-bit Counters
fOSC
÷ 12
C/T = 0
C/T = 1
T0 pin
TL0
(8 bits)
TF0
Interrupt
TH1
(8 bits)
TF1
Interrupt
Control
TR0
Gate
INT0 pin
fOSC
÷ 12
Control
TR1
Mode 2. Mode 2 configures the Timer register as
an 8-bit Counter (TL1) with automatic reload, as
shown in Figure 23. Overflow from TL1 not only
sets TF1, but also reloads TL1 with the contents of
TH1, which is preset by software. The reload
leaves TH1 unchanged. Mode 2 operation is the
same for Timer/Counter 0.
Mode 3. Timer 1 in Mode 3 simply holds its count.
The effect is the same as setting TR1 = 0.
Timer 0 in Mode 3 establishes TL0 and TH0 as two
separate counters. The logic for Mode 3 on Timer
0 is shown in Figure 24. TL0 uses the Timer 0 control Bits: C/T, GATE, TR0, INT0, and TF0. TH0 is
locked into a timer function (counting machine cycles) and takes over the use of TR1 and TF1 from
Timer 1. Thus, TH0 now controls the “Timer 1“ interrupt.
Mode 3 is provided for applications requiring an
extra 8-bit timer on the counter. With Timer 0 in
Mode 3, an µPSD325X devices can look like it has
three Timer/Counters. When Timer 0 is in Mode 3,
Timer 1 can be turned on and off by switching it out
of and into its own Mode 3, or can still be used by
the serial port as a baud rate generator, or in fact,
in any application not requiring an interrupt.
Timer 2
Like timer 0 and 1, timer 2 can operate as either an
event timer or as an event counter. This is selected by Bit C/T2 in the special function register
T2CON. It has three operating modes: capture,
56/176
AI06624
autoload, and baud rate generator, which are selected by bits in the T2CON as shown in Table 41.
In the Capture Mode there are two options which
are selected by Bit EXEN2 in T2CON. if EXEN2 =
0, then Timer 2 is a 16-bit timer or counter which
upon overflowing sets Bit TF2, the Timer 2 overflow bit, which can be used to generate an interrupt. If EXEN2 = 1, then Timer 2 still does the
above, but with the added feature that a 1-to-0
transition at external input T2EX causes the current value in the Timer 2 registers, TL2 and TH2,
to be captured into registers RCAP2L and
RCAP2H, respectively. In addition, the transition
at T2EX causes Bit EXF2 in T2CON to be set, and
EXF2 like TF2 can generate an interrupt. The Capture Mode is illustrated in Figure 25.
In the Auto-reload Mode, there are again two options, which are selected by bit EXEN2 in T2CON.
If EXEN2 = 0, then when Timer 2 rolls over it not
only sets TF2 but also causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2L and RCAP2H, which are preset by
software. If EXEN2 = 1, then Timer 2 still does the
above, but with the added feature that a 1-to-0
transition at external input T2EX will also trigger
the 16-bit reload and set EXF2. The Auto-reload
Mode is illustrated in Standard Serial Interface
(UART) Figure 26. The Baud Rate Generation
Mode is selected by (RCLK, RCLK1)=1 and/or
(TCLK, TCLK1)=1. It will be described in conjunction with the serial port.
µPSD325X DEVICES
Table 40. Timer/Counter 2 Control Register (T2CON)
7
6
5
4
3
2
1
0
TF2
EXF2
RCLK
TCLK
EXEN2
TR2
C/T2
CP/RL2
Table 41. Description of the T2CON Bits
Bit
Symbol
Function
7
TF2
Timer 2 overflow flag. Set by a Timer 2 overflow, and must be cleared by software. TF2
will not be set when either (RCLK, RCLK1)=1 or (TCLK, TCLK)=1
6
EXF2
5
RCLK1
Receive clock flag (UART 1). When set, causes the serial port to use Timer 2 overflow
pulses for its receive clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be
used for the receive clock
4
TCLK1
Transmit clock flag (UART 1). When set, causes the serial port to use Timer 2 overflow
pulses for its transmit clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be
used for the transmit clock
3
EXEN2
Timer 2 external enable flag. When set, allows a capture or reload to occur as a result of
a negative transition on T2EX if Timer 2 is not being used to clock the serial port.
EXEN2=0 causes Time 2 to ignore events at T2EX
2
TR2
Start/stop control for Timer 2. A logic 1 starts the timer
1
C/T2
Timer or Counter select for Timer 2. Cleared for timer operation (input from internal
system clock, tCPU); set for external event counter operation (negative edge triggered)
0
CP/RL2
Timer 2 external flag set when either a capture or reload is caused by a negative
transition on T2EX and EXEN2=1. When Timer 2 interrupt is enabled, EXF2=1 will
cause the CPU to vector to the Timer 2 interrupt routine. EXF2 must be cleared by
software
Capture/reload flag. When set, capture will occur on negative transition of T2EX if
EXEN2=1. When cleared, auto-reload will occur either with TImer 2 overflows, or
negative transitions of T2EX when EXEN2=1. When either (RCLK, RCLK1)=1 or (TCLK,
TCLK)=1, this bit is ignored, and timer is forced to auto-reload on Timer 2 overflow
Note: 1. The RCLK1 and TCLK1 Bits in the PCON Register control UART 2, and have the same function as RCLK and TCLK.
57/176
µPSD325X DEVICES
Table 42. Timer/Counter2 Operating Modes
T2CON
Mode
16-bit
Autoreload
Input Clock
RxCLK
or
TxCLK
CP/
RL2
TR2
T2MOD
DECN
T2CON
EXEN
P1.1
T2EX
0
0
1
0
0
x
reload upon overflow
0
0
1
0
1
↓
reload trigger (falling
edge)
0
0
1
1
x
0
Down counting
0
0
1
1
x
1
Up counting
0
1
1
x
0
x
16-bit Timer/Counter
(only up counting)
16-bit
Capture
0
1
1
x
1
↓
Capture (TH1,TL2) →
(RCAP2H,RCAP2L)
1
x
1
x
0
x
No overflow interrupt
request (TF2)
Baud Rate
Generator
Off
Remarks
1
x
1
x
1
↓
Extra external interrupt
(Timer 2)
x
x
0
x
x
x
Timer 2 stops
Internal
External
(P1.0/T2)
fOSC/12
MAX
fOSC/24
fOSC/12
MAX
fOSC/24
fOSC/12
MAX
fOSC/24
—
—
Note: ↓ = falling edge
Figure 25. Timer 2 in Capture Mode
fOSC
÷ 12
C/T2 = 0
C/T2 = 1
T2 pin
TL2
(8 bits)
TH2
(8 bits)
TF2
Control
TR2
Timer 2
Interrupt
Capture
RCAP2L RCAP2H
Transition
Detector
T2EX pin
EXP2
Control
EXEN2
AI06625
58/176
µPSD325X DEVICES
Figure 26. Timer 2 in Auto-Reload Mode
fOSC
÷ 12
C/T2 = 0
C/T2 = 1
T2 pin
TL2
(8 bits)
TH2
(8 bits)
TF2
Control
TR2
Timer 2
Interrupt
Reload
RCAP2L RCAP2H
Transition
Detector
T2EX pin
EXP2
Control
EXEN2
AI06626
59/176
µPSD325X DEVICES
STANDARD SERIAL INTERFACE (UART)
The µPSD325X devices provides two standard
8032 UART serial ports. The first port is connected
to pin P3.0 (RX) and P3.1 (TX). The second port is
connected to pin P1.2 (RX) and P1.3(TX). The operation of the two serial ports are the same and are
controlled by the SCON and SCON2 registers.
The serial port is full duplex, meaning it can transmit and receive simultaneously. It is also receivebuffered, meaning it can commence reception of a
second byte before a previously received byte has
been read from the register. (However, if the first
byte still has not been read by the time reception
of the second byte is complete, one of the bytes
will be lost.) The serial port receive and transmit
registers are both accessed at Special Function
Register SBUF (or SBUF2 for the second serial
port). Writing to SBUF loads the transmit register,
and reading SBUF accesses a physically separate
receive register.
The serial port can operate in 4 modes:
Mode 0. Serial data enters and exits through
RxD. TxD outputs the shift clock. 8 bits are transmitted/received (LSB first). The baud rate is fixed
at 1/6 the CPU clock frequency.
Mode 1. 10 bits are transmitted (through TxD) or
received (through RxD): a start Bit (0), 8 data bits
(LSB first), and a Stop Bit (1). On receive, the Stop
Bit goes into RB8 in Special Function Register
SCON. The baud rate is variable.
Mode 2. 11 bits are transmitted (through TxD) or
received (through RxD): start Bit (0), 8 data bits
(LSB first), a programmable 9th data bit, and a
Stop Bit (1). On Transmit, the 9th data bit (TB8 in
SCON) can be assigned the value of '0' or '1.' Or,
for example, the Parity Bit (P, in the PSW) could
be moved into TB8. On receive, the 9th data bit
goes into RB8 in Special Function Register SCON,
while the Stop Bit is ignored. The baud rate is programmable to either 1/32 or 1/64 the oscillator frequency.
Mode 3. 11 bits are transmitted (through TxD) or
received (through RxD): a start Bit (0), 8 data bits
(LSB first), a programmable 9th data bit, and a
Stop Bit (1). In fact, Mode 3 is the same as Mode
2 in all respects except baud rate. The baud rate
in Mode 3 is variable.
In all four modes, transmission is initiated by any
instruction that uses SBUF as a destination register. Reception is initiated in Mode 0 by the condition RI = 0 and REN = 1. Reception is initiated in
the other modes by the incoming start bit if REN =
1.
Multiprocessor Communications
Modes 2 and 3 have a special provision for multiprocessor communications. In these modes, 9
data bits are received. The 9th one goes into RB8.
Then comes a Stop Bit. The port can be programmed such that when the Stop Bit is received,
the serial port interrupt will be activated only if RB8
= 1. This feature is enabled by setting Bit SM2 in
SCON. A way to use this feature in multi-processor systems is as follows:
When the master processor wants to transmit a
block of data to one of several slaves, it first sends
out an address byte which identifies the target
slave. An address byte differs from a data byte in
that the 9th bit is '1' in an address byte and 0 in a
data byte. With SM2 = 1, no slave will be interrupted by a data byte. An ad-dress byte, however, will
interrupt all slaves, so that each slave can examine the received byte and see if it is being addressed. The addressed slave will clear its SM2
Bit and prepare to receive the data bytes that will
be coming. The slaves that weren’t being addressed leave their SM2s set and go on about
their business, ignoring the coming data bytes.
SM2 has no effect in Mode 0, and in Mode 1 can
be used to check the validity of the Stop Bit. In a
Mode 1 reception, if SM2 = 1, the receive interrupt
will not be activated unless a valid Stop Bit is received.
Serial Port Control Register
The serial port control and status register is the
Special Function Register SCON (SCON2 for the
second port), shown in Figure 27. This register
contains not only the mode selection bits, but also
the 9th data bit for transmit and receive (TB8 and
RB8), and the Serial Port Interrupt Bits (TI and RI).
Table 43. Serial Port Control Register (SCON)
7
6
5
4
3
2
1
0
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
60/176
µPSD325X DEVICES
Table 44. Description of the SCON Bits
Bit
Symbol
7
SM0
6
SM1
Function
(SM1,SM0)=(0,0): Shift Register. Baud rate = fOSC/12
(SM1,SM0)=(1,0): 8-bit UART. Baud rate = variable
(SM1,SM0)=(0,1): 8-bit UART. Baud rate = fOSC/64 or fOSC/32
(SM1,SM0)=(1,1): 8-bit UART. Baud rate = variable
5
SM2
Enables the multiprocessor communication features in Mode 2 and 3. In Mode 2 or 3, if
SM2 is set to ’1,’ R1 will not be activated if its received 8th data bit (RB8) is ’0.’ In Mode
1, if SM2=1, R1 will not be activated if a valid Stop Bit was not received. In Mode 0, SM2
should be ’0’
4
REN
Enables serial reception. Set by software to enable reception. Clear by software to
disable reception
3
TB8
The 8th data bit that will be transmitted in Modes 2 and 3. Set or clear by software as
desired
2
RB8
In Modes 2 and 3, this bit contains the 8th data bit that was received. In Mode 1, if
SM2=0, RB8 is the Snap Bit that was received. In Mode 0, RB8 is not used
1
TI
Transmit interrupt flag. Set by hardware at the end of the 8th bit time in Mode 0, or at the
beginning of the Stop Bit in the other modes, in any serial transmission. Must be cleared
by software
0
RI
Receive interrupt flag. Set by hardware at the end of the 8th bit time in Mode 0, or
halfway through the Stop Bit in the other modes, in any serial reception (except for
SM2). Must be cleared by software
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µPSD325X DEVICES
Baud Rates. The baud rate in Mode 0 is fixed:
Mode 0 Baud Rate = fosc / 12
The baud rate in Mode 2 depends on the value of
Bit SMOD = 0 (which is the value on reset), the
baud rate is 1/64 the oscillator frequency. If SMOD
= 1, the baud rate is 1/32 the oscillator frequency.
Mode 2 Baud Rate = (2 SMOD / 64) x fosc
In the µPSD325X devices, the baud rates in
Modes 1 and 3 are determined by the Timer 1
overflow rate.
Using Timer 1 to Generate Baud Rates. When
Timer 1 is used as the baud rate generator, the
baud rates in Modes 1 and 3 are determined by
the Timer 1 overflow rate and the value of SMOD
as follows (see:
Mode 1,3 Baud Rate = (2SMOD / 32) x (Timer 1
overflow Rate)
The Timer 1 interrupt should be disabled in this application. The Timer itself can be configured for either “timer” or “counter” operation, and in any of its
3 running modes. In the most typical applications,
it is configured for “timer” operation, in the Auto-reload Mode (high nibble of TMOD = 0010B). In that
case the baud rate is given by the formula:
Mode 1,3 Baud Rate = = (2SMOD / 32) x (fosc / 12
x [256 - (TH1)]
One can achieve very low baud rates with Timer 1
by leaving the Timer 1 interrupt enabled, and configuring the Timer to run as a 16-bit timer (high nibble of TMOD = 0001B), and using the Timer 1
interrupt to do a 16-bit software reload. Figure 22
lists various commonly used baud rates and how
they can be obtained from Timer 1.
Using Timer/Counter 2 to Generate Baud
Rates. In the µPSD325X devices, Timer 2 selected as the baud rate generator by setting TCLK
and/or RCLK (see Figure 22, page 55 Timer/
Counter 2 Control Register (T2CON)).
Note: The baud rate for transmit and receive can
be simultaneously different. Setting RCLK and/or
TCLK puts Timer into its Baud Rate Generator
Mode.
The RCLK and TCLK Bits in the T2CON register
configure UART 1. The RCLK1 and TCLK1 Bits in
the PCON register configure UART 2.
The Baud Rate Generator Mode is similar to the
Auto-reload Mode, in that a roll over in TH2 causes
the Timer 2 registers to be reloaded with the 16-bit
value in registers RCAP2H and RCAP2L, which
are preset by software.
Now, the baud rates in Modes 1 and 3 are determined at Timer 2’s overflow rate as follows:
Mode 1,3 Baud Rate = Timer 2 Overflow Rate / 16
Table 45. Timer 1-Generated Commonly Used Baud Rates
Baud Rate
fOSC
SMOD
Timer 1
C/T
Mode
Reload Value
Mode 0 Max: 1MHz
12MHz
X
X
X
X
Mode 2 Max: 375K
12MHz
1
X
X
X
Modes 1, 3: 62.5K
12MHz
1
0
2
FFh
19.2K
11.059MHz
1
0
2
FDh
9.6K
11.059MHz
0
0
2
FDh
4.8K
11.059MHz
0
0
2
FAh
2.4K
11.059MHz
0
0
2
F4h
1.2K
11.059MHz
0
0
2
E8h
137.5
11.059MHz
0
0
2
1Dh
110
6MHz
0
0
2
72h
110
12MHz
0
0
1
FEEBh
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µPSD325X DEVICES
The timer can be configured for either “timer” or
“counter” operation. In the most typical applications, it is configured for “timer” operation (C/T2 =
0). “Timer” operation is a little different for Timer 2
when it’s being used as a baud rate generator.
Normally, as a timer it would increment every machine cycle (thus at the 1/6 the CPU clock frequency). In the case, the baud rate is given by the
formula:
Mode 1,3 Baud Rate = fosc / (32 x [65536 (RCAP2H, RCAP2L)]
where (RCAP2H, RCAP2L) is the content of
RC2H and RC2L taken as a 16-bit unsigned integer.
Timer 2 also be used as the Baud Rate Generating
Mode. This mode is valid only if RCLK + TCLK = 1
in T2CON or in PCON.
Note: A roll-over in TH2 does not set TF2, and will
not generate an interrupt. Therefore, the Timer interrupt does not have to be disabled when Timer 2
is in the Baud Rate Generator Mode.
Note: If EXEN2 is set, a 1-to-0 transition in T2EX
will set EXF2 but will not cause a reload from
(RCAP2H, RCAP2L) to (TH2, TL2). Thus when
Timer 2 is in use as a baud rate generator, T2EX
can be used as an extra external interrupt, if desired.
It should be noted that when Timer 2 is running
(TR2 = 1) in “timer” function in the Baud Rate Generator Mode, one should not try to READ or
WRITE TH2 or TL2. Under these conditions the
timer is being incremented every state time, and
the results of a READ or WRITE may not be accurate. The RC registers may be read, but should not
be written to, because a WRITE might overlap a
reload and cause WRITE and/or reload errors.
Turn the timer off (clear TR2) before accessing the
Timer 2 or RC registers, in this case.
More About Mode 0. Serial data enters and exits
through RxD. TxD outputs the shift clock. 8 bits are
transmitted/received: 8 data bits (LSB first). The
baud rate is fixed a 1/6 the CPU clock frequency.
Figure 27, page 65 shows a simplified functional
diagram of the serial port in Mode 0, and associated timing.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal at S6P2 also loads a '1' into the
9th position of the transmit shift register and tells
the TX Control block to commence a transmission.
The internal timing is such that one full machine
cycle will elapse between “WRITE to SBUF” and
activation of SEND.
SEND enables the output of the shift register to the
alternate out-put function line of RxD and also enable SHIFT CLOCK to the alternate output function line of TxD. SHIFT CLOCK is low during S3,
S4, and S5 of every machine cycle, and high during S6, S1, and S2. At S6P2 of every machine cycle in which SEND is active, the contents of the
transmit shift are shifted to the right one position.
As data bits shift out to the right, zeros come in
from the left. When the MSB of the data byte is at
the output position of the shift register, then the '1'
that was initially loaded into the 9th position, is just
to the left of the MSB, and all positions to the left
of that contain zeros. This condition flags the TX
Control block to do one last shift and then deactivate SEND and set T1. Both of these actions occur
at S1P1. Both of these actions occur at S1P1 of
the 10th machine cycle after “WRITE to SBUF.”
Reception is initiated by the condition REN = 1 and
R1 = 0. At S6P2 of the next machine cycle, the RX
Control unit writes the bits 11111110 to the receive
shift register, and in the next clock phase activates
RECEIVE.
RECEIVE enables SHIFT CLOCK to the alternate
output function line of TxD. SHIFT CLOCK makes
transitions at S3P1 and S6P1 of every machine
cycle in which RECEIVE is active, the contents of
the receive shift register are shifted to the left one
position. The value that comes in from the right is
the value that was sampled at the RxD pin at S5P2
of the same machine cycle.
As data bits come in from the right, '1s' shift out to
the left. When the '0' that was initially loaded into
the right-most position arrives at the left-most position in the shift register, it flags the RX Control
block to do one last shift and load SBUF. At S1P1
of the 10th machine cycle after the WRITE to
SCON that cleared RI, RECEIVE is cleared as RI
is set.
More About Mode 1. Ten bits are transmitted
(through TxD), or received (through RxD): a start
Bit (0), 8 data bits (LSB first). and a Stop Bit (1). On
receive, the Stop Bit goes into RB8 in SCON. In
the µPSD325X devices the baud rate is determined by the Timer 1 over-flow rate.
Figure 29 shows a simplified functional diagram of
the serial port in Mode 1, and associated timings
for transmit receive.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal also loads a '1' into the 9th bit position of the transmit shift register and flags the TX
Control unit that a transmission is requested.
Transmission actually commences at S1P1 of the
machine cycle following the next rollover in the divide-by-16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the
“WRITE to SBUF” signal.)
The transmission begins with activation of SEND
which puts the start bit at TxD. One bit time later,
DATA is activated, which enables the output bit of
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µPSD325X DEVICES
the transmit shift register to TxD. The first shift
pulse occurs one bit time after that.
As data bits shift out to the right, zeros are clocked
in from the left. When the MSB of the data byte is
at the output position of the shift register, then the
’1’ that was initially loaded into the 9th position is
just to the left of the MSB, and all positions to the
left of that contain zeros. This condition flags the
TX Control unit to do one last shift and then deactivate SEND and set TI. This occurs at the 10th divide-by-16 rollover after “WRITE to SBUF.”
Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH
is written into the input shift register. Resetting the
divide-by-16 counter aligns its roll-overs with the
boundaries of the incoming bit times.
The 16 states of the counter divide each bit time
into 16ths. At the 7th, 8th, and 9th counter states
of each bit time, the bit detector samples the value
of RxD. The value accepted is the value that was
seen in at least 2 of the 3 samples. This is done for
noise rejection. If the value accepted during the
first bit time is not '0,' the receive circuits are reset
and the unit goes back to looking for an-other 1-to0 transition. This is to provide rejection of false
start bits. If the start bit proves valid, it is shifted
into the input shift register, and reception of the reset of the rest of the frame will proceed.
As data bits come in from the right, '1s' shift out to
the left. When the start bit arrives at the left-most
position in the shift register (which in Mode 1 is a
9-bit register), it flags the RX Control block to do
one last shift, load SBUF and RB8, and set RI. The
signal to load SBUF and RB8, and to set RI, will be
generated if, and only if, the following conditions
are met at the time the final shift pulse is generated:
1. R1 = 0, and
2. Either SM2 = 0, or the received Stop Bit = 1.
If either of these two conditions is not met, the received frame is irretrievably lost. If both conditions
are met, the Stop Bit goes into RB8, the 8 data bits
go into SBUF, and RI is activated. At this time,
whether the above conditions are met or not, the
unit goes back to looking for a 1-to-0 transition in
RxD.
More About Modes 2 and 3. Eleven bits are
transmitted (through TxD), or received (through
RxD): a Start Bit (0), 8 data bits (LSB first), a programmable 9th data bit, and a Stop Bit (1). On
transmit, the 9th data bit (TB8) can be assigned
the value of '0' or '1.' On receive, the data bit goes
into RB8 in SCON. The baud rate is programmable to either 1/16 or 1/32 the CPU clock frequency
64/176
in Mode 2. Mode 3 may have a variable baud rate
generated from Timer 1.
Figure 31, page 67 and Figure 33, page 68 show
a functional diagram of the serial port in Modes 2
and 3. The receive portion is exactly the same as
in Mode 1. The transmit portion differs from Mode
1 only in the 9th bit of the transmit shift register.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal also loads TB8 into the 9th bit position of the transmit shift register and flags the TX
Control unit that a transmission is requested.
Transmission commences at S1P1 of the machine
cycle following the next roll-over in the divide-by16 counter. (Thus, the bit times are synchronized
to the divide-by-16 counter, not to the “WRITE to
SBUF” signal.)
The transmission begins with activation of SEND,
which puts the start bit at TxD. One bit time later,
DATA is activated, which enables the output bit of
the transmit shift register to TxD. The first shift
pulse occurs one bit time after that. The first shift
clocks a '1' (the Stop Bit) into the 9th bit position of
the shift register. There-after, only zeros are
clocked in. Thus, as data bits shift out to the right,
zeros are clocked in from the left. When TB8 is at
the out-put position of the shift register, then the
Stop Bit is just to the left of TB8, and all positions
to the left of that contain zeros. This condition flags
the TX Control unit to do one last shift and then deactivate SEND and set TI. This occurs at the 11th
divide-by 16 rollover after “WRITE to SUBF.”
Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH
is written to the input shift register.
At the 7th, 8th, and 9th counter states of each bit
time, the bit detector samples the value of R-D.
The value accepted is the value that was seen in
at least 2 of the 3 samples. If the value accepted
during the first bit time is not '0,' the receive circuits
are reset and the unit goes back to looking for another 1-to-0 transition. If the Start Bit proves valid,
it is shifted into the input shift register, and reception of the rest of the frame will proceed.
As data bits come in from the right, '1s' shift out to
the left. When the Start Bit arrives at the left-most
position in the shift register (which in Modes 2 and
3 is a 9-bit register), it flags the RX Control block
to do one last shift, load SBUF and RB8, and set
RI.
The signal to load SBUF and RB8, and to set RI,
will be generated if, and only if, the following conditions are met at the time the final shift pulse is
generated:
µPSD325X DEVICES
1. RI = 0, and
2. Either SM2 = 0, or the received 9th data bit = 1
If either of these conditions is not met, the received
frame is irretrievably lost, and RI is not set. If both
conditions are met, the received 9th data bit goes
into RB8, and the first 8 data bits go into SBUF.
One bit time later, whether the above conditions
were met or not, the unit goes back to looking for
a 1-to-0 transition at the RxD input.
Figure 27. Serial Port Mode 0, Block Diagram
Internal Bus
Write
to
SBUF
D S
Q
CL
RxD
P3.0 Alt
Output
Function
SBUF
Zero Detector
Shift
Start
Tx Control
S6
Tx Clock
T
Send
Serial
Port
Interrupt
Shift
Clock
Rx Clock
REN
Start
R1
Receive
R
Shift
Rx Control
7 6 5 4 3 2 1 0
RxD
P3.0 Alt
Input
Function
Input Shift Register
Load
SBUF
TxD
P3.1 Alt
Output
Function
Shift
SBUF
Read
SBUF
Internal Bus
AI06824
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µPSD325X DEVICES
Figure 28. Serial Port Mode 0, Waveforms
Write to SBUF
Send
Shift
RxD (Data Out)
TxD (Shift Clock)
T
S6P2
D0
D1
S3P1
D2
D3
D4
D5
D6
Transmit
D7
S6P1
Write to SCON
RI
Receive
Shift
RxD (Data In)
TxD (Shift Clock)
Clear RI
Receive
D0
D1
D2
D3
D4
D5
D6
D7
AI06825
Figure 29. Serial Port Mode 1, Block Diagram
Timer1
Overflow
Timer2
Overflow
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
0
1
Shift
Start
TCLK
Tx Control
÷16
0
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
1
RCLK
÷16
Sample
1-to-0
Transition
Detector
Rx Clock
Start
Load SBUF
RI
Rx Control
1FFh
Shift
Rx Detector
Input Shift Register
RxD
Load
SBUF
Shift
SBUF
Read
SBUF
Internal Bus
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µPSD325X DEVICES
Figure 30. Serial Port Mode 1, Waveforms
Tx Clock
Write to SBUF
S1P1
Send
Transmit
Data
Shift
TxD
T1
Start Bit
D0
D1
D2
D3
D4
D5
D6
D7
TB8
Stop Bit
D1
D2
D3
D4
D5
D6
D7
RB8
Stop Bit
÷16 Reset
Rx Clock
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
AI06843
Figure 31. Serial Port Mode 2, Block Diagram
Phase2 Clock
1/2*fOSC
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
Shift
Start
Tx Control
÷16
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
÷16
Sample
1-to-0
Transition
Detector
Rx Clock
Start
Load SBUF
RI
Rx Control
1FFh
Shift
Rx Detector
Input Shift Register
RxD
Load
SBUF
Shift
SBUF
Read
SBUF
Internal Bus
AI06844
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µPSD325X DEVICES
Figure 32. Serial Port Mode 2, Waveforms
Tx Clock
Write to SBUF
S1P1
Send
Data
Transmit
Shift
Start Bit
TxD
TI
Stop Bit
Generator
D0
D1
D2
D3
D4
D5
D6
D7
TB8
Stop Bit
D1
D2
D3
D4
D5
D6
D7
RB8
Stop Bit
÷16 Reset
Rx Clock
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
AI06845
Figure 33. Serial Port Mode 3, Block Diagram
Timer1
Overflow
Timer2
Overflow
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
0
1
Shift
Start
TCLK
Tx Control
÷16
0
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
1
RCLK
÷16
Sample
1-to-0
Transition
Detector
Rx Clock
Start
Load SBUF
RI
Rx Control
1FFh
Shift
Rx Detector
Input Shift Register
RxD
Load
SBUF
Shift
SBUF
Read
SBUF
Internal Bus
AI06846
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µPSD325X DEVICES
Figure 34. Serial Port Mode 3, Waveforms
Tx Clock
Write to SBUF
Send
S1P1
Data
Transmit
Shift
TxD
TI
Stop Bit
Generator
Rx Clock
Start Bit
D0
D1
D2
D3
D4
D5
D6
D7
TB8
Stop Bit
D1
D2
D3
D4
D5
D6
D7
RB8
Stop Bit
÷16 Reset
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
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µPSD325X DEVICES
ANALOG-TO-DIGITAL CONVERTOR (ADC)
The analog to digital (A/D) converter allows conversion of an analog input to a corresponding 8-bit
digital value. The A/D module has four analog inputs, which are multiplexed into one sample and
hold. The output of the sample and hold is the input into the converter, which generates the result
via successive approximation. The analog supply
voltage is connected to AVREF of ladder resistance of A/D module.
