STMICROELECTRONICS UPSD3212A-40U6

uPSD3212A, uPSD3212C
uPSD3212CV
Flash Programmable System Devices with
8032 MCU with USB and Programmable Logic
FEATURES SUMMARY
■
■
■
■
■
FAST 8-BIT 8032 MCU
– 40MHz at 5.0V, 24MHz at 3.3V
– Core, 12-clocks per instruction
DUAL FLASH MEMORIES WITH MEMORY
MANAGEMENT
– Place either memory into 8032 program
address space or data address space
– READ-while-WRITE operation for InApplication Programming and EEPROM
emulation
– Single voltage program and erase
– 100K minimum erase cycles, 15-year
retention
CLOCK, RESET, AND SUPPLY
MANAGEMENT
– SRAM is Battery Backup capable
– Normal, Idle, and Power Down Modes
– Power-on and Low Voltage reset
supervisor
– Programmable Watchdog Timer
PROGRAMMABLE LOGIC, GENERAL
PURPOSE
– 16 macrocells
– Implements state machines, glue-logic,
and so forth
COMMUNICATION INTERFACES
– I2C Master/Slave bus controller
– Two UARTs with independent baud rate
– Six I/O ports with up to 46 I/O pins
– 8032 Address/Data bus available on
TQFP80 package
– 5 PWM outputs, 8-bit resolution
– USB v1.1, low-speed 1.5Mbps, 3
endpoints (uPSD3212A only)
December 2004
Figure 1. Packages
TQFP52 (T)
52-lead, Thin,
Quad, Flat
TQFP80 (U)
80-lead, Thin,
Quad, Flat
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■
■
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JTAG IN-SYSTEM PROGRAMMING
– Program the entire device in as little as
10 seconds
A/D CONVERTER
– Four channels, 8-bit resolution, 10µs
TIMERS AND INTERRUPTS
– Three 8032 standard 16-bit timers
– 10 Interrupt sources with two external
interrupt pins
Single Supply Voltage
– 4.5 to 5.5V
– 3.0 to 3.6V
1/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 1. Device Summary
Part Number
Max
1st
2nd
SRAM
Clock Flash
Flash
GPIO
(bytes)
(MHz) (bytes) (bytes)
USB
8032
Bus
VCC
(V)
Pkg.
Temp.
uPSD3212C-40T6
40
64K
16K
2K
37
No
No
4.5-5.5
TQFP52 –40°C to 85°C
uPSD3212CV-24T6
24
64K
16K
2K
37
No
No
3.0-3.6
TQFP52 –40°C to 85°C
uPSD3212C-40U6
40
64K
16K
2K
46
No
Yes
4.5-5.5
TQFP80 –40°C to 85°C
uPSD3212CV-24U6
24
64K
16K
2K
46
No
Yes
3.0-3.6
TQFP80 –40°C to 85°C
uPSD3212A-40T6
40
64K
16K
2K
37
Yes
No
4.5-5.5
TQFP52 –40°C to 85°C
uPSD3212A-40U6
40
64K
16K
2K
46
Yes
Yes
4.5-5.5
TQFP80 –40°C to 85°C
2/163
uPSD3212A, uPSD3212C, uPSD3212CV
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
52-PIN PACKAGE I/O PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ARCHITECTURE OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Data memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
XRAM-PSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SFR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Arithmetic Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Logical Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Data Transfers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Boolean Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Relative Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Jump Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Machine Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
uPSD3200 HARDWARE DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
MCU MODULE DISCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Special Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
INTERRUPT SYSTEM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
External Int0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 0 and 1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer 2 Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Int1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USB Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USART Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Priority Structure . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupts Enable Structure . . . . . . . . . . . . . . . . . . . . . . . .
How Interrupts are Handled . . . . . . . . . . . . . . . . . . . . . . . .
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POWER-SAVING MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Power Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3/163
uPSD3212A, uPSD3212C, uPSD3212CV
Idle Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
I/O PORTS (MCU Module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PORT Type and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
OSCILLATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
SUPERVISORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
External Reset . . . . . . . . . . . . . . .
Low VDD Voltage Reset . . . . . . . .
Watchdog Timer Overflow . . . . .
USB Reset . . . . . . . . . . . . . . . . . .
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WATCHDOG TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
TIMER/COUNTERS (TIMER 0, TIMER 1 AND TIMER 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Timer 0 and Timer 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Timer 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
STANDARD SERIAL INTERFACE (UART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Multiprocessor Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Serial Port Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
ANALOG-TO-DIGITAL CONVERTOR (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
ADC Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
PULSE WIDTH MODULATION (PWM). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
4-channel PWM Unit (PWM 0-3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Programmable Period 8-bit PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
PWM 4 Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
I2C INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Serial Status Register (S2STA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Data Shift Register (S2DAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Address Register (S2ADR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
USB HARDWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
USB related registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Receiver Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
External USB Pull-Up Resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
4/163
uPSD3212A, uPSD3212C, uPSD3212CV
In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET . . . . . . . . . . . . . . . . . . . . . . . . 92
PSD MODULE DETAILED OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
MEMORY BLOCKS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Primary Flash Memory and Secondary Flash memory Description . . . . . . . . . . . . . . . . . . . . . 93
Memory Block Select Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Power-down Instruction and Power-up Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Erasing Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Specific Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Sector Select and SRAM Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Page Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
The Turbo Bit in PSD MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Decode PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Output Macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Product Term Allocator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
I/O PORTS (PSD MODULE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
General Port Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
MCU I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Peripheral I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Ports A and B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
PLD Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
5/163
uPSD3212A, uPSD3212C, uPSD3212CV
PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Warm RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
I/O Pin, Register and PLD Status at RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . 127
Standard JTAG Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
JTAG Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Security and Flash memory Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Functional EMS (Electromagnetic Susceptibility) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Designing Hardened Software To Avoid Noise Problems . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Absolute Maximum Ratings (Electrical Sensitivity) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
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uPSD3212A, uPSD3212C, uPSD3212CV
SUMMARY DESCRIPTION
The uPSD321x Series combines a fast 8051based microcontroller with a flexible memory
structure, programmable logic, and a rich peripheral mix including USB, to form an ideal embedded
controller. At its core is an industry-standard 8032
MCU operating up to 40MHz.
A JTAG serial interface is used for In-System Programming (ISP) in as little as 10 seconds, perfect
for manufacturing and lab development.
The USB 1.1 low-speed interface has one Control
Endpoint and two Interrupt endpoints suitable for
HID class drivers.
The 8032 core is coupled to Programmable System Device (PSD) architecture to optimize the
8032 memory structure, offering two independent
banks of Flash memory that can be placed at virtually any address within 8032 program or data address space, and easily paged beyond 64K bytes
using on-chip programmable decode logic.
Dual Flash memory banks provide a robust solution for remote product updates in the field through
In-Application Programming (IAP). Dual Flash
banks also support EEPROM emulation, eliminating the need for external EEPROM chips.
General purpose programmable logic (PLD) is included to build an endless variety of glue-logic,
saving external logic devices. The PLD is configured using the software development tool, PSDsoft Express, available from the web at
www.st.com/psm, at no charge.
The uPSD321x also includes supervisor functions
such as a programmable watchdog timer and lowvoltage reset.
