ONSEMI MBRA320T3G

MBRA320T3G
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
Employing the Schottky Barrier principle in a large area
metal-to-silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•Small Compact Surface Mountable Package with J-Bent Leads
•Rectangular Package for Automated Handling
•Highly Stable Oxide Passivated Junction
•Very Low Forward Voltage Drop
•Guardring for Stress Protection
•Pb-Free Package is Available
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SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERES
20 VOLTS
1
Cathode
2
Anode
1
Mechanical Characteristics:
•Case: Epoxy, Molded
•Weight: 70 mg (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Shipped in 12 mm tape, 5000 units per 13 inch reel
•Polarity: Cathode Lead Indicated by Polarity Band
•ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
•Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TL = 100°C)
Symbol
Value
Unit
VRRM
VRWM
VR
20
V
IO
3.0
MARKING DIAGRAM
A32
AYWWG
A32
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb-Free Package
ORDERING INFORMATION
A
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
Storage Temperature
Tstg
-65 to +150
°C
Operating Junction Temperature
TJ
-65 to +125
°C
dv/dt
10,000
V/ms
Voltage Rate of Change
(Rated VR, TJ = 25°C)
2
SMA
CASE 403D
PLASTIC
80
A
Device
Package
Shipping†
MBRA320T3G
SMA
(Pb-Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1
Publication Order Number:
MBRA320/D
MBRA320T3G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
RθJL
RθJA
15
80
°C/W
VF
0.50
Volts
Thermal Resistance - Junction-to-Lead (Note 1)
Thermal Resistance - Junction-to-Ambient (Note 1)
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 3.0 A, TJ = 25°C)
Maximum Instantaneous Reverse Current (Note 2)
IR
TJ = 25°C
TJ = 100°C
2.0
20
(VR = 20 V)
mA
1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%.
TYPICAL CHARACTERISTICS
1
10
IF, FORWARD CURRENT (AMPS)
IF, FORWARD CURRENT (AMPS)
10
TJ = 125°C
TJ = 100°C
TJ = 25°C
0.1
0.0
TJ = -65°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
TJ = 100°C
TJ = 125°C
TJ = 25°C
0.1
0.0
1.0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
TJ = -65°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRA320T3G
1.E-01
IR, REVERSE CURRENT (AMPS)
1.E-01
1.E-02
1.E-02
1.E-03
TJ = 100°C
1.E-03
TJ = 100°C
TJ = 25°C
1.E-04
1.E-04
TJ = 25°C
1.E-05
1.E-06
IR, MAXIMUM REVERSE CURRENT (AMPS)
TYPICAL CHARACTERISTICS
0
5
1.E-05
10
15
20
1.E-06
0
5
VR, REVERSE VOLTAGE (V)
PFO, AVERAGE POWER DISSIPATION (W)
dc
4
SQUARE WAVE
3
2
1
70
80
90
100
110
120
130
6
5
SQUARE
WAVE
4
3
2
dc
1
0
0
1
TL, LEAD TEMPERATURE (°C)
2
TJ = 25°C
600
500
400
300
200
100
4
4
Figure 6. Forward Power Dissipation
700
0
0
3
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating
C, CAPACITANCE (pF)
IO, AVERAGE FORWARD CURRENT (AMPS)
RqJL = 15°C/W
60
20
Figure 4. Maximum Reverse Current
6
0
50
15
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
5
10
8
12
16
20
24
28
32
VR, REVERSE VOLTAGE (V)
Figure 7. Typical Capacitance
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3
36
40
5
MBRA320T3G
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
TYPICAL CHARACTERISTICS
1000
D = 0.5
100
10
1
0.2
0.1
0.05
0.02
0.01
0.1
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
10
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 8. Thermal Response, Junction-to-Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
1 0.02
0.01
0.1
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
t, TIME (S)
Figure 9. Thermal Response, Junction to Ambient (1 inch pad)
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4
1000
MBRA320T3G
PACKAGE DIMENSIONS
SMA
CASE 403D-02
ISSUE C
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.91
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.16
2.41
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.075
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.085
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.095
0.006
0.064
0.016
0.115
0.180
0.220
0.060
A
L
c
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your local
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MBRA320T3/D