The A/D module has two registers which are the
control register ACON and A/D result register
ADAT. The register ACON, shown in Table 47,
page 71, controls the operation of the A/D converter module. To use analog inputs, I/O is selected by
P1SFS register. Also an 8-bit prescaler ASCL divides the main system clock input down to approximately 6MHz clock that is required for the ADC
logic. Appropriate values need to be loaded into
the prescaler based upon the main MCU clock frequency prior to use.
The processing of conversion starts when the
Start Bit ADST is set to ’1.’ After one cycle, it is
cleared by hardware. The register ADAT contains
the results of the A/D conversion. When conversion is completed, the result is loaded into the
ADAT the A/D Conversion Status Bit ADSF is set
to ’1.’
The block diagram of the A/D module is shown in
Figure 35. The A/D Status Bit ADSF is set automatically when A/D conversion is completed,
cleared when A/D conversion is in process.
The ASCL should be loaded with a value that results in a clock rate of approximately 6MHz for the
ADC using the following formula:
ADC clock input = (Fosc / 2) / (Prescaler register
value +1)
Where Fosc is the MCU clock input frequency
The conversion time for the ADC can be calculated as follows:
ADC Conversion Time = 8 clock * 8bits * (ADC
Clock) ~= 10.67usec (at 6MHz)
ADC Interrupt
The ADSF Bit in the ACON register is set to ’1’
when the A/D conversion is complete. The status
bit can be driven by the MCU, or it can be configured to generate a falling edge interrupt when the
conversion is complete.
The ADSF interrupt is enabled by setting the ADSFINT Bit in the PCON register. Once the bit is set,
the external INT1 interrupt is disabled and the
ADSF interrupt takes over as INT1. INT1 must be
configured as if it is an edge interrupt input. The
INP1 pin (p3.3) is available for general I/O functions, or Timer1 gate control.
Figure 35. A/D Block Diagram
Ladder
Resistor
Decode
AVREF
ACH0
ACH1
Input
MUX
Successive
Approximation
Circuit
S/H
Conversion
Complete
Interrupt
ACH2
ACH3
ACON
ADAT
INTERNAL BUS
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µPSD325X DEVICES
Table 46. ADC SFR Memory Map
SFR
Addr
Reg
Name
95
ASCL
96
ADAT
97
ACON
Bit Register Name
7
ADAT7
6
ADAT6
5
4
ADAT5
3
ADAT4
ADEN
2
1
Reset
Comments
Value
0
00
8-bit
Prescaler for
ADC clock
ADAT3
ADAT2
ADAT1
ADAT0
00
ADC Data
Register
ADS1
ADS0
ADST
ADSF
00
ADC Control
Register
Table 47. Description of the ACON Bits
Bit
Symbol
7 to 6
—
ADEN
Function
Reserved
ADC Enable Bit: 0 : ADC shut off and consumes no operating current
5
1 : enable ADC
4
—
Reserved
ADS1, ADS0 Analog channel select
3 to 2
0, 0
Channel0 (ACH0)
0, 1
Channel1 (ACH1)
1, 0
Channel2 (ACH2)
1, 1
Channel3 (ACH3)
ADST
ADC Start Bit:
0 : force to zero
1
1 : start an ADC; after one cycle, bit is cleared to '0'
ADSF
ADC Status Bit:
0 : A/D conversion is in process
0
1 : A/D conversion is completed, not in process
Table 48. ADC Clock Input
MCU Clock Frequency
Prescaler Register Value
ADC Clock
40MHz
2
6.7MHz
36MHz
2
6MHz
24MHz
1
6MHz
12MHz
0
6MHz
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µPSD325X DEVICES
PULSE WIDTH MODULATION (PWM)
The PWM block has the following features:
■ Four-channel, 8-bit PWM unit with 16-bit
prescaler
■
One-channel, 8-bit unit with programmable
frequency and pulse width
■
PWM Output with programmable polarity
4-channel PWM unit (PWM 0-3)
The 8-bit counter of a PWM counts module 256
(i.e., from 0 to 255, inclusive). The value held in
the 8-bit counter is compared to the contents of the
Special Function Register (PWM 0-3) of the corresponding PWM. The polarity of the PWM outputs
is programmable and selected by the PWML Bit in
PWMCON register. Provided the contents of a
PWM 0-3 register is greater than the counter value, the corresponding PWM output is set HIGH
(with PWML = 0). When the contents of this register is less than or equal to the counter value, the
corresponding PWM output is set LOW (with
PWML = 0). The pulse-width-ratio is therefore de-
72/176
fined by the contents of the corresponding Special
Function Register (PWM 0-3) of a PWM. By loading the corresponding Special Function Register
(PWM 0-3) with either 00H or FFH, the PWM output can be retained at a constant HIGH or LOW
level respectively (with PWML = 0).
For each PWM unit, there is a 16-bit Prescaler that
are used to divide the main system clock to form
the input clock for the corresponding PWM unit.
This prescaler is used to define the desired repetition rate for the PWM unit. SFR registers B1h B2h are used to hold the 16-bit divisor values.
The repetition frequency of the PWM output is given by:
fPWM 8 = (fOSC / prescaler0) / (2 x 256)
And the input clock frequency to the PWM
counters is = fOSC / 2 / (prescaler data value + 1)
See the I/O PORTS (MCU Module), page 46 for
more information on how to configure the Port 4
pin as PWM output.
µPSD325X DEVICES
Figure 36. Four-Channel 8-bit PWM Block Diagram
DATA BUS
x4
8
8
CPU rd/wr
8-bit PWM0-PWM3
Data Registers
8
x4
8
load
8-bit PWM0-PWM3
Comparators Registers
8
x4
16-bit Prescaler
Register
(B2h,B1h)
CPU rd/wr
8-bit PWM0-PWM3
Comparators
4
Port4.3
Port4.4
Port4.5
Port4.6
PWMCON bit7 (PWML)
16
8
8-bit Counter
16-bit Prescaler
Counter
fOSC/2
clock
Overflow
load
PWMCON bit5 (PWME)
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µPSD325X DEVICES
Table 49. PWM SFR Memory Map
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
PWML
PWMP
PWME
CFG4
CFG3
CFG2
CFG1
CFG0
Reset
Comments
Value
00
PWM
Control
Polarity
PWM0
00
PWM0
Output
Duty Cycle
A3
PWM1
00
PWM1
Output
Duty Cycle
A4
PWM2
00
PWM2
Output
Duty Cycle
A5
PWM3
00
PWM3
Output
Duty Cycle
AA
PWM4P
00
PWM 4
Period
AB
PWM4W
00
PWM 4
Pulse
Width
B1
PSCL0L
00
Prescaler 0
Low (8-bit)
B2
PSCL0H
00
Prescaler 0
High (8-bit)
B3
PSCL1L
00
Prescaler 1
Low (8-bit)
B4
PSCL1H
00
Prescaler 1
High (8-bit)
A1
PWMCON
A2
PWMCON Register Bit Definition:
– PWML = PWM 0-3 polarity control
– PWMP = PWM 4 polarity control
– PWME = PWM enable (0 = disabled, 1= enabled)
– CFG3..CFG0 = PWM 0-3 Output (0 = Open Drain; 1 = Push-Pull)
– CFG4 = PWM 4 Output (0 = Open Drain; 1 = Push-Pull)
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µPSD325X DEVICES
Programmable Period 8-bit PWM
The PWM 4 channel can be programmed to provide a PWM output with variable pulse width and
period. The PWM 4 has a 16-bit Prescaler, an 8bit Counter, a Pulse Width Register, and a Period
Register. The Pulse Width Register defines the
PWM pulse width time, while the Period Register
defines the period of the PWM. The input clock to
the Prescaler is fOSC/2. The PWM 4 channel is assigned to Port 4.7.
Figure 37. Programmable PWM 4 Channel Block Diagram
DATA BUS
8
CPU RD/WR
8
8
8-bit PWM4P
Register
(Period)
8-bit PWM4W
Register
(Width)
8
8
8-bit PWM4
Comparator
Register
8-bit PWM4
Comparator
Register
8
CPU RD/WR
16-bit Prescaler
Register
Load
Port 4.7
(B4h, B3h)
8
PWM4
Control
8
16
8-bit PWM4
Comparator
fOSC / 2
16-bit Prescaler
Counter
Load
8-bit PWM4
Comparator
Match
8
PWMCON
Bit 6 (PWMP)
8
PWMCON
Bit 5 (PWME)
8-bit Counter
Clock
Reset
AI07091
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µPSD325X DEVICES
PWM 4 Channel Operation
The 16-bit Prescaler1 divides the input clock
(fOSC/2) to the desired frequency, the resulting
clock runs the 8-bit Counter of the PWM 4 channel. The input clock frequency to the PWM 4
Counter is:
f PWM4 = (fOSC/2)/(Prescaler1 data value +1)
When the Prescaler1 Register (B4h, B3h) is set to
data value ’0,’ the maximum input clock frequency
to the PWM 4 Counter is fOSC/2 and can be as high
as 20MHz.
The PWM 4 Counter is a free-running, 8-bit
counter. The output of the counter is compared to
the Compare Registers, which are loaded with
data from the Pulse Width Register (PWM4W,
ABh) and the Period Register (PWM4P, AAh). The
Pulse Width Register defines the pulse duration or
the Pulse Width, while the Period Register defines
the period of the PWM. When the PWM 4 channel
is enabled, the register values are loaded into the
Comparator Registers and are compared to the
Counter output. When the content of the counter is
equal to or greater than the value in the Pulse
Width Register, it sets the PWM 4 output to low
(with PWMP Bit = 0). When the Period Register
equals to the PWM4 Counter, the Counter is
cleared, and the PWM 4 channel output is set to
logic ’high’ level (beginning of the next PWM
pulse).
The Period Register cannot have a value of “00”
and its content should always be greater than the
Pulse Width Register.
The Prescaler1 Register, Pulse Width Register,
and Period Register can be modified while the
PWM 4 channel is active. The values of these registers are automatically loaded into the Prescaler
Counter and Comparator Registers when the current PWM 4 period ends.
The PWMCON Register (Bits 5 and 6) controls the
enable/disable and polarity of the PWM 4 channel.
Figure 38. PWM 4 With Programmable Pulse Width and Frequency
Defined by Period Register
PWM4
Defined by Pulse
Width Register
Switch Level
RESET
Counter
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µPSD325X DEVICES
I2C INTERFACE
There are two serial I2C ports implemented in the
µPSD325X devices.
The serial port supports the twin line I2C-bus, consists of a data line (SDAx) and a clock line (SCLx).
Depending on the configuration, the SDA and SCL
lines may require pull-up resistors.
■ SDA1, SCL1: the serial port line for DDC
Protocol
■
The I2C serial I/O has complete autonomy in byte
handling and operates in 4 modes.
■ Master transmitter
■
Master receiver
■
Slave transmitter
■
Slave receiver
These functions are controlled by the SFRs.
■ SxCON: the control of byte handling and the
operation of 4 mode.
SDA2, SCL2: the serial port line for general I2C
bus connection
In both I2C interfaces, these lines also function as
I/O port lines as follows.
■ SDA1 / P4.0, SCL1 / P4.1, SDA2 / P3.6, SCL2 /
P3.7
The system is unique because data transport,
clock generation, address recognition and bus
control arbitration are all controlled by hardware.
■
SxSTA: the contents of its register may also be
used as a vector to various service routines.
■
SxDAT: data shift register.
■
SxADR: slave address register. Slave address
recognition is performed by On-Chip H/W.
Figure 39. Block Diagram of the I2C Bus Serial I/O
7
0
Slave Address
7
0
Shift Register
SDAx
Internal Bus
Arbitration and Sync. Logic
Bus Clock Generator
SCLx
7
0
Control Register
7
0
Status Register
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µPSD325X DEVICES
Table 50. Serial Control Register (SxCON: S1CON, S2CON)
7
6
5
4
3
2
1
0
CR2
ENII
STA
STO
ADDR
AA
CR1
CR0
Table 51. Description of the SxCON Bits
Bit
Symbol
Function
7
CR2
This bit along with Bits CR1and CR0 determines the serial clock frequency when SIO is
in the Master Mode.
6
ENII
Enable IIC. When ENI1 = 0, the IIC is disabled. SDA and SCL outputs are in the high
impedance state.
5
STA
START flag. When this bit is set, the SIO H/W checks the status of the I2C-bus and
generates a START condition if the bus free. If the bus is busy, the SIO will generate a
repeated START condition when this bit is set.
4
STO
STOP flag. With this bit set while in Master Mode a STOP condition is generated.
When a STOP condition is detected on the I2C-bus, the I2C hardware clears the STO
flag.
Note: This bit have to be set before 1 cycle interrupt period of STOP. That is, if this bit is
set, STOP condition in Master Mode is generated after 1 cycle interrupt period.
3
ADDR
2
AA
1
CR1
0
CR0
This bit is set when address byte was received. Must be cleared by software.
Acknowledge enable signal. If this bit is set, an acknowledge (low level to SDA) is
returned during the acknowledge clock pulse on the SCL line when:
• Own slave address is received
• A data byte is received while the device is programmed to be a Master Receiver
• A data byte is received while the device is a selected Slave Receiver. When this bit is
reset, no acknowledge is returned.
SIO release SDA line as high during the acknowledge clock pulse.
These two bits along with the CR2 Bit determine the serial clock frequency when SIO is
in the Master Mode.
Table 52. Selection of the Serial Clock Frequency SCL in Master Mode
CR2
CR1
CR0
Bit Rate (kHz) at FOSC
FOSC
Divisor
12MHz
24MHz
36MHz
40MHz
0
0
0
16
375
750
X
X
0
0
1
24
250
500
750
833
0
1
0
30
200
400
600
666
0
1
1
60
100
200
300
333
1
0
0
120
50
100
150
166
1
0
1
240
25
50
75
83
1
1
0
480
12.5
25
37.5
41
1
1
1
960
6.25
12.5
18.75
20
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µPSD325X DEVICES
Serial Status Register (SxSTA: S1STA, S2STA)
SxSTA is a “Read-only” register. The contents of
this register may be used as a vector to a service
routine. This optimized the response time of the
software and consequently that of the I 2C-bus.
The status codes for all possible modes of the I2Cbus interface are given Table 54.
This flag is set, and an interrupt is generated, after
any of the following events occur.
1. Own slave address has been received during
AA = 1: ack_int
2. The general call address has been received
while GC(SxADR.0) = 1 and AA = 1:
3. A data byte has been received or transmitted in
Master Mode (even if arbitration is lost): ack_int
4. A data byte has been received or transmitted as
selected slave: ack_int
5. A stop condition is received as selected slave
receiver or transmitter: stop_int
Data Shift Register (SxDAT: S1DAT, S2DAT)
SxDAT contains the serial data to be transmitted
or data which has just been received. The MSB
(Bit 7) is transmitted or received first; that is, data
shifted from right to left.
Table 53. Serial Status Register (SxSTA)
7
6
5
4
3
2
1
0
GC
STOP
INTR
TX_MODE
BBUSY
BLOST
/ACK_REP
SLV
Table 54. Description of the SxSTA Bits
Bit
Symbol
Function
7
GC
6
STOP
Stop Flag. This bit is set when a STOP condition is received
5
INTR
Interrupt Flag. This bit is set when an I²C Interrupt condition is requested
4
TX_MODE
3
BBUSY
Bus Busy Flag.
This bit is set when the bus is being used by another master; otherwise, this bit is reset
2
BLOST
Bus Lost Flag.
This bit is set when the master loses the bus contention; otherwise this bit is reset
1
/ACK_REP
0
SLV
General Call Flag
Transmission Mode Flag.
This bit is set when the I²C is a transmitter; otherwise this bit is reset
Acknowledge Response Flag.
This bit is set when the receiver transmits the not acknowledge signal
This bit is reset when the receiver transmits the acknowledge signal
Slave Mode Flag.
This bit is set when the I²C plays role in the Slave Mode; otherwise this bit is reset
Note: 1. Interrupt Flag Bit (INTR, SxSTA Bit 5) is cleared by Hardware as reading SxSTA register.
2. I2C interrupt flag (INTR) can occur in below case. (except DDC2B Mode at SWENB=0)
Table 55. Data Shift Register (SxDAT: S1DAT, S2DAT)
7
6
5
4
3
2
1
0
SxDAT7
SxDAT6
SxDAT5
SxDAT4
SxDAT3
SxDAT2
SxDAT1
SxDAT0
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µPSD325X DEVICES
Address Register (SxADR: S1ADR, S2ADR)
This 8-bit register may be loaded with the 7-bit
slave address to which the controller will respond
when programmed as a slave receive/transmitter.
The Start/Stop Hold Time Detection and System
Clock registers (Tables 57 and 58) are included in
the I2C unit to specify the start/stop detection time
to work with the large range of MCU frequency values supported. For example, with a system clock
of 40MHz.
Table 56. Address Register (SxADR)
7
6
5
4
3
2
1
0
SLA6
SLA5
SLA4
SLA3
SLA2
SLA1
SLA0
—
Note: 1. SLA6 to SLA0: Own slave address.
Table 57. Start /Stop Hold Time Detection Register (S1SETUP, S2SETUP)
Address
Register Name
Reset Value
Note
D1h
S1SETUP
00h
To control the start/stop hold time detection for the DDC module
in Slave Mode
D2h
S2SETUP
00h
To control the start/stop hold time detection for the multi-master
I²C module in Slave Mode
SFR
Table 58. System Cock of 40MHz
S1SETUP,
S2SETUP Register
Value
Number of Sample
Clock (fOSC/2 ->
50ns)
Required Start/
Stop Hold Time
00h
1EA
50ns
80h
1EA
50ns
81h
2EA
100ns
82h
3EA
150ns
...
...
...
8Bh
12EA
600ns
...
...
...
FFh
128EA
6000ns
Note
When Bit 7 (enable bit) = 0, the number of
sample clock is 1EA (ignore Bit 6 to Bit 0)
Fast Mode I²C Start/Stop hold time specification
Table 59. System Clock Setup Examples
System Clock
S1SETUP,
S2SETUP Register
Value
Number of Sample
Clock
Required Start/Stop Hold Time
40MHz (fOSC/2 -> 50ns)
8Bh
12 EA
600ns
30MHz (fOSC/2 -> 66.6ns)
89h
9 EA
600ns
20MHz (fOSC/2 -> 100ns)
86h
6 EA
600ns
8MHz (fOSC/2 -> 250ns)
83h
3 EA
750ns
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µPSD325X DEVICES
Programmer’s Guide for I 2C and DDC2
The I2C serial I/O and DDC Interface operates in
four modes.
■ Master transmitter
■
Master receiver
■
Slave transmitter
■
Slave receiver
Master transmitter mode flow.
1. Read SxSTA.
2. If BBUSY == 1 then
go to step1.
Else then
write slave address to SxDAT and set both
ENI and STA, reset AA in SxCON.
3. Wait for interrupt.
4. Read SxSTA.
If BLOST == 1 or /ACK_REP == 1* then
write dummy data to SxDAT.
Go to step1.
Else then
clear STA.
5. Perform required service routines.
If this datum == LAST then
set STO in SxCON and write last data to SxDAT**.
Go to step 6.
Else then
write next data to SxDAT**.
Go to step3.
6. Wait for interrupt.
Write dummy data to SxDAT**.
Note: 1. (*) If the master don’t receive the acknowledge from the
slave, it generates the STOP condition and returns to the
IDLE state.
2. (**) This action should be the last in service routine.
Slave transmitter mode flow.
1. Write slave address to SxADR, set AA and ENI
in SxCON.
2. Wait for interrupt.
3. Read SxSTA and write the first data to SxDAT*.
Reset AA in SxCON.
4. Wait for interrupt.
5. Read SxSTA.
If /ACK_REP == 1** then
Go to step7.
Else then
write the next SxDAT*.
Go to step5.
6. Write dummy data to SxDAT*.
Note: 1. (*) These actions should be the last.
2. (**) If the master want to stop the current data requests, it
don’t have to acknowledge to the slave transmitter.
3. If the slave does not receive the acknowledge from the
master, it releases the SDA and enters the IDLE state, so
if the master is to resume the data requests, it must regenerate the START condition.
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µPSD325X DEVICES
Master receiver mode flow.
1. Read SxSTA.
2. If BBUSY == 1 then
go to step1.
Else then
write slave address to SxDAT and set both
ENI1 and STA, reset AA in SxCON.
3. Wait for interrupt.
4. Read SxSTA.
If BLOST == 1 or /ACK_REP == 1 then
write dummy data to SxDAT
Go to step1.
Else then
clear STA and write FFH to SxDAT.
Set AA in SxCON.
5. Wait for interrupt.
6. Read SxSTA.
If this datum == LAST then
reset AA* and read SxDAT**.
Go to step7.
Else then
read SxDAT**.
Go to step5.
7. Wait for interrupt.
Read SxSTA.
Read SxDAT**.
Note: 1. (*) If the master want to terminate the current data requests, it don’t have to acknowledge to the slave.
2. (**) This action should be the last.
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Slave transmitter mode.
1. Write slave address to SxADR, set AA and ENI
in SxCON.
2. Wait for interrupt.
3. Read SxSTA and write FFH to SxDAT*.
4.
5. Wait for interrupt.
6. Read SxSTA.
If STOP == 1 then
Go to step7.
Else then
read data from SxDAT*.
Go to step5.
7. Read dummy data from SxDAT*.
Note: 1. (*) This action should be the last.
µPSD325X DEVICES
DDC INTERFACE
The basic DDC unit consists of an I2C interface
and 256 bytes of SRAM for DDC data storage. The
8032 core is responsible of loading the contents of
the SRAM with the DDC data. The DDC unit has
the following features:
■ Supports both DDC1 and DDC2b Modes.
■
Features 256 bytes of DDC data - initialized by
the 8032
■
Supports fully automatic operation of DDC1 and
DDC2b Modes
■
DDC operates in Slave Mode only.
■
SW Interrupt Mode available (existing design)
The interface signals for the DDC can be mapped
to pins in Port 4. The interface consists of the standard VSYNC (P4.2), SDA (P4.0) and SCL (P4.1)
DDC signals. The conceptual block diagram is illustrated in Figure 43.
Figure 40. DDC Interface Block Diagram
7
DDC2B/DDC2AB
DDC2B+Interface
1
0
Monitor Address
S1ADR0
Monitor Address
S1ADR1
SDA1
Shift Register
S1DAT
Arbitration Logic
SCL1
Internal Bus
Bus Clock Generator
SICON
SISTA
DDC1/DDC2
Detection
RAMBUF
RAM
Buffer
DDC1 Hold Register
DDCDAT
DDC1 Transmitter
VSYNCEN
Address Pointer
Initialization Synchronization
X
EX_ SW
DAT ENB
X DDC1 DDC1 SWH
INT
EN
INT
M0
DDCADR
INTR (from SISTA)
DDCCON
INT
AI06628
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µPSD325X DEVICES
Special Function Register for the DDC Interface
There are eight SFR in the DDC interface:
RAMBUF, DDCCON, DDCADR, DDCDAT are
DDC registers.
S1CON, S1STA, S1DAT, S1ADR are I2C Interface registers, same as the ones described in the
standalone I2C bus.
DDCDAT Register. DDC1 DATA register for
transmission (DDCDAT: 0D5H)
■ 8-bit READ and WRITE register.
■
DDCADR Register. Address pointer for DDC interface (DDCADR: 0D6H)
■ 8-bit READ and WRITE register.
■
Indicates DATA BYTE to be transmitted in
DDC1 protocol.
Address pointer with the capability of the post
increment. After each access to RAMBUF
register (either by software or by hardware
DDC1 interface), the content of this register will
be increased by one. It’s available both in
DDC1, DDC2 (DDC2B, DDC2B+, and
DDC2AB) and system operation.
Table 60. DDC SFR Memory Map
SFR
Addr
Reg
Name
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
D4 RAMBUF
XX
DDC Ram
Buffer
D5
DDCDAT
00
DDC Data
xmit register
D6 DDCADR
00
Addr pointer
register
00
DDC Control
Register
D7 DDCCON
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—
EX_DAT SWENB DDC_AX DDCINT DDC1EN SWHINT
M0
µPSD325X DEVICES
Table 61. Description of the DDCON Register Bits
Bit
Symbol
7
—
6
EX_DAT
0 = The SRAM has 128 bytes (Default)
1 = The SRAM has 256 bytes
SWENB
Note: This bit is valid for DDC1 & DDC2b Modes
0 = Data is automatically read from SRAM at the current location of DDCADR and sent
out via current DDC protocol. (Default)
1 = MCU is interrupted during the current data byte transmission period to load the next
byte of data to send out.
DDC_AX
Note: This bit is valid for DDC1 & DDC2b Modes
0 = Data is automatically read from SRAM at the current location of DDCADR and sent
out via current DDC protocol. (Default)
1 = MCU is interrupted during the current data byte transmission period to load the next
byte of data to send out.
This bit only affects DDC2b Mode Operation:
0 = DDC2b I2C Address is A0/A1 (default)
1 = DDC2b I2C Address is AX. Least 3 significant address bits are ignored.
3
DDC1_Int
For DDC1 Mode Operation Only:
0 = No DDC1 interrupt
1 = DDC1 Interrupt request. Set by HW and should be cleared by SW interrupt service
routine.
Note1: This bit is set in the 9th VCLK at DDC1 Enable Mode. (SWENB=1)
2
DDC1EN
0 = DDC1 Mode is disabled – VSYNC is ignored.
The DDC unit will still respond to DDC2b requests. –provided I2C enabled.(Default)
1 = DDC1 Mode is enabled.