Figure 2. Block Diagram
uPSD321x
(3) 16-bit
Timer/
Counters
P3.0:7
1st Flash Memory:
64K Bytes
8032
MCU
Core
(2)
External
Interrupts
Programmable
Decode and
Page Logic
I2C
2nd Flash Memory:
16K Bytes
SRAM:
2K Bytes
(8) GPIO, Port 3
P1.0:7
(8) GPIO, Port 1
(4) 8-bit ADC
SYSTEM BUS
UART0
General
Purpose
Programmable
Logic,
16 Macrocells
(8) GPIO, Port A
(80-pin only)
PA0:7
(8) GPIO, Port B
PB0:7
(2) GPIO, Port D
PD1:2
(4) GPIO, Port C
PC0:7
UART1
P4.0:7
USB+,
USB–
JTAG ISP
(5) 8-bit PWM
8032 Address/Data/Control Bus
(80-pin device only)
(8) GPIO, Port 4
Supervisor:
Watchdog and Low-Voltage Reset
USB v1.1
VCC, VDD, GND, Reset, Crystal In
MCU
Bus
Dedicated
Pins
AI10428b
7/163
uPSD3212A, uPSD3212C, uPSD3212CV
40 P1.6/ADC2
41 P1.7/ADC3
42 PB7
43 PB6
44 RESET_
45 GND
46 VREF
47 PB5
48 PB4
49 PB3
50 PB2
51 PB1
52 PB0
Figure 3. TQFP52 Connections
PD1/CLKIN 1
39 P1.5/ADC1
PC7 2
38 P1.4/ADC0
JTAG TDO 3
37 P1.3/TXD1
JTAG TDI 4
USB–(1) 5
36 P1.2/RXD1
35 P1.1/T2X
PC4/TERR_ 6
34 P1.0/T2
USB+ 7
VCC 8
33 VCC
32 XTAL2
GND 9
31 XTAL1
PC3/TSTAT 10
30 P3.7/SCL1
PC2/VSTBY 11
JTAG TCK 12
29 P3.6/SDA1
28 P3.5/T1
JTAG TMS 13
P3.3/EXINT1 26
P3.2/EXINT0 25
P3.1/TXD 24
P3.0/RXD 23
P4.0 22
P4.1 21
GND 19
P4.2 20
P4.3/PWM0 18
P4.4/PWM1 17
P4.5/PWM2 16
P4.6/PWM3 15
P4.7/PWM4 14
27 P3.4/T0
AI07423c
Note: 1. Pull-up resistor required on pin 5 (2kΩ for 3V devices, 7.5kΩ for 5V devices).
8/163
uPSD3212A, uPSD3212C, uPSD3212CV
61 P1.6/ADC2
62 WR_
63 PSEN_
64 P1.7/ADC3
65 RD_
66 PB7
67 PB6
68 RESET_
70 VREF
69 GND
72 PB5
71 NC(2)
73 PB4
74 PB3
75 P3.0/RXD0
76 PB2
77 P3.1/TXD0
78 PB1
79 P3.2/EXINT0
80 PB0
Figure 4. TQFP80 Connections
PD2 1
60 P1.5/ADC1
P3.3 /EXINT1 2
59 P1.4/ADC0
PD1/CLKIN 3
58 P1.3/TXD1
ALE 4
57 A11
PC7 5
56 P1.2/RXD1
JTAG/TDO 6
55 A10
JTAG/TDI 7
USB–(1) 8
54 P1.1/TX2
53 A9
PC4/TERR_ 9
52 P1.0/T2
USB+ 10
NC(2) 11
51 A8
VCC 12
50 VCC
49 XTAL2
GND 13
48 XTAL1
PC3/TSTAT 14
47 AD7
PC2/VSTBY 15
JTAG TCK 16
NC(2) 17
46 P3.7/SCL1
P4.7/PWM4 18
43 AD5
P4.6/PWM3 19
42 P3.5/T1
45 AD6
44 P3.6/SDA1
JTAG TMS 20
P3.4/T0 40
AD3 39
AD2 38
AD1 37
AD0 36
PA0 35
PA1 34
P4.0 33
PA2 32
P4.1 31
P4.2 30
PA3 28
GND 29
P4.3/PWM0 27
PA4 26
P4.4/PWM1 25
PA5 24
P4.5/PWM2 23
PA6 22
PA7 21
41 AD4
AI07424c
Note: 1. Pull-up resistor required on pin 8 (2kΩ for 3V devices, 7.5kΩ for 5V devices).
2. NC = Not Connected.
9/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 2. 80-Pin Package Pin Description
Function
Signal
Name
Pin No.
AD0
36
I/O
External Bus
Multiplexed Address/Data bus A1/D1
AD1
37
I/O
Multiplexed Address/Data bus A0/D0
AD2
38
I/O
Multiplexed Address/Data bus A2/D2
AD3
39
I/O
Multiplexed Address/Data bus A3/D3
AD4
41
I/O
Multiplexed Address/Data bus A4/D4
AD5
43
I/O
Multiplexed Address/Data bus A5/D5
AD6
45
I/O
Multiplexed Address/Data bus A6/D6
AD7
47
I/O
Multiplexed Address/Data bus A7/D7
P1.0
T2
52
I/O
General I/O port pin
Timer 2 Count input
P1.1
TX2
54
I/O
General I/O port pin
Timer 2 Trigger input
P1.2
RxD1
56
I/O
General I/O port pin
2nd UART Receive
P1.3
TxD1
58
I/O
General I/O port pin
2nd UART Transmit
P1.4
ADC0
59
I/O
General I/O port pin
ADC Channel 0 input
P1.5
ADC1
60
I/O
General I/O port pin
ADC Channel 1 input
P1.6
ADC2
61
I/O
General I/O port pin
ADC Channel 2 input
P1.7
ADC3
64
I/O
General I/O port pin
ADC Channel 3 input
A8
51
O
External Bus, Address A8
A9
53
O
External Bus, Address A9
A10
55
O
External Bus, Address A10
A11
57
O
External Bus, Address A11
P3.0
RxD0
75
I/O
General I/O port pin
UART Receive
P3.1
TxD0
77
I/O
General I/O port pin
UART Transmit
P3.2
EXINT0
79
I/O
General I/O port pin
Interrupt 0 input / Timer 0 gate
control
P3.3
EXINT1
2
I/O
General I/O port pin
Interrupt 1 input / Timer 1 gate
control
P3.4
T0
40
I/O
General I/O port pin
Counter 0 input
P3.5
T1
42
I/O
General I/O port pin
Counter 1 input
P3.6
SDA1
44
I/O
General I/O port pin
I2C Bus serial data I/O
P3.7
SCL1
46
I/O
General I/O port pin
I2C Bus clock I/O
P4.0
33
I/O
General I/O port pin
P4.1
31
I/O
General I/O port pin
P4.2
30
I/O
General I/O port pin
27
I/O
General I/O port pin
Port Pin
P4.3
10/163
PWM0
In/Out
Basic
Alternate
8-bit Pulse Width Modulation
output 0
uPSD3212A, uPSD3212C, uPSD3212CV
Function
Signal
Name
Pin No.
P4.4
PWM1
25
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 1
P4.5
PWM2
23
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 2
P4.6
PWM3
19
I/O
General I/O port pin
8-bit Pulse Width Modulation
output 3
P4.7
PWM4
18
I/O
General I/O port pin
Programmable 8-bit Pulse Width
modulation output 4
USB–
8
I/O
Pull-up resistor required (2kΩ for 3V
devices, 7.5kΩ for 5V devices)
VREF
70
O
Reference Voltage input for ADC
RD_
65
O
READ signal, external bus
WR_
62
O
WRITE signal, external bus
PSEN_
63
O
PSEN signal, external bus
ALE
4
O
Address Latch signal, external bus
RESET_
68
I
Active low RESET input
XTAL1
48
I
Oscillator input pin for system clock
XTAL2
49
O
Oscillator output pin for system clock
PA0
35
I/O
General I/O port pin
PA1
34
I/O
General I/O port pin
PA2
32
I/O
General I/O port pin
PA3
28
I/O
General I/O port pin
PA4
26
I/O
General I/O port pin
PA5
24
I/O
General I/O port pin
PA6
22
I/O
General I/O port pin
PA7
21
I/O
General I/O port pin
PB0
80
I/O
General I/O port pin
PB1
78
I/O
General I/O port pin
PB2
76
I/O
General I/O port pin
PB3
74
I/O
General I/O port pin
PB4
73
I/O
General I/O port pin
PB5
72
I/O
General I/O port pin
PB6
67
I/O
General I/O port pin
PB7
66
I/O
General I/O port pin
Port Pin
In/Out
Basic
Alternate
1.
2.
3.
4.
1.
2.
3.
