TA7774P/PG/F/FG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA7774P/PG, TA7774F/FG, TA7774FAG Stepping Motor Driver IC The TA7774P/PG and TA7774F/FG/FAG are two-phase bipolar stepping motor driver ICs designed especially for 3.5- or 5.25-inch FDD head actuator drives. The ICs have a dual-bridge driver supporting the bipolar driving of induced loads, a power-saving circuit, and a standby circuit. They are ideal for achieving reduced set size and lower power consumption. TA7774P/PG Features z One-chip two-phase bipolar stepping motor driver z Power saving operation is available. TA7774F/FG z Standby operation is available. Current consumption ≤ 115 μA z Built-in punch-through current restriction circuit for system reliability and noise suppression z TTL-compatible inputs INA, INB, and PS pins z High driving ability TA7774P/PG/F/FG : IO(START) 350 mA (MAX): VS1 ENABLE : IO(HOLD) 100 mA (MAX): VS2 ENABLE TA7774FAG TA7774FAG : IO(START) 100 mA (MAX): VS1 ENABLE : IO(HOLD) 50 mA (MAX): VS2 ENABLE z Typical PKG DIP16 pin, HSOP16 pin, and SSOP16 pin z GND pin = heatsink SSOP16-P-225-1.00A TA7774PG/FG-FAG: The TA7774PG/FG/FAG is a lead-free (Pb-free) product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *number of times = once *use of R-type flux Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) SSOP16-P-225-1.00A: 0.14 g (typ.) 1 2007-6-4 TA7774P/PG/F/FG Block Diagram TA7774P/PG/F/FG/FAG Note: Pins 2, 7, 12, and 13 of the TA7774F/FG are all NC; the heat fin is connected to GND. Pin Description ( Pin No. Symbol Functional Description 1 / (1) VS2 A Low-voltage power supply terminal 2 / (3) VCC Power voltage supply terminal for control 3 / (4) IN A A-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 4 / (F) GND GND terminal 5 / (F) GND GND terminal 6 / (5) IN B B-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 7 / (6) PS 8 / (8) VS2 B Standby signal input terminal, Truth Table 2 9 / (9) VS1 B High-voltage power supply terminal 10 / (10) φB Output B 11 / (11) φB Output B 12 / (F) GND GND terminal 13 / (F) GND GND terminal 14 / (14) φΑ Output Α 15 / (15) φA Output A 16 / (16) VS1 A ): Power saving signal input terminal High-voltage power supply terminal. TA7774F/FG 2 2007-6-4 TA7774P/PG/F/FG Truth Table 1 Input Output PS IN φ φ L L L H Enable VS1 L H H L Enable VS1 H L L H Enable VS2 (power saving) H H H L Enable VS2 (power saving) Truth Table 2 VS2 B L Power off (standby) H Operation Note: Apply 5 V to VS2A as a supply terminal. 3 2007-6-4 TA7774P/PG/F/FG Output Circuit Input Circuit IN A, IN B Input Circuit VS2 A or VS2 B TA7774P/PG/F/FG/FAG Absolute Maximum Ratings (Ta = 25°C) Characteristic Supply voltage TA7774P/PG TA7774F/FG Output current TA7774FAG Input voltage Symbol Rating VCC 7.0 VS1 17.0 VS2 ≤VCC IO (PEAK) ±400 IO (START) ±350 IO (HOLD) ±100 IO (PEAK) ±200 IO (START) ±100 IO (HOLD) ±50 VIN ≤VCC TA7774F/FG V PD TA7774FAG 2.7 (Note 2) mA V W 1.4 (Note 3) 0.78 (Note 4) Operating temperature Topr −30 to 75 °C Storage temperature Tstg −55 to 150 °C 4 Note 1: IC only Note 2: This value is obtained if mounting is on a 50 × 50 × 0.8 mm PCB, 60% or more of which is occupied by copper. 1.4 (Note 1) TA7774P/PG Power dissipation Unit Note 3: This value is obtained if mounting is on a 60 × 30 × 1.6 mm PCB, 50% or more of which is occupied by copper. Note 4: This value is obtained if mounting is on a 50 × 50 × 1.6 mm PCB, 40% or more of which is occupied by copper. 