SWHINT
Set by hardware when the DDC unit switches from DDC1 to DDC2b Modes.
0 = No interrupt request.
1 = Switch to DDC2b Mode (Interrupt pending)
Set by HW and should be cleared by SW interrupt service routine.
Note1: This bit has no connection with SWENB.
5
4
1
0
Mode
Function
Reserved
Current Mode Indication Bit:
0 = Unit is in DDC1 Mode
1 = Unit is in DDC2b Mode
Note: When the DDC unit transitions to DDC2b Mode, the DDC unit will stay in DDC2b
Mode until the DDC unit is disabled, or the system is reset.
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µPSD325X DEVICES
Table 62. SWNEB Bit Function
DDC1 or DDC2b Mode Disabled
DDC1 or DDC2b Mode Enabled
DDCCON.bit2 = 0 (DDC1 Mode Disable) or
S1CON.bit6 = 0 (I2C Mode Disable)
DDCCON.bit2 = 1 (DDC1 Mode Enable) or
S1CON.bit6 = 1 (I2C Mode Enable)
0
In this state, the DDC unit is disabled. The DDC
SRAM cannot be accessed by the MCU. No MCU
interrupt and no DDC activity will occur.
MCU cannot access internal DDC SRAM: DDC
SRAM address space is re-assigned to external
data space.
In this state, the DDC is enabled and the unit is in
automatic mode. The DDC SRAM cannot be
accessed by the MCU – only the DDC unit has
access.
MCU cannot access internal DDC SRAM: data
space FF00h-FFFFh is dedicated to DDC SRAM.
1
In this state, the DDC unit is disabled, BUT with
SWENB=1, the MCU can access the SRAM. This
state is used to load the DDC SRAM with the
correct data for automatic modes. No MCU
interrupt and no DDC activity will occur.
MCU can access DDC SRAM: data space FF00hFFFFh is dedicated to DDC SRAM.
In this state, the DDC SRAM can be accessed by
the MCU. The DDC unit does not use the DDC
SRAM when SWENB=1. Since the DDC unit is in
manual mode, the DDC unit generates an MCU
interrupt for each byte transferred. The byte
transferred is held in the I2C S1DAT SFR register.
MCU can access DDC SRAM.
SWENB
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µPSD325X DEVICES
Host Type Detection
The detection procedure conforms to the sequences proposed by VESA Monitor Display Data
Channel (DDC) specification. The monitor needs
to determine the type of host system:
■
DDC1 or OLD type host.
■
DDC2B host (Host is master, monitor is always
slave)
■
DDC2B+/DDC2AB(ACCESS.bus) host.
Figure 41. Host Type Detection
Power on
Communication
isidle
Is VSYNC present?
EDID sent continously using
VSYNC as clock
Is DDC2 clock
present?
Stop sending of EDID
switch to DDC2
communication mode
DDC2 communication
is idle.
Has a command
been received?
Is 2B+/A.B
command detected?
Is it DDC2B
command?
Respond to
DDC2B command
Is
DDC2B+/DDC2AB?
Respond to DDC2B+/
DDC2AB command
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µPSD325X DEVICES
DDC1 Protocol
DDC1 is primitive and a point to point interface.
The monitor is always put at “Transmit only” mode.
In the initialization phase, 9 clock cycles on VCLK
pin will be given for the internal synchronization.
During this period, the SDA pin will be kept at high
impedance state.
If DDC1 hardware mode is used, the following procedure is recommended to proceed DDC1 operation.
1. Reset DDC1 enable (by default, DDC1 enable is
cleared as LOW after Power-on Reset).
2. Set SWENB as high (the default value is zero.)
3. Depending on the data size of EDID data, set
EX_DAT as LOW (128 bytes) or HIGH (256
bytes).
4. By using bulky moving commands (DDCADR,
RAMBUF involved) to move the entire EDID
data to RAM buffer.
5. Reset SWENB to LOW.
6. Reset DDCADR to 00h.
7. Set DDC1 enable as HIGH.
In case SWENB is set as high, interrupt service
routine is finished within 133 machine cycle in
40MHz System clock.
The maximum V SYNC (VCLK) frequency is 25Khz
(40µs). And the 9th clock of VSYNC (VCLK) is interrupt period.
So the machine cycle be needed is calculated as
below. For example,
When 40MHz system clock, 40µs = 133 x (25ns x
12); 133 machine cycle.
12MHz system clock, 40µs = 40 x (83.3ns x 12);
40 machine cycle.
8MHz system clock, 40µs = 26 x (125ns x 12); 26
machine cycle.
Note: If EX_DAT equals to LOW, it is meant the
lower part is occupied by DDC1 operation and the
upper part is still free to the system. Nevertheless,
the effect of the post increment just applies to the
part related to DDC1 operation. In other words, the
system program is still able to address the locations from 128 to 255 in the RAM buffer through
MOVX command but without the facility of the post
increment. For example, the case of accessing
200 of the RAM Buffer:
MOV R0, #200, and
MOVX A, @R0
Figure 42. Transmission Protocol in the DDC1 Interface
Max=40us
SC
VCLK
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
DDC1INT
DDC1EN
SD
B
Hi-Z
tSU(DDC1)
t H(VCLK)
t L(VCLK)
B
B
B
B
B
B
B
HiZ
B
t DOV
AI06652
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µPSD325X DEVICES
DDC2B Protocol
DDC2B is constructed based on the Philips I2C interface. However, in the level of DDC2B, PC host
is fixed as the master and the monitor is always regarded as the slave. Both master and slave can be
operated as a transmitter or receiver, but the master device determines which mode is activated. In
this protocol, address pointer is also used.
According to DDC2B specification, A0 (for WRITE
Mode) and A1 (for READ Mode) are assigned as
the default address of monitors.
The reception of the incoming data in WRITE
Mode or the updating of the outgoing data in
READ Mode should be finished within the specified time limit. If software in the slave’s side cannot
react to the master in time, based on I2C protocol,
SCL pin can be stretched low to inhibit the further
action from the master. The transaction can be
proceeded in either byte or burst format.
Figure 43. Conceptual Structure of the DDC Interface
DDC Interrupt
vector address
( 0023H )
Check Mode flag in DDCCON
Mode = 1 Mode = 1 Mode = 0
DDC2B/DDC2AB
commandreceived
SWENB =1
DDC2B
SWENB =1
DDC2B
Utilities
DDC2B/DDC2AB
Utilities
I2C
ServiceRoutines
SWENB =0
DDC1.DDC2B
Utilities
DDC Transmitter
(H/W)
I2C interface
(H/W)
AI06645
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µPSD325X DEVICES
USB HARDWARE
The characteristics of USB hardware are as follows:
■ Complies with the Universal Serial Bus
specification Rev. 1.1
■
Integrated SIE (Serial Interface Engine), FIFO
memory and transceiver
■
Low speed (1.5Mbit/s) device capability
■
Supports control endpoint0 and interrupt
endpoint1 and 2
■
USB clock input must be 6MHz (requires MCU
clock frequency to be 12, 24, or 36MHz).
The analog front-end is an on-chip generic USB
transceiver. It is designed to allow voltage levels
equal to V DD from the standard logic to interface
with the physical layer of the Universal Serial Bus.
It is capable of receiving and transmitting serial
data at low speed (1.5Mb/s).
The SIE is the digital-front-end of the USB block.
This module recovers the 1.5MHz clock, detects
the USB sync word and handles all low-level USB
protocols and error checking. The bit-clock recov-
ery circuit recovers the clock from the incoming
USB data stream and is able to track jitter and frequency drift according to the USB specification.
The SIE also translates the electrical USB signals
into bytes or signals. Depending upon the device
USB address and the USB endpoint.
Address, the USB data is directed to the correct
endpoint on SIE interface. The data transfer of this
H/W could be of type control or interrupt.
The device’s USB address and the enabling of the
endpoints are programmable in the SIE configuration header.
USB related registers
The USB block is controlled via seven registers in
the memory: (UADR, UCON0, UCON1, UCON2,
UISTA, UIEN, and USTA).
Three memory locations on chip which communicate the USB block are:
■ USB endpoint0 data transmit register (UDT0)
■
USB endpoint0 data receive register (UDR0)
■
USB endpoint1 data transmit register (UDT1)
Table 63. USB Address Register (UADR: 0EEh)
7
6
5
4
3
2
1
0
USBEN
UADD6
UADD5
UADD4
UADD3
UADD2
UADD1
UADD0
Table 64. Description of the UADR Bits
Bit
Symbol
R/W
7
USBEN
R/W
USB Function Enable Bit.
When USBEN is clear, the USB module will not respond to any tokens
from host.
RESET clears this bit.
6 to 0
UADD6 to
UADD0
R/W
Specify the USB address of the device.
RESET clears these bits.
90/176
Function
µPSD325X DEVICES
Table 65. USB Interrupt Enable Register (UIEN: 0E9h)
7
6
5
4
3
2
1
0
SUSPNDI
RSTE
RSTFIE
TXD0IE
RXD0IE
TXD1IE
EOPIE
RESUMI
Table 66. Description of the UIEN Bits
Bit
Symbol
R/W
Function
7
SUSPNDI
R/W
Enable SUSPND interrupt
6
RSTE
R/W
Enable USB Reset; also resets the CPU and PSD Modules when bit is
set to ’1.’
5
RSTFIE
R/W
Enable RSTF (USB Bus Reset Flag) Interrupt
4
TXD0IE
R/W
Enable TXD0 interrupt
3
RXD0IE
R/W
Enable RXD0 interrupt
2
TXD1IE
R/W
Enable TXD1 interrupt
1
EOPIE
R/W
Enable EOP interrupt
0
RESUMI
R/W
Enable USB resume interrupt when it is the Suspend Mode
Table 67. USB Interrupt Status Register (UISTA: 0E8h)
7
6
5
4
3
2
1
0
SUSPND
—
RSTF
TXD0F
RXD0F
TXD1F
EOPF
RESUMF
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µPSD325X DEVICES
Table 68. Description of the UISTA Bits
Bit
Symbol
R/W
Function
USB Suspend Mode Flag.
To save power, this bit should be set if a 3ms constant idle state is
detected on USB bus. Setting this bit stops the clock to the USB and
causes the USB module to enter Suspend Mode. Software must clear
this bit after the Resume flag (RESUMF) is set while this Resume
interrupt flag is serviced
7
SUSPND
R/W
6
—
—
Reserved
R
USB Reset Flag.
This bit is set when a valid RESET signal state is detected on the D+ and
D- lines. When the RSTE bit in the UIEN Register is set, this reset
detection will also generate an internal reset signal to reset the CPU and
other peripherals including the USB module.
R/W
Endpoint0 Data Transmit Flag.
This bit is set after the data stored in Endpoint 0 transmit buffers has
been sent and an ACK handshake packet from the host is received.
Once the next set of data is ready in the transmit buffers, software must
clear this flag. To enable the next data packet transmission, TX0E must
also be set. If TXD0F Bit is not cleared, a NAK handshake will be
returned in the next IN transactions. RESET clears this bit.
R/W
Endpoint0 Data Receive Flag.
This bit is set after the USB module has received a data packet and
responded with ACK handshake packet. Software must clear this flag
after all of the received data has been read. Software must also set
RX0E Bit to one to enable the next data packet reception. If RXD0F Bit is
not cleared, a NAK handshake will be returned in the next OUT
transaction. RESET clears this bit.
5
4
3
RSTF
TXD0F
RXD0F
2
TXD1F
R/W
Endpoint1 / Endpoint2 Data Transmit Flag.
This bit is shared by Endpoints 1 and Endpoints 2. It is set after the data
stored in the shared Endpoint 1/ Endpoint 2 transmit buffer has been
sent and an ACK handshake packet from the host is received. Once the
next set of data is ready in the transmit buffers, software must clear this
flag. To enable the next data packet transmission, TX1E must also be
set. If TXD1F Bit is not cleared, a NAK handshake will be returned in the
next IN transaction. RESET clears this bit.
1
EOPF
R/W
End of Packet Flag.
This bit is set when a valid End of Packet sequence is detected on the
D+ and D-line. Software must clear this flag. RESET clears this bit.
R/W
Resume Flag.
This bit is set when USB bus activity is detected while the SUSPND Bit is
set.
Software must clear this flag. RESET clears this bit.
0
92/176
RESUMF
µPSD325X DEVICES
Table 69. USB Endpoint0 Transmit Control Register (UCON0: 0EAh)
7
6
5
4
3
2
1
0
TSEQ0
STALL0
TX0E
RX0E
TP0SIZ3
TP0SIZ2
TP0SIZ1
TP0SIZ0
Table 70. Description of the UCON0 Bits
Bit
7
6
5
Symbol
TSEQ0
STALL0
TX0E
R/W
Function
R/W
Endpoint0 Data Sequence Bit. (0=DATA0, 1=DATA1)
This bit determines which type of data packet (DATA0 or DATA1) will be
sent during the next IN transaction. Toggling of this bit must be controlled
by software. RESET clears this bit
R/W
Endpoint0 Force Stall Bit.
This bit causes Endpoint 0 to return a STALL handshake when polled by
either an IN or OUT token by the USB Host Controller. The USB
hardware clears this bit when a SETUP token is received. RESET clears
this bit.
R/W
Endpoint0 Transmit Enable.
This bit enables a transmit to occur when the USB Host Controller sends
an IN token to Endpoint 0. Software should set this bit when data is ready
to be transmitted. It must be cleared by software when no more Endpoint
0 data needs to be transmitted. If this bit is ’0’ or the TXD0F is set, the
USB will respond with a NAK handshake to any Endpoint 0 IN tokens.
RESET clears this bit.
4
RX0E
R/W
Endpoint0 receive enable.
This bit enables a receive to occur when the USB Host Controller sends
an OUT token to Endpoint 0. Software should set this bit when data is
ready to be received. It must be cleared by software when data cannot
be received. If this bit is ’0’ or the RXD0F is set, the USB will respond
with a NAK handshake to any Endpoint 0 OUT tokens. RESET clears
this bit.
3 to 0
TP0SIZ3 to
TP0SIZ0
R/W
The number of transmit data bytes. These bits are cleared by RESET.
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µPSD325X DEVICES
Table 71. USB Endpoint1 (and 2) Transmit Control Register (UCON1: 0EBh)
7
6
5
4
3
2
1
0
TSEQ1
EP12SEL
TX1E
FRESUM
TP1SIZ3
TP1SIZ2
TP1SIZ1
TP1SIZ0
Table 72. Description of the UCON1 Bits
Bit
7
6
5
Symbol
TSEQ1
EP12SEL
TX1E
R/W
Function
R/W
Endpoint 1/ Endpoint 2 Transmit Data Packet PID. (0=DATA0, 1=DATA1)
This bit determines which type of data packet (DATA0 or DATA1) will be
sent during the next IN transaction directed to Endpoint 1 or Endpoint 2.
Toggling of this bit must be controlled by software. RESET clears this bit.
R/W
Endpoint 1/ Endpoint 2 Transmit Selection. (0=Endpoint 1, 1=Endpoint 2)
This bit specifies whether the data inside the registers UDT1 are used for
Endpoint 1 or Endpoint 2. If all the conditions for a successful Endpoint 2
USB response to a hosts IN token are satisfied (TXD1F=0, TX1E=1,
STALL2=0, and EP2E=1) except that the EP12SEL Bit is configured for
Endpoint 1, the USB responds with a NAK handshake packet. RESET
clears this bit.
R/W
Endpoint1 / Endpoint2 Transmit Enable.
This bit enables a transmit to occur when the USB Host Controller send
an IN token to Endpoint 1 or Endpoint 2. The appropriate endpoint
enable bit, EP1E or EP2E Bit in the UCON2 register, should also be set.
Software should set the TX1E Bit when data is ready to be transmitted. It
must be cleared by software when no more data needs to be transmitted.
If this bit is ’0’ or TXD1F is set, the USB will respond with a NAK
handshake to any Endpoint 1 or Endpoint 2 directed IN token.
RESET clears this bit.
4
FRESUM
R/W
Force Resume.
This bit forces a resume state (“K” on non-idle state) on the USB data
lines to initiate a remote wake-up. Software should control the timing of
the forced resume to be between 10ms and 15ms. Setting this bit will not
cause the RESUMF Bit to set.
3 to 0
TP1SIZ3 to
TP1SIZ0
R/W
The number of transmit data bytes. These bits are cleared by RESET.
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µPSD325X DEVICES
Table 73. USB Control Register (UCON2: 0ECh)
7
6
5
4
3
2
1
0
—
—
—
SOUT
EP2E
EP1E
STALL2
STALL1
Table 74. Description of the UCON2 Bits
Bit
Symbol
R/W
Function
7 to 5
—
—
4
SOUT
R/W
Status out is used to automatically respond to the OUT of a control READ
transfer
3
EP2E
R/W
Endpoint2 enable. RESET clears this bit
2
EP1E
R/W
Endpoint1 enable. RESET clears this bit
1
STALL2
R/W
Endpoint2 Force Stall Bit. RESET clears this bit
0
STALL1
R/W
Endpoint1 Force Stall Bit. RESET clears this bit
Reserved
Table 75. USB Endpoint0 Status Register (USTA: 0EDh)
7
6
5
4
3
2
1
0
RSEQ
SETUP
IN
OUT
RP0SIZ3
RP0SIZ2
RP0SIZ1
RP0SIZ0
Table 76. Description of the USTA Bits
Bit
Symbol
R/W
Function
7
RSEQ
R/W
6
SETUP
R
SETUP Token Detect Bit. This bit is set when the received token packet
is a SEPUP token, PID = b1101.
5
IN
R
IN Token Detect Bit.
This bit is set when the received token packet is an IN token.
4
OUT
R
OUT Token Detect Bit.
This bit is set when the received token packet is an OUT token.
3 to 0
RP0SIZ3 to
RP0SIZ0
R
The number of data bytes received in a DATA packet
Endpoint0 receive data packet PID. (0=DATA0, 1=DATA1)
This bit will be compared with the type of data packet last received for
Endpoint0
Table 77. USB Endpoint0 Data Receive Register (UDR0: 0EFh)
7
6
5
4
3
2
1
0
UDR0.7
UDR0.6
UDR0.5
UDR0.4
UDR0.3
UDR0.2
UDR0.1
UDR0.0
Table 78. USB Endpoint0 Data Transmit Register (UDT0: 0E7h)
7
6
5
4
3
2
1
0
UDT0.7
UDT0.6
UDT0.5
UDT0.4
UDT0.3
UDT0.2
UDT0.1
UDT0.0
Table 79. USB Endpoint1 Data Transmit Register (UDT1: 0E6h)
7
6
5
4
3
2
1
0
UDT1.7
UDT1.6
UDT1.5
UDT1.4
UDT1.3
UDT1.2
UDT1.1
UDT1.0
95/176
µPSD325X DEVICES
The USCL 8-bit Prescaler Register for USB is at
E1h. The USCL should be loaded with a value that
results in a clock rate of 6MHz for the USB using
the following formula:
USB clock input =
(FOSC / 2) / (Prescaler register value +1)
Note: USB works ONLY with the MCU Clock frequencies of 12, 24, or 36MHz. The Prescaler values for these frequencies are 0, 1, and 2.
Where Fosc is the MCU clock input frequency.
Table 80. USB SFR Memory Map
SFR Reg
Addr Name
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
00
8-bit
Prescaler for
USB logic
UDT1.0
00
USB Endpt1
Data Xmit
UDT0.1
UDT0.0
00
USB Endpt0
Data Xmit
RXD1F
EOPF
RESUMF
00
USB
Interrupt
Status
TXD1IE
EOPIE RESUMIE
00
USB
Interrupt
Enable
TP0SIZ3 TP0SIZ2 TP0SIZ1 TP0SIZ0
00
USB Endpt0
Xmit Control
FRESUM TP1SIZ3 TP1SIZ2 TP1SIZ1 TP1SIZ0
00
USB Endpt1
Xmit Control
00
USB Control
Register
00
USB Endpt0
Status
E1
USCL
E6
UDT1
UDT1.7
UDT1.6
UDT1.5
UDT1.4
UDT1.3
UDT1.2
UDT1.1
E7
UDT0
UDT0.7
UDT0.6
UDT0.5
UDT0.4
UDT0.3
UDT0.2
E8
UISTA
SUSPND
—
RSTF
TXD0F
RXD0F
E9
UIEN SUSPNDIE
RSTE
RSTFIE
TXD0IE
RXD0IE
RX0E
EA UCON0
TSEQ0
STALL0
TX0E
EB UCON1
TSEQ1
EP12SEL
—
EC UCON2
—
—
—
SOUT
EP2E
EP1E
STALL2
STALL1
ED
USTA
RSEQ
SETUP
IN
OUT
EE
UADR
USBEN
UADD6
UADD5
UADD4
UADD3
UADD2
UADD1
UADD0
00
USB
Address
Register
EF
UDR0
UDR0.7
UDR0.6
UDR0.5
UDR0.4
UDR0.3
UDR0.2
UDR0.1
UDR0.0
00
USB Endpt0
Data Recv
96/176
RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0
µPSD325X DEVICES
Transceiver
USB Physical Layer Characteristics. The following section describes the µPSD325X devices
compliance to the Chapter 7 Electrical section of
the USB Specification, Revision 1.1. The section
contains all signaling, and physical layer specifications necessary to describe a low speed USB
function.
Low Speed Driver Characteristics. The
µPSD325X devices use a differential output driver
to drive the Low Speed USB data signal onto the
USB cable. The output swings between the differential high and low state are well balanced to minimize signal skew. The slew rate control on the
driver minimizes the radiated noise and cross talk
on the USB cable. The driver’s outputs support
three-state operation to achieve bi-directional half
duplex operation. The µPSD325X devices driver
tolerates a voltage on the signal pins of -0.5V to
3.6V with respect to local ground reference without
damage. The driver tolerates this voltage for
10.0µs while the driver is active and driving, and
tolerates this condition indefinitely when the driver
is in its high impedance state.
A low speed USB connection is made through an
unshielded, untwisted wire cable a maximum of 3
meters in length. The rise and fall time of the signals on this cable are well controlled to reduce RFI
emissions while limiting delays, signaling skews
and distortions. The µPSD325X devices driver
reaches the specified static signal levels with
smooth rise and fall times, resulting in segments
between low speed devices and the ports to which
they are connected.
Figure 44. Low Speed Driver Signal Waveforms
One Bit
Time
1.5 Mb/s
VSE(max)
Driver
Signal Pins
Signal pins
pass output
spec levels
with minimal
reflections and
ringing
VSE(min)
VSS
AI06629
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µPSD325X DEVICES
Receiver Characteristics
The µPSD325X devices has a differential input receiver which is able to accept the USB data signal.
The receiver features an input sensitivity of at least
200mV when both differential data inputs are in
the range of at least 0.8V to 2.5V with respect to
its local ground reference. This is the common
mode range, as shown in Figure 45. The receiver
tolerates static input voltages between -0.5V to
3.8V with respect to its local ground reference
without damage. In addition to the differential receiver, there is a single-ended receiver for each of
the two data lines. The single-ended receivers
have a switching threshold between 0.8V and 2.0V
(TTL inputs).
Minimum Differential Sensitivity (volts)
Figure 45. Differential Input Sensitivity Over Entire Common Mode Range
1.0
0.8
0.6
0.4
0.2
0.0
0.0
98/176
0.2
0.4
0.6
0.8
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Common Mode Input Voltage (volts)
2.6
2.8
3.0
3.2
AI06630
µPSD325X DEVICES
External USB Pull-Up Resistor
The USB system specifies a pull-up resistor on the
D- pin for low-speed peripherals. The USB
Spec 1.1 describes a 1.5kΩ pull-up resistor to a
3.3V supply. An approved alternative method is a
7.5kΩ pull-up to the USB VCC supply. This alterna-
tive is defined for low-speed devices with an integrated cable. The chip is specified for the 7.5kΩ
pull-up. This eliminates the need for an external
3.3V regulator, or for a pin dedicated to providing
a 3.3V output from the chip.
Figure 46. USB Data Signal Timing and Voltage Levels
tR
VOH
tF
D+
90%
90%
VCR
VOL
10%
10%
D-
AI06631
Figure 47. Receiver Jitter Tolerance
TPERIOD
Differential
Data Lines
TJR
TJR1
TJR2
Consecutive
Transitions
N*TPERIOD+TJR1
Paired
Transitions
N*TPERIOD+TJR2
AI06632
99/176
µPSD325X DEVICES
Figure 48. Differential to EOP Transition Skew and EOP Width
TPERIOD
Crossover
Point Extended
Crossover
Point
Differential
Data Lines
Diff. Data to
SE0 Skew
N*TPERIOD+TDEOP
Source EOP Width: TEOPT
Receiver EOP Width
TEOPR1, TEOPR2
AI06633
Figure 49. Differential Data Jitter
TPERIOD
Differential
Data Lines
Crossover
Points
Consecutive
Transitions
N*TPERIOD+TxJR1
Paired
Transitions
N*TPERIOD+TxJR2
AI06634
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µPSD325X DEVICES
Table 81. Transceiver DC Characteristics
Symb
Parameter
Test Conditions
Min
Max
Unit
VOH
Static Output High
15kΩ±5%
2.8
3.6
V
VOL
Static Output Low
Notes 2,3
—
0.3
V
VDI
Differential Input Sensitivity
|(D+) - (D-)|, Fig 6.9
0.2
—
V
VCM
Differential Input Common Mode
Fig 6.9
0.8
2.5
V
VSE
Single Ended Receiver Threshold
—
0.8
2.0
V
CIN
Transceiver Capacitance
—
—
20
pF
IIO
Data Line (D+, D-) Leakage
0V<(D+,D-)<3. 3,
–10
10
µA
RPU
External Bus Pull-up Resistance, D-
7.5kΩ±2%
7.35
7.65
kΩ
RPD
External Bus Pull-down Resistance
15kΩ±5%
14.25
15.75
kΩ
Note: 1.
2.
3.
4.
5.
6.
VDD=5V ± 10%; VSS=0V; TA=0 to 70
Level guaranteed for range of VDD = 4.5V to 5.5V
With RPU, external idle resistor, 7.5κ±2%, D- to VDD.
CL of 50pF(75ns) to 350pF (300ns).
Measured at crossover point of differential data signals.
USB specification indicates 330ns
Table 82. Transceiver AC Characteristics
Parameter
Symb
Min
Max
Unit
Test Conditions
Low Speed Data Rate
fDRATE
1.4775
1.5225
Mbit/s
Ave. bit rate
Receiver Data Jitter Tolerance
tDJR1
–75
75
ns
to next transition,
Differential Input Sensitivity
tDJR2
–45
45
ns
for paired transition,
Differential to EOP Transition Skew
tDEOP
–40
100
ns
Fig 6.10 4
EOP Width at Receiver
tEOPR1
165
—
ns
rejects as EOP 4, 5
EOP Width at Receiver
tEOPR2
675
—
ns
accepts as EOP 4
Source EOP Width
tEOPT
–1.25
1.50
µs
—
Differential Driver Jitter
tUDJ1
–95
95
ns
to next transition,
Differential Driver Jitter
tUDJ2
–150
150
ns
to paired transition,
USB Data Transition Rise Time
tR
75
300
ns
Notes 1, 2, 3
USB Data Transition Fall Time
tF
75
300
ns
Notes 1, 2, 3
Rise/Fall Time Matching
tRFM
80
120
%
tR / tF
Output Signal Crossover Volt age
VCRS
1.3
2.0
V
—
Note: 1. VDD=5V ± 10%; VSS=0V; TA=0 to 70
101/176
µPSD325X DEVICES
PSD MODULE
■ The PSD Module provides configurable
Program and Data memories to the 8032 CPU
core (MCU). In addition, it has its own set of I/O
ports and a PLD with 16 macrocells for general
logic implementation.