PLD Macro-cell outputs
PLD inputs
Latched Address Out (A0A7)
Peripheral I/O Mode
PLD Macro-cell outputs
PLD inputs
Latched Address Out (A0A7)
11/163
uPSD3212A, uPSD3212C, uPSD3212CV
Function
Signal
Name
Pin No.
JTAG TMS
20
I
JTAG pin
JTAG TCK
16
I
JTAG pin
PC2
VSTBY
15
I/O
General I/O port pin
PC3
TSTAT
14
I/O
General I/O port pin
PC4
TERR_
9
I/O
General I/O port pin
4.
JTAG TDI
7
I
JTAG pin
5.
JTAG TDO
6
O
JTAG pin
5
I/O
General I/O port pin
3
I/O
General I/O port pin
1.
2.
PLD I/O
Clock input to PLD and APD
PD2
1
I/O
General I/O port pin
1.
2.
PLD I/O
Chip select to PSD Module
Vcc
12
Vcc
50
GND
13
GND
29
GND
69
Port Pin
PC7
PD1
CLKIN
USB+
In/Out
Basic
Alternate
1.
2.
3.
PLD Macro-cell outputs
PLD inputs
SRAM stand by voltage input (VSTBY)
SRAM battery-on indicator
(PC4)
JTAG pins are dedicated
pins
10
NC
11
NC
17
NC
71
52-PIN PACKAGE I/O PORT
The 52-pin package members of the uPSD321x
Devices have the same port pins as those of the
80-pin package except:
– Port 0 (P0.0-P0.7, external address/data bus
AD0-AD7)
– Port 2 (P2.0-P2.3, external address bus A8A11)
12/163
–
–
–
Port A (PA0-PA7)
Port D (PD2)
Bus control signal (RD,WR,PSEN,ALE)
Pin 5 requires a pull-up resistor (2kΩ for 3V
devices, 7.5kΩ for 5V devices) for all devices.
uPSD3212A, uPSD3212C, uPSD3212CV
ARCHITECTURE OVERVIEW
Memory Organization
The uPSD321x Devices’s standard 8032 Core has
separate 64KB address spaces for Program memory and Data Memory. Program memory is where
the 8032 executes instructions from. Data memory
is used to hold data variables. Flash memory can
be mapped in either program or data space. The
Flash memory consists of two flash memory
blocks: the main Flash (512Kbit) and the Secondary Flash (128Kbit). Except during flash memory
programming or update, Flash memory can only
be read, not written to. A Page Register is used to
access memory beyond the 64K bytes address
space. Refer to the PSD Module for details on
mapping of the Flash memory.
The 8032 core has two types of data memory (internal and external) that can be read and written.
The internal SRAM consists of 256 bytes, and includes the stack area.
The SFR (Special Function Registers) occupies
the upper 128 bytes of the internal SRAM, the registers can be accessed by Direct addressing only.
Another 2K bytes resides in the PSD Module that
can be mapped to any address space defined by
the user.
Figure 5. Memory Map and Address Space
MAIN
FLASH
EXT. RAM
INT. RAM
SFR
Indirect
Addressing
Direct
Addressing
FF
SECONDARY
FLASH
64KB
7F
16KB
2KB
Indirect
or
Direct
Addressing
0
Flash Memory Space
Internal RAM Space
(256 Bytes)
External RAM Space
(MOVX)
AI07425
13/163
uPSD3212A, uPSD3212C, uPSD3212CV
Registers
The 8032 has several registers; these are the Program Counter (PC), Accumulator (A), B Register
(B), the Stack Pointer (SP), the Program Status
Word (PSW), General purpose registers (R0 to
R7), and DPTR (Data Pointer register).
Accumulator. The Accumulator is the 8-bit general purpose register, used for data operation such
as transfer, temporary saving, and conditional
tests. The Accumulator can be used as a 16-bit
register with B Register as shown in Figure 6.
B Register. The B Register is the 8-bit general
purpose register, used for an arithmetic operation
such as multiply, division with the Accumulator
(see Figure 7).
Stack Pointer. The Stack Pointer Register is 8
bits wide. It is incremented before data is stored
during PUSH and CALL executions. While the
stack may reside anywhere in on-chip RAM, the
Stack Pointer is initialized to 07h after reset. This
causes the stack to begin at location 08h (see Figure 8).
Program Counter. The Program Counter is a 16bit wide which consists of two 8-bit registers, PCH
and PCL. This counter indicates the address of the
next instruction to be executed. In RESET state,
the program counter has reset routine address
(PCH:00h, PCL:00h).
Program Status Word. The Program Status
Word (PSW) contains several bits that reflect the
current state of the CPU and select Internal RAM
(00h to 1Fh: Bank0 to Bank3). The PSW is described in Figure 9., page 15. It contains the Carry
Flag, the Auxiliary Carry Flag, the Half Carry (for
BCD operation), the general purpose flag, the
Register Bank Select Flags, the Overflow Flag,
and Parity Flag.
[Carry Flag, CY]. This flag stores any carry or not
borrow from the ALU of CPU after an arithmetic
operation and is also changed by the Shift Instruction or Rotate Instruction.
[Auxiliary Carry Flag, AC]. After operation, this is
set when there is a carry from Bit 3 of ALU or there
is no borrow from Bit 4 of ALU.
[Register Bank Select Flags, RS0, RS1]. This flags
select one of
four bank(00~07H:bank0,
08~0Fh:bank1, 10~17h:bank2, 17~1Fh:bank3) in
Internal RAM.
[Overflow Flag, OV]. This flag is set to '1' when an
overflow occurs as the result of an arithmetic operation involving signs. An overflow occurs when the
result of an addition or subtraction exceeds +127
(7Fh) or -128 (80h). The CLRV instruction clears
the overflow flag. There is no set instruction. When
the BIT instruction is executed, Bit 6 of memory is
copied to this flag.
14/163
[Parity Flag, P]. This flag reflects on number of Accumulator’s “1.” If the number of Accumulator’s 1
is odd, P=0. otherwise, P=1. The sum of adding
Accumulator’s 1 to P is always even.
R0~R7. General purpose 8-bit registers that are
locked in the lower portion of internal data area.
Data Pointer Register. Data Pointer Register is
16-bit wide which consists of two-8bit registers,
DPH and DPL. This register is used as a data
pointer for the data transmission with external data
memory in the PSD Module.
Figure 6. 8032 MCU Registers
A
Accumulator
B
B Register
Stack Pointer
SP
PCH
PCL
Program Counter
PSW
Program Status Word
General Purpose
Register (Bank0-3)
Data Pointer Register
R0-R7
DPTR(DPH)
DPTR(DPL)
AI06636
Figure 7. Configuration of BA 16-bit Registers
B
B
A
A
Two 8-bit Registers can be used as a "BA" 16-bit Registers
AI06637
Figure 8. Stack Pointer
Stack Area (30h-FFh)
Bit 15
Bit 8 Bit 7
00h
Hardware Fixed
Bit 0
SP
00h-FFh
SP (Stack Pointer) could be in 00h-FFh
AI06638
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 9. PSW (Program Status Word) Register
MSB
PSW
CY AC FO RS1 RS0 OV
LSB
P Reset Value 00h
Parity Flag
Carry Flag
Auxillary Carry Flag
Bit not assigned
General Purpose Flag
Overflow Flag
Register Bank Select Flags
(to select Bank0-3)
AI06639
Program Memory
The program memory consists of two Flash memory: 64KByte Main Flash and 16KByte of Secondary Flash. The Flash memory can be mapped to
any address space as defined by the user in the
PSDsoft Tool. It can also be mapped to Data
memory space during Flash memory update or
programming.
After reset, the CPU begins execution from location 0000h. As shown in Figure 10, each interrupt
is assigned a fixed location in Program Memory.
The interrupt causes the CPU to jump to that location, where it commences execution of the service
routine. External Interrupt 0, for example, is assigned to location 0003h. If External Interrupt 0 is
going to be used, its service routine must begin at
location 0003h. If the interrupt is not going to be
used, its service location is available as general
purpose Program Memory.
