STMICROELECTRONICS STM961-15B

STM961-15B

RF POWER MODULE
DIGITAL CELLULAR APPLICATIONS
■
■
■
■
■
■
LINEAR POWER AMPLIFIER
915-960 MHz
26 VOLTS
INPUT/OUTPUT 50 OHMS
POUT = 42 dBm CW or PEP
GAIN = 30 dB
DESCRIPTION
The STM961-15B module is designed for digital
cellular radio base station applications in the
915-960 MHz frequency range operating at 26V.
The STM961-15B is designed to meet the low
distortion, high linearity requirements of modern
digital cellular base station equipment.
CASE STYLE H110
ORDER CODE
STM961-15B
BRANDING
STM961-15B
PIN CONNECTION
1. RF Input
2. VS1, 26V
3.VB, 26V
4. RF Output
ABSOLUTE MAXIMUM RATINGS (Tcase = 85 oC)
Symbol
V S1, V S2
Parameter
Valu e
Un it
DC Supply Voltage
28
Vdc
VB
DC Bias Voltage
28
Vdc
PI N
RF Input Power
14
dBm CW
P OUT
RF Output Power (V = 26V)
43
dBm CW
T STG
Storage Temperature
June 1999
- 30 to + 100
o
C
1/7
STM961-15B
ELECTRICAL SPECIFICATION (Tcase = -10 oC to +85oC, VS1 = 26 V, VB = 26 V to 27 V)
DYNAMIC
Symb ol
BW
GP
Parameter
T est Con ditio ns
Frequency Range
Min.
Typ .
915
Max.
Un it
960
MHz
Power G ain
P OUT = +42 dBm CW
28
30
dB
Efficiency
P OUT = +42 dBm CW
32
35
%
VSWR
P OUT = +42 dBm CW
Quiescent Current
P IN = 0 dBm
2F O
Harmonics
P OUT = +42 dBm CW
-30
dBc
3F O
Harmonics
P OUT = +42 dBm CW
-50
dBc
Gain F latness
P OUT = +42 dBm CW
h
IQ
F
P 1 dB
Z S , ZL = 50 Ω
2:1
580
Output Power @ 1
dB Compression
1
41
POUT = +42 dBm CW
Load Mismatch
VSW R = 3:1
Stability
P OUT = +10 dBm to +42 dBm
Load VSW R = 3:1 All phase angles
VSW R
mA
dB
dBm
No Degradation in Output
Power
All Spurious O utputs more
than 60db Below Carrier
REF. 1017332I
MODULE DC AND TEST FIXTURE CONFIGURATION
REF. 1014532D
2/7
STM961-15B
TYPICAL PERFORMANCE
Power Gain vs Output Power
34
Power Gain vs Output Power
Tcase = -10 deg.C
27.0 v
25. 0 v
26.0 v
27.0 v
26. 0 v
POWER GAIN [dB]
POWER GAIN [dB]
33 27.0 v
25. 0 v
32
Tcase= +25 deg.C
27. 0 v
31
26. 0 v
25.0 v
30
Tcase=-10 deg.C
27.0 v
34.5
26.0 v
33.5
26.0 v
32.5
f=960 MHz
30
Tcase=+25 deg.C
26.0 v
25.0 v
Tcase =+85 deg.C
f=915 MHz
Tcase= +85 deg.C
20
25.0 v
27.0 v
31.5
30.5
29
10
25.0 v
29.5
10
34 36 38 40 42
20
30
34 36 38 40 42
OUTPUT POWER [dBm]
OUTPUT POWER [dBm]
Power Gain vs Frequency & Temperature
3rd Order IMD vs Output Power & Temperature
34
-25
Tc=-10 deg.C
33
-30
3rd IMD [dBT]
POWER GAIN [dB]
Tcase=-10 deg.C
Tc=+25 deg .C
32
31
-35
Tcase=+85 deg.C
-40
Tcase=+25 deg.C
Tc=+85 deg .C
30
-45
Po=42 dBm CW
Vs=26.0 V
29
900
910
920
930
940
950
960
970
-50
20
980
Freq.=960 MHz
Vs=26.0 V
22
24
26
28
FREQUENCY [MHz]
30
32
34
36
38
40
42
PEP [dBm]
see note 1
3rd Order IMD vs Output Power & Temperature
5th Order IMD vs Output Power & Temperature
-26.5
-33
-38
-31.5
Tcase=-10 deg.C
-36.5
3rd IMD [dBT]
3rd IMD [dBT]
Tcase=-10 deg.C
Tcase=+85 deg.C
-41.5
Tcase=+25 deg.C
-43
-48
-53
-46.5
20
Freq.=915 MHz
Vs=26.0 V
22
24
26
28
30
32
34
36
38
40
Tcase=+25 deg.C
-58
42
20
PEP [dBm]
see note 1
Tcase=+85 deg.C
Freq.=960 MHz
Vs=26.0 V
22
24
26
28
30
32
34
36
38
40
42
PEP [dBm]
see note 1
3/7
STM961-15B
TYPICAL PERFORMANCE
5th Order IMD vs Output Power & Temperature
Efficiency vs Frequency
-33
Tcase=+25 deg.C
Po=42 dBm CW
38.5
Tcase=-10 deg.C
EFFICIENCY [%]
3rd IMD [dBT]
-38
-43
Tcase=+25 deg.C
-48
Tcase=+85 deg.C
Vs=25.0 V
37.5
36.5
Vs=26.0 V
-53
35.5
-58
Vs=27.0 V
Freq.=915 MHz
Vs=26.0 V
20
22
24
26
28
30
32
34
36
38
40
34.5
900
42
910
PEP [dBm]
920
930
940
950
960
970
980
FREQUENCY [MHz]
see note 1