■ Ports A,B,C, and D are general purpose
programmable I/O ports that have a port
architecture which is different from the I/O ports
in the MCU Module.
■ The PSD Module communicates with the MCU
Module through the internal address, data bus
(AO-A15, DO-D7) and control signals (RD, WR,
PSEN, ALE, RESET). The user defines the
Decoding PLD in the PSDsoft Development
Tool and can map the resources in the PSD
Module to any program or data address space.
Figure 50 shows the functional blocks in the
PSD Module.
Functional Overview
■ 1 or 2 Mbit Flash memory. This is the main
Flash memory. It is divided into eight equalsized blocks that can be accessed with userspecified addresses.
■ Secondary 256 Kbit Flash boot memory. It is
divided into four equal-sized blocks that can be
accessed with user-specified addresses. This
secondary memory brings the ability to execute
code and update the main Flash concurrently.
■ 256 Kbit SRAM. The SRAM’s contents can be
protected from a power failure by connecting an
external battery.
■ CPLD with 1G Output Micro Cells (OMCs} and
24 Input Micro Cells (IMCs). The CPLD may be
used to efficiently implement a variety of logic
functions for internal and external control.
102/176
■
■
Examples include state machines, loadable
shift registers, and loadable counters.
Decode PLD (DPLD) that decodes address for
selection of memory blocks in the PSD Module.
Configurable I/O ports (Port A,B,C and D) that
can be used for the following functions:
– MCU I/Os
– PLD I/Os
– Latched MCU address output
– Special function I/Os.
– I/O ports may be configured as open-drain
outputs.
■
■
■
■
Built-in JTAG compliant serial port allows fullchip In-System Programmability (ISP). With it,
you can program a blank device or reprogram a
device in the factory or the field.
Internal page register that can be used to
expand the 8032 MCU Module address space
by a factor of 256.
Internal programmable Power Management
Unit (PMU) that supports a low-power mode
called Power-down Mode. The PMU can
automatically detect a lack of the 8032 CPU
core activity and put the PSD Module into
Power-down Mode.
Erase/WRITE cycles:
– Flash memory - 100,000 minimum
– PLD - 1,000 minimum
– Data Retention: 15 year minimum (for Main
Flash memory, Boot, PLD and Configuration
bits)
D0 – D7
WR_, RD_,
PSEN_, ALE,
RESET_,
A0-A15
8032 Bus
CLKIN
(PD1)
GLOBAL
CONFIG. &
SECURITY
BUS
Interface
BUS
Interface
PLD
INPUT
BUS
CLKIN
73
8
CSIOP
CLKIN
256 KBIT BATTERY
BACKUP SRAM
256 KBIT SECONDARY
NON-VOLATILE MEMORY
(BOOT OR DATA)
4 SECTORS
2 EXT CS TO PORT D
JTAG
SERIAL
CHANNEL
PORT A ,B & C
24 INPUT MACROCELLS
PORT A ,B & C
16 OUTPUT MACROCELLS
PLD, CONFIGURATION
& FLASH MEMORY
LOADER
8 SECTORS
1 OR 2 MBIT PRIMARY
FLASH MEMORY
RUNTIME CONTROL
AND I/O REGISTERS
PERIP I/O MODE SELECTS
SRAM SELECT
SECTOR
SELECTS
FLASH ISP CPLD
(CPLD)
FLASH DECODE
PLD (DPLD)
SECTOR
SELECTS
EMBEDDED
ALGORITHM
MACROCELL FEEDBACK OR PORT INPUT
73
PAGE
REGISTER
ADDRESS/DATA/CONTROL BUS
PORT
D
PROG.
PORT
PORT
C
PROG.
PORT
PORT
B
PROG.
PORT
PORT
A
PROG.
PORT
POWER
MANGMT
UNIT
PD1 – PD2
PC0 – PC7
PB0 – PB7
PA0 – PA7
VSTDBY
(PC2)
µPSD325X DEVICES
Figure 50. PSD MODULE Block Diagram
AI07803
103/176
µPSD325X DEVICES
In-System Programming (ISP)
Using the JTAG signals on Port C, the entire PSD
MODULE device can be programmed or erased
without the use of the MCU. The primary Flash
memory can also be programmed in-system by
the MCU executing the programming algorithms
out of the secondary memory, or SRAM. The secondary memory can be programmed the same
way by executing out of the primary Flash memory. The PLD or other PSD MODULE Configuration
blocks can be programmed through the JTAG port
or a device programmer. Table 83 indicates which
programming methods can program different functional blocks of the PSD MODULE.
Table 83. Methods of Programming Different Functional Blocks of the PSD MODULE
Functional Block
JTAG Programming
Device Programmer
Primary Flash Memory
Yes
Yes
Yes
Secondary Flash Memory
Yes
Yes
Yes
PLD Array (DPLD and CPLD)
Yes
Yes
No
PSD MODULE Configuration
Yes
Yes
No
104/176
IAP
µPSD325X DEVICES
DEVELOPMENT SYSTEM
The µPSD325X devices are supported by PSDsoft, a Windows-based software development tool
(Windows-95, Windows-98, Windows-NT). A PSD
MODULE design is quickly and easily produced in
a point and click environment. The designer does
not need to enter Hardware Description Language
(HDL) equations, unless desired, to define PSD
MODULE pin functions and memory map information. The general design flow is shown in Figure
51. PSDsoft is available from our web site (the ad-
dress is given on the back page of this data sheet)
or other distribution channels.
PSDsoft directly supports a low cost device programmer from ST: FlashLINK (JTAG). The programmer may be purchased through your local
distributor/representative, or directly from our web
site using a credit card. The µPSD325X devices
are also supported by third party device programmers. See our web site for the current list.
Figure 51. PSDsoft Express Development Tool
Choose µPSD
Define µPSD Pin and
Node Functions
Point and click definition of
PSD pin functions, internal nodes,
and MCU system memory map
Define General Purpose
Logic in CPLD
C Code Generation
Point and click definition of combinatorial and registered logic in CPLD.
Access HDL is available if needed
GENERATE C CODE
SPECIFIC TO PSD
FUNCTIONS
Merge MCU Firmware with
PSD Module Configuration
A composite object file is created
containing MCU firmware and
PSD configuration
MCU FIRMWARE
HEX OR S-RECORD
FORMAT
USER'S CHOICE OF
8032
COMPILER/LINKER
*.OBJ FILE
PSD Programmer
FlashLINK (JTAG)
*.OBJ FILE
AVAILABLE
FOR 3rd PARTY
PROGRAMMERS
(CONVENTIONAL or
JTAG-ISC)
AI05798
105/176
µPSD325X DEVICES
PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET
Table 84 shows the offset addresses to the PSD
PSD MODULE registers. Table 84 provides brief
MODULE registers relative to the CSIOP base addescriptions of the registers in CSIOP space. The
dress. The CSIOP space is the 256 bytes of adfollowing section gives a more detailed descripdress that is allocated by the user to the internal
tion.
Table 84. Register Address Offset
Register Name
Other1
Description
Port A
Port B
Port C
Port D
Data In
00
01
10
11
Control
02
03
Data Out
04
05
12
13
Stores data for output to Port pins, MCU I/O
Output Mode
Direction
06
07
14
15
Configures Port pin as input or output
Drive Select
08
09
16
17
Configures Port pins as either CMOS or Open
Drain on some pins, while selecting high slew rate
on other pins.
Input Macrocell
0A
0B
18
Enable Out
0C
0D
1A
Output Macrocells
AB
20
20
Output Macrocells
BC
Mask Macrocells AB
Mask Macrocells BC
21
22
Reads Port pin as input, MCU I/O Input Mode
Selects mode between MCU I/O or Address Out
Reads Input Macrocells
Reads the status of the output enable to the I/O
Port driver
1B
READ – reads output of macrocells AB
WRITE – loads macrocell flip-flops
READ – reads output of macrocells BC
WRITE – loads macrocell flip-flops
21
22
23
Blocks writing to the Output Macrocells AB
23
Blocks writing to the Output Macrocells BC
Primary Flash
Protection
C0
Read-only – Primary Flash Sector Protection
Secondary Flash
memory Protection
C2
Read-only – PSD MODULE Security and
Secondary Flash memory Sector Protection
PMMR0
B0
Power Management Register 0
PMMR2
B4
Power Management Register 2
Page
E0
Page Register
VM
E2
Places PSD MODULE memory areas in Program
and/or Data space on an individual basis.
Note: 1. Other registers that are not part of the I/O ports.
106/176
µPSD325X DEVICES
PSD MODULE DETAILED OPERATION
As shown in Figure 15, the PSD MODULE consists of five major types of functional blocks:
■ Memory Block
■
PLD Blocks
■
I/O Ports
■
Power Management Unit (PMU)
■
JTAG Interface
The functions of each block are described in the
following sections. Many of the blocks perform
multiple functions, and are user configurable.
MEMORY BLOCKS
The PSD MODULE has the following memory
blocks:
– Primary Flash memory
– Secondary Flash memory
– SRAM
The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express.
Primary Flash Memory and Secondary Flash
memory Description
The primary Flash memory is divided evenly into
eight equal sectors. The secondary Flash memory
is divided into four equal sectors. Each sector of
either memory block can be separately protected
from Program and Erase cycles.
Flash memory may be erased on a sector-by-sector basis. Flash sector erasure may be suspended
while data is read from other sectors of the block
and then resumed after reading.
During a Program or Erase cycle in Flash memory,
the status can be output on Ready/Busy (PC3).
This pin is set up using PSDsoft Express Configuration.
Memory Block Select Signals
The DPLD generates the Select signals for all the
internal memory blocks (see the section entitled
“PLDs,” page 120). Each of the eight sectors of the
primary Flash memory has a Select signal (FS0FS7) which can contain up to three product terms.
Each of the four sectors of the secondary Flash
memory has a Select signal (CSBOOT0CSBOOT3) which can contain up to three product
terms. Having three product terms for each Select
signal allows a given sector to be mapped in Program or Data space.
Ready/Busy (PC3). This signal can be used to
output the Ready/Busy status of the Flash memory. The output on Ready/Busy (PC3) is a '0' (Busy)
when Flash memory is being written to, or when
Flash memory is being erased. The output is a 1
(Ready) when no WRITE or Erase cycle is in
progress.
Memory Operation. The primary Flash memory
and secondary Flash memory are addressed
through the MCU Bus. The MCU can access these
memories in one of two ways:
■ The MCU can execute a typical bus WRITE or
READ operation.
■ The MCU can execute a specific Flash memory
instruction that consists of several WRITE and
READ operations. This involves writing specific
data patterns to special addresses within the
Flash memory to invoke an embedded
algorithm. These instructions are summarized
in Table 85.
Typically, the MCU can read Flash memory using
READ operations, just as it would read a ROM device. However, Flash memory can only be altered
using specific Erase and Program instructions. For
example, the MCU cannot write a single byte directly to Flash memory as it would write a byte to
RAM. To program a byte into Flash memory, the
MCU must execute a Program instruction, then
test the status of the Program cycle. This status
test is achieved by a READ operation or polling
Ready/Busy (PC3).
Flash memory can also be read by using special
instructions to retrieve particular Flash device information (sector protect status and ID).
107/176
µPSD325X DEVICES
Instructions
An instruction consists of a sequence of specific
operations. Each received byte is sequentially decoded by the PSD MODULE and not executed as
a standard WRITE operation. The instruction is executed when the correct number of bytes are properly received and the time between two
consecutive bytes is shorter than the time-out period. Some instructions are structured to include
READ operations after the initial WRITE operations.
The instruction must be followed exactly. Any invalid combination of instruction bytes or time-out
between two consecutive bytes while addressing
Flash memory resets the device logic into READ
Mode (Flash memory is read like a ROM device).
The Flash memory supports the instructions summarized in Table 85:
Flash memory:
■ Erase memory by chip or sector
■
Suspend or resume sector erase
■
Program a Byte
■
RESET to READ Mode
108/176
■
Read primary Flash Identifier value
■
Read Sector Protection Status
■
Bypass
These instructions are detailed in Table 85. For efficient decoding of the instructions, the first two
bytes of an instruction are the coded cycles and
are followed by an instruction byte or confirmation
byte. The coded cycles consist of writing the data
AAh to address X555h during the first cycle and
data 55h to address XAAAh during the second cycle. Address signals A15-A12 are Don’t Care during the instruction WRITE cycles. However, the
appropriate
Sector
Select
(FS0-FS7
or
CSBOOT0-CSBOOT3) must be selected.
The primary and secondary Flash memories have
the same instruction set (except for Read Primary
Flash Identifier). The Sector Select signals determine which Flash memory is to receive and execute the instruction. The primary Flash memory is
selected if any one of Sector Select (FS0-FS7) is
High, and the secondary Flash memory is selected
if any one of Sector Select (CSBOOT0CSBOOT3) is High.
µPSD325X DEVICES
Table 85. Instructions
FS0-FS7 or
CSBOOT0CSBOOT3
Cycle 1
READ5
1
“Read”
RD @ RA
READ Main
Flash ID6
1
READ Sector
Protection6,8,13
Instruction
Cycle 2
Cycle 3
Cycle 4
Cycle 5
Cycle 6
Cycle 7
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Read ID @ XX01h
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Read status @
XX02h
Program a
Flash Byte13
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
[email protected] PA
Flash Sector
Erase7,13
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
[email protected] X555h
[email protected]
XAAAh
[email protected]
SA
[email protected]
next SA
Flash Bulk
Erase13
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
[email protected] X555h
[email protected]
XAAAh
[email protected]
X555h
Suspend
Sector Erase11
1
[email protected]
XXXXh
Resume
Sector Erase12
1
[email protected]
XXXXh
RESET6
1
[email protected]
XXXXh
Unlock Bypass
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Unlock Bypass
Program9
1
[email protected]
XXXXh
[email protected] PA
Unlock Bypass
Reset10
1
[email protected]
XXXXh
[email protected]
XXXXh
Note: 1. All bus cycles are WRITE bus cycles, except the ones with the “Read” label
2. All values are in hexadecimal:
X = Don’t care. Addresses of the form XXXXh, in this table, must be even addresses
RA = Address of the memory location to be read
RD = Data READ from location RA during the READ cycle
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of WRITE Strobe (WR, CNTL0).
PA is an even address for PSD in Word Programming Mode.
PD = Data word to be programmed at location PA. Data is latched on the rising edge of WRITE Strobe (WR, CNTL0)
SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) of the sector to be
erased, or verified, must be Active (High).
3. Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) signals are active High, and are defined in PSDsoft Express.
4. Only address Bits A11-A0 are used in instruction decoding.
5. No Unlock or instruction cycles are required when the device is in the READ Mode
6. The RESET instruction is required to return to the READ Mode after reading the Flash ID, or after reading the Sector Protection
Status, or if the Error Flag Bit (DQ5/DQ13) goes High.
7. Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80µs.
8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and
(A1,A0)=(1,0)
9. The Unlock Bypass instruction is required prior to the Unlock Bypass Program instruction.
10. The Unlock Bypass Reset Flash instruction is required to return to reading memory data when the device is in the Unlock Bypass
Mode.
11. The system may perform READ and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protection Status
when in the Suspend Sector Erase Mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle.
12. The Resume Sector Erase instruction is valid only during the Suspend Sector Erase Mode.
13. The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is
intended. The MCU must retrieve, for example, the code from the secondary Flash memory when reading the Sector Protection
Status of the primary Flash memory.
109/176
µPSD325X DEVICES
Power-down Instruction and Power-up Mode
Power-up Mode. The PSD MODULE internal
logic is reset upon Power-up to the READ Mode.
Sector Select (FS0-FS7 and CSBOOT0CSBOOT3) must be held Low, and WRITE Strobe
(WR, CNTL0) High, during Power-up for maximum
security of the data contents and to remove the
possibility of a byte being written on the first edge
of WRITE Strobe (WR, CNTL0). Any WRITE cycle
initiation is locked when VCC is below V LKO.
READ
Under typical conditions, the MCU may read the
primary Flash memory or the secondary Flash
memory using READ operations just as it would a
ROM or RAM device. Alternately, the MCU may
use READ operations to obtain status information
about a Program or Erase cycle that is currently in
progress. Lastly, the MCU may use instructions to
read special data from these memory blocks. The
following sections describe these READ functions.
READ Memory Contents. Primary Flash memory and secondary Flash memory are placed in the
READ Mode after Power-up, chip reset, or a
Reset Flash instruction (see Table 85, page 109).
The MCU can read the memory contents of the primary Flash memory or the secondary Flash memory by using READ operations any time the READ
operation is not part of an instruction.
READ Primary Flash Identifier. The
primary
Flash memory identifier (E7h) is read with an instruction composed of 4 operations: 3 specific
WRITE operations and a READ operation (see Table 85). During the READ operation, Address Bits
A6, A1, and A0 must be ’0,’ ’0,’ and ’1,’ respectively, and the appropriate Sector Select (FS0-FS7)
must be High.
READ Memory Sector Protection Status. The
primary Flash memory Sector Protection Status is
read with an instruction composed of 4 operations:
3 specific WRITE operations and a READ operation (see Table 85). During the READ operation,
address Bits A6, A1, and A0 must be ’0,’ ’1,’ and
’0,’ respectively, while Sector Select (FS0-FS7 or
CSBOOT0-CSBOOT3) designates the Flash
memory sector whose protection has to be verified. The READ operation produces 01h if the
Flash memory sector is protected, or 00h if the
sector is not protected.
110/176
The sector protection status for all NVM blocks
(primary Flash memory or secondary Flash memory) can also be read by the MCU accessing the
Flash Protection registers in PSD I/O space. See
the section entitled “Flash Memory Sector Protect,” page 115, for register definitions.
Reading the Erase/Program Status Bits. The
Flash memory provides several status bits to be
used by the MCU to confirm the completion of an
Erase or Program cycle of Flash memory. These
status bits minimize the time that the MCU spends
performing these tasks and are defined in Table
86, page 111. The status bits can be read as many
times as needed.
For Flash memory, the MCU can perform a READ
operation to obtain these status bits while an
Erase or Program instruction is being executed by
the embedded algorithm. See the section entitled
“Programming Flash Memory,” page 112, for details.
Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag
Bit (DQ7) outputs the complement of the bit being
entered for programming/writing on the DQ7 Bit.
Once the Program instruction or the WRITE operation is completed, the true logic value is read on
the Data Polling Flag Bit (DQ7) (in a READ operation).
■ Data Polling is effective after the fourth WRITE
pulse (for a Program instruction) or after the
sixth WRITE pulse (for an Erase instruction). It
must be performed at the address being
programmed or at an address within the Flash
memory sector being erased.
■ During an Erase cycle, the Data Polling Flag Bit
(DQ7) outputs a '0.' After completion of the
cycle, the Data Polling Flag Bit (DQ7) outputs
the last bit programmed (it is a '1' after erasing).
■ If the byte to be programmed is in a protected
Flash memory sector, the instruction is ignored.
■ If all the Flash memory sectors to be erased are
protected, the Data Polling Flag Bit (DQ7) is
reset to '0' for about 100µs, and then returns to
the previous addressed byte. No erasure is
performed.
µPSD325X DEVICES
Toggle Flag (DQ6). The Flash memory offers another way for determining when the Program cycle
is completed. During the internal WRITE operation
and when either the FS0-FS7 or CSBOOT0CSBOOT3 is true, the Toggle Flag Bit (DQ6) toggles from ’0’ to ’1’ and ’1’ to ’0’ on subsequent attempts to read any byte of the memory.
When the internal cycle is complete, the toggling
stops and the data READ on the Data Bus D0-D7
is the addressed memory byte. The device is now
accessible for a new READ or WRITE operation.
The cycle is finished when two successive Reads
yield the same output data.
■ The Toggle Flag Bit (DQ6) is effective after the
fourth WRITE pulse (for a Program instruction)
or after the sixth WRITE pulse (for an Erase
instruction).
■ If the byte to be programmed belongs to a
protected Flash memory sector, the instruction
is ignored.
■ If all the Flash memory sectors selected for
erasure are protected, the Toggle Flag Bit
(DQ6) toggles to '0' for about 100µs and then
returns to the previous addressed byte.
Error Flag (DQ5). During a normal Program or
Erase cycle, the Error Flag Bit (DQ5) is to '0.' This
bit is set to '1' when there is a failure during Flash
memory Byte Program, Sector Erase, or Bulk
Erase cycle.
In the case of Flash memory programming, the Error Flag Bit (DQ5) indicates the attempt to program
a Flash memory bit from the programmed state,
'0', to the erased state, '1,' which is not valid. The
Error Flag Bit (DQ5) may also indicate a Time-out
condition while attempting to program a byte.
In case of an error in a Flash memory Sector Erase
or Byte Program cycle, the Flash memory sector in
which the error occurred or to which the programmed byte belongs must no longer be used.
Other Flash memory sectors may still be used.
The Error Flag Bit (DQ5) is reset after a Reset
Flash instruction.
Erase Time-out Flag (DQ3). The Erase Timeout Flag Bit (DQ3) reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase Time-out Flag Bit (DQ3) is
reset to '0' after a Sector Erase cycle for a time period of 100µs + 20% unless an additional Sector
Erase instruction is decoded. After this time period, or when the additional Sector Erase instruction
is decoded, the Erase Time-out Flag Bit (DQ3) is
set to '1.'
Table 86. Status Bit
Functional Block
Flash Memory
FS0-FS7/CSBOOT0CSBOOT3
VIH
DQ7
DQ6
Data
Polling
Toggle
Flag
DQ5
Error
Flag
DQ4
X
DQ3
Erase
Timeout
DQ2
X
DQ1
X
DQ0
X
Note: 1. X = Not guaranteed value, can be read either ’1’ or ’0.’
2. DQ7-DQ0 represent the Data Bus bits, D7-D0.
3. FS0-FS7 and CSBOOT0-CSBOOT3 are active High.
111/176
µPSD325X DEVICES
Programming Flash Memory
Flash memory must be erased prior to being programmed. A byte of Flash memory is erased to all
’1s’ (FFh), and is programmed by setting selected
bits to ’0.’ The MCU may erase Flash memory all
at once or by-sector, but not byte-by-byte. However, the MCU may program Flash memory byte-bybyte.
The primary and secondary Flash memories require the MCU to send an instruction to program a
byte or to erase sectors (see Table 85).
Once the MCU issues a Flash memory Program or
Erase instruction, it must check for the status bits
for completion. The embedded algorithms that are
invoked support several means to provide status
to the MCU. Status may be checked using any of
three methods: Data Polling, Data Toggle, or
Ready/Busy (PC3).
Data Polling. Polling on the Data Polling Flag Bit
(DQ7) is a method of checking whether a Program
or Erase cycle is in progress or has completed.
Figure 52 shows the Data Polling algorithm.
When the MCU issues a Program instruction, the
embedded algorithm begins. The MCU then reads
the location of the byte to be programmed in Flash
memory to check status. The Data Polling Flag Bit
(DQ7) of this location becomes the complement of
b7 of the original data byte to be programmed. The
MCU continues to poll this location, comparing the
Data Polling Flag Bit (DQ7) and monitoring the Error Flag Bit (DQ5). When the Data Polling Flag Bit
(DQ7) matches b7 of the original data, and the Error Flag Bit (DQ5) remains ’0,’ the embedded algorithm is complete. If the Error Flag Bit (DQ5) is ’1,’
the MCU should test the Data Polling Flag Bit
(DQ7) again since the Data Polling Flag Bit (DQ7)
may have changed simultaneously with the Error
Flag Bit (DQ5) (see Figure 52).
The Error Flag Bit (DQ5) is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte or if the MCU attempted to program a ’1’ to a bit that was not
erased (not erased is logic ’0’).
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
112/176
byte that was written to the Flash memory with the
byte that was intended to be written.
When using the Data Polling method during an
Erase cycle, Figure 52 still applies. However, the
Data Polling Flag Bit (DQ7) is ’0’ until the Erase cycle is complete. A ’1’ on the Error Flag Bit (DQ5) indicates a time-out condition on the Erase cycle; a
’0’ indicates no error. The MCU can read any location within the sector being erased to get the Data
Polling Flag Bit (DQ7) and the Error Flag Bit
(DQ5).
PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms.
Figure 52. Data Polling Flowchart
START
READ DQ5 & DQ7
at VALID ADDRESS
DQ7
=
DATA
YES
NO
NO
DQ5
=1
YES
READ DQ7
DQ7
=
DATA
YES
NO
FAIL
PASS
AI01369B
µPSD325X DEVICES
Data Toggle. Checking the Toggle Flag Bit
(DQ6) is a method of determining whether a Program or Erase cycle is in progress or has completed. Figure 53 shows the Data Toggle algorithm.
When the MCU issues a Program instruction, the
embedded algorithm begins. The MCU then reads
the location of the byte to be programmed in Flash
memory to check status. The Toggle Flag Bit
(DQ6) of this location toggles each time the MCU
reads this location until the embedded algorithm is
complete. The MCU continues to read this location, checking the Toggle Flag Bit (DQ6) and monitoring the Error Flag Bit (DQ5). When the Toggle
Flag Bit (DQ6) stops toggling (two consecutive
reads yield the same value), and the Error Flag Bit
(DQ5) remains ’0,’ the embedded algorithm is
complete. If the Error Flag Bit (DQ5) is ’1,’ the
MCU should test the Toggle Flag Bit (DQ6) again,
since the Toggle Flag Bit (DQ6) may have
changed simultaneously with the Error Flag Bit
(DQ5) (see Figure 53).
The Error Flag Bit(DQ5) is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte, or if the MCU attempted to program a ’1’ to a bit that was not
erased (not erased is logic ’0’).
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
byte that was written to Flash memory with the
byte that was intended to be written.
When using the Data Toggle method after an
Erase cycle, Figure 53 still applies. the Toggle
Flag Bit (DQ6) toggles until the Erase cycle is
complete. A 1 on the Error Flag Bit (DQ5) indicates
a time-out condition on the Erase cycle; a ’0’ indi-
cates no error. The MCU can read any location
within the sector being erased to get the Toggle
Flag Bit (DQ6) and the Error Flag Bit (DQ5).
PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms.
Figure 53. Data Toggle Flowchart
START
READ
DQ5 & DQ6
DQ6
=
TOGGLE
NO
YES
NO
DQ5
=1
YES
READ DQ6
DQ6
=
TOGGLE
NO
YES
FAIL
PASS
AI01370B
113/176
µPSD325X DEVICES
Unlock Bypass. The Unlock Bypass instructions
allow the system to program bytes to the Flash
memories faster than using the standard Program
instruction. The Unlock Bypass Mode is entered
by first initiating two Unlock cycles. This is followed
by a third WRITE cycle containing the Unlock Bypass code, 20h (as shown in Table 85).
The Flash memory then enters the Unlock Bypass
Mode. A two-cycle Unlock Bypass Program instruction is all that is required to program in this
mode. The first cycle in this instruction contains
the Unlock Bypass Program code, A0h. The second cycle contains the program address and data.
Additional data is programmed in the same manner. These instructions dispense with the initial
two Unlock cycles required in the standard Program instruction, resulting in faster total Flash
memory programming.
During the Unlock Bypass Mode, only the Unlock
Bypass Program and Unlock Bypass Reset Flash
instructions are valid.
To exit the Unlock Bypass Mode, the system must
issue the two-cycle Unlock Bypass Reset Flash instruction. The first cycle must contain the data
90h; the second cycle the data 00h. Addresses are
Don’t Care for both cycles. The Flash memory
then returns to READ Mode.