The interrupt service locations are spaced at 8byte intervals: 0003h for External Interrupt 0,
000Bh for Timer 0, 0013h for External Interrupt 1,
001Bh for Timer 1 and so forth. If an interrupt service routine is short enough (as is often the case
in control applications), it can reside entirely within
that 8-byte interval (see Figure 10). Longer service
routines can use a jump instruction to skip over
subsequent interrupt locations, if other interrupts
are in use.
Data memory
The internal data memory is divided into four physically separated blocks: 256 bytes of internal RAM,
128 bytes of Special Function Registers (SFRs)
areas and 2K bytes (XRAM-PSD) in the PSD Module.
RAM
Four register banks, each 8 registers wide, occupy
locations 0 through 31 in the lower RAM area.
Only one of these banks may be enabled at a time.
The next 16 bytes, locations 32 through 47, contain 128 directly addressable bit locations. The
stack depth is only limited by the available internal
RAM space of 256 bytes.
XRAM-PSD
The 2K bytes of XRAM-PSD resides in the PSD
Module and can be mapped to any address space
through the DPLD (Decoding PLD) as defined by
the user in PSDsoft Development tool. The XRAMPSD has a battery backup feature that allow the
data to be retained in the event of a power lost.
The battery is connected to the Port C PC2 pin.
This pin must be configured in PSDSoft to be battery back-up.
Figure 10. Interrupt Location of Program
Memory
Interrupt
Location
•
•
•
•
•
008Bh
•
•
•
•
0013h
8 Bytes
000Bh
0003h
Reset
0000h
AI06640
15/163
uPSD3212A, uPSD3212C, uPSD3212CV
SFR
The SFRs can only be addressed directly in the
address range from 80h to FFh. Table
15., page 28 gives an overview of the Special
Function Registers. Sixteen address in the SFRs
space are both-byte and bit-addressable. The bitaddressable SFRs are those whose address ends
in 0h and 8h. The bit addresses in this area are
80h to FFh.
Table 3. RAM Address
Byte Address
(in Hexadecimal)
Byte Address
(in Decimal)
↓
↓
FFh
255
30h
48
msb
Bit Address (Hex)
lsb
2Fh
7F
7E
7D
7C
7B
7A
79
78
47
2Eh
77
76
75
74
73
72
71
70
46
2Dh
6F
6E
6D
6C
6B
6A
69
68
45
2Ch
67
66
65
64
63
62
61
60
44
2Bh
5F
5E
5D
5C
5B
5A
59
58
43
2Ah
57
56
55
54
53
52
51
50
42
29h
4F
4E
4D
4C
4B
4A
49
48
41
28h
47
46
45
44
43
42
41
40
40
27h
3F
3E
3D
3C
3B
3A
39
38
39
26h
37
36
35
34
33
32
31
30
38
25h
2F
2E
2D
2C
2B
2A
29
28
37
24h
27
26
25
24
23
22
21
20
36
23h
1F
1E
1D
1C
1B
1A
19
18
35
22h
17
16
15
14
13
12
11
10
34
21h
0F
0E
0D
0C
0B
0A
09
08
33
20h
07
06
05
04
03
02
01
00
32
1Fh
Register Bank 3
24
17h
23
Register Bank 2
10h
Figure 11. Direct Addressing
Program Memory
3Eh
04
A
AI06641
(2) Indirect addressing. In indirect addressing
the instruction specifies a register which contains
the address of the operand. Both internal and external RAM can be indirectly addressed. The address register for 8-bit addresses can be R0 or R1
of the selected register bank, or the Stack Pointer.
The address register for 16-bit addresses can only
be the 16-bit “data pointer” register, DPTR.
Example:
mov @R1, #40 H ;[R1] <-----40H
Figure 12. Indirect Addressing
Program Memory
55h
40h
R1
55
16
0Fh
15
Register Bank 1
08h
8
07h
7
Register Bank 0
16/163
(1) Direct addressing. In a direct addressing the
operand is specified by an 8-bit address field in the
instruction. Only internal Data RAM and SFRs
(80~FFH RAM) can be directly addressed.
Example:
mov A, 3EH ;A <----- RAM[3E]
31
18h
00h
Addressing Modes
The addressing modes in uPSD321x Devices instruction set are as follows
■
Direct addressing
■
Indirect addressing
■
Register addressing
■
Register-specific addressing
■
Immediate constants addressing
■
Indexed addressing
0
AI06642
uPSD3212A, uPSD3212C, uPSD3212CV
(3) Register addressing. The register banks,
containing registers R0 through R7, can be accessed by certain instructions which carry a 3-bit
register specification within the opcode of the instruction. Instructions that access the registers
this way are code efficient, since this mode eliminates an address byte. When the instruction is executed, one of four banks is selected at execution
time by the two bank select bits in the PSW.
Example:
mov PSW, #0001000B ; select Bank0
mov A, #30H
mov R1, A
(4) Register-specific addressing. Some
instructions are specific to a certain register. For example, some instructions always operate on the
Accumulator, or Data Pointer, etc., so no address
byte is needed to point it. The opcode itself does
that.
(5) Immediate constants addressing. The value of a constant can follow the opcode in Program
memory.
Example:
mov A, #10H.
(6) Indexed addressing. Only Program memory
can be accessed with indexed addressing, and it
can only be read. This addressing mode is intended for reading look-up tables in Program memory.
A 16-bit base register (either DPTR or PC) points
to the base of the table, and the Accumulator is set
up with the table entry number. The address of the
table entry in Program memory is formed by adding the Accumulator data to the base pointer (see
Figure 13).
Example:
movc A, @A+DPTR
Figure 13. Indexed Addressing
ACC
3Ah
DPTR
1E73h
Arithmetic Instructions
The arithmetic instructions is listed in Table
4., page 18. The table indicates the addressing
modes that can be used with each instruction to
access the <byte> operand. For example, the
ADD A, <byte> instruction can be written as:
ADD a, 7FH (direct addressing)
ADD A, @R0 (indirect addressing)
ADD a, R7 (register addressing)
ADD A, #127 (immediate constant)
Note: Any byte in the internal Data Memory space
can be incremented without going through the Accumulator.
One of the INC instructions operates on the 16-bit
Data Pointer. The Data Pointer is used to generate
16-bit addresses for external memory, so being
able to increment it in one 16-bit operations is
a useful feature.
The MUL AB instruction multiplies the Accumulator by the data in the B register and puts the 16-bit
product into the concatenated B and Accumulator
registers.
The DIV AB instruction divides the Accumulator by
the data in the B register and leaves the 8-bit quotient in the Accumulator, and the 8-bit remainder in
the B register.
In shift operations, dividing a number by 2n shifts
its “n” bits to the right. Using DIV AB to perform the
division completes the shift in 4?s and leaves the
B register holding the bits that were shifted out.
The DAA instruction is for BCD arithmetic operations. In BCD arithmetic, ADD and ADDC instructions should always be followed by a DAA
operation, to ensure that the result is also in BCD.
Note: DAA will not convert a binary number to
BCD. The DAA operation produces a meaningful
result only as the second step in the addition of
two BCD bytes.
Program Memory
3Eh
AI06643
17/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 4. Arithmetic Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
ADD A,<byte>
A = A + <byte>
X
X
X
X
ADDC A,<byte>
A = A + <byte> + C
X
X
X
X
SUBB A,<byte>
A = A – <byte> – C
X
X
X
X
INC
A=A+1
INC <byte>
<byte> = <byte> + 1
INC DPTR
DPTR = DPTR + 1
Data Pointer only
DEC
A=A–1
Accumulator only
DEC <byte>
<byte> = <byte> – 1
MUL AB
B:A = B x A
Accumulator and B only
DIV AB
A = Int[ A / B ]
B = Mod[ A / B ]
Accumulator and B only
DA A
Decimal Adjust
Accumulator only
Logical Instructions
Table 5., page 19 shows list of uPSD321x Devices logical instructions. The instructions that perform Boolean operations (AND, OR, Exclusive
OR, NOT) on bytes perform the operation on a bitby-bit basis. That is, if the Accumulator contains
00110101B and byte contains 01010011B, then:
ANL A, <byte>
will leave the Accumulator holding 00010001B.
