SMBJ5.0A-TR,CA-TR SMBJ188A-TR,CA-TR ® TRANSILTM FEATURES ■ ■ ■ ■ ■ ■ PEAK PULSE POWER : 600 W (10/1000µs) STAND OFF VOLTAGE RANGE : From 5V to 188V. UNI AND BIDIRECTIONAL TYPES LOW CLAMPING FACTOR FAST RESPONSE TIME JEDEC REGISTERED PACKAGE OUTLINE DESCRIPTION The SMBJ series are TRANSILTM diodes designed specifically for protecting sensitive equipment against transient overvoltages. Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s. SMB (JEDEC DO-214AA) ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameter Peak pulse power dissipation (see note 1) Tj initial = Tamb Power dissipation on infinite heatsink Tamb = 50°C IFSM Non repetitive surge peak forward current for unidirectional types tp = 10ms Tj initial = Tamb Tstg Tj Storage temperature range Maximum junction temperature TL Maximum lead temperature for soldering during 10 s. PPP P Value Unit 600 W 5 W 100 A - 65 to + 175 150 °C °C 260 °C Value Unit Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCES Symbol Parameter Rth (j-l) Junction to leads 20 °C/W Rth (j-a) Junction to ambient on printed circuit on recommended pad layout 100 °C/W October 2001- Ed: 4 1/6 SMBJxxxA-TR, CA-TR ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol I IF Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop VCL V RM max. Bidirectional Mark. µA SMBJ5.0CA-TR BBZ 800 SMBJ6.0CA-TR BBA 800 SMBJ6.5CA-TR BBB 500 SMBJ8.5CA-TR BBC 5 SMBJ10CA-TR BBD 5 SMBJ12CA-TR BBE 5 SMBJ13AC-TR BBF 1 SMBJ15CA-TR BBG 1 SMBJ16CA-TR CBG 1 SMBJ18CA-TR BBH 1 SMBJ20CA-TR BBI 1 SMBJ22CA-TR CBH 1 SMBJ24CA-TR BBJ 1 SMBJ26CA-TR BBK 1 SMBJ28CA-TR BBL 1 SMBJ30CA-TR BBM 1 SMBJ33CA-TR BBN 1 SMBJ40CA-TR CBJ 1 SMBJ48CA-TR BBW 1 SMBJ58CA-TR BBO 1 SMBJ70CA-TR CBM 1 SMBJ85CA-TR BBQ 1 SMBJ100CA-TR CBQ 1 SMBJ130CA-TR BBS 1 SMBJ154CA-TR BBT 1 SMBJ170CA-TR BBU 1 SMBJ188CA-TR BBV 1 VCL @ IPP min. note2 V mA 6.4 10 6.7 10 7.2 10 9.4 1 11.1 1 13.3 1 14.4 1 16.7 1 17.8 1 20 1 22.2 1 24.4 1 26.7 1 28.9 1 31.1 1 33.3 1 36.7 1 44.4 1 53.3 1 64.4 1 77.8 1 94.4 1 111 1 144 1 171 1 189 1 209 1 max. 10/1000µs V A 9.2 68 10.3 61 11.2 56 14.4 41.7 17 37 19.9 31 21.5 29 24.4 25.1 26 23.1 29.2 21.5 32.4 19.4 35.5 17.7 38.9 16 42.1 14.9 45.4 13.8 48.4 13 53.3 11.8 64.5 9.7 77.4 8.1 93.6 6.7 113 5.5 137 4.6 162 3.8 209 3 246 2.4 275 2.2 328 2 VCL @ IPP αT max. max. 8/20µs note3 V A 10-4/°C 13.4 298 5.7 13.7 290 5.9 14.5 276 6.1 19.5 205 7.3 21.7 184 7.8 25.3 157 8.3 27.2 147 8.4 32.5 123 8.8 32.5 123 8.8 39.3 102 9.2 42.8 93 9.4 48.3 83 9.6 50 80 9.6 53.5 75 9.7 59 68 9.8 64.3 62 9.9 69.7 57 10.0 84 48 10.1 100 40 10.3 121 33 10.4 146 27 10.5 178 22.5 10.6 212 19 10.7 265 15 10.8 317 12.6 10.8 353 11.3 10.8 388 10.3 10.8 Note 3 : ∆VBR = αT * (Tamb - 25) * VBR(25°C). Note 4 : VR = 0 V, F = 1 MHz. For bidirectional types, 10 s capacitance value is divided by 2. PULSE WAVEFORM 10/1000 s 50 0 t 1000 s 2/6 V 5.0 6.0 6.5 8.5 10 12 13 15 16 18 20 22 24 26 28 30 33 40 48 58 