Erasing Flash Memory
Flash Bulk Erase. The Flash Bulk Erase instruction uses six WRITE operations followed by a
READ operation of the status register, as described in Table 85. If any byte of the Bulk Erase
instruction is wrong, the Bulk Erase instruction
aborts and the device is reset to the READ Flash
memory status.
During a Bulk Erase, the memory status may be
checked by reading the Error Flag Bit (DQ5), the
Toggle Flag Bit (DQ6), and the Data Polling Flag
Bit (DQ7), as detailed in the section entitled “Programming Flash Memory,” page 112. The Error
Flag Bit (DQ5) returns a '1' if there has been an
Erase Failure (maximum number of Erase cycles
have been executed).
It is not necessary to program the memory with
00h because the PSD MODULE automatically
does this before erasing to 0FFh.
During execution of the Bulk Erase instruction, the
Flash memory does not accept any instructions.
Flash Sector Erase. The Sector Erase instruction uses six WRITE operations, as described in
Table 85. Additional Flash Sector Erase codes
and Flash memory sector addresses can be written subsequently to erase other Flash memory
sectors in parallel, without further coded cycles, if
the additional bytes are transmitted in a shorter
time than the time-out period of about 100µs. The
114/176
input of a new Sector Erase code restarts the timeout period.
The status of the internal timer can be monitored
through the level of the Erase Time-out Flag Bit
(DQ3). If the Erase Time-out Flag Bit (DQ3) is '0,'
the Sector Erase instruction has been received
and the time-out period is counting. If the Erase
Time-out Flag Bit (DQ3) is '1,' the time-out period
has expired and the embedded algorithm is busy
erasing the Flash memory sector(s). Before and
during Erase time-out, any instruction other than
Suspend Sector Erase and Resume Sector Erase
instructions abort the cycle that is currently in
progress, and reset the device to READ Mode.
During a Sector Erase, the memory status may be
checked by reading the Error Flag Bit (DQ5), the
Toggle Flag Bit (DQ6), and the Data Polling Flag
Bit (DQ7), as detailed in the section entitled “Programming Flash Memory,” page 112.
During execution of the Erase cycle, the Flash
memory accepts only RESET and Suspend Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order to read
data from another Flash memory sector, and then
resumed.
Suspend Sector Erase. When a Sector Erase
cycle is in progress, the Suspend Sector Erase instruction can be used to suspend the cycle by writing 0B0h to any address when an appropriate
Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3)
is High. (See Table 85). This allows reading of
data from another Flash memory sector after the
Erase cycle has been suspended. Suspend Sector Erase is accepted only during an Erase cycle
and defaults to READ Mode. A Suspend Sector
Erase instruction executed during an Erase timeout period, in addition to suspending the Erase cycle, terminates the time out period.
The Toggle Flag Bit (DQ6) stops toggling when the
internal logic is suspended. The status of this bit
must be monitored at an address within the Flash
memory sector being erased. The Toggle Flag Bit
(DQ6) stops toggling between 0.1µs and 15µs after the Suspend Sector Erase instruction has been
executed. The Flash memory is then automatically
set to READ Mode.
If an Suspend Sector Erase instruction was executed, the following rules apply:
– Attempting to read from a Flash memory sector
that was being erased outputs invalid data.
– Reading from a Flash sector that was not being
erased is valid.
– The Flash memory cannot be programmed, and
only responds to Resume Sector Erase and
Reset Flash instructions (READ is an operation
and is allowed).
µPSD325X DEVICES
– If a Reset Flash instruction is received, data in
the Flash memory sector that was being erased
is invalid.
Resume Sector Erase. If a Suspend Sector
Erase instruction was previously executed, the
erase cycle may be resumed with this instruction.
The Resume Sector Erase instruction consists of
writing 030h to any address while an appropriate
Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3)
is High. (See Table 85.)
Specific Features
Flash Memory Sector Protect. Each
primary
and secondary Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data
security because it disables all Program or Erase
cycles. This mode can be activated through the
JTAG Port or a Device Programmer.
Sector protection can be selected for each sector
using the PSDsoft Express Configuration program. This automatically protects selected sectors
when the device is programmed through the JTAG
Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their
contents using the JTAG Port or a Device Programmer. The MCU can read (but cannot change)
the sector protection bits.
Any attempt to program or erase a protected Flash
memory sector is ignored by the device. The Verify
operation results in a READ of the protected data.
This allows a guarantee of the retention of the Protection status.
The sector protection status can be read by the
MCU through the Flash memory protection registers (in the CSIOP block). See Table 87 and Table
88.
Table 87. Sector Protection/Security Bit Definition – Flash Protection Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Sec7_Prot
Sec6_Prot
Sec5_Prot
Sec4_Prot
Sec3_Prot
Sec2_Prot
Sec1_Prot
Sec0_Prot
Note: 1. Bit Definitions:
Sec<i>_Prot 1 = Primary Flash memory or secondary Flash memory Sector <i> is write-protected.
Sec<i>_Prot 0 = Primary Flash memory or secondary Flash memory Sector <i> is not write-protected.
Table 88. Sector Protection/Security Bit Definition – Secondary Flash Protection Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Security_Bit
not used
not used
not used
Sec3_Prot
Sec2_Prot
Sec1_Prot
Sec0_Prot
Note: 1. Bit Definitions:
Sec<i>_Prot 1 = Secondary Flash memory Sector <i> is write-protected.
Sec<i>_Prot 0 = Secondary Flash memory Sector <i> is not write-protected.
Security_Bit 0 = Security Bit in device has not been set.
1 = Security Bit in device has been set.
115/176
µPSD325X DEVICES
Reset Flash. The Reset Flash instruction consists of one WRITE cycle (see Table 85). It can
also be optionally preceded by the standard two
WRITE decoding cycles (writing AAh to 555h and
55h to AAAh). It must be executed after:
– Reading the Flash Protection Status or Flash ID
– An Error condition has occurred (and the device
has set the Error Flag Bit (DQ5) to '1' during a
Flash memory Program or Erase cycle.
The Reset Flash instruction puts the Flash memory back into normal READ Mode. If an Error condition has occurred (and the device has set the Error
Flag Bit (DQ5) to '1' the Flash memory is put back
into normal READ Mode within 25µs of the Reset
Flash instruction having been issued. The Reset
Flash instruction is ignored when it is issued during a Program or Bulk Erase cycle of the Flash
memory. The Reset Flash instruction aborts any
on-going Sector Erase cycle, and returns the
Flash memory to the normal READ Mode within
25µs.
Reset (RESET) Signal. A pulse on Reset (RESET) aborts any cycle that is in progress, and resets the Flash memory to the READ Mode. When
the reset occurs during a Program or Erase cycle,
the Flash memory takes up to 25µs to return to the
READ Mode. It is recommended that the Reset
(RESET) pulse (except for Power-on RESET, as
described on page 140) be at least 25µs so that
the Flash memory is always ready for the MCU to
retreive the bootstrap instructions after the reset
cycle is complete.
SRAM
The SRAM is enabled when SRAM Select (RS0)
from the DPLD is High. SRAM Select (RS0) can
contain up to two product terms, allowing flexible
memory mapping.
The SRAM can be backed up using an external
battery. The external battery should be connected
to Voltage Stand-by (V STBY, PC2). If you have an
external battery connected to the µPSD325X de-
116/176
vices, the contents of the SRAM are retained in the
event of a power loss. The contents of the SRAM
are retained so long as the battery voltage remains
at 2V or greater. If the supply voltage falls below
the battery voltage, an internal power switch-over
to the battery occurs.
PC4 can be configured as an output that indicates
when power is being drawn from the external battery. Battery-on Indicator (V BATON, PC4) is High
with the supply voltage falls below the battery voltage and the battery on Voltage Stand-by (VSTBY,
PC2) is supplying power to the internal SRAM.
SRAM Select (RS0), Voltage Stand-by (VSTBY,
PC2) and Battery-on Indicator (VBATON, PC4) are
all configured using PSDsoft Express Configuration.
Sector Select and SRAM Select
Sector Select (FS0-FS7, CSBOOT0-CSBOOT3)
and SRAM Select (RS0) are all outputs of the
DPLD. They are setup by writing equations for
them in PSDsoft Express. The following rules apply to the equations for these signals:
1. Primary Flash memory and secondary Flash
memory Sector Select signals must not be larger than the physical sector size.
2. Any primary Flash memory sector must not be
mapped in the same memory space as another
Flash memory sector.
3. A secondary Flash memory sector must not be
mapped in the same memory space as another
secondary Flash memory sector.
4. SRAM, I/O, and Peripheral I/O spaces must not
overlap.
5. A secondary Flash memory sector may overlap
a primary Flash memory sector. In case of overlap, priority is given to the secondary Flash
memory sector.
6. SRAM, I/O, and Peripheral I/O spaces may
overlap any other memory sector. Priority is given to the SRAM, I/O, or Peripheral I/O.
µPSD325X DEVICES
Example. FS0 is valid when the address is in the
range of 8000h to BFFFh, CSBOOT0 is valid from
8000h to 9FFFh, and RS0 is valid from 8000h to
87FFh. Any address in the range of RS0 always
accesses the SRAM. Any address in the range of
CSBOOT0 greater than 87FFh (and less than
9FFFh) automatically addresses secondary Flash
memory segment 0. Any address greater than
9FFFh accesses the primary Flash memory segment 0. You can see that half of the primary Flash
memory segment 0 and one-fourth of secondary
Flash memory segment 0 cannot be accessed in
this example.
Note: An equation that defined FS1 to anywhere
in the range of 8000h to BFFFh would not be valid.
Figure 54 shows the priority levels for all memory
components. Any component on a higher level can
overlap and has priority over any component on a
lower level. Components on the same level must
not overlap. Level one has the highest priority and
level 3 has the lowest.
Memory Select Configuration in Program and
Data Spaces. The MCU Core has separate address spaces for Program memory and Data
memory. Any of the memories within the PSD
MODULE can reside in either space or both spaces. This is controlled through manipulation of the
VM Register that resides in the CSIOP space.
The VM Register is set using PSDsoft Express to
have an initial value. It can subsequently be
changed by the MCU so that memory mapping
can be changed on-the-fly.
For example, you may wish to have SRAM and primary Flash memory in the Data space at Boot-up,
and secondary Flash memory in the Program
space at Boot-up, and later swap the primary and
secondary Flash memories. This is easily done
with the VM Register by using PSDsoft Express
Configuration to configure it for Boot-up and having the MCU change it when desired. Table 89 describes the VM Register.
Figure 54. Priority Level of Memory and I/O
Components in the PSD MODULE
Highest Priority
Level 1
SRAM, I /O, or
Peripheral I /O
Level 2
Secondary
Non-Volatile Memory
Level 3
Primary Flash Memory
Lowest Priority
AI02867D
Table 89. VM Register
Bit 7
PIO_EN
0 = disable
PIO Mode
1= enable
PIO Mode
Bit 6
not used
not used
Bit 4
Primary
FL_Data
Bit 3
Secondary Data
Bit 2
Primary
FL_Code
Bit 1
Secondary Code
Bit 0
SRAM_Code
not used
0 = RD
can’t
access
Flash
memory
0 = RD can’t
access Secondary
Flash memory
0 = PSEN
can’t
access
Flash
memory
0 = PSEN can’t
access Secondary
Flash memory
0 = PSEN
can’t
access
SRAM
not used
1 = RD
access
Flash
memory
1 = RD access
Secondary Flash
memory
1 = PSEN
access
Flash
memory
1 = PSEN access
Secondary Flash
memory
1 = PSEN
access
SRAM
Bit 5
117/176
µPSD325X DEVICES
Separate Space Mode. Program space is separated from Data space. For example, Program Select Enable (PSEN) is used to access the program
code from the primary Flash memory, while READ
Strobe (RD) is used to access data from the secondary Flash memory, SRAM and I/O Port blocks.
This configuration requires the VM Register to be
set to 0Ch (see Figure 55).
Combined Space Modes. The Program and
Data spaces are combined into one memory
space that allows the primary Flash memory, secondary Flash memory, and SRAM to be accessed
by either Program Select Enable (PSEN) or READ
Strobe (RD). For example, to configure the primary Flash memory in Combined space, Bits b2 and
b4 of the VM Register are set to ’1’ (see Figure 56).
Figure 55. Separate Space Mode
DPLD
SRAM
Secondary
Flash
Memory
Primary
Flash
Memory
RS0
CSBOOT0-3
FS0-FS7
CS
CS
OE
CS
OE
OE
PSEN
RD
AI02869C
Figure 56. Combined Space Mode
DPLD
RD
RS0
Secondary
Flash
Memory
Primary
Flash
Memory
SRAM
CSBOOT0-3
FS0-FS7
CS
CS
OE
CS
OE
OE
VM REG BIT 3
VM REG BIT 4
PSEN
VM REG BIT 1
VM REG BIT 2
RD
VM REG BIT 0
AI02870C
118/176
µPSD325X DEVICES
Page Register
The 8-bit Page Register increases the addressing
capability of the MCU Core by a factor of up to 256.
The contents of the register can also be read by
the MCU. The outputs of the Page Register
(PGR0-PGR7) are inputs to the DPLD decoder
and can be included in the Sector Select (FS0FS7, CSBOOT0-CSBOOT3), and SRAM Select
(RS0) equations.
If memory paging is not needed, or if not all 8 page
register bits are needed for memory paging, then
these bits may be used in the CPLD for general
logic.
Figure 57 shows the Page Register. The eight flipflops in the register are connected to the internal
data bus D0-D7. The MCU can write to or read
from the Page Register. The Page Register can be
accessed at address location CSIOP + E0h.
Figure 57. Page Register
RESET
D0
D0 - D7
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
PGR0
INTERNAL PSD MODULE
SELECTS
AND LOGIC
PGR1
PGR2
PGR3
PGR4
DPLD
AND
CPLD
PGR5
PGR6
PGR7
R/ W
PAGE
REGISTER
PLD
AI05799
119/176
µPSD325X DEVICES
PLDS
The PLDs bring programmable logic functionality
to the µPSD. After specifying the logic for the
PLDs in PSDsoft Express, the logic is programmed into the device and available upon Power-up.
Table 90. DPLD and CPLD Inputs
Input Source
Input Name
Number
of
Signals
MCU Address Bus
A15-A0
16
MCU Control Signals
PSEN, RD, WR,
ALE
4
RESET
RST
1
Power-down
PDN
1
Port A Input
Macrocells1
PA7-PA0
8
Port B Input
Macrocells
PB7-PB0
8
Port C Input
Macrocells
PC7-PC0
8
Port D Inputs
PD2-PD1
2
Page Register
PGR7-PGR0
8
Macrocell AB
Feedback
MCELLAB.FB7FB0
8
Macrocell BC
Feedback
MCELLBC.FB7FB0
8
Flash memory
Program Status Bit
Ready/Busy
1
Note: 1. These inputs are not available in the 52-pin package.
120/176
The PSD MODULE contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD).
The PLDs are briefly discussed in the next few
paragraphs, and in more detail in the section entitled “Decode PLD (DPLD),” page 122, and the
section entitled “Complex PLD (CPLD),” page 123.
Figure 58 shows the configuration of the PLDs.
The DPLD performs address decoding for Select
signals for PSD MODULE components, such as
memory, registers, and I/O ports.
The CPLD can be used for logic functions, such as
loadable counters and shift registers, state machines, and encoding and decoding logic. These
logic functions can be constructed using the Output Macrocells (OMC), Input Macrocells (IMC),
and the AND Array. The CPLD can also be used
to generate External Chip Select (ECS1-ECS2)
signals.
The AND Array is used to form product terms.
These product terms are specified using PSDsoft.
The PLD input signals consist of internal MCU signals and external inputs from the I/O ports. The input signals are shown in Table 90.
The Turbo Bit in PSD MODULE
The PLDs can minimize power consumption by
switching off when inputs remain unchanged for
an extended time of about 70ns. Resetting the
Turbo Bit to '0' (Bit 3 of PMMR0) automatically
places the PLDs into standby if no inputs are
changing. Turning the Turbo Mode off increases
propagation delays while reducing power consumption. See the section entitled “POWER MANAGEMENT,” page 136, on how to set the Turbo
Bit.
Additionally, five bits are available in PMMR2 to
block MCU control signals from entering the PLDs.
This reduces power consumption and can be used
only when these MCU control signals are not used
in PLD logic equations.
Each of the two PLDs has unique characteristics
suited for its applications. They are described in
the following sections.
µPSD325X DEVICES
Figure 58. PLD Diagram
8
PAGE
REGISTER
DECODE PLD
73
8
PRIMARY FLASH MEMORY SELECTS
4
SECONDARY NON-VOLATILE MEMORY SELECTS
1
SRAM SELECT
1
CSIOP SELECT
PLD INPUT BUS
2
16
PERIPHERAL SELECTS
DIRECT MACROCELL ACCESS FROM MCU DATA BUS
OUTPUT MACROCELL FEEDBACK
CPLD
16 OUTPUT
MACROCELL
PT
ALLOC.
73
24 INPUT MACROCELL
(PORT A,B,C)
MACROCELL
ALLOC.
I/O PORTS
DATA
BUS
MCELLAB
TO PORT A OR B1
8
MCELLBC
TO PORT B OR C
8
2
EXTERNAL CHIP SELECTS
TO PORT D
DIRECT MACROCELL INPUT TO MCU DATA BUS
24
INPUT MACROCELL & INPUT PORTS
2
PORT D INPUTS
AI06600
Note: 1. Ports A is not available in the 52-pin package
121/176
µPSD325X DEVICES
Decode PLD (DPLD)
The DPLD, shown in Figure 59, is used for decoding the address for PSD MODULE and external
components. The DPLD can be used to generate
the following decode signals:
■ 8 Sector Select (FS0-FS7) signals for the
primary Flash memory (three product terms
each)
■
4 Sector Select (CSBOOT0-CSBOOT3) signals
for the secondary Flash memory (three product
terms each)
■
1 internal SRAM Select (RS0) signal (two
product terms)
■
1 internal CSIOP Select signal (selects the PSD
MODULE registers)
■
2 internal Peripheral Select signals (Peripheral
I/O Mode).
Figure 59. DPLD Logic Array
(INPUTS)
I /O PORTS (PORT A,B,C)1
3
CSBOOT 0
3
CSBOOT 1
3
CSBOOT 2
3
CSBOOT 3
3
FS0
(24)
3
MCELLAB.FB [7:0] (FEEDBACKS)
(8)
MCELLBC.FB [7:0] (FEEDBACKS)
(8)
PGR0 -PGR7
(8)
FS1
3
FS2
3
FS3
3
A[15:0]2
FS4
(16)
3
PD[2:1]
(2)
PDN (APD OUTPUT)
(1)
PSEN, RD, WR, ALE2
(4)
FS5
3
FS6
3
2
(1)
RD_BSY
(1)
RESET
8 PRIMARY FLASH
MEMORY SECTOR
SELECTS
FS7
2
RS0
1
CSIOP
1
PSEL0
1
PSEL1
SRAM SELECT
I/O DECODER
SELECT
PERIPHERAL I/O
MODE SELECT
AI06601
Note: 1. Port A inputs are not available in the 52-pin package
2. Inputs from the MCU module
122/176
µPSD325X DEVICES
Complex PLD (CPLD)
The CPLD can be used to implement system logic
functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols,
state machines, and random logic. The CPLD can
also be used to generate External Chip Select
(ECS1-ECS2), routed to Port D.
Although External Chip Select (ECS1-ECS2) can
be produced by any Output Macrocell (OMC),
these External Chip Select (ECS1-ECS2) on Port
D do not consume any Output Macrocells (OMC).
As shown in Figure 58, the CPLD has the following
blocks:
■ 24 Input Macrocells (IMC)
■
16 Output Macrocells (OMC)
■
Macrocell Allocator
■
Product Term Allocator
■
AND Array capable of generating up to 137
product terms
■
Four I/O Ports.
Each of the blocks are described in the sections
that follow.
The Input Macrocells (IMC) and Output Macrocells
(OMC) are connected to the PSD MODULE internal data bus and can be directly accessed by the
MCU. This enables the MCU software to load data
into the Output Macrocells (OMC) or read data
from both the Input and Output Macrocells (IMC
and OMC).
This feature allows efficient implementation of system logic and eliminates the need to connect the
data bus to the AND Array as required in most
standard PLD macrocell architectures.
Figure 60. Macrocell and I/O Port
PLD INPUT BUS
PRODUCT TERMS
FROM OTHER
MACROCELLS
MCU ADDRESS / DATA BUS
TO OTHER I/O PORTS
CPLD MACROCELLS
I/O PORTS
DATA
LOAD
CONTROL
PT PRESET
MCU DATA IN
PRODUCT TERM
ALLOCATOR
LATCHED
ADDRESS OUT
DATA
MCU LOAD
I/O PIN
D
Q
MUX
POLARITY
SELECT
MUX
CPLD OUTPUT
PR DI LD
D/T
MUX
PT
CLOCK
GLOBAL
CLOCK
CK
CL
CLOCK
SELECT
SELECT
Q
D/T/JK FF
SELECT
COMB.
/REG
SELECT
CPLD
OUTPUT
PDR
MACROCELL
TO
I/O PORT
ALLOC.
INPUT
Q
DIR
REG.
D
WR
PT CLEAR
PT OUTPUT ENABLE (OE)
MACROCELL FEEDBACK
INPUT MACROCELLS
I/O PORT INPUT
MUX
PLD INPUT BUS
MACROCELL
OUT TO
MCU
PT INPUT LATCH GATE/CLOCK
ALE
MUX
AND ARRAY
WR
UP TO 10
PRODUCT TERMS
Q D
Q D
G
AI06602
123/176
µPSD325X DEVICES
Output Macrocell (OMC)
Eight of the Output Macrocells (OMC) are connected to Ports A and B pins and are named as
McellAB0-McellAB7. The other eight macrocells
are connected to Ports B and C pins and are
named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in PSDsoft, the
Macrocell Allocator block assigns it to either Port A
or B. The same is true for a McellBC output on Port
B or C. Table 91 shows the macrocells and port
assignment.
The Output Macrocell (OMC) architecture is
shown in Figure 61. As shown in the figure, there
are native product terms available from the AND
Array, and borrowed product terms available (if
unused) from other Output Macrocells (OMC). The
polarity of the product term is controlled by the
XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop
element, or combinatorial logic. The multiplexer
selects between the sequential or combinatorial
logic outputs. The multiplexer output can drive a
port pin and has a feedback path to the AND Array
inputs.
The flip-flop in the Output Macrocell (OMC) block
can be configured as a D, T, JK, or SR type in PSDsoft. The flip-flop’s clock, preset, and clear inputs
may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for
the clock input to the flip-flop. The flip-flop is
clocked on the rising edge of CLKIN (PD1). The
preset and clear are active High inputs. Each clear
input can use up to two product terms.
Table 91. Output Macrocell Port and Data Bit Assignments
Output
Macrocell
Port
Assignment1
Native Product Terms
Maximum Borrowed
Product Terms
Data Bit for Loading or
Reading
McellAB0
Port A0, B0
3
6
D0
McellAB1
Port A1, B1
3
6
D1
McellAB2
Port A2, B2
3
6
D2
McellAB3
Port A3, B3
3
6
D3
McellAB4
Port A4, B4
3
6
D4
McellAB5
Port A5, B5
3
6
D5
McellAB6
Port A6, B6
3
6
D6
McellAB7
Port A7, B7
3
6
D7
McellBC0
Port B0, C0
4
5
D0
McellBC1
Port B1, C1
4
5
D1
McellBC2
Port B2, C2
4
5
D2
McellBC3
Port B3, C3
4
5
D3
McellBC4
Port B4, C4
4
6
D4
McellBC5
Port B5, C5
4
6
D5
McellBC6
Port B6, C6
4
6
D6
McellBC7
Port B7, C7
4
6
D7
Note: 1. McellAB0-McellAB7 can only be assigned to Port B in the 52-pin package
124/176
µPSD325X DEVICES
Product Term Allocator
The CPLD has a Product Term Allocator. PSDsoft
uses the Product Term Allocator to borrow and
place product terms from one macrocell to another. The following list summarizes how product
terms are allocated:
■ McellAB0-McellAB7 all have three native
product terms and may borrow up to six more
■
McellBC0-McellBC3 all have four native product
terms and may borrow up to five more
■
McellBC4-McellBC7 all have four native product
terms and may borrow up to six more.
This is called product term expansion. PSDsoft
Express performs this expansion as needed.
Loading and Reading the Output Macrocells
(OMC). The Output Macrocells (OMC) block occupies a memory location in the MCU address
space, as defined by the CSIOP block (see the
section entitled “I/O PORTS (PSD MODULE),” on
page 127). The flip-flops in each of the 16 Output
Macrocells (OMC) can be loaded from the data
bus by a MCU. Loading the Output Macrocells
(OMC) with data from the MCU takes priority over
internal functions. As such, the preset, clear, and
clock inputs to the flip-flop can be overridden by
the MCU. The ability to load the flip-flops and read
them back is useful in such applications as loadable counters and shift registers, mailboxes, and
handshaking protocols.
Data can be loaded to the Output Macrocells
(OMC) on the trailing edge of WRITE Strobe (WR,
edge loading) or during the time that WRITE
Strobe (WR) is active (level loading). The method
of loading is specified in PSDsoft Express Configuration.
Each macrocell may only borrow product terms
from certain other macrocells. Product terms already in use by one macrocell are not available for
another macrocell.
If an equation requires more product terms than
are available to it, then “external” product terms
are required, which consume other Output Macrocells (OMC). If external product terms are used,
extra delay is added for the equation that required
the extra product terms.
Figure 61. CPLD Output Macrocell
MASK
REG.
MACROCELL CS
MCU DATA BUS
D [ 7:0]
RD
PT
ALLOCATOR
WR
DIRECTION
REGISTER
ENABLE (.OE)
AND ARRAY
PLD INPUT BUS
PRESET(.PR)
COMB/REG
SELECT
PT
PT
DIN PR
MUX
PT
LD
POLARITY
SELECT
I/O PIN
MACROCELL
ALLOCATOR
IN
CLEAR (.RE)
CLR
PORT
DRIVER
PROGRAMMABLE
FF (D / T/JK /SR)
PT CLK
CLKIN
Q
MUX
FEEDBACK (.FB)
PORT INPUT
INPUT
MACROCELL
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µPSD325X DEVICES
The OMC Mask Register. There is one Mask
Register for each of the two groups of eight Output
Macrocells (OMC). The Mask Registers can be
used to block the loading of data to individual Output Macrocells (OMC). The default value for the
Mask Registers is 00h, which allows loading of the
Output Macrocells (OMC). When a given bit in a
Mask Register is set to a ’1,’ the MCU is blocked
from writing to the associated Output Macrocells
(OMC). For example, suppose McellAB0McellAB3 are being used for a state machine. You
would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you
would want to load the Mask Register for McellAB
(Mask Macrocell AB) with the value 0Fh.
The Output Enable of the OMC. The
Output
Macrocells (OMC) block can be connected to an I/
O port pin as a PLD output. The output enable of
each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon
Power-up if no output enable equation is defined
and if the pin is declared as a PLD output in PSDsoft Express.
If the Output Macrocell (OMC) output is declared
as an internal node and not as a port pin output in
the PSDabel file, the port pin can be used for other
I/O functions. The internal node feedback can be
routed as an input to the AND Array.