The addressing modes that can be used to access
the <byte> operand are listed in Table 5.
The ANL A, <byte> instruction may take any of the
forms:
ANL A,7FH(direct addressing)
ANL A, @R1 (indirect addressing)
ANL A,R6 (register addressing)
ANL A,#53H (immediate constant)
Note: Boolean operations can be performed on
any byte in the internal Data Memory space without going through the Accumulator. The XRL
<byte>, #data instruction, for example, offers a
quick and easy way to invert port bits, as in
XRL P1, #0FFH.
18/163
Accumulator only
X
X
X
X
X
X
If the operation is in response to an interrupt, not
using the Accumulator saves the time and effort to
push it onto the stack in the service routine.
The Rotate instructions (RL A, RLC A, etc.) shift
the Accumulator 1 bit to the left or right. For a left
rotation, the MSB rolls into the LSB position. For a
right rotation, the LSB rolls into the MSB position.
The SWAP A instruction interchanges the high
and low nibbles within the Accumulator. This is a
useful operation in BCD manipulations. For example, if the Accumulator contains a binary number
which is known to be less than 100, it can be quickly converted to BCD by the following code:
MOVE B,#10
DIV AB
SWAP A
ADD A,B
Dividing the number by 10 leaves the tens digit in
the low nibble of the Accumulator, and the ones
digit in the B register. The SWAP and ADD instructions move the tens digit to the high nibble of the
Accumulator, and the ones digit to the low nibble.
uPSD3212A, uPSD3212C, uPSD3212CV
Table 5. Logical Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
X
X
X
X
X
X
X
X
X
ANL A,<byte>
A = A .AND. <byte>
X
ANL <byte>,A
A = <byte> .AND. A
X
ANL <byte>,#data
A = <byte> .AND. #data
X
ORL A,<byte>
A = A .OR. <byte>
X
ORL <byte>,A
A = <byte> .OR. A
X
ORL <byte>,#data
A = <byte> .OR. #data
X
XRL A,<byte>
A = A .XOR. <byte>
X
XRL <byte>,A
A = <byte> .XOR. A
X
XRL <byte>,#data
A = <byte> .XOR. #data
X
CRL A
A = 00h
Accumulator only
CPL A
A = .NOT. A
Accumulator only
RL A
Rotate A Left 1 bit
Accumulator only
RLC A
Rotate A Left through Carry
Accumulator only
RR A
Rotate A Right 1 bit
Accumulator only
RRC A
Rotate A Right through Carry
Accumulator only
SWAP A
Swap Nibbles in A
Accumulator only
19/163
uPSD3212A, uPSD3212C, uPSD3212CV
Data Transfers
Internal RAM. Table 6 shows the menu of instructions that are available for moving data
around within the internal memory spaces, and the
addressing modes that can be used with each
one. The MOV <dest>, <src> instruction allows
data to be transferred between any two internal
RAM or SFR locations without going through the
Accumulator. Remember, the Upper 128 bytes of
data RAM can be accessed only by indirect addressing, and SFR space only by direct addressing.
Note: In uPSD321x Devices, the stack resides in
on-chip RAM, and grows upwards. The PUSH instruction first increments the Stack Pointer (SP),
then copies the byte into the stack. PUSH and
POP use only direct addressing to identify the byte
being saved or restored, but the stack itself is accessed by indirect addressing using the SP register. This means the stack can go into the Upper
128 bytes of RAM, if they are implemented, but not
into SFR space.
The Data Transfer instructions include a 16-bit
MOV that can be used to initialize the Data Pointer
(DPTR) for look-up tables in Program Memory.
The XCH A, <byte> instruction causes the Accumulator and ad-dressed byte to exchange data.
The XCHD A, @Ri instruction is similar, but only
the low nibbles are involved in the exchange. To
see how XCH and XCHD can be used to facilitate
data manipulations, consider first the problem of
shifting and 8-digit BCD number two digits to the
right. Table 8., page 21 shows how this can be
done using XCH instructions. To aid in understanding how the code works, the contents of the
registers that are holding the BCD number and the
content of the Accumulator are shown alongside
each instruction to indicate their status after the instruction has been executed.
After the routine has been executed, the Accumulator contains the two digits that were shifted out
on the right. Doing the routine with direct MOVs
uses 14 code bytes. The same operation with
XCHs uses only 9 bytes and executes almost
twice as fast. To right-shift by an odd number of
digits, a one-digit must be executed. Table
9., page 21 shows a sample of code that will rightshift a BCD number one digit, using the XCHD instruction. Again, the contents of the registers holding the number and of the accumulator are shown
alongside each instruction.
Table 6. Data Transfer Instructions that Access Internal Data Memory Space
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
Imm
X
MOV A,<src>
A = <src>
X
X
X
MOV <dest>,A
<dest> = A
X
X
X
MOV <dest>,<src>
<dest> = <src>
X
X
X
MOV DPTR,#data16
DPTR = 16-bit immediate constant
PUSH <src>
INC SP; MOV “@SP”,<src>
X
POP <dest>
MOV <dest>,”@SP”; DEC SP
X
XCH A,<byte>
Exchange contents of A and <byte>
X
XCHD A,@Ri
Exchange low nibbles of A and @Ri
20/163
X
X
X
X
X
uPSD3212A, uPSD3212C, uPSD3212CV
First, pointers R1 and R0 are set up to point to the
two bytes containing the last four BCD digits. Then
a loop is executed which leaves the last byte, location 2EH, holding the last two digits of the shifted
number. The pointers are decremented, and the
loop is repeated for location 2DH. The CJNE instruction (Compare and Jump if Not equal) is a
loop control that will be described later. The loop
executed from LOOP to CJNE for R1 = 2EH, 2DH,
2CH, and 2BH. At that point the digit that was originally shifted out on the right has propagated to location 2AH. Since that location should be left with
0s, the lost digit is moved to the Accumulator.
Table 7. Shifting a BCD Number Two Digits to
the Right (using direct MOVs: 14 bytes)
2A
2B
2C
2D
2E
ACC
MOV
A,2Eh
00
12
34
56
78
78
MOV
2Eh,2Dh
00
12
34
56
56
78
MOV
2Dh,2Ch
00
12
34
34
56
78
MOV
2Ch,2Bh
00
12
12
34
56
78
MOV
2Bh,#0
00
00
12
34
56
78
Table 8. Shifting a BCD Number Two Digits to
the Right (using direct XCHs: 9 bytes)
2A
2B
2C
2D
2E
ACC
CLR
A
00
12
34
56
78
00
XCH
A,2Bh
00
00
34
56
78
12
XCH
A,2Ch
00
00
12
56
78
34
XCH
A,2Dh
00
00
12
34
78
56
XCH
A,2Eh
00
00
12
34
56
78
Table 9. Shifting a BCD Number One Digit to the Right
2A
2B
2C
2D
2E
ACC
MOV
R1,#2Eh
00
12
34
56
78
xx
MOV
R0,#2Dh
00
12
34
56
78
xx
; loop for R1 = 2Eh
LOOP:
MOV
A,@R1
00
12
34
56
78
78
XCHD
A,@R0
00
12
34
58
78
76
SWAP
A
00
12
34
58
78
67
MOV
@R1,A
00
12
34
58
67
67
DEC
R1
00
12
34
58
67
67
DEC
R0
00
12
34
58
67
67
CNJE
R1,#2Ah,LOOP
00
12
34
58
67
67
; loop for R1 = 2Dh
00
12
38
45
67
45
; loop for R1 = 2Ch
00
18
23
45
67
23
; loop for R1 = 2Bh
08
01
23
45
67
01
CLR
A
08
01
23
45
67
00
XCH
A,2Ah
00
01
23
45
67
08
21/163
uPSD3212A, uPSD3212C, uPSD3212CV
External RAM. Table 10 shows a list of the Data
Transfer instructions that access external Data
Memory. Only indirect addressing can be used.
The choice is whether to use a one-byte address,
@Ri, where Ri can be either R0 or R1 of the selected
register
bank,
or
a
two-byte
address, @DTPR.