CW Efficiency vs Output Power & Temperature
37
CW Efficiency vs Output Power & Temperature
37
Tcase=-10 deg.C
Tcase=-10 deg.C
Tcase=+25 deg.C
Tcase=+25 deg.C
32
27
22
Tcase=+85 deg.C
17
12
CW EFFICIENCY [%]
CW EFFICIENCY [%]
32
27
22
Tcase=+85 deg.C
17
12
Freq.=960 MHz
Vs=26.0 V
7
32
34
36
38
40
42
OUTPUT POWER [dBm]
7
32
Freq.=915 MHz
Vs=26.0 V
34
36
38
40
OUTPUT POWER [dBm]
VSWR vs Frequency & Temperature
Note (1) :
Two-tone test; 20KHz separation;
IMD (in dBT) is referenced to the individual tone level.
2
Vs=26.0 V
Po=42 dBm CW
1.8
Tcase=+85 deg.C
VSWR
1.6
Tcase=+25 deg.C
1.4
1.2
Tcase=-10 deg.C
1
900
910
920
930
940
950
FREQUENCY [MHz]
4/7
960
970
980
42
STM961-15B
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM961-15B power module should never
be operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
subjected to one or more of the maximum rating
conditions, care must be taken to monitor other
parameters which may be affected.
DECOUPLING
Failure to properly decouple any of the voltage
supply pins will result in oscillations at certain
operating frequencies. Therefore, it is
recommended that these pins be bypassed as
indicated in the Module DC and Test Fixture
Configuration drawing of this data sheet.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the
module should be flat to within ± 0.05mm (±
0.002 inch). The module should be mounted to
the heatsink using 3.5 mm (or 6-32) or
equivalent screws torqued to 5-6 kg-cm (4-6
in-lb).
The module leads should be attached to
equipment PC board using 180°C solder
applied to the leads with a properly grounded
soldering iron tip, not to exceed 195°C, applied
a minimum of 2 mm (0.080 inch) from the body
of the module for a duration not to exceed 15
seconds per lead. It is imperative that no other
portion of the module, other than the leads, be
subjected to temperatures in excess of 100°C
(maximum storage temperature), for any period
of time, as the plastic moulded cover, internal
components and sealing adhesives may be
adversely affected by such conditions.
Due to the construction techniques and
materials used within the module, reflow
soldering of the flange heatsink or leads, is not
recommended.
THERMAL CONSIDERATIONS
It will be necessary to provide a suitable
heatsink in order to maintain the module flange
temperature at or below to maximum case
operating temperature. In a case where the
module output power limited to +42 dBm CW
and designing for the worst case efficiency of
32%, the power dissipated by the module will
be 33.6 Watts. The heatsink must be designed
such that the thermal rise will be less than the
difference between the maximum operating
case temperature of the module while
dissipating 33.6 W.
At Tcase = +85 oC, V = 26V, ZL = 50 Ω and POUT
= 42 dBm, maximum junction temperatures for
the individual transistors should be below the
following values:
Q1 = 140 oC, Q2 = 145 oC, Q3 = 130 oC.
5/7
STM961-15B
H110 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
48.01
48.51
1.890
1.910
B
29.72
30.22
1.170
1.190
C
15.12
15.49
0.595
0.610
D
8.89
9.55
0.350
0.376
E
3.05
3.42
0.120
F
G
4.06
0.13
0.135
0.160
0.38
0.005
0.015
H
40.64
1.600
J
35.94
1.415
K
33.40
1.315
M
15.62
0.615
N
P
13.08
0.38
0.515
0.63
0.015
0.025
Q
3.81
4.06
0.150
0.160
R
17.40
19.55
0.685
0.770
S
8.77
9.77
0.345
0.385
T
4.52
5.72
0.178
0.225
1014273H
6/7
STM961-15B
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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