Input Macrocells (IMC)
The CPLD has 24 Input Macrocells (IMC), one for
each pin on Ports A, B, and C. The architecture of
the Input Macrocells (IMC) is shown in Figure 62.
The Input Macrocells (IMC) are individually configurable, and can be used as a latch, register, or to
pass incoming Port signals prior to driving them
onto the PLD input bus. The outputs of the Input
Macrocells (IMC) can be read by the MCU through
the internal data bus.
The enable for the latch and clock for the register
are driven by a multiplexer whose inputs are a
product term from the CPLD AND Array or the
MCU Address Strobe (ALE). Each product term
output is used to latch or clock four Input Macrocells (IMC). Port inputs 3-0 can be controlled by
one product term and 7-4 by another.
Configurations for the Input Macrocells (IMC) are
specified by equations written in PSDsoft (see Application Note AN1171). Outputs of the Input Macrocells (IMC) can be read by the MCU via the IMC
buffer. See the section entitled “I/O PORTS (PSD
MODULE),” page 127.
Figure 62. Input Macrocell
D [ 7:0]
MCU DATA BUS
INPUT MACROCELL _ RD
DIRECTION
REGISTER
ENABLE ( .OE )
AND ARRAY
PLD INPUT BUS
PT
OUTPUT
MACROCELLS BC
AND
MACROCELL AB
I/O PIN
PT
PORT
DRIVER
MUX
Q
D
PT
MUX
ALE
D FF
FEEDBACK
Q
D
G
LATCH
INPUT MACROCELL
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µPSD325X DEVICES
I/O PORTS (PSD MODULE)
There are four programmable I/O ports: Ports A, B,
C, and D in the PSD MODULE. Each of the ports
is eight bits except Port D, which is 3 bits. Each
port pin is individually user configurable, thus allowing multiple functions per port. The ports are
configured using PSDsoft Express Configuration
or by the MCU writing to on-chip registers in the
CSIOP space. Port A is not available in the 52-pin
package.
The topics discussed in this section are:
■ General Port architecture
■
Port operating modes
■
Port Configuration Registers (PCR)
■
Port Data Registers
■
Individual Port functionality.
General Port Architecture
The general architecture of the I/O Port block is
shown in Figure 63. Individual Port architectures
are shown in Figure 65 to Figure 68. In general,
once the purpose for a port pin has been defined,
that pin is no longer available for other purposes.
Exceptions are noted.
As shown in Figure 63, the ports contain an output
multiplexer whose select signals are driven by the
configuration bits in the Control Registers (Ports A
and B only) and PSDsoft Express Configuration.
Inputs to the multiplexer include the following:
■ Output data from the Data Out register
■
Latched address outputs
■
CPLD macrocell output
■
External Chip Select (ECS1-ECS2) from the
CPLD.
The Port Data Buffer (PDB) is a tri-state buffer that
allows only one source at a time to be read. The
Port Data Buffer (PDB) is connected to the Internal
Data Bus for feedback and can be read by the
MCU. The Data Out and macrocell outputs, Direction and Control Registers, and port pin input are
all connected to the Port Data Buffer (PDB).
Figure 63. General I/O Port Architecture
DATA OUT
REG.
D
Q
D
Q
DATA OUT
WR
ADDRESS
ALE
ADDRESS
PORT PIN
OUTPUT
MUX
G
MACROCELL OUTPUTS
EXT CS
READ MUX
MCU DATA BUS
P
OUTPUT
SELECT
D
DATA IN
B
CONTROL REG.
D
Q
ENABLE OUT
WR
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD - INPUT
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µPSD325X DEVICES
The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come
from the CPLD AND Array enable product term
and the Direction Register. If the enable product
term of any of the Array outputs are not defined
and that port pin is not defined as a CPLD output
in the PSDsoft, then the Direction Register has
sole control of the buffer that drives the port pin.
The contents of these registers can be altered by
the MCU. The Port Data Buffer (PDB) feedback
path allows the MCU to check the contents of the
registers.
Ports A, B, and C have embedded Input Macrocells (IMC). The Input Macrocells (IMC) can be
configured as latches, registers, or direct inputs to
the PLDs. The latches and registers are clocked
by Address Strobe (ALE) or a product term from
the PLD AND Array. The outputs from the Input
Macrocells (IMC) drive the PLD input bus and can
be read by the MCU. See the section entitled “Input Macrocell,” page 126.
Port Operating Modes
The I/O Ports have several modes of operation.
Some modes can be defined using PSDsoft, some
by the MCU writing to the Control Registers in
CSIOP space, and some by both. The modes that
can only be defined using PSDsoft must be programmed into the device and cannot be changed
unless the device is reprogrammed. The modes
that can be changed by the MCU can be done so
dynamically at run-time. The PLD I/O, Data Port,
Address Input, and Peripheral I/O Modes are the
only modes that must be defined before programming the device. All other modes can be changed
by the MCU at run-time. See Application Note
AN1171 for more detail.
Table 92 summarizes which modes are available
on each port. Table 95 shows how and where the
different modes are configured. Each of the port
operating modes are described in the following
sections.
MCU I/O Mode
In the MCU I/O Mode, the MCU uses the I/O Ports
block to expand its own I/O ports. By setting up the
CSIOP space, the ports on the PSD MODULE are
mapped into the MCU address space. The addresses of the ports are listed in Table 84.
A port pin can be put into MCU I/O Mode by writing
a '0' to the corresponding bit in the Control Register. The MCU I/O direction may be changed by
writing to the corresponding bit in the Direction
Register, or by the output enable product term.
See the section entitled “Peripheral I/O Mode,”
page 128. When the pin is configured as an out-
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put, the content of the Data Out Register drives the
pin. When configured as an input, the MCU can
read the port input through the Data In buffer. See
Figure 63, page 127.
Ports C and D do not have Control Registers, and
are in MCU I/O Mode by default. They can be used
for PLD I/O if equations are written for them in PSDabel.
PLD I/O Mode
The PLD I/O Mode uses a port as an input to the
CPLD’s Input Macrocells (IMC), and/or as an output from the CPLD’s Output Macrocells (OMC).
The output can be tri-stated with a control signal.
This output enable control signal can be defined
by a product term from the PLD, or by resetting the
corresponding bit in the Direction Register to '0.'
The corresponding bit in the Direction Register
must not be set to '1' if the pin is defined for a PLD
input signal in PSDsoft. The PLD I/O Mode is
specified in PSDsoft by declaring the port pins,
and then writing an equation assigning the PLD I/
O to a port.
Address Out Mode
Address Out Mode can be used to drive latched
MCU addresses on to the port pins. These port
pins can, in turn, drive external devices. Either the
output enable or the corresponding bits of both the
Direction Register and Control Register must be
set to a '1' for pins to use Address Out Mode. This
must be done by the MCU at run-time. See Table
94 for the address output pin assignments on
Ports A and B for various MCUs.
Peripheral I/O Mode
Peripheral I/O Mode can be used to interface with
external peripherals. In this mode, all of Port A
serves as a tri-state, bi-directional data buffer for
the MCU. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a '1.' Figure 64
shows how Port A acts as a bi-directional buffer for
the MCU data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/or PSEL1 must
be written in PSDsoft. The buffer is tri-stated when
PSEL0 or PSEL1 is low (not active). The PSEN
signal should be “ANDed” in the PSEL equations
to disable the buffer when PSEL resides in the
data space.
JTAG In-System Programming (ISP)
Port C is JTAG compliant, and can be used for InSystem Programming (ISP). For more information
on the JTAG Port, see the section entitled “PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE,” page 142.
µPSD325X DEVICES
Figure 64. Peripheral I/O Mode
RD
PSEL0
PSEL
PSEL1
D0 - D7
DATA BUS
VM REGISTER BIT 7
PA0 - PA7
WR
AI02886
Table 92. Port Operating Modes
Port A 2
Port Mode
Port B
Port C
Port D
MCU I/O
Yes
Yes
Yes
Yes
PLD I/O
McellAB Outputs
McellBC Outputs
Additional Ext. CS Outputs
PLD Inputs
Yes
No
No
Yes
Yes
Yes
No
Yes
No
Yes
No
Yes
No
No
Yes
Yes
Address Out
Yes (A7 – 0)
Yes (A7 – 0)
No
No
Peripheral I/O
Yes
No
No
No
JTAG ISP
No
No
Yes1
No
Note: 1. JTAG pins (TMS, TCK, TDI, TDO) are dedicated pins.
2. Port A is not available in the 52-pin package.
Table 93. Port Operating Mode Settings
Mode
Control Register
Setting
Defined in PSDsoft
Direction Register
Setting
VM Register Setting
MCU I/O
Declare pins only
0
1 = output,
0 = input (Note 2)
N/A
PLD I/O
Logic equations
N/A
(Note 2)
N/A
Address Out
(Port A,B)
Declare pins only
1
1 (Note 2)
N/A
Peripheral I/O
(Port A)
Logic equations
(PSEL0 & 1)
N/A
N/A
PIO Bit = 1
Note: 1. N/A = Not Applicable
2. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product
term (.oe) from the CPLD AND Array.
Table 94. I/O Port Latched Address Output Assignments
Port A (PA3-PA0)
Address a3-a0
Port A (PA7-PA4)
Address a7-a4
Port B (PB3-PB0)
Address a3-a0
Port B (PB7-PB4)
Address a7-a4
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µPSD325X DEVICES
Port Configuration Registers (PCR)
Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of
the registers can be accessed by the MCU through
normal READ/WRITE bus cycles at the addresses
given in Table 84. The addresses in Table 84 are
the offsets in hexadecimal from the base of the
CSIOP register.
The pins of a port are individually configurable and
each bit in the register controls its respective pin.
For example, Bit 0 in a register refers to Bit 0 of its
port. The three Port Configuration Registers
(PCR), shown in Table 95, are used for setting the
Port configurations. The default Power-up state for
each register in Table 95 is 00h.
Control Register. Any bit reset to ’0’ in the Control Register sets the corresponding port pin to
MCU I/O Mode, and a ’1’ sets it to Address Out
Mode. The default mode is MCU I/O. Only Ports A
and B have an associated Control Register.
Direction Register. The Direction Register, in
conjunction with the output enable (except for Port
D), controls the direction of data flow in the I/O
Ports. Any bit set to ’1’ in the Direction Register
causes the corresponding pin to be an output, and
any bit set to ’0’ causes it to be an input. The default mode for all port pins is input.
Figure 65, page 132 and Figure 66, page 133
show the Port Architecture diagrams for Ports A/B
and C, respectively. The direction of data flow for
Ports A, B, and C are controlled not only by the direction register, but also by the output enable
product term from the PLD AND Array. If the output enable product term is not active, the Direction
Register has sole control of a given pin’s direction.
An example of a configuration for a Port with the
three least significant bits set to output and the remainder set to input is shown in Table 98. Since
Port D only contains two pins (shown in Figure 68),
the Direction Register for Port D has only two bits
active.
Drive Select Register. The Drive Select Register
configures the pin driver as Open Drain or CMOS
for some port pins, and controls the slew rate for
the other port pins. An external pull-up resistor
should be used for pins configured as Open Drain.
A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a
'1.' The default pin drive is CMOS.
130/176
Note: The slew rate is a measurement of the rise
and fall times of an output. A higher slew rate
means a faster output response and may create
more electrical noise. A pin operates in a high slew
rate when the corresponding bit in the Drive Register is set to '1.' The default rate is slow slew.
Table 99, page 131 shows the Drive Register for
Ports A, B, C, and D. It summarizes which pins can
be configured as Open Drain outputs and which
pins the slew rate can be set for.
Table 95. Port Configuration Registers (PCR)
Register Name
Port
MCU Access
Control
A,B
WRITE/READ
Direction
A,B,C,D
WRITE/READ
Drive Select1
A,B,C,D
WRITE/READ
Note: 1. See Table 99 for Drive Register Bit definition.
Table 96. Port Pin Direction Control, Output
Enable P.T. Not Defined
Direction Register Bit
Port Pin Mode
0
Input
1
Output
Table 97. Port Pin Direction Control, Output
Enable P.T. Defined
Direction
Register Bit
Output Enable
P.T.
Port Pin Mode
0
0
Input
0
1
Output
1
0
Output
1
1
Output
Table 98. Port Direction Assignment Example
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
1
1
1
µPSD325X DEVICES
Port Data Registers
The Port Data Registers, shown in Table 100, are
used by the MCU to write data to or read data from
the ports. Table 100 shows the register name, the
ports having each register type, and MCU access
for each register type. The registers are described
below.
Data In. Port pins are connected directly to the
Data In buffer. In MCU I/O Input Mode, the pin input is read through the Data In buffer.
Data Out Register. Stores output data written by
the MCU in the MCU I/O Output Mode. The contents of the Register are driven out to the pins if the
Direction Register or the output enable product
term is set to ’1.’ The contents of the register can
also be read back by the MCU.
Output Macrocells (OMC). The CPLD Output
Macrocells (OMC) occupy a location in the MCU’s
address space. The MCU can read the output of
the Output Macrocells (OMC). If the OMC Mask
Register Bits are not set, writing to the macrocell
loads data to the macrocell flip-flops. See the section entitled “PLDs,” page 120.
OMC Mask Register. Each OMC Mask Register
Bit corresponds to an Output Macrocell (OMC) flipflop. When the OMC Mask Register Bit is set to a
'1,' loading data into the Output Macrocell (OMC)
flip-flop is blocked. The default value is '0' or unblocked.
Input Macrocells (IMC). The Input Macrocells
(IMC) can be used to latch or store external inputs.
The outputs of the Input Macrocells (IMC) are routed to the PLD input bus, and can be read by the
MCU. See the section entitled “PLDs,” page 120.
Enable Out. The Enable Out register can be read
by the MCU. It contains the output enable values
for a given port. A '1' indicates the driver is in output mode. A '0' indicates the driver is in tri-state
and the pin is in input mode.
Table 99. Drive Register Pin Assignment
Drive
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Port A
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Slew
Rate
Slew
Rate
Slew
Rate
Slew
Rate
Port B
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Slew
Rate
Slew
Rate
Slew
Rate
Slew
Rate
Port C
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Port D
NA 1
NA1
NA1
NA1
NA1
Slew
Rate
Slew
Rate
NA1
Note: 1. NA = Not Applicable.
Table 100. Port Data Registers
Register Name
Port
MCU Access
Data In
A,B,C,D
READ – input on pin
Data Out
A,B,C,D
WRITE/READ
Output Macrocell
A,B,C
READ – outputs of macrocells
WRITE – loading macrocells flip-flop
Mask Macrocell
A,B,C
WRITE/READ – prevents loading into a given
macrocell
Input Macrocell
A,B,C
READ – outputs of the Input Macrocells
Enable Out
A,B,C
READ – the output enable control of the port driver
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µPSD325X DEVICES
Ports A and B – Functionality and Structure
Ports A and B have similar functionality and structure, as shown in Figure 65. The two ports can be
configured to perform one or more of the following
functions:
■ MCU I/O Mode
■
■
CPLD Input – Via the Input Macrocells (IMC).
■
Latched Address output – Provide latched
address output as per Table 94.
■
Open Drain/Slew Rate – pins PA3-PA0 and
PB3-PB0 can be configured to fast slew rate,
pins PA7-PA4 and PB7-PB4 can be configured
to Open Drain Mode.
■
Peripheral Mode – Port A only (80-pin package)
CPLD Output – Macrocells McellAB7-McellAB0
can be connected to Port A or Port B. McellBC7McellBC0 can be connected to Port B or Port C.
Figure 65. Port A and Port B Structure
DATA OUT
REG.
D
Q
D
Q
DATA OUT
WR
ADDRESS
ALE
ADDRESS
A[ 7:0]
G
PORT
A OR B PIN
OUTPUT
MUX
MACROCELL OUTPUTS
READ MUX
MCU DATA BUS
P
OUTPUT
SELECT
D
DATA IN
B
CONTROL REG.
D
Q
ENABLE OUT
WR
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD - INPUT
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µPSD325X DEVICES
Port C – Functionality and Structure
Port C can be configured to perform one or more
of the following functions (see Figure 66):
■ MCU I/O Mode
■
■
CPLD Output – McellBC7-McellBC0 outputs
can be connected to Port B or Port C.
Open Drain – Port C pins can be configured in
Open Drain Mode
■
■
CPLD Input – via the Input Macrocells (IMC)
■
In-System Programming (ISP) – JTAG pins
(TMS, TCK, TDI, TDO) are dedicated pins for
device programming. (See the section entitled
“PROGRAMMING IN-CIRCUIT USING THE
Battery Backup features – PC2 can be
configured for a battery input supply, Voltage
Stand-by (VSTBY).
JTAG SERIAL INTERFACE,” page 142, for
more information on JTAG programming.)
PC4 can be configured as a Battery-on Indicator
(VBATON), indicating when VCC is less than
VBAT.
Port C does not support Address Out Mode, and
therefore no Control Register is required.
Figure 66. Port C Structure
DATA OUT
REG.
D
DATA OUT
Q
WR
SPECIAL FUNCTION
PORT C PIN
1
OUTPUT
MUX
MCELLBC[ 7:0]
MCU DATA BUS
READ MUX
P
OUTPUT
SELECT
D
DATA IN
B
ENABLE OUT
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD-INPUT
SPECIAL FUNCTION
1
CONFIGURATION
BIT
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Note: 1. ISP or battery back-up
133/176
µPSD325X DEVICES
Port D – Functionality and Structure
Port D has two I/O pins (only one pin, PD1, in the
52-pin package). See Figure 67 and Figure 68.
This port does not support Address Out Mode, and
therefore no Control Register is required. Of the
eight bits in the Port D registers, only Bits 2 and 1
are used to configure pins PD2 and PD1.
Port D can be configured to perform one or more
of the following functions:
■ MCU I/O Mode
■
■
CPLD Input – direct input to the CPLD, no Input
Macrocells (IMC)
■
Slew rate – pins can be set up for fast slew rate
Port D pins can be configured in PSDsoft Express
as input pins for other dedicated functions:
■ CLKIN (PD1) as input to the macrocells flipflops and APD counter
■
CPLD Output – External Chip Select (ECS1ECS2)
PSD Chip Select Input (CSI, PD2). Driving this
signal High disables the Flash memory, SRAM
and CSIOP.
Figure 67. Port D Structure
DATA OUT
REG.
DATA OUT
D
Q
WR
PORT D PIN
OUTPUT
MUX
ECS [ 2:1]
MCU DATA BUS
READ MUX
OUTPUT
SELECT
P
D
DATA IN
B
ENABLE PRODUCT
TERM (.OE)
DIR REG.
D
WR
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Q
CPLD - INPUT
AI06606
µPSD325X DEVICES
External Chip Select
The CPLD also provides two External Chip Select
(ECS1-ECS2) outputs on Port D pins that can be
used to select external devices. Each External
Chip Select (ECS1-ECS2) consists of one product
term that can be configured active High or Low.
The output enable of the pin is controlled by either
the output enable product term or the Direction
Register. (See Figure 68.)
Figure 68. Port D External Chip Select Signals
ENABLE (.OE)
PD1 PIN
ECS1
POLARITY
BIT
CPLD AND ARRAY
PLD INPUT BUS
PT1
DIRECTION
REGISTER
ENABLE (.OE)
PT2
DIRECTION
REGISTER
ECS2
POLARITY
BIT
PD2 PIN
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µPSD325X DEVICES
POWER MANAGEMENT
All PSD MODULE offers configurable power saving options. These options may be used individually or in combinations, as follows:
■ The primary and secondary Flash memory, and
SRAM blocks are built with power management
technology. In addition to using special silicon
design methodology, power management
technology puts the memories into Standby
Mode when address/data inputs are not
changing (zero DC current). As soon as a
transition occurs on an input, the affected
memory “wakes up,” changes and latches its
outputs, then goes back to standby. The
designer does not have to do anything special to
achieve Memory Standby Mode when no inputs
are changing—it happens automatically.
The PLD sections can also achieve Standby
Mode when its inputs are not changing, as described in the sections on the Power Management Mode Registers (PMMR).
■ As with the Power Management Mode, the
Automatic Power Down (APD) block allows the
PSD MODULE to reduce to stand-by current
automatically. The APD Unit can also block
MCU address/data signals from reaching the
memories and PLDs. The APD Unit is described
in more detail in the sections entitled “The PSD
MODULE has a Turbo Bit in PMMR0. This bit
can be set to turn the Turbo Mode off (the
default is with Turbo Mode turned on). While
Turbo Mode is off, the PLDs can achieve
standby current when no PLD inputs are
changing (zero DC current). Even when inputs
do change, significant power can be saved at
lower frequencies (AC current), compared to
when Turbo Mode is on. When the Turbo Mode
is on, there is a significant DC current
■
■
component and the AC component is higher...,”
page 137.
Built in logic monitors the Address Strobe of the
MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD Unit
initiates Power-down Mode (if enabled). Once in
Power-down Mode, all address/data signals are
blocked from reaching memory and PLDs, and
the memories are deselected internally. This allows the memory and PLDs to remain in
Standby Mode even if the address/data signals
are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that
any unblocked PLD input signals that are
changing states keeps the PLD out of Stand-by
Mode, but not the memories.
PSD Chip Select Input (CSI, PD2) can be used
to disable the internal memories, placing them
in Standby Mode even if inputs are changing.
This feature does not block any internal signals
or disable the PLDs. This is a good alternative
to using the APD Unit. There is a slight penalty
in memory access time when PSD Chip Select
Input (CSI, PD2) makes its initial transition from
deselected to selected.
The PMMRs can be written by the MCU at runtime to manage power. The PSD MODULE
supports “blocking bits” in these registers that
are set to block designated signals from
reaching both PLDs. Current consumption of
the PLDs is directly related to the composite
frequency of the changes on their inputs (see
Figure 72 and Figure 73). Significant power
savings can be achieved by blocking signals
that are not used in DPLD or CPLD logic
equations.
Figure 69. APD Unit
APD EN
PMMR0 BIT 1=1
TRANSITION
DETECTION
DISABLE BUS
INTERFACE
ALE
CLR
FLASH SELECT
EDGE
DETECT
CLKIN
PD
PLD
SRAM SELECT
POWER DOWN
(PDN) SELECT
DISABLE
FLASH/SRAM
136/176
CSIOP SELECT
APD
COUNTER
RESET
CSI
PD
AI06608
µPSD325X DEVICES
The PSD MODULE has a Turbo Bit in PMMR0.
This bit can be set to turn the Turbo Mode off (the
default is with Turbo Mode turned on). While Turbo
Mode is off, the PLDs can achieve standby current
when no PLD inputs are changing (zero DC current). Even when inputs do change, significant
power can be saved at lower frequencies (AC current), compared to when Turbo Mode is on. When
the Turbo Mode is on, there is a significant DC current component and the AC component is higher.
Automatic Power-down (APD) Unit and Powerdown Mode. The APD Unit, shown in Figure 69,
puts the PSD MODULE into Power-down Mode by
monitoring the activity of Address Strobe (ALE). If
the APD Unit is enabled, as soon as activity on Address Strobe (ALE) stops, a four-bit counter starts
counting. If Address Strobe (ALE/AS, PD0) remains inactive for fifteen clock periods of CLKIN
(PD1), Power-down (PDN) goes High, and the
PSD MODULE enters Power-down Mode, as discussed next.
Power-down Mode. By default, if you enable the
APD Unit, Power-down Mode is automatically enabled. The device enters Power-down Mode if Address Strobe (ALE) remains inactive for fifteen
periods of CLKIN (PD1).
The following should be kept in mind when the
PSD MODULE is in Power-down Mode:
■ If Address Strobe (ALE) starts pulsing again, the
PSD MODULE returns to normal Operating
mode. The PSD MODULE also returns to
normal Operating mode if either PSD Chip
Select Input (CSI, PD2) is Low or the RESET
input is High.
■ The MCU address/data bus is blocked from all
memory and PLDs.
■ Various signals can be blocked (prior to Powerdown Mode) from entering the PLDs by setting
the appropriate bits in the PMMR registers. The
blocked signals include MCU control signals
and the common CLKIN (PD1).
Note: Blocking CLKIN (PD1) from the PLDs
does not block CLKIN (PD1) from the APD Unit.
■ All memories enter Standby Mode and are
drawing standby current. However, the PLD and
I/O ports blocks do not go into Standby Mode
because you don’t want to have to wait for the
logic and I/O to “wake-up” before their outputs
can change. See Table 101 for Power-down
Mode effects on PSD MODULE ports.
■ Typical standby current is of the order of
microamperes. These standby current values
assume that there are no transitions on any PLD
input.
Other Power Saving Options. The PSD MODULE offers other reduced power saving options
that are independent of the Power-down Mode.
Except for the SRAM Stand-by and PSD Chip Select Input (CSI, PD2) features, they are enabled by
setting bits in PMMR0 and PMMR2.
Figure 70. Enable Power-down Flow Chart
RESET
Enable APD
Set PMMR0 Bit 1 = 1
OPTIONAL
Disable desired inputs to PLD
by setting PMMR0 bits 4 and 5
and PMMR2 bits 2 through 6.
ALE idle
for 15 CLKIN
clocks?
No
Yes
PSD Module in Power
Down Mode
AI06609
Table 101. Power-down Mode’s Effect on Ports
Port Function
Pin Level
MCU I/O
No Change
PLD Out
No Change
Address Out
Undefined
Peripheral I/O
Tri-State
137/176
µPSD325X DEVICES
PLD Power Management
The power and speed of the PLDs are controlled
by the Turbo Bit (Bit 3) in PMMR0. By setting the
bit to ’1,’ the Turbo Mode is off and the PLDs consume the specified stand-by current when the inputs are not switching for an extended time of
70ns. The propagation delay time is increased by
10ns (for a 5V device) after the Turbo Bit is set to
’1’ (turned off) when the inputs change at a composite frequency of less than 15MHz. When the
Turbo Bit is reset to ’0’ (turned on), the PLDs run
at full power and speed. The Turbo Bit affects the
PLD’s DC power, AC power, and propagation delay. When the Turbo Mode is off, the µPSD325X
devices’ input clock frequency is reduced by 5MHz
from the maximum rated clock frequency.
Blocking MCU control signals with the bits of
PMMR2 can further reduce PLD AC power consumption.
SRAM Standby Mode (Battery Backup). The
SRAM in the PSD MODULE supports a battery
backup mode in which the contents are retained in
the event of a power loss. The SRAM has Voltage
Stand-by (VSTBY, PC2) that can be connected to
an external battery. When VCC becomes lower
than V STBY then the SRAM automatically connects to Voltage Stand-by (V STBY, PC2) as a power source. The SRAM Standby Current (ISTBY) is
typically 0.5 µA. The SRAM data retention voltage
is 2V minimum. The Battery-on Indicator
(VBATON) can be routed to PC4. This signal indicates when the V CC has dropped below VSTBY.
PSD Chip Select Input (CSI, PD2)
PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low,
the signal selects and enables the PSD MODULE
Flash memory, SRAM, and I/O blocks for READ or
WRITE operations. A High on PSD Chip Select Input (CSI, PD2) disables the Flash memory, and
SRAM, and reduces power consumption. However, the PLD and I/O signals remain operational
when PSD Chip Select Input (CSI, PD2) is High.
Input Clock
CLKIN (PD1) can be turned off, to the PLD to save
AC power consumption. CLKIN (PD1) is an input
to the PLD AND Array and the Output Macrocells
(OMC).
During Power-down Mode, or, if CLKIN (PD1) is
not being used as part of the PLD logic equation,
the clock should be disabled to save AC power.
CLKIN (PD1) is disconnected from the PLD AND
Array or the Macrocells block by setting Bits 4 or 5
to a '1' in PMMR0.
