TOSHIBA TPCA8106

TPCA8106
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSⅤ)
TPCA8106
Lithium Ion Battery Applications
Notebook PC Applications
Portable Equipment Applications
Unit: mm
1.27 0.4 ± 0.1
(VGS= −10V）
High forward transfer admittance: |Yfs| = 79S (typ.)
•
Low leakage current: IDSS = −10 μA (max) (VDS = −30 V)
•
Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA)
0.95 ± 0.05
•
4
1
5.0 ± 0.2
0.05 S
S
Absolute Maximum Ratings (Ta = 25°C)
4
Symbol
Rating
Unit
Drain-source voltage
VDSS
−30
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
−30
V
Gate-source voltage
VGSS
±20
V
DC
Drain current
(Note 1)
Pulsed (Note 1)
Drain power dissipation
(Tc=25℃)
Drain power dissipation
(t = 10 s)
(Note 2a)
Drain power dissipation
(t = 10 s)
IDP
PD
45
W
JEDEC
⎯
PD
2.8
W
JEITA
⎯
A
208
mJ
IAR
−40
A
EAR
4.5
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
Repetitive avalanche energy
(Tc = 25℃) (Note 4)
1,2,3: SOURCE
5,6,7,8: DRAIN
TOSHIBA
EAS
Avalanche current
5
−40
W
(Note 3)
8
−120
1.6
Single pulse avalanche energy
4.25 ± 0.2
ID
PD
(Note 2b)
0.6 ± 0.1
1
Characteristics
0.595
0.166 ± 0.05
Low drain-source ON-resistance: RDS (ON) = 2.9 mΩ (typ.)
A
1.1 ± 0.2
•
0.15 ± 0.05
3.5 ± 0.2
Small footprint due to small and thin package
0.8 ± 0.1
•
0.05 M A
5
5.0 ± 0.2
6.0 ± 0.3
8
4: GATE
2-5Q1A
Weight: 0.069 g (typ.)
Circuit Configuration
8
7
6
5
Note: For Note 1 to 4, please refer to the next page.
4
1
2
3
Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.
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TPCA8106
Thermal Characteristics
Characteristics
Thermal resistance, channel to case
(Tc=25℃)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2a)
Thermal resistance, channel to ambient
(t = 10 s)
(Note 2b)
Symbol
Max
Unit
Rth (ch-c)
2.78
°C/W
Rth (ch-a)
44.6
°C/W
Rth (ch-a)
78.1
°C/W
Marking (Note 5)
TPCA
8106
Part number
※
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2:
(a) Device mounted on a glass-epoxy board (a)
(b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(a)
(b)
Note 3: VDD = −24 V, Tch = 25°C (initial), L = 100 μH, RG = 25 Ω, IAR = −40 A
Note 4: Repetitive rating: pulse width limited by max channel temperature
Note 5: * Weekly code: (Three digits)
Week of manufacture
(01 for the first week of the year, continuing up to 52 or 53)
Year of manufacture
(The last digit of the year)
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TPCA8106
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±20 V, VDS = 0 V
⎯
⎯
±100
nA
Drain cut-OFF current
IDSS
VDS = −30 V, VGS = 0 V
⎯
⎯
−10
μA
V (BR) DSS
ID = −10 mA, VGS = 0 V
−30
⎯
⎯
V (BR) DSX
ID = −10 mA, VGS = 20 V
−13
⎯
⎯
Vth
VDS = −10 V, ID = −1 mA
−0.8
⎯
−2.0
VGS = −4 V, ID = −20 A
⎯
5.5
7.8
VGS = −10 V, ID = −20 A
⎯
2.9
3.7
VDS = −10 V, ID = −20 A
39.5
79
⎯
⎯
4600
⎯
⎯
970
⎯
⎯
1500
⎯
⎯
10
⎯
⎯
20
⎯
Drain-source breakdown voltage
Gate threshold voltage
Drain-source ON-resistance
RDS (ON)
Forward transfer admittance
|Yfs|
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
Rise time
VDS = −10 V, VGS = 0 V, f = 1 MHz
tr
ID = −20A
VOUT
0V
ton
VGS
−10 V
Fall time
4.7 Ω
Switching time
tf
Turn-OFF time
Total gate charge
(gate-source plus gate-drain)
toff
Qg
Gate-source charge 1
Qgs1
Gate-drain (“miller”) charge
Qgd
RL = 0.75 Ω
Turn-ON time
VDD ≈ −15 V
Duty ≤ 1%, tw = 10 μs
VDD ≈ −24 V, VGS = −10 V,
ID = −40 A
V
V
mΩ
S
pF
ns
⎯
300
⎯
⎯
750
⎯
⎯
130
⎯
⎯
12
⎯
⎯
40
⎯
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Drain reverse current
Forward voltage (diode)
Pulse
(Note 1)
Symbol
Test Condition
Min
Typ.