Note: In all external Data RAM accesses, the Accumulator is always either the destination or
source of the data.
Lookup Tables. Table 11 shows the two instructions that are available for reading lookup tables in
Program Memory. Since these instructions access
only Program Memory, the lookup tables can only
be read, not updated.
The mnemonic is MOVC for “move constant.” The
first MOVC instruction in Table 11 can accommodate a table of up to 256 entries numbered 0
through 255. The number of the desired entry is
loaded into the Accumulator, and the Data Pointer
is set up to point to the beginning of the table.
Then:
MOVC A, @A+DPTR
copies the desired table entry into the Accumulator.
The other MOVC instruction works the same way,
except the Program Counter (PC) is used as the
table base, and the table is accessed through a
subroutine. First the number of the desired en-try
is loaded into the Accumulator, and the subroutine
is called:
MOV A , ENTRY NUMBER
CALL TABLE
The subroutine “TABLE” would look like this:
TABLE: MOVC A , @A+PC
RET
The table itself immediately follows the RET (return) instruction is Program Memory. This type of
table can have up to 255 entries, numbered 1
through 255. Number 0 cannot be used, because
at the time the MOVC instruction is executed, the
PC contains the address of the RET instruction.
An entry numbered 0 would be the RET opcode itself.
Table 10. Data Transfer Instruction that Access External Data Memory Space
Address Width
Mnemonic
Operation
8 bits
MOVX A,@Ri
READ external RAM @Ri
8 bits
MOVX @Ri,A
WRITE external RAM @Ri
16 bits
MOVX A,@DPTR
READ external RAM @DPTR
16 bits
MOVX @DPTR,a
WRITE external RAM @DPTR
Table 11. Lookup Table READ Instruction
22/163
Mnemonic
Operation
MOVC A,@A+DPTR
READ program memory at (A+DPTR)
MOVC A,@A+PC
READ program memory at (A+PC)
uPSD3212A, uPSD3212C, uPSD3212CV
Boolean Instructions
The uPSD321x Devices contain a complete Boolean (single-bit) processor. One page of the internal RAM contains 128 addressable bits, and the
SFR space can support up to 128 addressable bits
as well. All of the port lines are bit-addressable,
and each one can be treated as a separate singlebit port. The instructions that access these bits are
not just conditional branches, but a complete
menu of move, set, clear, complement, OR and
AND instructions. These kinds of bit operations
are not easily obtained in other architectures with
any amount of byte-oriented software.
The instruction set for the Boolean processor is
shown in Table 12. All bits accesses are by direct
addressing.
Bit addresses 00h through 7Fh are in the Lower
128, and bit addresses 80h through FFh are in
SFR space.
Note how easily an internal flag can be moved to
a port pin:
MOV C,FLAG
MOV P1.0,C
In this example, FLAG is the name of any addressable bit in the Lower 128 or SFR space. An I/O
line (the LSB of Port 1, in this case) is set or
cleared depending on whether the Flag Bit is '1' or
'0.'
The Carry Bit in the PSW is used as the single-bit
Accumulator of the Boolean processor. Bit instructions that refer to the Carry Bit as C assemble as
Carry-specific instructions (CLR C, etc.). The Carry Bit also has a direct address, since it resides in
the PSW register, which is bit-addressable.
Note: The Boolean instruction set includes ANL
and ORL operations, but not the XRL (Exclusive
OR) operation. An XRL operation is simple to implement in software. Suppose, for example, it is required to form the Exclusive OR of two bits:
C = bit 1 .XRL. bit2
The software to do that could be as follows:
MOV C , bit1
JNB bit2, OVER
CPL C
OVER: (continue)
First, Bit 1 is moved to the Carry. If bit2 = 0, then
C now contains the correct result. That is, Bit 1
.XRL. bit2 = bit1 if bit2 = 0. On the other hand, if
bit2 = 1, C now contains the complement of the
correct result. It need only be inverted (CPL C) to
complete the operation.
This code uses the JNB instruction, one of a series
of bit-test instructions which execute a jump if the
addressed bit is set (JC, JB, JBC) or if the addressed bit is not set (JNC, JNB). In the above
case, Bit 2 is being tested, and if bit2 = 0, the CPL
C instruction is jumped over.
JBC executes the jump if the addressed bit is set,
and also clears the bit. Thus a flag can be tested
and cleared in one operation. All the PSW bits are
directly addressable, so the Parity Bit, or the general-purpose flags, for example, are also available
to the bit-test instructions.
Relative Offset
The destination address for these jumps is specified to the assembler by a label or by an actual address in Program memory. How-ever, the
destination address assembles to a relative offset
byte. This is a signed (two’s complement) offset
byte which is added to the PC in two’s complement
arithmetic if the jump is executed.
The range of the jump is therefore -128 to +127
Program Memory bytes relative to the first byte following the instruction.
Table 12. Boolean Instructions
Mnemonic
Operation
ANL C,bit
C = A .AND. bit
ANL C,/bit
C = C .AND. .NOT. bit
ORL C,bit
C = A .OR. bit
ORL C,/bit
C = C .OR. .NOT. bit
MOV C,bit
C = bit
MOV bit,C
bit = C
CLR C
C=0
CLR bit
bit = 0
SETB C
C=1
SETB bit
bit = 1
CPL C
C = .NOT. C
CPL bit
bit = .NOT. bit
JC rel
Jump if C =1
JNC rel
Jump if C = 0
JB bit,rel
Jump if bit =1
JNB bit,rel
Jump if bit = 0
JBC bit,rel
Jump if bit = 1; CLR bit
23/163
uPSD3212A, uPSD3212C, uPSD3212CV
Jump Instructions
Table 13 shows the list of unconditional jump instructions. The table lists a single “JMP add” instruction, but in fact there are three SJMP, LJMP,
and AJMP, which differ in the format of the destination address. JMP is a generic mnemonic which
can be used if the programmer does not care
which way the jump is en-coded.
The SJMP instruction encodes the destination address as a relative offset, as described above. The
instruction is 2 bytes long, consisting of the opcode and the relative offset byte. The jump distance is limited to a range of -128 to +127 bytes
relative to the instruction following the SJMP.
The LJMP instruction encodes the destination address as a 16-bit constant. The instruction is 3
bytes long, consisting of the opcode and two address bytes. The destination address can be anywhere in the 64K Program Memory space.
The AJMP instruction encodes the destination address as an 11-bit constant. The instruction is 2
bytes long, consisting of the opcode, which itself
contains 3 of the 11 address bits, followed by another byte containing the low 8 bits of the destination address. When the instruction is executed,
these 11 bits are simply substituted for the low 11
bits in the PC. The high 5 bits stay the same.
Hence the destination has to be within the same
2K block as the instruction following the AJMP.
In all cases the programmer specifies the destination address to the assembler in the same way: as
a label or as a 16-bit constant. The assembler will
put the destination address into the correct format
for the given instruction. If the format required by
the instruction will not support the distance to the
specified destination address, a “Destination out
of range” message is written into the List file.
The JMP @A+DPTR instruction supports case
jumps. The destination address is computed at execution time as the sum of the 16-bit DPTR register and the Accumulator. Typically. DPTR is set up
with the address of a jump table. In a 5-way
branch, for ex-ample, an integer 0 through 4 is
loaded into the Accumulator. The code to be executed might be as follows:
MOV DPTR,#JUMP TABLE
MOV A,INDEX_NUMBER
RL A
JMP @A+DPTR
24/163
The RL A instruction converts the index number (0
through 4) to an even number on the range 0
through 8, because each entry in the jump table is
2 bytes long:
JUMP TABLE:
AJMP CASE 0
AJMP CASE 1
AJMP CASE 2
AJMP CASE 3
AJMP CASE 4
Table 13 shows a single “CALL addr” instruction,
but there are two of them, LCALL and ACALL,
which differ in the format in which the subroutine
address is given to the CPU. CALL is a generic
mnemonic which can be used if the programmer
does not care which way the address is encoded.