Input Control Signals
The PSD MODULE provides the option to turn off
the MCU signals (WR, RD, PSEN, and Address
Strobe (ALE)) to the PLD to save AC power consumption. These control signals are inputs to the
PLD AND Array. During Power-down Mode, or, if
any of them are not being used as part of the PLD
logic equation, these control signals should be disabled to save AC power. They are disconnected
from the PLD AND Array by setting Bits 2, 3, 4, 5,
and 6 to a '1' in PMMR2.
Table 102. Power Management Mode Registers PMMR01
Bit 0
X
Bit 1
APD Enable
0
Not used, and should be set to zero.
0 = off Automatic Power-down (APD) is disabled.
1 = on Automatic Power-down (APD) is enabled.
Bit 2
X
Bit 3
PLD Turbo
0
Not used, and should be set to zero.
0 = on PLD Turbo Mode is on
Bit 4
1 = off
PLD Turbo Mode is off, saving power.
µPSD325X devices operate at 5MHz below the maximum rated clock frequency
0 = on
CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN
(PD1) Powers-up the PLD when Turbo Bit is '0.'
PLD Array clk
1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power.
0 = on CLKIN (PD1) input to the PLD macrocells is connected.
Bit 5
PLD MCell clk
1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power.
Bit 6
X
0
Not used, and should be set to zero.
Bit 7
X
0
Not used, and should be set to zero.
138/176
µPSD325X DEVICES
Table 103. Power Management Mode Registers PMMR21
Bit 0
X
0
Not used, and should be set to zero.
Bit 1
X
0
Not used, and should be set to zero.
PLD Array
WR
0 = on WR input to the PLD AND Array is connected.
Bit 2
PLD Array
RD
0 = on RD input to the PLD AND Array is connected.
PLD Array
PSEN
0 = on PSEN input to the PLD AND Array is connected.
PLD Array
ALE
0 = on ALE input to the PLD AND Array is connected.
Bit 6
X
0
Not used, and should be set to zero.
Bit 7
X
0
Not used, and should be set to zero.
Bit 3
Bit 4
Bit 5
1 = off WR input to PLD AND Array is disconnected, saving power.
1 = off RD input to PLD AND Array is disconnected, saving power.
1 = off PSEN input to PLD AND Array is disconnected, saving power.
1 = off ALE input to PLD AND Array is disconnected, saving power.
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent RESET pulses do not clear the registers.
Table 104. APD Counter Operation
APD Enable Bit
ALE Level
APD Counter
0
X
Not Counting
1
Pulsing
Not Counting
1
0 or 1
Counting (Generates PDN after 15 Clocks)
139/176
µPSD325X DEVICES
RESET TIMING AND DEVICE STATUS AT RESET
Upon Power-up, the PSD MODULE requires a Reset (RESET) pulse of duration tNLNH-PO after V CC
is steady. During this period, the device loads internal configurations, clears some of the registers
and sets the Flash memory into operating mode.
After the rising edge of Reset (RESET), the PSD
MODULE remains in the Reset Mode for an additional period, tOPR, before the first memory access
is allowed.
The Flash memory is reset to the READ Mode
upon Power-up. Sector Select (FS0-FS7 and
CSBOOT0-CSBOOT3) must all be Low, WRITE
Strobe (WR, CNTL0) High, during Power-on
RESET for maximum security of the data contents
and to remove the possibility of a byte being written on the first edge of WRITE Strobe (WR). Any
Flash memory WRITE cycle initiation is prevented
automatically when V CC is below VLKO .
Warm RESET
Once the device is up and running, the PSD MODULE can be reset with a pulse of a much shorter
duration, tNLNH. The same tOPR period is needed
before the device is operational after a Warm
RESET. Figure 71 shows the timing of the Powerup and Warm RESET.
I/O Pin, Register and PLD Status at RESET
Table 105 shows the I/O pin, register and PLD status during Power-on RESET, Warm RESET, and
Power-down Mode. PLD outputs are always valid
during Warm RESET, and they are valid in Poweron RESET once the internal Configuration bits are
loaded. This loading is completed typically long
before the VCC ramps up to operating level. Once
the PLD is active, the state of the outputs are determined by the PLD equations.
Reset of Flash Memory Erase and Program
Cycles
A Reset (RESET) also resets the internal Flash
memory state machine. During a Flash memory
Program or Erase cycle, Reset (RESET) terminates the cycle and returns the Flash memory to
the READ Mode within a period of tNLNH-A.
Figure 71. Reset (RESET) Timing
VCC
VCC(min)
tNLNH-PO
Power-On Reset
tOPR
tNLNH
tNLNH-A
tOPR
Warm Reset
RESET
AI02866b
140/176
µPSD325X DEVICES
Table 105. Status During Power-on RESET, Warm RESET and Power-down Mode
Port Configuration
Power-On RESET
Warm RESET
Power-down Mode
MCU I/O
Input mode
Input mode
Unchanged
PLD Output
Valid after internal PSD
configuration bits are
loaded
Valid
Depends on inputs to PLD
(addresses are blocked in
PD Mode)
Address Out
Tri-stated
Tri-stated
Not defined
Peripheral I/O
Tri-stated
Tri-stated
Tri-stated
Register
Power-On RESET
Warm RESET
Power-down Mode
PMMR0 and PMMR2
Cleared to ’0’
Unchanged
Unchanged
Macrocells flip-flop status
Cleared to ’0’ by internal
Power-on RESET
Depends on .re and .pr
equations
Depends on .re and .pr
equations
VM Register1
Initialized, based on the
selection in PSDsoft
Configuration menu
Initialized, based on the
selection in PSDsoft
Configuration menu
Unchanged
All other registers
Cleared to ’0’
Cleared to ’0’
Unchanged
Note: 1. The SR_cod and PeriphMode Bits in the VM Register are always cleared to ’0’ on Power-on RESET or Warm RESET.
141/176
µPSD325X DEVICES
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE
The JTAG Serial Interface pins (TMS, TCK, TDI,
JTAG Extensions
TDO) are dedicated pins on Port C (see Table
TSTAT and TERR are two JTAG extension signals
106). All memory blocks (primary and secondary
enabled by an “ISC_ENABLE” command received
Flash memory), PLD logic, and PSD MODULE
over the four standard JTAG signals (TMS, TCK,
Configuration Register Bits may be programmed
TDI, and TDO). They are used to speed Program
through the JTAG Serial Interface block. A blank
and Erase cycles by indicating status on µPDS
device can be mounted on a printed circuit board
signals instead of having to scan the status out seand programmed using JTAG.
rially using the standard JTAG channel. See Application Note AN1153.
The standard JTAG signals (IEEE 1149.1) are
TMS, TCK, TDI, and TDO. Two additional signals,
TERR indicates if an error has occurred when
TSTAT and TERR, are optional JTAG extensions
erasing a sector or programming a byte in Flash
used to speed up Program and Erase cycles.
memory. This signal goes Low (active) when an
By default, on a blank device (as shipped from the
Error condition occurs, and stays Low until an
factory or after erasure), four pins on Port C are
“ISC_CLEAR” command is executed or a chip Rethe basic JTAG signals TMS, TCK, TDI, and TDO.
set (RESET) pulse is received after an
“ISC_DISABLE” command.
Standard JTAG Signals
TSTAT behaves the same as Ready/Busy deAt power-up, the standard JTAG pins are inputs,
scribed in the section entitled “Ready/Busy (PC3),”
waiting for a JTAG serial command from an exterpage 107. TSTAT is High when the PSD MODULE
nal JTAG controller device (such as FlashLINK or
device is in READ Mode (primary and secondary
Automated Test Equipment). When the enabling
Flash memory contents can be read). TSTAT is
command is received, TDO becomes an output
Low
when Flash memory Program or Erase cycles
and the JTAG channel is fully functional. The
are in progress, and also when data is being writsame command that enables the JTAG channel
ten to the secondary Flash memory.
may optionally enable the two additional JTAG sigTSTAT and TERR can be configured as opennals, TSTAT and TERR.
drain type signals during an “ISC_ENABLE” comThe RESET input to the µPS3200 should be active
mand.
during JTAG programming. The active RESET
Security and Flash memory Protection
puts the MCU module into RESET Mode while the
PSD Module is being programmed. See ApplicaWhen the Security Bit is set, the device cannot be
tion Note AN1153 for more details on JTAG Inread on a Device Programmer or through the
System Programming (ISP).
JTAG Port. When using the JTAG Port, only a Full
Chip Erase command is allowed.
The µPSD325X devices supports JTAG In-System-Configuration (ISC) commands, but not
All other Program, Erase and Verify commands
Boundary Scan. The PSDsoft Express software
are blocked. Full Chip Erase returns the part to a
tool and FlashLINK JTAG programming cable imnon-secured blank state. The Security Bit can be
plement the JTAG In-System-Configuration (ISC)
set in PSDsoft Express Configuration.
commands. A definition of these JTAG In-SystemAll primary and secondary Flash memory sectors
Configuration (ISC) commands and sequences is
can individually be sector protected against eradefined in a supplemental document available
sures. The sector protect bits can be set in PSDfrom ST. This document is needed only as a refersoft Express Configuration.
ence for designers who use a FlashLINK to program the µPSD325X devices.
INITIAL DELIVERY STATE
When delivered from ST, the µPSD325X devices
Table 106. JTAG Port Signals
have all bits in the memory and PLDs set to '1.'
Port C Pin
JTAG Signals
Description
The code, configuration, and PLD logic are loaded
using the programming procedure. Information for
PC0
TMS
Mode Select
programming the device is available directly from
PC1
TCK
Clock
ST. Please contact your local sales representative.
Status (optional)
PC3
TSTAT
PC4
TERR
Error Flag (optional)
PC5
TDI
Serial Data In
PC6
TDO
Serial Data Out
142/176
µPSD325X DEVICES
AC/DC PARAMETERS
These tables describe the AD and DC parameters
of the µPSD325X devices:
➜ DC Electrical Specification
➜ AC Timing Specification
■ PLD Timing
– Power-down and RESET Timing
The following are issues concerning the parameters presented:
■ In the DC specification the supply current is
given for different modes of operation.
– Combinatorial Timing
■
The AC power component gives the PLD, Flash
memory, and SRAM mA/MHz specification.
Figure 72 and Figure 73 show the PLD mA/MHz
as a function of the number of Product Terms
(PT) used.
■
In the PLD timing parameters, add the required
delay when Turbo Bit is '0.'
– Synchronous Clock Mode
– Asynchronous Clock Mode
– Input Macrocell Timing
■
MCU Module Timing
– READ Timing
– WRITE Timing
Figure 72. PLD ICC /Frequency Consumption (5V range)
110
VCC = 5V
100
90
80
70
FF
)
ON
RBO
O
60
O
TU
RB
50
(25%
TU
ICC – (mA)
%)
(100
ON
BO
TUR
40
30
F
20
O
RB
OF
PT 100%
PT 25%
TU
10
0
0
5
10
15
20
25
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
AI02894
Figure 73. PLD ICC /Frequency Consumption (3V range)
60
VCC = 3V
B
TUR
40
O
FF
30
TU
RB
O
ICC – (mA)
)
100%
N(
O O
50
20
O
TURB
10
PT 100%
PT 25%
F
O
RB
TU
5%)
ON (2
OF
0
0
5
10
15
20
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
25
AI03100
143/176
µPSD325X DEVICES
Table 107. PSD MODULE Example, Typ. Power Calculation at VCC = 5.0V (Turbo Mode Off)
Conditions
MCU Clock Frequency
= 12MHz
Highest Composite PLD input frequency
(Freq PLD)
MCU ALE frequency (Freq ALE)
= 8MHz
= 2MHz
% Flash memory
Access
= 80%
% SRAM access
= 15%
% I/O access
= 5% (no additional power above base)
Operational Modes
% Normal
= 40%
% Power-down Mode
= 60%
Number of product terms used
(from fitter report)
= 45 PT
% of total product terms
= 45/182 = 24.7%
Turbo Mode
= Off
Calculation (using typical values)
ICC total
= ICC(MCUactive) x %MCUactive + ICC(PSDactive) x %PSDactive + IPD(pwrdown) x %pwrdown
ICC(MCUactive)
= 20mA
IPD(pwrdown)
= 250µA
ICC(PSDactive)
= ICC(ac) + ICC(dc)
= %flash x 2.5 mA/MHz x Freq ALE
+ %SRAM x 1.5 mA/MHz x Freq ALE
+ % PLD x (from graph using Freq PLD)
= 0.8 x 2.5 mA/MHz x 2MHz + 0.15 x 1.5 mA/MHz x 2MHz + 24 mA
= (4 + 0.45 + 24) mA
= 28.45mA
ICC total
= 20mA x 40% + 28.45mA x 40% + 250µA x 60%
= 8mA + 11.38mA + 150µA
= 19.53mA
This is the operating power with no Flash memory Erase or Program cycles in progress. Calculation is based on all I/
O pins being disconnected and IOUT = 0 mA.
144/176
µPSD325X DEVICES
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 108. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering (20 seconds max.)1
Min.
Max.
Unit
–65
125
°C
235
°C
VIO
Input and Output Voltage (Q = VOH or Hi-Z)
–0.5
6.5
V
VCC
Supply Voltage
–0.5
6.5
V
VPP
Device Programmer Supply Voltage
–0.5
14.0
V
VESD
Electrostatic Discharge Voltage (Human Body Model) 2
–2000
2000
V
Note: 1. IPC/JEDEC J-STD-020A
2. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 Ω, R2=500 Ω)
145/176
µPSD325X DEVICES
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 109. Operating Conditions (5V Devices)
Symbol
VCC
Parameter
Min.
Max.
Unit
Supply Voltage
4.5
5.5
V
Ambient Operating Temperature (industrial)
–40
85
°C
0
70
°C
Min.
Max.
Unit
Supply Voltage
3.0
3.6
V
Ambient Operating Temperature (industrial)
–40
85
°C
0
70
°C
TA
Ambient Operating Temperature (commercial)
Table 110. Operating Conditions (3V Devices)
Symbol
VCC
Parameter
TA
Ambient Operating Temperature (commercial)
146/176
µPSD325X DEVICES
Table 111. AC Symbols for Timing
Signal Letters
Signal Behavior
A
Address
t
Time
C
Clock
L
Logic Level Low or ALE
D
Input Data
H
Logic Level High
I
Instruction
V
Valid
L
ALE
X
No Longer a Valid Logic Level
N
RESET Input or Output
Z
Float
P
PSEN signal
Q
Output Data
R
RD signal
W
WR signal
B
VSTBY Output
M
Output Macrocell
PW
Pulse Width
Example: t AVLX – Time from Address Valid to ALE
Invalid.
Figure 74. Switching Waveforms – Key
WAVEFORMS
INPUTS
OUTPUTS
STEADY INPUT
STEADY OUTPUT
MAY CHANGE FROM
HI TO LO
WILL BE CHANGING
FROM HI TO LO
MAY CHANGE FROM
LO TO HI
WILL BE CHANGING
LO TO HI
DON'T CARE
CHANGING, STATE
UNKNOWN
OUTPUTS ONLY
CENTER LINE IS
TRI-STATE
AI03102
147/176
µPSD325X DEVICES
Table 112. DC Characteristics (5V Devices)
Symbol
Parameter
Test Condition
(in addition to those in
Table 109, page 146)
Min.
VIH
Input High Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
4.5V < VCC < 5.5V
VIH1
Input High Voltage (Ports A, B,
C, D, 4[Bit 2], USB+, USB–)
VIL
VIL1
VOL
Max.
Unit
0.7VCC
VCC + 0.5
V
4.5V < VCC < 5.5V
2.0
VCC + 0.5
V
Input Low Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
4.5V < VCC < 5.5V
VSS– 0.5
0.3VCC
V
Input Low Voltage
(Ports A, B, C, D, 4[Bit 2])
4.5V < VCC < 5.5V
–0.5
0.8
V
Input High Voltage
(USB+, USB–)
4.5V < VCC < 5.5V
VSS– 0.5
0.8
V
Output Low Voltage
(Ports A,B,C,D)
Typ.
IOL = 20µA
VCC = 4.5V
0.01
0.1
V
IOL = 8mA
VCC = 4.5V
0.25
0.45
V
VOL1
Output Low Voltage
(Ports 1,2,3,4, WR, RD)
IOL = 1.6mA
0.45
V
VOL2
Output Low Voltage
(Port 0, ALE, PSEN)
IOL = 3.2mA
0.45
V
IOH = –20µA
VCC = 4.5V
4.4
4.49
V
IOH = –2mA
VCC = 4.5V
2.4
3.9
V
Output High Voltage
(Ports 1,2,3,4, WR, RD)
IOH = –80µA
2.4
V
IOH = –10µA
4.05
V
Output High Voltage (Port 0 in
ext. Bus Mode, ALE, PSEN))4
IOH = –800µA
2.4
V
IOH = –80µA
4.05
V
VOH3
Output High Voltage VSTBYON
IOH = –1µA
VSTBY – 0.8
V
VLVR
Low Voltage RESET
0.1V hysteresis
3.75
VOP
XTAL Open Bias Voltage
(XTAL1, XTAL2)
IOL = 3.2mA
VLKO
VSTBY
VOH
VOH1
VOH2
VDF
Output High Voltage
(Ports A,B,C,D)
4.25
V
2.0
3.0
V
VCC(min) for Flash Erase and
Program
2.5
4.2
V
SRAM (PSD) Stand-by Voltage
2.0
VCC–0.2
V
SRAM (PSD) Data Retention
Voltage
IIL
Logic '0' Input Current
(Ports 1,2,3,4)
ITL
Logic 1-to-0 Transition Current
(Ports 1,2,3,4)
148/176
4.0
Only on VSTBY
2
VIN = 0.45V
(0V for Port 4[pin 2])
–10
–50
µA
VIN = 3.5V
(2.5V for Port 4[pin 2])
–65
–650
µA
V
µPSD325X DEVICES
Symbol
Parameter
Test Condition
(in addition to those in
Table 109, page 146)
ISTBY
SRAM (PSD) Stand-by Current
(VSTBY input)
VCC = 0V
IIDLE
SRAM (PSD) Idle Current
(VSTBY input)
VCC > VSTBY
IRST
Reset Pin Pull-up Current
(RESET)
IFR
XTAL Feedback Resistor
Current (XTAL1)
ILI
Input Leakage Current
ILO
Output Leakage Current
IPD
1
Power-down Mode
Typ.
Max.
Unit
0.5
1
µA
–0.1
0.1
µA
VIN = VSS
–10
–55
µA
XTAL1 = VCC
XTAL2 = VSS
–20
–50
µA
VSS < VIN < VCC
–1
1
µA
0.45 < VOUT < VCC
–10
10
µA
VCC = 5.5V
LVD logic disabled
250
µA
LVD logic enabled
380
µA
20
30
mA
8
10
mA
30
38
mA
15
20
mA
40
62
mA
20
30
mA
Active (12MHz)
VCC = 5V
Idle (12MHz)
ICC_CPU 2,3,6
Active (24MHz)
VCC = 5V
Idle (24MHz)
Active (40MHz)
VCC = 5V
Idle (40MHz)
PLD Only
ICC_PSD
(DC)6
Operating
Supply Current
Flash
memory
SRAM
PLD AC Base
ICC_PSD
(AC)6
Min.
PLD_TURBO = Off,
f = 0MHz 7
0
PLD_TURBO = On,
f = 0MHz
400
700
µA/PT
During Flash memory
WRITE/Erase Only
15
30
mA
Read-only, f = 0MHz
0
0
mA
f = 0MHz
0
0
mA
µA/PT5
note 5
Flash memory AC Adder
2.5
3.5
mA/
MHz
SRAM AC Adder
1.5
3.0
mA/
MHz
Note: 1. IPD (Power-down Mode) is measured with:
XTAL1=V SS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo Mode.
2. ICC_CPU (active mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS +0.5V, VIH = Vcc – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all
other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA).
3. ICC_CPU (Idle Mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = V CC– 0.5V, XTAL2 = not connected; Port 0 = VCC;
RESET=VCC; all other pins are disconnected.
4. PLD is in non-Turbo Mode and none of the inputs are switching.
5. See Figure 72 for the PLD current calculation.
6. I/O current = 0 mA, all I/O pins are disconnected.
149/176
µPSD325X DEVICES
Table 113. DC Characteristics (3V Devices)
Symbol
Parameter
Test Condition
(in addition to those in
Table 110, page 146)
Min.
VIH
Input High Voltage (Ports 1, 2, 3,
4[Bits 7,6,5,4,3,1,0], A, B, C, D,
XTAL1, RESET)
3.0V < VCC < 3.6V
VIH1
Input High Voltage (Port 4[Bit 2])
VIL
VIL1
VOL
VOL1
VOL2
Max.
Unit
0.7VCC
VCC + 0.5
V
3.0V < VCC < 3.6V
2.0
VCC + 0.5
V
Input High Voltage (Ports 1, 2, 3,
4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
3.0V < VCC < 3.6V
VSS– 0.5
0.3VCC
V
Input Low Voltage
(Ports A, B, C, D)
3.0V < VCC < 3.6V
–0.5
0.8
V
Input Low Voltage
(Port 4[Bit 2])
3.0V < VCC < 3.6V
VSS– 0.5
0.8
V
Output Low Voltage
(Ports A,B,C,D)
Output Low Voltage
(Ports 1,2,3,4, WR, RD)
Output Low Voltage
(Port 0, ALE, PSEN)
Typ.
IOL = 20µA
VCC = 3.0V
0.01
0.1
V
IOL = 4mA
VCC = 3.0V
0.15
0.45
V
IOL = 1.6mA
0.45
V
IOL = 100µA
0.3
V
IOL = 3.2mA
0.45
V
IOL = 200µA
0.3
V
IOH = –20µA
VCC = 3.0V
2.9
2.99
V
IOH = –1mA
VCC = 3.0V
2.4
2.6
V
IOH = –20µA
2.0
V
IOH = –10µA
2.7
V
Output High Voltage (Port 0 in
ext. Bus Mode, ALE, PSEN))4
IOH = –800µA
2.0
V
IOH = –80µA
2.7
V
VOH3
Output High Voltage VSTBYON
IOH = –1µA
VSTBY – 0.8
V
VLVR
Low Voltage Reset
0.1V hysteresis
2.3
VOP
XTAL Open Bias Voltage
(XTAL1, XTAL2)
IOL = 3.2mA
VLKO
VSTBY
VOH
VOH1
VOH2
VDF
IIL
150/176
Output High Voltage
(Ports A,B,C,D)
Output High Voltage
(Ports 1,2,3,4, WR, RD)
2.7
V
1.0
2.0
V
VCC(min) for Flash Erase and
Program
1.5
2.2
V
SRAM (PSD) Stand-by Voltage
2.0
VCC–0.2
V
SRAM (PSD) Data Retention
Voltage
Logic '0' Input Current
(Ports 1,2,3,4)
Only on VSTBY
2
VIN = 0.45V
(0V for Port 4[pin 2])
–1
2.5
V
–50
µA
µPSD325X DEVICES
Symbol
Parameter
Test Condition
(in addition to those in
Table 110, page 146)
Min.
–25
Typ.
Max.
Unit
–250
µA
1
µA
ITL
Logic 1-to-0 Transition Current
(Ports 1,2,3,4)
VIN = 3.5V
(2.5V for Port 4[pin 2])
ISTBY
SRAM (PSD) Stand-by Current
(VSTBY input)
VCC = 0V
IIDLE
SRAM (PSD) Idle Current
(VSTBY input)
VCC > VSTBY
–0.1
0.1
µA
IRST
Reset Pin Pull-up Current
(RESET)
VIN = VSS
–10
–55
µA
IFR
XTAL Feedback Resistor
Current (XTAL1)
XTAL1 = VCC
XTAL2 = VSS
–20
–50
µA
VSS < VIN < VCC
–1
1
µA
0.45 < VOUT < VCC
–10
10
µA
VCC = 3.6V
LVD logic disabled
110
µA
LVD logic enabled
180
µA
8
10
mA
4
5
mA
15
20
mA
8
10
mA
ILI
Input Leakage Current
ILO
Output Leakage Current
IPD
1
Power-down Mode
Active (12MHz)
ICC_CPU 2,3,6
VCC = 3.6V
Idle (12MHz)
Active (24MHz)
VCC = 3.6V
Idle (24MHz)
PLD Only
ICC_PSD
(DC)6
Operating
Supply Current
Flash
memory
SRAM
PLD AC Base
ICC_PSD
(AC)
0.5
PLD_TURBO = Off,
f = 0MHz 7
0
PLD_TURBO = On,
f = 0MHz
200
400
µA/
PT
During Flash memory
WRITE/Erase Only
10
25
mA
Read-only, f = 0MHz
0
0
mA
f = 0MHz
0
0
mA
µA/
PT5
note 5
Flash memory AC Adder
1.5
2.0
mA/
MHz
SRAM AC Adder
0.8
1.5
mA/
MHz
6
Note: 1. IPD (Power-down Mode) is measured with:
XTAL1=V SS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo mode.
2. ICC_CPU (active mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS +0.5V, VIH = Vcc – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all
other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA).
3. ICC_CPU (Idle Mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = V CC– 0.5V, XTAL2 = not connected; Port 0 = VCC;
RESET=VCC; all other pins are disconnected.
4. PLD is in non-Turbo Mode and none of the inputs are switching.
5. See Figure 72 for the PLD current calculation.
6. I/O current = 0 mA, all I/O pins are disconnected.
151/176
µPSD325X DEVICES
Figure 75. External Program Memory READ Cycle
tLLPL
tLHLL
ALE
tAVLL
tPLPH
tLLIV
tPLIV
PSEN
tPXAV
tLLAX
tPXIZ
tAZPL
PORT 0
INSTR
IN
A0-A7
tAVIV
A0-A7
tPXIX
A8-A11
PORT 2
A8-A11
AI06848
Table 114. External Program Memory AC Characteristics (with the 5V MCU Module)
Symbol
Parameter
1
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Unit
Max
tLHLL
ALE pulse width
35
2tCLCL – 15
ns
tAVLL
Address set-up to ALE
10
tCLCL – 15
ns
tLLAX
Address hold after ALE
10
tCLCL – 15
ns
tLLIV
ALE Low to valid instruction in
tLLPL
ALE to PSEN
10
tCLCL – 15
ns
tPLPH
PSEN pulse width
60
3tCLCL – 15
ns
tPLIV
PSEN to valid instruction in
tPXIX
Input instruction hold after PSEN
tPXIZ2
Input instruction float after PSEN
tPXAV2
Address valid after PSEN
tAVIV
Address to valid instruction in
tAZPL
Address float to PSEN
4tCLCL – 45
55
3tCLCL – 45
30
0
0
tCLCL – 5
20
–5
–5
ns
ns
5tCLCL – 55
70
ns
ns
tCLCL – 10
15
ns
ns
ns
Note: 1. Conditions (in addition to those in Table 109, VCC = 4.5 to 5.5V): V SS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for
other outputs is 80pF
2. Interfacing the µPSD325X devices to devices with float times up to 20ns is permissible. This limited bus contention does not cause
any damage to Port 0 drivers.
