TA7289P/F/FG TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA7289P,TA7289F/FG PWM STEPPING MOTOR DRIVER The TA7289P, TA7289F/FG are PWM solenoid driver designed especially for use high efficiency stepping motor control. It consist of 1.5A peak current drive capable output full bridge driver, oscillation circuit for PWM switching, 4bit D−A for output current control and TTL compatible input circuit. FEATURES z Wide Range of Operating Voltage : VCC (opr.) Min. = 6~27 V z High Current Capability: IO Max = 1.5 A (PEAK) z LS−TTL Compatible Control Inputs (IN A, IN B) TA7289F/FG z Few External Components Required. z Build−in 4bit DAC. The TA7289FG is a Pb-free product. The TA7289P is Sn plated product including Pb. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *the number of times = once *use of R-type flux Weight HDIP14−P−500−2.54A : 3.00g (Typ.) HSOP20−P−450−1.00 : 0.79g (Typ.) 1 2006-3-2 TA7289P/F/FG BLOCK DIAGRAM TA7289P / TA7289F/FG Note: Pin (1), (4), (6), (8), (11), (13) of TA7289F/FG are all NC (Non−connection) 2 2006-3-2 TA7289P/F/FG PIN FUNCTION PIN No. P F/FG PIN SYMBOL 1 20 Vref NF voltage supply input terminal 2 2 IN B Signal input terminal 3 3 IN A Signal input terminal 4 5 COSC 5 7 NF 6 9 OUT B 7 10 VI 8 12 OUT A 9 14 GND GND terminal 10 15 VCC Power voltage supply terminal 11 16 12 2 17 13 2 18 2 Output current detection terminal Output B terminal Comparator input terminal Output A terminal D / A input terminal 1 D / A input terminal 2 D / A input terminal 3 19 2 FIN FIN GND Function Internal oscillation frequency input terminal 0 14 Note: FUNCTIONAL DESCRIPTION D / A input terminal GND terminal Pin (1), (4), (6), (8), (11), (13) of TA7289F/FG are all NC (Non−connection) FUNCTION IN A IN B OUT A OUT B MODE L L OFF OFF H L H L CW / CCW L H L H CCW / CW H H OFF OFF STOP STOP INPUT CIRCUIT (IN A, IN B) Input circuit is shown in Fig.1 IN A and IN B are TTL compatible “Low Active” type and have a hysteresis of 0.8 V Typ at Tj = 25°C. TA7289P / TA7289F/FG Fig. 1 3 2006-3-2 TA7289P/F/FG D / A AND Vref CIRCUIT TA7289P / TA7289F/FG Fig. 2 IDO of current mode DAC output is proportional to multipled voltage of Vref (PIN (1) (or (20))) and DAC inputs. DAC inputs are all “low active” type and required input current of 300 µA MIN for each input terminal. OSC AND COMPARATOR TA7289P / TA7289F/FG Fig. 3 4 2006-3-2 TA7289P/F/FG Sawtooth OSC circuit consists of Q1 through Q4 and R1 through R3. R1 and R2 are voltage divider of 5 V build−in regulator. Q1 is turned “off” when V4 is less than the voltage of 2.5 V + VBE Q4 + VBE Q3 approximately equal to 3.8 V. V4 is increased by C1 charging of I4. Q1 and Q2 are turned “ON” when V4 becomes V4 − H level. Lower level of V4 (V4 − L) is equal to VBE Q4 + VBE Q3 + VSAT Q1 approximately equal to 1.5 V. V4 is calculated by following equation. V4 = 5·(1 − e − 1 ·t) .................................................(1) C1·R3 Assuming that V4 = 1.5 V (t = t1) and=3.8 V (t = t2). C1 is external capacitance connected to Pin (4) (or (5)) and R3 is on−chip 20 kΩ resistor. Therefore, OSC frequency is calculated as follows. t1 = −C1·R3·1n (1 − 1.5 ) ................................................(2) 5 t2 = −C1·R3·1n (1 − 3.8 )................................................