TOSHIBA TD62930FG

TD62930PG/FG
TOSHIBA BIPOLAR DIGITAL IC SILICON MONOLITHIC
TD62930PG,TD62930FG
THREE−CHANNEL SMALL−SIGNAL IGBT GATE DRIVER
The TD62930PG and TD62930FG are drivers using 5 V−signal
input to output the signals required to drive IGBT gates.
TD62930PG / FG is the most suitable for low−side drive of a
miniature IGBT to use for inverter for the household electric
appliances mainly.
The outputs are separated into high−side and low−side outputs.
This separation simplifies the IGBT gate on / off timing control.
Two output signals are assigned for one input signal.
The high−side output is high−level for high−level input, and high
impedance for low−level input. The low−side output is high
impedance for high−level input, and low−level for low−level
input.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
TD62930PG
TD62930FG
Features
Power supply voltage (absolute maximum rating)
High−voltage block power supply voltage VCC = 30 V
Low−voltage block power supply voltage VDD = 7 V
Output current (absolute maximum rating)
High−side peak current IOUT = −0.4 A (max)
Low−side peak current
IOUT = 0.4 A (max)
Weight
DIP16-P-300-2.54A : 1.11 g (typ.)
SSOP16-P-225-1.00A : 0.14 g (typ.)
Input−output response speed tpHL, tpLH ≤ 1 µs (max)
Package : DIP16 / SSOP16 (1.00 mm pitch)
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Pin Assignment (top view)
Internal Equivalent Circuit
Pin Description
PIN No.
PIN NAME
1, 8
VCC
2
VDD
3, 7
L−GND
4, 5, 6
IN1~3
FUNCTION
30 V supply pins
5 V supply pin
Ground pins for 5 V supply
Input pins for 5 V output control signals
11, 14
P−GND
9, 12, 15
OUT−L1~3
Low−side output pins
Ground pins for 30 V supply
10, 13, 16
OUT−H1~3
High−side output pins
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Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC
PIN / PACKAGE
SYMBOL
RATING
UNIT
Power Supply Voltage
VCC
VCC
30
V
Power Supply Voltage
VDD
VDD
7
V
IN1~3
VIN
−0.5~VDD + 0.5
V
Input Voltage
0~20 (Ta = −20~85°C)
OUT−H1~3
VOUT (H)
OUT−L1~3
VOUT (L)
High−level Output Peak Current
OUT−H1~3
IOPH (Note 1)
−0.4
A / ch
Low−level Output Peak Current
OUT−L1~3
IOPL (Note 1)
+0.4
A / ch
IN1~3
f
25
kHz
DIP16
PD1 (Note 2)
1.47 (FREE AIR)
W
SSOP16
PD2 (Note 2)
0.78 (ON PCB)
W
Output Voltage
Operating Frequency
Power Dissipation
V
0~30 (Ta = −20~70°C)
−0.5~20 (Ta = −20~85°C)
V
−0.5~30 (Ta = −20~70°C)
Operating Ambient Temperature
Topr
−20~85
°C
Storage Temperature
Tstg
−55~150
°C
Note 1: Output pin current
The pulse width of the output pin current at peak is ≤ 1 µs, 300 pps.
Note 2: When ambient temperature exceeds 25°C
Derate the power dissipation of DIP−type devices at 11.76 mW / 1°C (device only) and
Derate the power dissipation of SMD−type devices at 6.24 mW / 1°C (mounted on the board).
Recommended Operating Conditions
(Unless otherwise specified, Ta = −20 to 70°C)
CHARACTERISTIC
Input Voltage
Input Current
High level
Low level
High level
Low level
Input Power Supply Voltage
PIN
IN1~3
IN1~3
VIH
VIL
IIH
IIL
TEST CONDITION
MIN
TYP.
MAX
VCC = 15 V,
VDD = 4.5~5.5 V
3.5
―
―
―
―
1.0
VCC = 15 V,
VDD = 4.5~5.5 V
―
―
5
―
―
−5
VCC
VCC
10
15
25
VDD
VDD
4.5
5.0
5.5
―
―
−0.1
―
―
−0.35
―
―
0.1
―
―
0.35
VCC = 30 V, VDD = 5.5 V
−20
25
70
VCC = 20 V, VDD = 5.5 V
−20
25
85
OUT−H1~3
Output Current
OUT−L1~3
Operating Temperature
SYMBOL
IOH (DC)
IOH (Peak)
IOL (DC)
IOL (Peak)
Topr
3
VCC = 20 V, VDD = 4.5 V
VCC = 20 V, VDD = 4.5 V
UNIT
V
mA
V
A
°C
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Electrical Characteristics (Unless otherwise specified, Ta = −20 to 70°C)
CHARACTERISTIC
Input Current
Output
Voltage
High level
Low level
PIN
IN1~3
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
IIH
VCC = 15 V, VIN = 5 V
0.1
0.2
0.4
IIL
VCC = 15 V, VIN = 0 V
―
0
―
UNIT
mA
High level
OUT−H1~3
VOH
VCC = 15 V, VIH = 5 V,
RLH = 100 Ω
VCC
−4.0
VCC
−1.9
VCC
−1.0
Low level
OUT−L1~3
VOL
VCC = 15 V, VIL = 0 V,
RLL = 100 Ω
0.3
0.5
2.5
VDD = 5.5 V, VIH = 0 V,
Ta = 25°C
―
1.5
3.0
VDD = 5.5 V, VIH = 0 V,
Ta = −20~85°C
―
―
3.5
VDD = 5.5 V, VIH = 5 V,
Ta = 25°C
―
1.8
3.5
VDD = 5.5 V, VIH = 5 V,
Ta = −20~85°C
―
―
4.0
VCC = 30 V, VDD = 5.5 V,
VIH = 0 V, Ta = 25°C
―
10.2
15.0
VCC = 30 V, VDD = 5.5 V,
VIH = 0 V
―
―
18.0
VCC = 30 V, VDD = 5.5 V,
VIH = 5 V, Ta = 25°C
―
7.5
11.0
VCC = 30 V, VDD = 5.5 V,
VIH = 5 V
―
―
14.0
10
―
30
V
UNIT
IDDL
Dissipation Current 1
VDD
IDDH
ICCL
Dissipation Current 2
VCC
ICCH
Operating Power Supply Voltage
VCC
VCCopr
V
mA
mA
Switching Characteristics (Unless otherwise specified, Ta = −20~70°C)
CHARACTERISTIC
Output
Propagation
Delay Time
High level
Low level
PIN
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
OUT−H1~3
tPLH
VDD = 5.0 V, VCC = 15 V
RLH = RLL = 100 Ω,
VIN = 0.7 to 4 V
―
0.25
1.00
tPHL
VDD = 5.0 V, VCC = 15 V
RLH = RLL = 100 Ω,
VIN = 4 to 0.7 V
―
OUT−L1~3
4
µs
0.25
1.00
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Switching Waveform
Propagation Delay Time Test Circuit
Toshiba recommends connecting load resistors as in the above diagram, utilizing the independence of the
high−level and low−level sides of this IC.
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Test Circuit
(1) IIH
(2) IIL
(3)
(4)
VIH, VOH
(5) IDDL, IDDH
VIL, VOL
(6) ICCL, ICCH
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Application Circuit
TD62930PG, TD62930FG
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND (L−GND, P−GND) line since IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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Package Dimensions
DIP16−P−300−2.54A
Unit: mm
Weight: 1.11 g (Typ.)
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Package Dimensions
SSOP16−P−225−1.00A
Unit: mm
Weight: 0.14 g (Typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
3. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to Remember on Handling of ICs
(1)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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