The LCALL instruction uses the 16-bit address format, and the subroutine can be anywhere in the
64K Program Memory space. The ACALL instruction uses the 11-bit format, and the subroutine
must be in the same 2K block as the instruction following the ACALL.
In any case, the programmer specifies the subroutine address to the assembler in the same way: as
a label or as a 16-bit constant. The assembler will
put the address into the correct format for the given instructions.
Subroutines should end with a RET instruction,
which returns execution to the instruction following
the CALL.
RETI is used to return from an interrupt service
routine. The only difference between RET and
RETI is that RETI tells the interrupt control system
that the interrupt in progress is done. If there is no
interrupt in progress at the time RETI is executed,
then the RETI is functionally identical to RET.
Table 13. Unconditional Jump Instructions
Mnemonic
Operation
JMP addr
Jump to addr
JMP @A+DPTR
Jump to A+DPTR
CALL addr
Call Subroutine at addr
RET
Return from subroutine
RETI
Return from Interrupt
NOP
No operation
uPSD3212A, uPSD3212C, uPSD3212CV
Table 14 shows the list of conditional jumps available to the uPSD321x Devices user. All of these
jumps specify the destination address by the relative offset method, and so are limited to a jump distance of -128 to +127 bytes from the instruction
following the conditional jump instruction. Important to note, however, the user specifies to the assembler the actual destination address the same
way as the other jumps: as a label or a 16-bit constant.
There is no Zero Bit in the PSW. The JZ and JNZ
instructions test the Accumulator data for that condition.
The DJNZ instruction (Decrement and Jump if Not
Zero) is for loop control. To execute a loop N
times, load a counter byte with N and terminate the
loop with a DJNZ to the beginning of the loop, as
shown below for N = 10:
MOV COUNTER,#10
LOOP: (begin loop)
•
•
•
(end loop)
DJNZ COUNTER, LOOP
(continue)
The CJNE instruction (Compare and Jump if Not
Equal) can also be used for loop control as in Table 9., page 21. Two bytes are specified in the operand field of the instruction. The jump is executed
only if the two bytes are not equal. In the example
of Table 9., page 21 Shifting a BCD Number One
Digits to the Right, the two bytes were data in R1
and the constant 2Ah. The initial data in R1 was
2Eh.
Every time the loop was executed, R1 was decremented, and the looping was to continue until the
R1 data reached 2Ah.
Another application of this instruction is in “greater
than, less than” comparisons. The two bytes in the
operand field are taken as unsigned integers. If the
first is less than the second, then the Carry Bit is
set (1). If the first is greater than or equal to the
second, then the Carry Bit is cleared.
Machine Cycles
A machine cycle consists of a sequence of six
states, numbered S1 through S6. Each state time
lasts for two oscillator periods. Thus, a machine
cycle takes 12 oscillator periods or 1µs if the oscillator frequency is 12MHz. Refer to Figure
14., page 26.
Each state is divided into a Phase 1 half and a
Phase 2 half. State Sequence in uPSD321x Devices shows that retrieve/execute sequences in
states and phases for various kinds of instructions.
Normally two program retrievals are generated
during each machine cycle, even if the instruction
being executed does not require it. If the instruction being executed does not need more code
bytes, the CPU simply ignores the extra retrieval,
and the Program Counter is not incremented.
Execution of a one-cycle instruction (Figure
14., page 26) begins during State 1 of the machine
cycle, when the opcode is latched into the Instruction Register. A second retrieve occurs during S4
of the same machine cycle. Execution is complete
at the end of State 6 of this machine cycle.
The MOVX instructions take two machine cycles
to execute. No program retrieval is generated during the second cycle of a MOVX instruction. This
is the only time program retrievals are skipped.
The retrieve/execute sequence for MOVX instruction is shown in Figure 14., page 26 (d).
Table 14. Conditional Jump Instructions
Addressing Modes
Mnemonic
Operation
Dir.
Ind.
Reg.
JZ rel
Jump if A = 0
Accumulator only
JNZ rel
Jump if A ≠ 0
Accumulator only
DJNZ <byte>,rel
Decrement and jump if not zero
X
CJNE A,<byte>,rel
Jump if A ≠ <byte>
X
CJNE <byte>,#data,rel
Jump if <byte> ≠ #data
Imm
X
X
X
X
25/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 14. State Sequence in uPSD321x Devices
Osc.
(XTAL2)
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2 p1 p2
Read next
opcode and
discard
Read opcode
S1
S2
S3
S4
S5
Read next
opcode
S6
a. 1-Byte, 1-Cycle Instruction, e.g. INC A
S1
S2
Read next
opcode
Read 2nd
Byte
Read opcode
S3
S4
S5
S6
b. 2-Byte, 1-Cycle Instruction, e.g. ADD A, adrs
Read next
opcode and
discard
Read opcode
S1
S2
S3
S4
S5
Read next
opcode and
discard
Read next
opcode and
discard
S6
S1
S2
S3
S4
S5
Read next
opcode
S6
c. 1-Byte, 2-Cycle Instruction, e.g. INC DPTR
S1
S2
S3
d. 1-Byte, 2-Cycle MOVX Instruction
S4
S5
Read next
opcode
No ALE
S6
Addr
No Fetch
No Fetch
Read next
opcode and
discard
Read opcode
(MOVX)
S1
S2
S3
S4
S5
S6
Data
Access External Memory
AI06822
26/163
uPSD3212A, uPSD3212C, uPSD3212CV
uPSD3200 HARDWARE DESCRIPTION
The uPSD321x Devices has a modular architecture with two main functional modules: the MCU
Module and the PSD Module. The MCU Module
consists of a standard 8032 core, peripherals and
other system supporting functions. The PSD Module provides configurable Program and Data memories to the 8032 CPU core. In addition, it has its
own set of I/O ports and a PLD with 16 macrocells
for general logic implementation. Ports A,B,C, and
D are general purpose programmable I/O ports
that have a port architecture which is different from
Ports 0-4 in the MCU Module.
The PSD Module communicates with the CPU
Core through the internal address, data bus (A0A15, D0-D7) and control signals (RD_, WR_,
PSEN_ , ALE, RESET_). The user defines the Decoding PLD in the PSDsoft Development Tool and
can map the resources in the PSD Module to any
program or data address space.
Figure 15. uPSD321x Devices Functional Modules
Port 1, Timers and
2nd UART and ADC
Port 3, UART,
Intr, Timers,I2C
Port 3
Port 1
8032 Core
2 UARTs
Interrupt
Dedicated
USB Pins
Port 4 PWM
I2C
3 Timer /
Counters
256 Byte SRAM
4
Channel
ADC
PWM
5
Channels
USB
&
Transceiver
Reset Logic
LVD & WDT
MCU MODULE
Port 0, 2
Ext. Bus
8032 Internal Bus
A0-A15
RD,PSEN
WR,ALE
D0-D7 Reset
PSD MODULE
Page Register
Decode PLD
512Kb
Main Flash
128Kb
Secondary
Flash
16Kb
SRAM
Bus
Interface
PSD Internal Bus
JTAG ISP
CPLD - 16 MACROCELLS
Port C,
JTAG, PLD I/O
and GPIO
Port A & B, PLD
I/O and GPIO
Port D
GPIO
VCC, GND,
XTAL
Dedicated
Pins
AI07426b
27/163
uPSD3212A, uPSD3212C, uPSD3212CV
MCU MODULE DISCRIPTION
This section provides a detail description of the
MCU Module system functions and Peripherals,
including:
■
Special Function Registers
■
Timers/Counter
■
Interrupts
■
PWM
■
Supervisory Function (LVD and Watchdog)
■
USART
■
Power Saving Modes
■
I2C Bus
■
On-chip Oscillator
■
ADC
■
I/O Ports
Special Function Registers
A map of the on-chip memory area called the Special Function Register (SFR) space is shown in Table 15.
Note: In the SFRs not all of the addresses are occupied. Unoccupied addresses are not implemented on the chip. READ accesses to these
addresses will in general return random data, and
WRITE accesses will have no effect. User software should write '0s' to these unimplemented locations.