2007-6-4 TA7774P/PG/F/FG Electrical Characteristics (Unless otherwise specified, Ta = 25°C, VCC = 5 V, VS1 = 12 V, VS2A = 5 V) Characteristic Symbol Test Cir− cuit Min Typ. Max PS: H, VS2B: H ― 9 14 PS: L, VS2B: H ― 8.5 13 VS2B: L 70 90 115 2.0 ― VCC GND ― 0.8 2.0 ― VCC GND ― 0.8 3.5 ― VCC GND ― 0.4 ― 2.6 30 ― 2.6 30 IOUT = 100 mA ― 0.9 ― IOUT = 400 mA ― 1.2 1.5 IOUT = 20 mA ― 1.6 ― IOUT = 100 mA ― 1.8 2.1 IOUT = 20 mA ― 0.03 ― IOUT = 100 mA ― 0.15 ― VSAT L3 IOUT = 400 mA ― 0.35 0.6 VSAT 1H1 IOUT = 100 mA ― 0.9 ― IOUT = 200 mA ― 1.0 1.3 IOUT = 20 mA ― 1.6 ― IOUT = 50 mA ― 1.7 2.0 IOUT = 20 mA ― 0.03 ― IOUT = 100 mA ― 0.15 ― IOUT = 200 mA ― 0.2 0.4 ― 1.5 ― ― 1.0 ― ― 7 ― ― 2 ― 4.5 5.0 5.5 ICC1 Supply current 1 ICC2 ICC3 Test Condition VIN H Pin 3, 6 VIN L Tj = 25°C VS2B: H VPS H Input voltage VPS L VS2 BH Tj = 25°C VS2 BL IIN Input current IPS VSAT 1H1 VSAT 1H2 TA7774P/PG TA7774F/FG VSAT 2H1 VSAT 2H2 VSAT 1H2 VSAT 2H1 TA7774FAG Pin 8 1 Pin 3, 6 Tj = 25°C, VS2B: H VIN / PS (2 V): sink current Pin 7 2 PS: L, VS2B: H 3 PS: H, VS2B: H 2 VS2B: H VSAT L1 VSAT L2 Output saturation voltage Pin 7 ― VSAT 2H2 2 PS: L, VS2B: H 3 PS: H, VS2B: H VSAT L1 2 VSAT L2 VS2B: H VSAT L3 Diode forward voltage Delay time Operating voltage VF U VF L tpLH tpHL VCC (opr.) Recommended operating voltage 4 IF = 350 mA ― IN − φ ― VCC = ST Unit mA μA V μA V V μs V VS1 (opr.) 12 V ± 10% VS2A (opr.) 5 V ± 10% Operating voltage restriction VS1 ≥ VS2A 5 2007-6-4 TA7774P/PG/F/FG TA7774P/PG/F/FG/FAG Test Circuit 1 ICC1, ICC2, ICC3, IIN A, IIN B, IPS Item SW1 SW2 SW3 SW4 ICC1 b b a a ICC2 b b b a ICC3 b b ― b IIN A a ― ― a IIN B ― a ― a IPS ― ― a a TA7774P/PG/F/FG/FAG 6 2007-6-4 TA7774P/PG/F/FG TA7774P/PG/F/FG/FAG Test Circuit 2 VSAT 1H1, VSAT 1H2, VSAT L2, VSAT L3 Note: Adjust RL to correspond to IL. Item VSAT 1H1 VSAT 1H2 VSAT L2 VSAT L3 SW1 SW2 SW3 SW4 a ― b ― ― a ― b c a ― a b ― ― a ― b c a ― b b ― ― a ― b d a ― b b ― ― a ― b SW5 IL (mA) a 100 a 400 b 100 b 400 a b b d b b d a ― c a b c d 7 2007-6-4 TA7774P/PG/F/FG TA7774P/PG/F/FG/FAG Test Circuit 3 VSAT 2H1, VSAT 2H2, VSAT L1 Note: Adjust RL to correspond to IL. Item VSAT 2H1 VSAT 2H2 VSAT L1 SW1 SW2 SW3 SW4 a ― b ― ― a ― b d a ― a SW5 IL (mA) a 20 a 100 b 20 a b a c b ― ― a b ― b d a ― b b ― ― a ― b a c a a c d 8 2007-6-4 TA7774P/PG/F/FG Test Circuit 4 VF U, VF L Measuring Method TA7774P/PG/F/FG/FAG ITEM SW1 SW2 a VF U b c e d a VF L e b c d Timing Chart (two-phase excitation) 9 2007-6-4 TA7774P/PG/F/FG TA7774F/FG TA7774P/PG No heatsink Mounting on a PCB of 50 x 50 x 0.8 mm, 50% or more of which is occupied by copper Power Dissipation Power Dissipation Mounting on a PCB of 50 x 50 x 0.8 mm, 60% or more of which is occupied by copper No heatsink Ambient Temperature Ambient Temperature TA7774FAG Mounting on a PCB of 50 x 50 x 1.6 mm, 40% or more of which is occupied by copper Power Dissipation PD (W) Thermal resistance Rth(j-a)=160°C/W Ambient Temperature Ta (°C) 10 2007-6-4 TA7774P/PG/F/FG Application Circuit TA7774P/PG/F/FG/FAG TA7774P/PG/F/FG/FAG Note 1: Connect the VS2A pin to the lower supply voltage (5 V). Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 11 2007-6-4 TA7774P/PG/F/FG Package Dimensions DIP16−P−300−2.54A Unit: mm Weight: 1.11 g (typ.) 12 2007-6-4 TA7774P/PG/F/FG Package Dimensions HSOP16−P−300−1.00 Unit: mm Weight: 0.50 g (typ.) 13 2007-6-4 TA7774P/PG/F/FG SSOP16−P−225−1.00A Unit: mm Weight: 0.14 g (typ.) 14 2007-6-4 TA7774P/PG/F/FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 15 2007-6-4 TA7774P/PG/F/FG Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 16 2007-6-4 TA7774P/PG/F/FG RESTRICTIONS ON PRODUCT USE 070122EBA_R6 • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 17 2007-6-4