SEMICONDUCTOR TECHNICAL DATA The MC10E/100E193 is an error detection and correction (EDAC) circuit. Modified Hamming parity codes are generated on an 8-bit word according to the pattern shown in the logic symbol. The P5 output gives the parity of the whole word. The word parity is also provided at the PGEN pin, after Odd/Even parity control and gating with the BPAR input. This output also feeds to a 1-bit shiftable register, for use as part of a scan ring. Used in conjunction with 12-bit parity generators such as the E160, a SECDED (single error correction, double error detection) error system can be designed for a multiple of an 8-bit word. • • • • • • ERROR DETECTION/ CORRECTION CIRCUIT Hamming Code Generation 8-Bit Word, Expandable Provides Parity of Whole Word Scannable Parity Register Extended 100E VEE Range of – 4.2V to – 5.46V FN SUFFIX PLASTIC PACKAGE CASE 776-02 75kΩ Input Pulldown Resistors B INPUTS 03 6 574 2 1 LOGIC DIAGRAM B2, B3, B6, B7 P2 Pinout: 28-Lead PLCC (Top View) B1, B3, B5, B7 EN P1 25 B4, B5, B6, B7 P4 BYTE (B0 – B7) P5 PGEN BPAR EV/OD 1 0 D 1 24 23 SHIFT CLK VCCO PGEN 22 21 20 19 EV/OD 26 18 PARERR BPAR 27 17 PARERR B0 28 16 VCC VEE 1 15 P5 B1 2 14 VCCO B2 3 13 P4 B3 4 12 P3 P3 B1, B2, B4, B7 0 HOLD S-IN PARERR 5 6 7 8 9 10 11 PARERR B4 B5 B6 B7 VCCO P1 P2 EN * All VCC and VCCO pins are tied together on the die. HOLD S-IN SHIFT CLK 7/96 Motorola, Inc. 1996 2–1 REV 3 MC10E193 MC100E193 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min 85°C typ max 150 min typ 150 max Unit 150 µA Condition mA 112 112 134 134 112 112 134 134 112 129 134 155 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic 25°C 85°C min typ max min typ max min typ max 1000 1150 850 1450 850 350 400 350 600 300 700 775 650 1000 550 1000 1150 850 1450 850 350 400 350 600 300 700 775 650 1000 550 1000 1150 850 1450 850 tPLH tPHL Propagation Delay to Output B to P1, P2, P3, P4 B to P5 EV/OD, BPAR to PGEN B to PGEN CLK to PARERR 350 400 350 600 300 700 775 650 1000 550 ts Setup Time SHIFT S-IN HOLD EN EV/OD BPAR B 400 300 750 500 1300 1300 1700 150 50 350 250 850 850 1100 400 300 750 500 1300 1300 1700 150 50 350 250 850 850 1100 400 300 750 500 1300 1300 1700 150 50 350 250 850 850 1100 Hold Time SHIFT S-IN HOLD EN EV/OD BPAR B 200 300 100 100 – 200 – 200 – 300 –150 – 50 – 350 – 250 – 850 – 850 –1100 200 300 100 100 – 200 – 200 – 300 –150 – 50 – 350 – 250 – 850 – 850 –1100 200 300 100 100 – 200 – 200 – 300 –150 – 50 – 350 – 250 – 850 – 850 –1100 300 700 300 700 300 700 th tr tf Rise/Fall Times 20 - 80% MOTOROLA Unit Condition ps ps ps ps 1100 2–2 1100 1100 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E193 MC100E193 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E193 MC100E193 Motorola reserves the right to make changes without further notice to any products herein. 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