70 85 100 130 154 170 188 VBR @ IR Note 2 : Pulse test : tp < 50 ms. % I PP 100 V I PP IRM @ VRM Mark. BUZ BUA BUB BUC BUD BUE BUF BUG CUG BUH BUI BVA BUJ BUK BUL BUM BUN CUJ BUW BUO CUM BUQ CUQ BUS BUT BUU BUV VF I RM Types Unidirectional SMBJ5.0A-TR SMBJ6.0A-TR SMBJ6.5A-TR SMBJ8.5A-TR SMBJ10A-TR SMBJ12A-TR SMBJ13A-TR SMBJ15A-TR SMBJ16A-TR SMBJ18A-TR SMBJ20A-TR SMBJ22A-TR SMBJ24A-TR SMBJ26A-TR SMBJ28A-TR SMBJ30A-TR SMBJ33A-TR SMBJ40A-TR SMBJ48A-TR SMBJ58A-TR SMBJ70A-TR SMBJ85A-TR SMBJ100A-TR SMBJ130A-TR SMBJ154A-TR SMBJ170A-TR SMBJ188A-TR VBR C typ. note4 pF 4000 3850 3700 2800 2300 2025 1900 1600 1600 1350 1250 1150 1112 1075 1000 950 900 800 700 625 550 500 450 400 360 350 330 SMBJxxxA-TR, CA-TR Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board). Fig. 2 : Peak pulse power versus exponential pulse duration. 3/6 SMBJxxxA-TR, CA-TR Fig. 3 : Clamping voltage versus peak pulse current. Exponential waveform tp = 20 µs ________ tp = 1 ms ——————tp = 10 ms ............... SMBJ188A SMBJ130A SMBJ58A SMBJ33A SMBJ18A SMBJ8.5A SMBJ5.0A Note : The curves of the figure 3 are specified for a junction temperature of 25 ⊃C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : ∆VBR = αT * [Tamb -25] * VBR(25°C) For intermediate voltages, extrapolate the given results. Fig. 4a : Capacitance versus reverse applied voltage for unidirectional types (typical values). Fig. 4b : Capacitance versus reverse applied voltage for bidirectional types (typical values). C (pF) C (pF) 10000 10000 Tj = 25°C F= 1 MHz Tj = 25°C F= 1 MHz SMBJ 5.0 SMBJ5.0A A 1000 SMBJ13A SMBJ26A SMBJ58A SMBJ188A 100 1000 SMBJ13 A SMBJ26 A SMBJ58 A SMBJ188 A 100 V R (V) V R (V) 10 1 4/6 10 100 500 10 1 10 100 500 SMBJxxxA-TR, CA-TR Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional types). Fig. 6 : Transient thermal impedance junction-ambient versus pulse duration. Mounting on FR4 PC Board with Recommended pad layout. Fig. 7 : Relative variation of leakage current versus junction temperature. ORDER CODE SM B J 85 C A -TR TAPE & REEL SURFACE MOUNT BIDIRECTIONAL No suffix: Unidirectional 600W STAND OFF VOLTAGE 5/6 SMBJxxxA-TR, CA-TR MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). PACKAGE MECHANICAL DATA SMB (Plastic) DIMENSIONS E1 REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. D A1 1.90 2.15 2.45 0.075 0.085 0.096 A2 0.05 0.15 0.20 0.002 0.006 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.40 5.60 0.201 0.213 0.220 E1 4.05 4.30 4.60 0.159 0.169 0.181 D 3.30 3.60 3.95 0.130 0.142 0.156 L 0.75 1.15 1.60 0.030 0.045 0.063 E c A1 A2 L b FOOTPRINT DIMENSIONS (Millimeter) SMD Plastic. 2.3 1.52 2.75 1.52 Packaging : standard packaging is in tape and reel. SOD15 = Standard packaging is in Film. Weight : 0.12 g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2001 STMicroelectronics - Printed in Italy - All rights reserved. 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