SEMICONDUCTOR TECHNICAL DATA The MC10H115 is a quad differential amplifier designed for use in sensing differential signals over long lines. This 10H part is a functional/ pinout duplication of the standard MECL 10K family part, with 100% improvement in counting frequency and no increase in power–supply current. The base bias supply (VBB) is made available at Pin 9 to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary. Active current sources provide the MC10H115 with excellent common mode rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB (Pin 9) to prevent upsetting the current source bias network. L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 • Propagation Delay, 1.0 ns Typical • Power Dissipation 110 mW Typ/Pkg (No Load) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible LOGIC DIAGRAM MAXIMUM RATINGS Characteristic Symbol Power Supply (VCC = 0) Rating VEE Input Voltage (VCC = 0) Output Current — Continuous — Surge Operating Temperature Range Storage Temperature Range — Plastic — Ceramic Unit –8.0 to 0 Vdc VI 0 to VEE Vdc Iout 50 100 mA TA 0 to +75 °C Tstg –55 to +150 –55 to +165 °C °C VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 0° 25° Min Max Min Max Min Max Unit IE — 29 — 26 — 29 mA IinH — 150 — 95 — 95 µA Input Leakage Current ICBO — 1.5 — 1.0 — 1.0 µA Reference Voltage VBB –1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc High Output Voltage VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc Low Output Voltage VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage (1) VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage (1) VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc VCMR — — –2.85 to –0.8 — — Vdc VPP — — 150 typ — — mVPP tpd 0.4 1.3 0.4 1.3 0.45 1.45 ns Rise Time tr 0.5 1.4 0.5 1.5 0.5 1.6 ns Fall Time tf 0.5 1.4 0.5 1.5 0.5 1.6 ns Power Supply Current Input Current High Common Mode Range (3) Input Sensitivity (4) 3 10 11 14 13 12 15 VBB* 9 DIP PIN ASSIGNMENT AC PARAMETERS Propagation Delay 7 6 *VBB to be used to supply bias to the MC10H115 only and bypassed (when used) with 0.01 µF to 0.1 µF capacitor to ground (0 V). VBB can source < 1.0 mA. The MC10H115 is designed to be used in sensing differential signals over long lines. The bias supply (VBB) is made available to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary. Active current sources provide these receivers with excellent common–mode noise rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB to prevent unbalancing the current–source bias network. The MC10H115 does not have internal–input pull– down resistors. This provides high impedance to the amplifier input and facilitates differential connections. Applications: • Low Level Receiver • Voltage Level • Schmitt Trigger Interface 75° Symbol 2 When input pin with bubble goes positive its respective output pin with bubble goes positive. ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (2) Characteristic 4 5 VCC1 AOUT BOUT NOTES: 1. When VBB is used as the reference voltage. 2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. 3. Differential input not to exceed 1.0 Vdc. 4. 150 mVp–p differential input required to obtain full logic swing on output. 1 16 2 15 3 14 AIN AIN 4 13 5 12 BIN BIN 6 11 7 10 VEE 8 9 VCC2 DOUT COUT DIN DIN CIN CIN VBB Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 2–216 REV 5 MC10H115 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–217 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H115 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–218 *MC10H115/D* MC10H115/D MECL Data DL122 — Rev 6