Max
Unit
IDRP
⎯
⎯
⎯
−120
A
⎯
⎯
1.2
V
VDSF
IDR = −40 A, VGS = 0 V
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TPCA8106
ID – VDS
−3
−3.4
−3.6
−6
(A)
−2.8
−4
−4.5
−30
−2.6
−20
−2.4
−10
−60
−40
−3.4
−10
−80
ID
Drain current
ID
(A)
−40
−3.2
−10
−8
−6
ID – VDS
−100
Common source
Ta = 25°C
Pulse test
Drain current
−50
Common source
Ta = 25°C
Pulse test
−3.2
−3.6
−4
−4.5
−3
−2.8
−2.6
−2.4
−20
VGS = −2.2 V
VGS = −2.2 V
0
0
−0.2
−0.4
−0.6
−0.8
Drain−source voltage
VDS
0
0
−1
−1
(V)
−2
Drain-source voltage
ID – VGS
−60
−40
VDS (V)
100
−4
(V)
VDS – VGS
Common source
VDS = −10 V
Pulse test
−20
VDS
−0.5
Drain−source voltage
ID
−80
Drain current
(A)
−100
−3
Ta = −55°C
Common source
Ta = 25°C
Pulse test
−0.4
−0.3
−0.2
ID = −40 A
−0.1
−10
−20
25
0
0
−1
−2
−3
Gate−source voltage
VGS
0
0
−4
−4
(V)
−8
|Yfs| – ID
Ta = −55°C
25
1
Common source
VDS = −10 V
Pulse test
−1
Drain current
−10
ID
Drain−source ON-resistance
RDS (ON) (mΩ)
Forward transfer admittance
|Yfs| (S)
100
0.1
−0.1
VGS
−20
(V)
RDS (ON) – ID
100
100
−16
Gate−source voltage
1000
10
−12
Common source
Ta = 25°C
Pulse test
10
−4
VGS = −10 V
1
0.1
−0.1
−100
(A)
−1
Drain current
4
−10
ID
−100
(A)
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TPCA8106
RDS (ON) – Ta
IDR – VDS
−1000
10
(A)
8
IDR
ID = −10, −20, −40 A
Drain reverse current
Drain-source ON-resistance
RDS (ON) (mΩ)
Common source
Pulse test
6
VGS = −4 V
4
ID = −10, −20, −40 A
2
VGS = −10 V
0
−80
−40
0
40
80
Ambient temperature
120
Ta
−100
VGS = 0 V
−10
−1
Common source
Ta = 25°C
Pulse test
(°C)
0.2
0.4
0.6
Drain−source voltage
Capacitance – VDS
0.8
1
VDS
(V)
80
120
1.2
Vth – Ta
−2
Vth (V)
10000
Gate threshold voltage
(pF)
Ciss
C
Capacitance
−3
−1
−0.1
0
160
−5
−10
1000
Coss
Crss
Common source
VGS = 0 V
f = 1 MHz
Ta = 25°C
100
−0.1
−1
−10
Drain−source voltage
−1.2
−0.8
Common source
−0.4 VDS = −10 V
ID = −1mA
Pulse test
0
−80
−100
VDS
−1.6
(V)
−40
0
40
Ambient temperature
Ta
160
(°C)
Dynamic input/output
characteristics
−20
(V)
VDD = −24V
−30
−20
VDS
−6
−12
VDD = −24V
−10
VGS
−6
0
0
−10
−12
40
80
Total gate charge
120
Qg
160
200
VGS
Common source
ID = −40 A
Ta = 25°C
Pulse test
Gate−source voltage
Drain−source voltage
VDS (V)
−30
0
(nC)
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TPCA8106
rth − tw
Transient thermal impedance
rth (°C/W)
1000
(1) Device mounted on a glass-epoxy board (a) (Note 2a)
(2) Device mounted on a glass-epoxy board (b) (Note 2b)
(3) Tc=25℃
(2)
100
(1)
10
(3)
1
Single pulse
0.1
0.001
0.01
0.1
1
Pulse width
10
tw
100
(s)
PD – Tc
PD – Ta
(W)
40
PD
2.5
2
Drain power dissipation
Drain power dissipation
50
(1) Device mounted on a
glass-epoxy board (a) (Note 2a)
(2) Device mounted on a
glass-epoxy board (b) (Note 2b)
t = 10 s
(1)
PD
(W)
3
(2)
1.5
1
0.5
0
0
40
80
Ambient temperature
1000
120
Ta
30
20
10
0
0
160
40
80
Case temperature
(°C)
120
Tc
160
(°C)
Safe operating area
−1000
ID max (Pulse) *
(A)
−100
ID
1 ms *
Drain current
t = 10 ms *
−10
−1
* Single pulse
Ta = 25°C
Curves must be derated
linearly with increase in
temperature.
−0.1
−0.1
−1
Drain−source voltage
VDSS max
−10
VDS
−100
(V)
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TPCA8106
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
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technology products (mass destruction weapons). Product and related software and technology may be controlled under the
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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