CS8240 500 mA High Side (PNP) Driver with On-Chip Flyback Diode The CS8240 is a fast, PNP high side driver capable of delivering up to 500 mA into a resistive or inductive load in harsh automotive or industrial environments. An internal flyback diode clamp is incorporated for inductive loads. The input (VIN) is TTL and CMOS compatible and has hysteresis to minimize the effects of noise. When the input is high, the output is on. When the input is low, the output is off and the supply voltage quiescent current is very low (< 1.0 µA, typ). For device protection, the CS8240 incorporates thermal shutdown, short circuit current limiting, overvoltage shutdown, and reverse battery protection. The CS8240 can withstand supply voltage transients of 60 V (min) and –50 V. The CS8240 is available in an overmolded 5 lead TO–220 package and is a competitive replacement for the LM–1921, LM–1951, LM–1952, MC–3399, and L–9350. http://onsemi.com TO–220 FIVE LEAD TQ SUFFIX CASE 314D Pin 1. VCC 2. OUT 3. NC 4. GND 5. VIN 1 5 TO–220 FIVE LEAD TQVA SUFFIX CASE 314N Features • Low Output Saturation Voltage – 0.22 V at IOUT = 125 mA – 0.33 V at IOUT = 225 mA • Overmolded Package • On–Chip Flyback Diode • Fault Protection – Over Voltage Shutdown (32 V, typ) – Thermal Shutdown (165°C, typ) – Short Circuit Limiting (1.1 A typ) – –50 V Reverse Transient Protection – 60 V Load Dump Protection – Reverse Battery • Low Quiescent Current (Off State) • ESD Protected 1 5 MARKING DIAGRAM CS8240 AWLYWW 1 VCC A WL, L YY, Y WW, W Current Limit Overvoltage Shutdown Control Circuit OUT VIN Thermal Shutdown GND Figure 1. Block Diagram Semiconductor Components Industries, LLC, 2001 April, 2001 – Rev. 4 1 = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping CS8240YTQ5 TO–220 FIVE LEAD STRAIGHT 50 Units/Rail CS8240YTQVA5 TO–220 FIVE LEAD VERTICAL 50 Units/Rail Publication Order Number: CS8240/D CS8240 MAXIMUM RATINGS* Rating Value Unit 6.0 to 26 V 60 V –16 –50 V V Internally limited – –0.3 to +7.0 V Junction Temperature Range, TJ –40 to150 °C Storage Temperature Range, TS –55 to +165 °C 260 peak °C 2.0 kV Supply Voltage Overvoltage Protection Reverse Voltage: DC Transient Internal Power Dissipation Logic Input Voltage Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1) Electrostatic Discharge (Human Body Model) 1. 10 second maximum. *The maximum package power dissipation must be observed. ELECTRICAL CHARACTERISTICS (–40°C ≤ TA ≤ 125°C; –40°C ≤ TJ ≤ 150°C, unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit – 6.0 – – V VCC = 12V, VIN ≤ VIN(LOW) VIN ≥⋅VIN(HI), RLOAD = 50 Ω, 6.0 V ≤ VCC ≤ 20 V 20 V ≤ VCC ≤ 24 V – 1.0 100 µA – – 16 25 30 50 mA mA Output Saturation Voltage VIN ≤ VIN(HI), VCC = 6.0 V, ILOAD = 125 mA VCC = 14 V, ILOAD = 225 mA – – 0.22 0.33 0.5 0.7 V V Output Leakage Current Input ≤ VIN(L), VCC = 12 V, VOUT = 0 V – 1.0 150 µA Negative Output Clamp ICLAMP = 100 mA, VCC = 12 V –18 –15.5 –12 V Turn On Delay Time VCC = 12 V, ILOAD = 150 mA – 5.0 20 µs Turn Off Delay Time VCC = 12 V, ILOAD = 150 mA – 5.0 20 µs 0.8 – 1.45 1.2 – 2.0 V V General Characteristics Operating Supply Voltage Quiescent Current Output Stage Input Stage Input Voltage Logic = High, VCC = 12 V Turn ON Logic = Low, VCC = 12 V Turn OFF Input Current VIN = 5.5 V VIN = 0.8 V – – 100 15 200 50 µA µA Overvoltage Shutdown VIN ≥ VIN(HI) 26 32 – V Output Short Circuit Current VIN ≥ VIN(HI), VCC = 12 V, VOUT = 0 V 0.55 1.1 2.5 A 150 165 – °C Protection Circuitry Thermal Shutdown – http://onsemi.com 2 CS8240 PACKAGE PIN DESCRIPTION PACKAGE PIN # 5 Lead TO–220 PIN SYMBOL 1 VCC Supply Voltage to the IC. Supplies load current through PNP. 2 OUT Collector of output PNP, current to load is sourced from this lead. 3 NC 4 GND 5 VIN FUNCTION No connection. Ground. Input voltage to control output. Logic high turns output on. Logic low turns output off. TYPICAL PERFORMANCE CHARACTERISTICS 40 +125°C VCC = 12 V VIN ≥ 2.0 V 35 5 VIN (V) +25°C 30 –40°C 20 0 12 15 VOUT (V) IQ (mA) 25 10 0 5 0 0 100 200 300 IOUT (mA) 400 500 0 600 Figure 2. Quiescent Current vs. IOUT 1 2 3 4 (µs) 5 6 7 8 Figure 3. Turn–On Delay Time 1.2 5 VIN (V) 1.1 VSAT (V) 0 VOUT (V) 12 0 2 4 6 8 10 (µs) 12 14 16 18 20 +25°C 0.6 –40°C 0.5 0.4 0.3 0.2 0.1 0 –15 +125°C VCC = 12 V VIN ≥ 2.0 V 1.0 0.9 0.8 0.7 0 Figure 4. Turn Off Delay Time 100 200 300 IOUT (mA) 400 500 Figure 5. Output Saturation Voltage vs. IOUT http://onsemi.com 3 600 CS8240 60 VIN (V) 5 50 Input Current (µA) Load = 80 Ω, 50 mH 0 VOUT (V) 12 0 –15 ON 40 30 OFF 20 10 0 1 2 3 4 5 (ms) 6 7 8 9 0 10 0 0.2 0.4 0.6 Figure 6. Flyback Clamp Characteristics 0.8 1.0 1.2 1.4 Input Voltage (V) 1.6 1.8 2.0 Figure 7. IIN vs. VIN CIRCUIT DESCRIPTION Input Stage the given output current. The base drive of the PNP is the dominant component of the quiescent current of the CS8240 and is dependent on the level of output current. Short circuit protection (1.1 A, typ) is also incorporated in the output stage. The input stage is a self biased band gap based circuit with a positive going trip point of 1.45 V (typ) and a negative going trip point of 1.20 V (typ) (250 mV of hysteresis). When the input voltage is below the positive trip point, the quiescent current of the supply voltage line is less than 1.0 µA, (typ). When the input voltage exceeds the positive trip point (1.45 V, typ), the input stage “wakes up” the rest of the CS8240 circuitry and turns on the output stage. Protection Circuitry In addition to the short circuit protection mentioned above, the CS8240 also incorporates a thermal shutdown circuit (165°C, typ) and a high voltage shutdown circuit (33 V, typ), both of which cut off the drive to the PNP output transistor when excessive current is drawn. Inherent in the design of the CS8240 is transient protection to +60 V and –50 V on the supply line. The CS8240 is ESD protected in excess of 2.0 kV (Human Body Model). Output Stage The output stage is built around a high current PNP output transistor. A control amplifier monitors the saturation voltage of the output PNP and maintains a balance of low saturation voltage and minimum base drive to the PNP for http://onsemi.com 4 CS8240 TYPICAL APPLICATION CIRCUITS VCC* 1 0.1 µF 2 CS8240 5.0 V 0V 5 3 Figure 8. Solenoid Driver VCC* 1 0.1 µF 2 CS8240 GE194 5 3 * VCC = 6.0 V TO 26 V Figure 9. Lamp Driver VBATT VIGNITION 0.1 µF CS8240 15 kΩ Figure 10. Controlled High Side Switch http://onsemi.com 5 LOAD CS8240 PACKAGE DIMENSIONS TO–220 FIVE LEAD TQ SUFFIX CASE 314D–04 ISSUE E –T– –Q– SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C B E A U L K J H G D DIM A B C D E G H J K L Q U 1234 5 5 PL 0.356 (0.014) M T Q M INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.990 1.045 0.320 0.365 0.140 0.153 0.105 0.117 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.146 26.543 8.128 9.271 3.556 3.886 2.667 2.972 TO–220 FIVE LEAD TQVA SUFFIX CASE 314N–01 ISSUE O –T– C B H –Q– SEATING PLANE E N W A U L 1 2 3 4 F K 5 M G D J S 5 PL 0.356 (0.014) M T Q M R http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. 4. LEADS MAINTAIN A RIGHT ANGLE WITH RESPECT TO THE PACKAGE BODY TO WITHIN 0.015 ". DIM A B C D E F G H J K L M N Q R S U W INCHES MIN MAX 0.604 0.614 0.395 0.405 0.175 0.185 0.027 0.037 0.100 0.110 0.712 0.727 0.067 BSC 0.020 0.030 0.014 0.022 0.889 0.904 0.324 0.339 0.115 0.130 0.115 0.125 0.120 0.130 0.292 0.342 0.133 0.183 0.480 0.495 5° MILLIMETERS MIN MAX 15.34 15.60 10.03 10.29 4.44 4.70 0.69 0.94 2.54 2.79 18.08 18.47 1.70 BSC 0.51 0.76 0.36 0.56 22.58 22.96 8.23 8.61 2.92 3.30 2.92 3.17 3.05 3.30 7.42 8.69 3.38 4.65 12.19 12.57 5° CS8240 PACKAGE THERMAL DATA Parameter TO–220, Five Lead Unit RΘJC Typical 4.0 °C/W RΘJA Typical 50 °C/W http://onsemi.com 7 CS8240 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). 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