152/176
µPSD325X DEVICES
Table 115. External Program Memory AC Characteristics (with the 3V MCU Module)
Parameter1
Symbol
24MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 8 to 24MHz
Min
Unit
Max
tLHLL
ALE pulse width
43
2tCLCL – 40
ns
tAVLL
Address set-up to ALE
17
tCLCL – 25
ns
tLLAX
Address hold after ALE
17
tCLCL – 25
ns
tLLIV
ALE Low to valid instruction in
tLLPL
ALE to PSEN
22
tCLCL – 20
ns
tPLPH
PSEN pulse width
95
3tCLCL – 30
ns
tPLIV
PSEN to valid instruction in
tPXIX
tPXIZ
2
Input instruction hold after PSEN
Address valid after PSEN
tAVIV
Address to valid instruction in
tAZPL
Address float to PSEN
3tCLCL – 65
60
0
Input instruction float after PSEN
tPXAV2
4tCLCL – 87
80
0
tCLCL – 5
37
–10
ns
ns
5tCLCL – 60
148
ns
ns
tCLCL – 10
32
ns
–10
ns
ns
Note: 1. Conditions (in addition to those in Table 110, V CC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V
devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
2. Interfacing the µPSD325X devices to devices with float times up to 35ns is permissible. This limited bus contention does not cause
any damage to Port 0 drivers.
Table 116. External Clock Drive (with the 5V MCU Module)
Parameter1
Symbol
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Max
Unit
tRLRH
Oscillator period
25
41.7
ns
tWLWH
High time
10
tCLCL – tCLCX
ns
tLLAX2
Low time
10
tCLCL – tCLCX
ns
tRHDX
Rise time
10
ns
tRHDX
Fall time
10
ns
Note: 1. Conditions (in addition to those in Table 109, VCC = 4.5 to 5.5V): V SS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for
other outputs is 80pF
Table 117. External Clock Drive (with the 3V MCU Module)
Symbol
Parameter
1
24MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 8 to 24MHz
Unit
Min
Max
41.7
125
ns
tRLRH
Oscillator period
tWLWH
High time
12
tCLCL – tCLCX
ns
tLLAX2
Low time
12
tCLCL – tCLCX
ns
tRHDX
Rise time
12
ns
tRHDX
Fall time
12
ns
Note: 1. Conditions (in addition to those in Table 110, V CC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V
devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
153/176
µPSD325X DEVICES
Figure 76. External Data Memory READ Cycle
ALE
tLHLL
tWHLH
PSEN
tLLDV
tLLWL
tRLRH
RD
tRLDV
tAVLL
tLLAX2
tRLAZ
A0-A7 from
RI or DPL
PORT 0
tRHDZ
tRHDX
DATA IN
A0-A7 from PCL
INSTR IN
tAVWL
tAVDV
PORT 2
P2.0 to P2.3 or A8-A11 from DPH
A8-A11 from PCH
AI07088
Figure 77. External Data Memory WRITE Cycle
ALE
tLHLL
tWHLH
PSEN
tLLWL
tWLWH
WR
tQVWX
tAVLL
tLLAX
PORT 0
A0-A7 from
RI or DPL
tWHQX
tQVWH
DATA OUT
A0-A7 from PCL
INSTR IN
tAVWL
PORT 2
P2.0 to P2.3 or A8-A11 from DPH
A8-A11 from PCH
AI07089
154/176
µPSD325X DEVICES
Table 118. External Data Memory AC Characteristics (with the 5V MCU Module)
Symbol
Parameter1
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Unit
Max
tRLRH
RD pulse width
120
6tCLCL – 30
ns
tWLWH
WR pulse width
120
6tCLCL – 30
ns
tLLAX2
Address hold after ALE
10
tCLCL – 15
ns
tRHDX
RD to valid data in
tRHDX
Data hold after RD
tRHDZ
Data float after RD
38
2tCLCL – 12
ns
tLLDV
ALE to valid data in
150
8tCLCL – 50
ns
tAVDV
Address to valid data in
150
9tCLCL – 75
ns
tLLWL
ALE to WR or RD
60
tCLCL + 15
ns
tAVWL
Address valid to WR or RD
70
tWHLH
WR or RD High to ALE High
10
tQVWX
Data valid to WR transition
5
tCLCL – 20
ns
tQVWH
Data set-up before WR
125
7tCLCL – 50
ns
tWHQX
Data hold after WR
5
tCLCL – 20
ns
tRLAZ
Address float after RD
5tCLCL – 50
75
0
0
90
3tCLCL – 15
ns
4tCLCL – 30
40
0
tCLCL – 15
ns
ns
tCLCL + 15
0
ns
ns
Note: 1. Conditions (in addition to those in Table 109, VCC = 4.5 to 5.5V): V SS = 0V; CL for Port 0, ALE and PSEN output is 100pF; CL for
other outputs is 80pF
155/176
µPSD325X DEVICES
Table 119. External Data Memory AC Characteristics (with the 3V MCU Module)
Symbol
Parameter1
Variable Oscillator
1/tCLCL = 8 to 24MHz
24MHz Oscillator
Min
Max
Min
Unit
Max
tRLRH
RD pulse width
180
6tCLCL – 70
ns
tWLWH
WR pulse width
180
6tCLCL – 70
ns
tLLAX2
Address hold after ALE
56
2tCLCL – 27
ns
tRHDX
RD to valid data in
tRHDX
Data hold after RD
tRHDZ
Data float after RD
63
2tCLCL – 20
ns
tLLDV
ALE to valid data in
200
8tCLCL – 133
ns
tAVDV
Address to valid data in
220
9tCLCL – 155
ns
tLLWL
ALE to WR or RD
75
tCLCL + 50
ns
tAVWL
Address valid to WR or RD
67
tWHLH
WR or RD High to ALE High
17
tQVWX
Data valid to WR transition
5
tCLCL – 37
ns
tQVWH
Data set-up before WR
170
7tCLCL – 122
ns
tWHQX
Data hold after WR
15
tCLCL – 27
ns
tRLAZ
Address float after RD
5tCLCL – 90
118
0
0
3tCLCL – 50
175
ns
4tCLCL – 97
tCLCL – 25
67
ns
ns
tCLCL + 25
0
0
ns
ns
Note: 1. Conditions (in addition to those in Table 110, V CC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF, for 5V
devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
Table 120. A/D Analog Specification
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
AVREF
Analog Power Supply Input
Voltage Range
VSS
VCC
V
VAN
Analog Input Voltage Range
VSS – 0.3
AVREF + 0.3
V
IAVDD
Current Following between VCC
and VSS
200
µA
CAIN
Overall Accuracy
±2
l.s.b.
NNLE
Non-Linearity Error
±2
l.s.b.
NDNLE
Differential Non-Linearity Error
±2
l.s.b.
NZOE
Zero-Offset Error
±2
l.s.b.
NFSE
Full Scale Error
±2
l.s.b.
NGE
Gain Error
±2
l.s.b.
20
µs
TCONV
156/176
Conversion Time
at 8MHz clock
µPSD325X DEVICES
Figure 78. Input to Output Disable / Enable
INPUT
tER
tEA
INPUT TO
OUTPUT
ENABLE/DISABLE
AI02863
Table 121. CPLD Combinatorial Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
tPD2
CPLD Input Pin/Feedback to
CPLD Combinatorial Output
20
tEA
CPLD Input to CPLD Output
Enable
tER
PT Turbo Slew
Aloc
Off
rate1
+2
Unit
+ 10
–2
ns
21
+ 10
–2
ns
CPLD Input to CPLD Output
Disable
21
+ 10
–2
ns
tARP
CPLD Register Clear or Preset
Delay
21
+ 10
–2
ns
tARPW
CPLD Register Clear or Preset
Pulse Width
tARD
CPLD Array Delay
10
Any
macrocell
+ 10
11
ns
+2
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount
2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial
output (80-pin package only)
Table 122. CPLD Combinatorial Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
+4
tPD2
CPLD Input Pin/Feedback to
CPLD Combinatorial Output
40
tEA
CPLD Input to CPLD Output
Enable
tER
Turbo Slew
Off
rate1
Unit
+ 20
–6
ns
43
+ 20
–6
ns
CPLD Input to CPLD Output
Disable
43
+ 20
–6
ns
tARP
CPLD Register Clear or
Preset Delay
40
+ 20
–6
ns
tARPW
CPLD Register Clear or
Preset Pulse Width
tARD
CPLD Array Delay
25
Any
macrocell
+ 20
25
+4
ns
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount
2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial
output (80-pin package only)
157/176
µPSD325X DEVICES
Figure 79. Synchronous Clock Mode Timing – PLD
tCH
tCL
CLKIN
tS
tH
INPUT
tCO
REGISTERED
OUTPUT
AI02860
Table 123. CPLD Macrocell Synchronous Clock Mode Timing (5V Devices)
Symbol
Parameter
Maximum Frequency
External Feedback
fMAX
Maximum Frequency
Internal Feedback (fCNT)
Maximum Frequency
Pipelined Data
Conditions
Min
Max
PT Turbo Slew
Aloc
Off
rate1
Unit
1/(tS+tCO)
40.0
MHz
1/(tS+tCO–10)
66.6
MHz
1/(tCH+tCL)
83.3
MHz
tS
Input Setup Time
12
tH
Input Hold Time
0
ns
tCH
Clock High Time
Clock Input
6
ns
tCL
Clock Low Time
Clock Input
6
ns
tCO
Clock to Output Delay
Clock Input
13
tARD
CPLD Array Delay
Any macrocell
11
tMIN
Minimum Clock Period 2
tCH+tCL
+2
+ 10
–2
+2
12
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount.
2. CLKIN (PD1) t CLCL = tCH + tCL.
158/176
ns
ns
ns
ns
µPSD325X DEVICES
Table 124. CPLD Macrocell Synchronous Clock Mode Timing (3V Devices)
Symbol
Parameter
Maximum Frequency
External Feedback
fMAX
Maximum Frequency
Internal Feedback (fCNT)
Maximum Frequency
Pipelined Data
Conditions
Min
Max
PT
Aloc
Turbo Slew
Off
rate1
Unit
1/(tS+tCO)
22.2
MHz
1/(tS+tCO–10)
28.5
MHz
1/(tCH+tCL)
40.0
MHz
tS
Input Setup Time
20
tH
Input Hold Time
0
ns
tCH
Clock High Time
Clock Input
15
ns
tCL
Clock Low Time
Clock Input
10
ns
tCO
Clock to Output Delay
Clock Input
25
tARD
CPLD Array Delay
Any macrocell
25
tMIN
Minimum Clock Period2
tCH+tCL
+4
+ 20
ns
–6
+4
25
ns
ns
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount.
2. CLKIN (PD1) t CLCL = tCH + tCL.
159/176
µPSD325X DEVICES
Figure 80. Asynchronous RESET / Preset
tARPW
RESET/PRESET
INPUT
tARP
REGISTER
OUTPUT
AI02864
Figure 81. Asynchronous Clock Mode Timing (product term clock)
tCHA
tCLA
CLOCK
tSA
tHA
INPUT
tCOA
REGISTERED
OUTPUT
AI02859
Table 125. CPLD Macrocell Asynchronous Clock Mode Timing (5V Devices)
Symbol
fMAXA
Conditions
Maximum Frequency
External Feedback
1/(tSA+tCOA)
38.4
MHz
1/(tSA+tCOA–10)
62.5
MHz
1/(tCHA+tCLA)
71.4
MHz
Maximum Frequency
Internal Feedback (fCNTA)
Maximum Frequency
Pipelined Data
Min
Max
PT Turbo Slew
Aloc
Off
Rate
Parameter
Unit
tSA
Input Setup Time
7
tHA
Input Hold Time
8
tCHA
Clock Input High Time
9
+ 10
ns
tCLA
Clock Input Low Time
9
+ 10
ns
tCOA
Clock to Output Delay
tARDA
CPLD Array Delay
tMINA
Minimum Clock Period
160/176
+2
1/fCNTA
11
16
ns
ns
21
Any macrocell
+ 10
+ 10
+2
–2
ns
ns
ns
µPSD325X DEVICES
Table 126. CPLD Macrocell Asynchronous Clock Mode Timing (3V Devices)
Symbol
fMAXA
Conditions
Maximum Frequency
External Feedback
1/(tSA+tCOA)
21.7
MHz
1/(tSA+tCOA–10)
27.8
MHz
1/(tCHA+tCLA)
33.3
MHz
Maximum Frequency
Internal Feedback (fCNTA)
Maximum Frequency
Pipelined Data
Min
Max
PT Turbo Slew
Aloc
Off
Rate
Parameter
Unit
tSA
Input Setup Time
10
tHA
Input Hold Time
12
tCHA
Clock High Time
17
+ 20
ns
tCLA
Clock Low Time
13
+ 20
ns
tCOA
Clock to Output Delay
tARD
CPLD Array Delay
tMINA
Minimum Clock Period
+4
1/fCNTA
25
36
ns
ns
36
Any macrocell
+ 20
+ 20
+4
–6
ns
ns
ns
161/176
µPSD325X DEVICES
Figure 82. Input Macrocell Timing (product term clock)
t INH
t INL
PT CLOCK
t IS
t IH
INPUT
OUTPUT
t INO
AI03101
Table 127. Input Macrocell Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Unit
tIS
Input Setup Time
(Note 1)
0
tIH
Input Hold Time
(Note 1)
15
tINH
NIB Input High Time
(Note 1)
9
ns
tINL
NIB Input Low Time
(Note 1)
9
ns
tINO
NIB Input to Combinatorial Delay
(Note 1)
ns
+ 10
34
+2
+ 10
ns
ns
Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to t AVLX and t LXAX.
Table 128. Input Macrocell Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Unit
tIS
Input Setup Time
(Note 1)
0
tIH
Input Hold Time
(Note 1)
25
tINH
NIB Input High Time
(Note 1)
12
ns
tINL
NIB Input Low Time
(Note 1)
12
ns
tINO
NIB Input to Combinatorial Delay
(Note 1)
ns
+ 20
46
+4
+ 20
Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to t AVLX and tLXAX.
162/176
ns
ns
µPSD325X DEVICES
Table 129. Program, WRITE and Erase Times (5V Devices)
Symbol
Parameter
Min.
Flash Program
Typ.
Max.
8.5
Flash Bulk Erase1 (pre-programmed)
3
Flash Bulk Erase (not pre-programmed)
5
tWHQV3
Sector Erase (pre-programmed)
1
tWHQV2
Sector Erase (not pre-programmed)
2.2
tWHQV1
Byte Program
14
Program / Erase Cycles (per Sector)
tWHWLO
Sector Erase Time-Out
tQ7VQV
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2
Unit
s
30
s
s
30
s
s
1200
100,000
µs
cycles
100
µs
30
ns
Max.
Unit
Note: 1. Programmed to all zero before erase.
2. The polling status, DQ7, is valid t Q7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
Table 130. Program, WRITE and Erase Times (3V Devices)
Symbol
Parameter
Min.
Flash Program
Typ.
8.5
Flash Bulk Erase1 (pre-programmed)
3
Flash Bulk Erase (not pre-programmed)
5
tWHQV3
Sector Erase (pre-programmed)
1
tWHQV2
Sector Erase (not pre-programmed)
2.2
tWHQV1
Byte Program
14
Program / Erase Cycles (per Sector)
tWHWLO
Sector Erase Time-Out
tQ7VQV
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2
s
30
s
s
30
s
s
1200
100,000
µs
cycles
100
µs
30
ns
Note: 1. Programmed to all zero before erase.
2. The polling status, DQ7, is valid t Q7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
163/176
µPSD325X DEVICES
Figure 83. Peripheral I/O READ Timing
ALE
ADDRESS
A/D BUS
DATA VALID
tAVQV (PA)
tSLQV (PA)
CSI
tRLQV (PA)
tRHQZ (PA)
RD
tDVQV (PA)
DATA ON PORT A
AI06610
Table 131. Port A Peripheral Data Mode READ Timing (5V Devices)
Symbol
Parameter
tAVQV–PA
Address Valid to Data
Valid
tSLQV–PA
CSI Valid to Data Valid
tRLQV–PA
RD to Data Valid
tDVQV–PA
tRHQZ–PA
Conditions
Min
(Note 1)
(Note 2)
Max
Turbo
Off
Unit
37
+ 10
ns
27
+ 10
ns
32
ns
Data In to Data Out Valid
22
ns
RD to Data High-Z
23
ns
Note: 1. Any input used to select Port A Data Peripheral Mode.
2. Data is already stable on Port A.
Table 132. Port A Peripheral Data Mode READ Timing (3V Devices)
Symbol
Parameter
tAVQV–PA
Address Valid to Data Valid
tSLQV–PA
CSI Valid to Data Valid
tRLQV–PA
RD to Data Valid
tDVQV–PA
tRHQZ–PA
(Note 1)
(Note 2)
Min
Max
Turbo
Off
Unit
50
+ 20
ns
37
+ 20
ns
45
ns
Data In to Data Out Valid
38
ns
RD to Data High-Z
36
ns
Note: 1. Any input used to select Port A Data Peripheral Mode.
2. Data is already stable on Port A.
164/176
Conditions
µPSD325X DEVICES
Figure 84. Peripheral I/O WRITE Timing
ALE
A / D BUS
ADDRESS
DATA OUT
tWLQV
tWHQZ (PA)
(PA)
WR
tDVQV (PA)
PORT A
DATA OUT
AI06611
Table 133. Port A Peripheral Data Mode WRITE Timing (5V Devices)
Symbol
Parameter
tWLQV–PA
WR to Data Propagation Delay
tDVQV–PA
Data to Port A Data Propagation Delay
tWHQZ–PA
WR Invalid to Port A Tri-state
Conditions
Min
(Note 1)
Max
Unit
25
ns
22
ns
20
ns
Max
Unit
42
ns
38
ns
33
ns
Note: 1. Data stable on Port 0 pins to data on Port A.
Table 134. Port A Peripheral Data Mode WRITE Timing (3V Devices)
Symbol
Parameter
tWLQV–PA
WR to Data Propagation Delay
tDVQV–PA
Data to Port A Data Propagation Delay
tWHQZ–PA
WR Invalid to Port A Tri-state
Conditions
(Note 1)
Min
Note: 1. Data stable on Port 0 pins to data on Port A.
165/176
µPSD325X DEVICES
Figure 85. Reset (RESET) Timing
VCC
VCC(min)
tNLNH-PO
tNLNH
tNLNH-A
tOPR
Power-On Reset
tOPR
Warm Reset
RESET
AI02866b
Table 135. Reset (RESET) Timing (5V Devices)
Symbol
Parameter
tNLNH
RESET Active Low Time 1
tNLNH–PO
Conditions
Min
Max
Unit
150
ns
Power-on Reset Active Low Time
1
ms
tNLNH–A
Warm RESET 2
25
µs
tOPR
RESET High to Operational Device
120
ns
Max
Unit
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.
2. Warm RESET aborts Flash memory Program or Erase cycles, and puts the device in READ Mode.
Table 136. Reset (RESET) Timing (3V Devices)
Symbol
Parameter
tNLNH
RESET Active Low Time 1
tNLNH–PO
Conditions
Min
300
ns
Power-on Reset Active Low Time
1
ms
tNLNH–A
Warm RESET 2
25
µs
tOPR
RESET High to Operational Device
300
ns
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.
2. Warm RESET aborts Flash memory Program or Erase cycles, and puts the device in READ Mode.
Table 137. VSTBYON Definitions Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tBVBH
VSTBY Detection to VSTBYON Output High
(Note 1)
20
µs
tBXBL
VSTBY Off Detection to VSTBYON Output
Low
(Note 1)
20
µs
Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms.
Table 138. VSTBYON Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tBVBH
VSTBY Detection to VSTBYON Output High
(Note 1)
20
µs
tBXBL
VSTBY Off Detection to VSTBYON Output
Low
(Note 1)
20
µs
Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms.
166/176
µPSD325X DEVICES
Figure 86. ISC Timing
t ISCCH
TCK
t ISCCL
t ISCPSU
t ISCPH
TDI/TMS
t ISCPZV
t ISCPCO
ISC OUTPUTS/TDO
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
Table 139. ISC Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
Unit
20
MHz
tISCCF
Clock (TCK, PC1) Frequency (except for PLD)
(Note 1)
tISCCH
Clock (TCK, PC1) High Time (except for PLD)
(Note 1)
23
ns
tISCCL
Clock (TCK, PC1) Low Time (except for PLD)
(Note 1)
23
ns
tISCCFP
Clock (TCK, PC1) Frequency (PLD only)
(Note 2)
tISCCHP
Clock (TCK, PC1) High Time (PLD only)
(Note 2)
240
ns
tISCCLP
Clock (TCK, PC1) Low Time (PLD only)
(Note 2)
240
ns
tISCPSU
ISC Port Set Up Time
7
ns
tISCPH
ISC Port Hold Up Time
5
ns
tISCPCO
ISC Port Clock to Output
21
ns
tISCPZV
ISC Port High-Impedance to Valid Output
21
ns
tISCPVZ
ISC Port Valid Output to High-Impedance
21
ns
2
MHz
Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode.
2. For Program or Erase PLD only.
167/176
µPSD325X DEVICES
Table 140. ISC Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
Unit
12
MHz
tISCCF
Clock (TCK, PC1) Frequency (except for PLD)
(Note 1)
tISCCH
Clock (TCK, PC1) High Time (except for PLD)
(Note 1)
40
ns
tISCCL
Clock (TCK, PC1) Low Time (except for PLD)
(Note 1)
40
ns
tISCCFP
Clock (TCK, PC1) Frequency (PLD only)
(Note 2)
tISCCHP
Clock (TCK, PC1) High Time (PLD only)
(Note 2)
240
ns
tISCCLP
Clock (TCK, PC1) Low Time (PLD only)
(Note 2)
240
ns
tISCPSU
ISC Port Set Up Time
12
ns
tISCPH
ISC Port Hold Up Time
5
ns
tISCPCO
ISC Port Clock to Output
30
ns
tISCPZV
ISC Port High-Impedance to Valid Output
30
ns
tISCPVZ
ISC Port Valid Output to High-Impedance
30
ns
2
MHz
Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode.
2. For Program or Erase PLD only.
Figure 87. MCU Module AC Measurement I/O Waveform
VCC – 0.5V
0.2 VCC + 0.9V
Test Points
0.2 VCC – 0.1V
0.45V
AI06650
Note: AC inputs during testing are driven at VCC–0.5V for a logic '1,' and 0.45V for a logic '0.'
Timing measurements are made at VIH(min) for a logic '1,' and VIL(max) for a logic '0'
Figure 88. PSD MODULE AC Float I/O Waveform
VOH – 0.1V
VLOAD + 0.1V
Test Reference Points
VLOAD – 0.1V
0.2 VCC – 0.1V
VOL + 0.1V
AI06651
Note: For timing purposes, a Port pin is considered to be no longer floating when a 100mV change from load voltage occurs, and begins to
float when a 100mV change from the loaded VOH or VOL level occurs
IOL and IOH ≥ 20mA
168/176
µPSD325X DEVICES
Figure 89. External Clock Cycle
Figure 90. Recommended Oscillator Circuits
Note: C1, C2 = 30pF ± 10pF for crystals
For ceramic resonators, contact resonator manufacturer
Oscillation circuit is designed to be used either with a ceramic resonator or crystal oscillator. Since each crystal and ceramic resonator
have their own characteristics, the user should consult the crystal manufacturer for appropriate values of external components.
Figure 91. PSD MODULE AC Measurement I/O
Waveform
Figure 92. PSD MODULE AC Measurement
Load Circuit
2.01 V
195 Ω
3.0V
Test Point
1.5V
Device
Under Test
0V
CL = 30 pF
(Including Scope and
Jig Capacitance)
AI03103b
AI03104b
Table 141. Capacitance
Symbol
Parameter
Test Condition
Typ.2
Max.
Unit
CIN
Input Capacitance (for input pins)
VIN = 0V
4
6
pF
VOUT = 0V
8
12
COUT
Output Capacitance (for input/
output pins)
pF
Note: 1. Sampled only, not 100% tested.
2. Typical values are for T A = 25°C and nominal supply voltages.
169/176
µPSD325X DEVICES
PACKAGE MECHANICAL INFORMATION
Figure 93. TQFP52 – 52-lead Plastic Quad Flatpack Package Outline
D
D1
D2
A2
e
E2 E1 E
Ne
b
N
1
A
Nd
CP
L1
c
QFP-A
Note: Drawing is not to scale.
170/176
A1
α
L
µPSD325X DEVICES
Table 142. TQFP52 – 52-lead Plastic Quad Flatpack Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A
–
–
1.75
–
–
0.069
A1
–
0.05
0.020
–
0.002
0.008
A2
–
1.25
1.55
–
0.049
0.061
b
–
0.02
0.04
–
0.007
0.016
c
–
0.07
0.23
–
0.002
0.009
D
12.00
–
–
0.473
–
–
D1
10.00
–
–
0.394
–
–
E
12.00
–
–
0.473
–
–
E1
10.00
–
–
0.394
–
–
e
0.65
–
–
0.026
–
–
L
–
0.45
0.75
–
0.018
0.030
L1
1.00
–
–
0.039
–
–
α
–
0°
7°
–
0°
7°
D2
E2
n
52
52
Nd
13
13
Ne
13
13
CP
–
–
0.10
–
–
0.004
171/176
µPSD325X DEVICES
Figure 94. TQFP80 – 80-lead Plastic Quad Flatpack Package Outline
D
D1
D2
A2
e
E2 E1 E
Ne
b
N
1
A
Nd
CP
L1
c
QFP-A
Note: Drawing is not to scale.
172/176
A1
α
L
µPSD325X DEVICES
Table 143. TQFP80 – 80-lead Plastic Quad Flatpack Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A
–
–
1.60
–
–
0.063
A1
–
0.05
0.15
–
0.002
0.006
A2
1.40
1.35
1.45
0.055
0.053
0.057
b
0.22
0.17
0.27
0.009
0.007
0.011
c
–
0.09
0.20
–
0.004
0.008
D
14.00
–
–
0.551
–
–
D1
12.00
–
–
0.472
–
–
D2
9.50
–
–
0.374
–
–
E
14.00
–
–
0.473
–
–
E1
12.00
–
–
0.394
–
–
E2
9.50
–
–
0.374
–
–
e
0.50
–
–
0.020
–
–
L
0.60
0.45
0.75
0.024
0.018
0.030
L1
1.00
–
–
0.039
–
–
α
3.5
0°
7°
3.5
0°
7°
n
80
80
Nd
20
20
Ne
20
20
CP
–
–
0.08
–
–
0.003
173/176
µPSD325X DEVICES
PART NUMBERING
Table 144. Ordering Information Scheme
Example:
µPSD
3
2
5
4
B
V
– 24
U
6
T
Device Type
µPSD = Microcontroller PSD
Family
3 = 8032 core
PLD Size
2 = 16 Macrocells
SRAM Size
5 = 256Kbit
Main Flash Memory Size
3 = 1Mbit
4 = 2Mbit
IP Mix
A = USB, I2C, PWM, DDC, ADC, (2) UARTs
Supervisor (Reset Out, Reset In, LVD, WD)
B = I2C, PWM, DDC, ADC, (2) UARTs
Supervisor (Reset Out, Reset In, LVD, WD)
Operating Voltage
blank = VCC = 4.5 to 5.5V
V = VCC = 3.0 to 3.6V
Speed
–24 = 24MHz
–40 = 40MHz
Package
T = 52-pin TQFP
U = 80-pin TQFP
Temperature Range
1 = 0 to 70°C
6 = –40 to 85°C
Shipping Option
T = Tape and Reel Packing
For a list of available options (e.g., Speed, Package) or for further information on any aspect of this device,
please contact your nearest ST Sales Office.
174/176
µPSD325X DEVICES
REVISION HISTORY
Table 145. Document Revision History
Date
Rev. #
26-Nov-2002
1.0
Revision Details
First Issue
175/176
µPSD325X DEVICES
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
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176/176