(3) 5 fOSC = = 1 t1 − t 2 = 1 1.5 3.8 C1· ( R 3·1n (1 − ) − R 3·1n (1 − )) 5 5 1 (kHz) (Unit of C1 is µF) 21.4 C1 ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Supply Voltage Reference Voltage TA7289P Output Current TA7289F/FG TA7289P TA7289F/FG Power Dissipation TA7289P TA7289F/FG SYMBOL RATING VCC 30 Vref 30 VIN 7 VI 2 IO (MAX.) IO (AVE.) PD (Note) UNIT V 1.5 0.8 0.7 A 0.3 2.3 1.0 W Operating Temperature Topr −30~85 °C Storage Temperature Tstg −55~150 °C Note: NO HEAT SINK 5 2006-3-2 TA7289P/F/FG ELECTRICAL CHARACTERISTICS (Unless otherwise specified, VCC = 24 V, Ta = 25°C) CHARACTERISTIC Quiescent Current SYMBOL TEST CIR− CUIT Input Hysteresis Width 30 ICC2 STOP 12 20 30 12 20 30 13 23 32 2.0 ― 7.0 −0.4 ― 0.8 ― 0.8 ― ― 25 35 90 160 200 ― 1.1 1.5 ― 0.8 1.1 ― 1.2 1.7 ― 0.9 1.3 ― 1.8 2.6 ― 1.2 1.9 GND ― 2.0 V ― 25 35 µA ― 2.6 3.3 ― 0.8 1.1 VL = 30 V ― ― 50 VL = 30 V ― ― 50 180 300 490 µA ― 5 ― V 13 20 32 kΩ ICC3 1 VIN (H) VIN (L) ∆VIN 0 2 3 3 IN A IN B, Source type. 2 ― IN A, IN B VIN = 0 V Source type 0 1 2 3 2 ,2 ,2 ,2 Source type 3 VSAT U−3 IOUT = 0.7 A IOUT = 1.5 A VSAT L−3 Control Supply Voltage Vref ― Control Supply Current Iref 2 Vref = 0~2.0 V 4 IF = 1.5 A VFU VFL IL−U IL−L VIN = 0 V IOUT = 0.2 A VSAT L−1 VSAT L−2 0 2 ~2 : H 2 ~2 : L 2 VSAT U−2 Output : Open CW / CCW mode, CW / CCW mode, VSAT U−1 NF Terminal Current UNIT 20 IIN2 Output Leakage Current MAX 12 Input Current Diode Forward Voltage TYP. CW / CCW IIN1 Output Saturation Voltage MIN ICC1 ICC4 Output Voltage TEST CONDITION 5 INF 6 Internal Supply Output Voltage VCC2 6 Resistor for Oscillation (R3) ROSC 6 ― Source type VNF = 0~2.0 V Tj = 0~125°C ― Tj = 0~125°C 6 mA V V µA V V µA 2006-3-2 TA7289P/F/FG TEST CIRCUIT 1 ICC1, 2, 3, 4 TA7289P/F/FG TA7289P / TA7289F/FG TEST CIRCUIT 2 VIN (H), (L), IIN1, 2, ∆VIN, Iref TA7289P/F/FG TA7289P / TA7289F/FG 7 2006-3-2 TA7289P/F/FG TEST CIRCUIT 3 VSAT U1, L1, U2, L2, U3, L3 TA7289P/F/FG TA7289 / TA7289F/FG Note: Calibrate IOUT to 0.2A / 0.7A / 1.5A by RL TEST CIRCUIT 4 VFU, VFL TA7289P/F/FG TA7289 / TA7289F/FG 8 2006-3-2 TA7289P/F/FG TEST CIRCUIT 5 IL−U, IL−L TA7289P/F/FG TA7289P / TA7289F/FG TEST CIRCUIT 6 INF, VCC2, ROSC TA7289P/F/FG TA7289P / TA7289F/FG Note: ROSC = VCC2 (V ) (Ω) I OSC (A ) 9 2006-3-2 TA7289P/F/FG TEST CIRCUIT 7 IOUT − Vref CHARACTERISTIC, IOUT − D / A CHARACTERISTIC TA7289P/F/FG TA7289P / TA7289F/FG TEST CIRCUIT 8 ICC − FREQUENCY CHARACTERISTIC TA7289P/F/FG TA7289P / TA7289F/FG 10 2006-3-2 TA7289P/F/FG TA7289F/FG 11 2006-3-2 TA7289P/F/FG 12 2006-3-2 TA7289P/F/FG APPLICATION CIRCUIT 1 TA7289P / TA7289F/FG Note 1: Connect if required. Note 2: Recommended RF value is approximately 200 Ω. And CF value is concerned with the OSC frequency. We recommend to select optimum value of CF under the experimental consideration of noise cutting and time delay characteristics. Note 3: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 13 2006-3-2 TA7289P/F/FG APPLICATION CIRCUIT 2 (PWM chopper stepping motor driver) TA7289P / TA7289F/FG 14 2006-3-2 TA7289P/F/FG PACKAGE DIMENSIONS HDIP14−P−500−2.54A Unit: mm Weight: 3.00 g (Typ.) 15 2006-3-2 TA7289P/F/FG PACKAGE DIMENSIONS HSOP20−P−450−1.00 Unit: mm Weight: 0.79 g (Typ.) 16 2006-3-2 TA7289P/F/FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 17 2006-3-2 TA7289P/F/FG Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 18 2006-3-2 TA7289P/F/FG 19 2006-3-2