Application Specific Discretes A.S.D.TM SA12B5 SA16B3 / SA16B6 SCHOTTKY ARRAYS MAIN APPLICATIONS Any electronic equipment where suitable bus termination is required to avoid signal reflections and distortions : PCs Workstations High frequency processor boards Dataline interface DESCRIPTION Dedicated to bus termination, the Schottky arrays SA12B5, SA16B3 and SA16B6 minimise stray emissions from PCB tracks. They provide suitable termination by avoiding signal reflexions and distortions. SO-16 FEATURES 12-BIT (SA12) OR 16-BIT (SA16) DUAL SCHOTTKY DIODE ARRAYS REVERSE VOLTAGE : VRRM = 7.5 V FORWARD VOLTAGE VF < 1.3 V BENEFITS Provides impedance matching, and minimizes distortion. Lowers EMI / RFI radiation. Eliminates negative voltage : minimizes risk of latch-up for sensitive ICs. Saves valuable space on board. SO-20 COMPLIES WITH FOLLOWING STANDARD : - MIL STD 883C - Method 3015-6 - class 3 - IEC1000-4-2 level 4 SSOP20 April 1999 - Ed: 1 1/5 SA12B5 / SA16B3 / SA16B6 FUNCTIONAL DIAGRAM (SO-16) VCC 1 16 2 15 3 14 4 13 5 12 6 11 7 VSS FUNCTIONAL DIAGRAM (SO-20 and SSOP20) VCC VCC 1 20 VCC 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 8 9 VSS VSS 10 11 VSS ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C) Symbol P Parameter and test conditions Power dissipation SO-20 SO-16 and SSOP20 Value Unit 1250 850 mW 7.5 V 8 kV VOP Maximum operating voltage (VCC - VSS) VPP Maximum electrostatic discharge MIL STD 883C - Method 3015-6 / IEC1000-4-2 contact Top Operating temperature range (see note 1) -40 to +85 °C Tstg Storage temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10s 260 °C Tj Maximum junction temperature 150 °C Note1: withinthe Top range, the SAxx keepon operating. The impacts of the ambient temperature are givenby derating curves on thefollowingpage. ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol Parameter and test conditions IR Leakage current @ VRRM = 7.5 V VF Forward voltage (see note 2) Capacitance Cd Typ. Max. Unit 5 1.05 1.3 16 µA Packages Value Unit SO-16 and SSOP20 SO-20 140 100 °C/W IPP = 18 mA IPP = 50 mA Vbias = 0V, F = 1MHz V pF Note 2: for both pull-up and pull-down schotty diodes. THERMAL RESISTANCE Symbol Rth(j-a) 2/5 Parameter Junction to ambient SA12B5 / SA16B3 / SA16B6 Fig1-1: Clamping forward voltage versus peak pulse current (typical values, low level). Fig1-2: Clamping forward voltage versus peak pulse current (typical values, high level). Ipp(A) Ipp(A) 1E+0 5.0 tp=2.5µs Tj=25°C tp=2.5µs Tj=25°C 1E-1 1.0 1E-2 Tj=85°C Tj=-40°C 1E-3 Vcl(V) Vcl(V) 1E-4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 Fig 2: Leakage current versus junction temperature (typical values). Fig 3: Non repetitive surge peak forward current versus pulse duration (rectangular waveform). 0 1 2 3 4 5 6 7 IFSM(A) IR(µA) 10 1E+2 Tj initial =25°C VR=7.5V 1E+1 5 1E+0 2 1E-1 tp(µs) Tj(°C) 1E-2 0 25 50 75 100 125 Fig 4: Non repetitive surge peak forward current versus initial junction temperature. 1 1 10 100 1000 Fig 5: Capacitance between input or output and ground versus applied voltage (typical values). Ci/o(pF) IFSM[Tj] / IFSM[Tj=25°C] 1.2 30 1.0 28 Vcc=5V F=1MHz Vosc=30mV 26 0.8 24 0.6 22 0.4 20 18 0.2 Tj(°C) 0.0 0 25 50 16 75 100 125 Vi/o-gnd(V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 3/5 SA12B5 / SA16B3 / SA16B6 TYPICAL APPLICATION VCC SAxxBx Bus µP High speed memory MARKING Type Package Marking SA12B5 SA16B3 SA16B6 SO16 SO20 SSOP20 SA12B5 SA16B3 SA16B6 PACKAGE MECHANICAL DATA SO-16 DIMENSIONS L REF. G Min. a2 A b e a1 E M 9 1 8 F (1) Weight : 0.160g b1 a1 (1) Do not include mold flash or protr usions.Mold flash or protr usions shall not exceed 0.15mm (0.006inches) Typ. Max. 1.75 0.069 0.20 0.004 0.008 1.6 0.063 b 0.35 0.46 0.014 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 c1 0.020 45°(typ.) D 9.8 10 0.386 0.394 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.150 0.158 G 4.6 5.3 0.181 0.209 L 0.5 1.27 0.020 0.050 0.75 0.030 M S 4/5 0.1 a2 D (1) 16 Inches Typ. Max. Min. A S e3 Millimeters c1 C 8°(typ.) SA12B5 / SA16B3 / SA16B6 PACKAGE MECHANICAL DATA SO-20 DIMENSIONS REF. A A1 B C D E e H h L K Weight : 0.520g Millimeters Inches Min. Typ. Max. Min. Typ. Max. 2.35 0.10 0.33 0.23 12.6 7.40 2.65 0.20 0.51 0.32 13.0 7.60 0.092 0.004 0.013 0.009 0.484 0.291 1.27 10.0 0.25 0.50 0.104 0.008 0.020 0.013 0.512 0.299 0.050 10.65 0.394 0.75 0.010 1.27 0.020 8° (max) 0.419 0.029 0.050 SSOP20 REF. L a2 A e b S D 20 11 1 10 F E a1 b1 A A1 A2 b c D E E1 e k L DIMENSIONS Millimeters Inches Min. Typ. Max. Min. 1.51 0.25 0.10 7.05 7.60 5.02 2.00 0.25 2.00 0.35 0.35 8.05 8.70 6.22 0° 0.25 0.30 6.10 0.65 0.50 Typ. Max. 0.079 0.010 0.059 0.079 0.010 0.012 0.014 0.004 0.014 0.278 0.317 0.299 0.343 0.198 0.240 0.245 0.026 10° 0° 10° 0.80 0.010 0.020 0.031 Weight : 0.180g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all informationprevious ly supplied. 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