Table 15. SFR Memory Map
F8
FF
F0
B(1)
E8
UISTA(1)
UIEN
E0
ACC(1)
USCL
F7
UCON0
UCON1
D8
UCON2
S2CON
USTA
S2STA
UADR
UDR0
EF
UDT1
UDT0
E7
S2DAT
S2ADR
DF
D0
PSW(1)
C8
T2CON(1)
C0
P4(1)
C7
B8
IP(1)
BF
B0
P3(1)
A8
IE(1)
A0
P2(1)
98
D7
T2MOD
PSCL0L
RCAP2L
RCAP2H
PSCL0H
PSCL1L
PWM4P
PWM4W
PWMCON
PWM0
PWM1
SCON
SBUF
SCON2
SBUF2
90
P1(1)
P1SFS
88
TCON(1)
TMOD
80
P0(1)
SP
Note: 1. Register can be bit addressing
28/163
TL2
TH2
CF
PSCL1H
IPA
WDKEY
PWM2
PWM3
WDRST
B7
AF
IEA
A7
9F
P3SFS
P4SFS
ASCL
TL0
TL1
TH0
TH1
DPL
DPH
ADAT
ACON
97
8F
PCON
87
uPSD3212A, uPSD3212C, uPSD3212CV
Table 16. List of all SFR
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
80
P0
FF
Port 0
81
SP
07
Stack Ptr
82
DPL
00
Data Ptr Low
83
DPH
87
PCON
SMOD
00
Data Ptr High
TCLK1
PD
IDLE
00
Power Ctrl
88
TCON
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
00
Timer / Cntr
Control
89
TMOD
Gate
C/T
M1
M0
Gate
C/T
M1
M0
00
Timer / Cntr
Mode Control
8A
TL0
00
Timer 0 Low
8B
TL1
00
Timer 1 Low
8C
TH0
00
Timer 0 High
8D
TH1
00
Timer 1 High
90
P1
FF
Port 1
91
P1SFS
P1S7
P1S6
00
Port 1 Select
Register
93
P3SFS
P3S7
P3S6
00
Port 3 Select
Register
94
P4SFS
P4S7
P4S6
00
Port 4 Select
Register
95
ASCL
00
8-bit
Prescaler for
ADC clock
96
ADAT
97
ACON
98
SCON
99
SBUF
9A
SCON2
9B
A0
SMOD1 LVREN ADSFINT RCLK1
P1S5
P4S5
P1S4
P4S4
P4S3
P4S2
P4S1
P4S0
ADAT3
ADAT2
ADAT1
ADAT0
00
ADC Data
Register
ADS1
ADS0
ADST
ADSF
00
ADC Control
Register
TB8
RB8
TI
RI
00
Serial Control
Register
00
Serial Buffer
00
2nd UART
Ctrl Register
SBUF2
00
2nd UART
Serial Buffer
P2
FF
Port 2
00
PWM Control
Polarity
A1 PWMCON
ADAT7
ADAT6
ADAT5
ADAT4
ADEN
SM0
SM0
PWML
SM1
SM1
PWMP
SM2
SM2
PWME
REN
REN
CFG4
TB8
CFG3
RB8
CFG2
TI
CFG1
RI
CFG0
A2
PWM0
00
PWM0
Output Duty
Cycle
A3
PWM1
00
PWM1
Output Duty
Cycle
29/163
uPSD3212A, uPSD3212C, uPSD3212CV
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
A4
PWM2
00
PWM2
Output Duty
Cycle
A5
PWM3
00
PWM3
Output Duty
Cycle
A6
WDRST
00
Watch Dog
Reset
A7
IEA
00
Interrupt
Enable (2nd)
A8
IE
00
Interrupt
Enable
EI2C
ES2
EA
-
ET2
ES
ET1
EX1
ET0
EX0
A9
AA
PWM4P
00
PWM 4
Period
AB
PWM4W
00
PWM 4 Pulse
Width
AE
WDKEY
00
Watch Dog
Key Register
B0
P3
FF
Port 3
B1
PSCL0L
00
Prescaler 0
Low (8-bit)
B2
PSCL0H
00
Prescaler 0
High (8-bit)
B3
PSCL1L
00
Prescaler 1
Low (8-bit)
B4
PSCL1H
00
Prescaler 1
High (8-bit)
B7
IPA
00
Interrupt
Priority (2nd)
B8
IP
00
Interrupt
Priority
C0
P4
FF
New Port 4
C8
T2CON
00
Timer 2
Control
C9
T2MOD
CA
RCAP2L
00
Timer 2
Reload low
CB
RCAP2H
00
Timer 2
Reload High
CC
TL2
00
Timer 2 Low
byte
CD
TH2
00
Timer 2 High
byte
D0
PSW
00
Program
Status Word
D1
30/163
PS2
PT2
TF2
EXF2
RCLK
PS
TCLK
PI2C
PT1
EXEN2
PX1
TR2
PT0
C/T2
PX0
CP/RL2
DCEN
CY
AC
FO
RS1
RS0
OV
P
00 Timer 2 Mode
uPSD3212A, uPSD3212C, uPSD3212CV
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
D2 S2SETUP
Reset
Comments
Value
00
I2C (S2)
Setup
D4
D5
D6
D7
D8
D9
DA
DB
DC
S2CON
CR2
EN1
STA
STO
ADDR
AA
CR1
CR0
00
I2C Bus
Control Reg
DD
S2STA
GC
Stop
Intr
TX-Md
Bbusy
Blost
ACK_R
SLV
00
I2C Bus
Status
DE
S2DAT
00
Data Hold
Register
DF
S2ADR
00
I2C address
E0
ACC
00
Accumulator
E1
USCL
00
8-bit
Prescaler for
USB logic
E6
UDT1
UDT1.7
UDT1.6 UDT1.5 UDT1.4 UDT1.3 UDT1.2 UDT1.1
UDT1.0
00
USB Endpt1
Data Xmit
E7
UDT0
UDT0.7
UDT0.6 UDT0.5 UDT0.4 UDT0.3 UDT0.2 UDT0.1
UDT0.0
00
USB Endpt0
Data Xmit
E8
UISTA
SUSPND
—
RESUMF
00
USB Interrupt
Status
E9
UIEN
SUSPNDIE
RSTE
RSTFIE TXD0IE RXD0IE TXD1IE EOPIE RESUMIE
00
USB Interrupt
Enable
EA
UCON0
TSEQ0
STALL0
TX0E
TP0SIZ3 TP0SiZ2 TP0SIZ1 TP0SIZ0
00
USB Endpt0
Xmit Control
EB
UCON1
TSEQ1
EP12SEL
—
FRESUM TP1SIZ3 TP1SiZ2 TP1SIZ1 TP1SIZ0
00
USB Endpt1
Xmit Control
EC
UCON2
—
—
—
SOUT
STALL2 STALL1
00
USB Control
Register
ED
USTA
RSEQ
SETUP
IN
OUT
RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0
00
USB Endpt0
Status
EE
UADR
USBEN
UADD6 UADD5 UADD4
UADD0
00
USB Address
Register
EF
UDR0
UDR0.7
UDR0.6 UDR0.5 UDR0.4 UDR0.3 UDR0.2 UDR0.1 UDR0.0
00
USB Endpt0
Data Recv
F0
B
00
B Register
RSTF
TXD0F
RX0E
RXD0F
EP2E
RXD1F
EP1E
EOPF
UADD3 UADD2 UADD1
31/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 17. PSD Module Register Address Offset
CSIOP
Addr
Offset
Register Name
00
Data In (Port A)
Reads Port pins as input
02
Control (Port A)
Configure pin between I/O or Address Out Mode. Bit = 0 selects I/
O
00
04
Data Out (Port A)
Latched data for output to Port pins, I/O Output Mode
00
06
Direction (Port A)
Configures Port pin as input or output. Bit = 0 selects input
00
08
Drive (Port A)
Configures Port pin between CMOS, Open Drain or Slew rate. Bit
= 0 selects CMOS
00
0A
Input Macrocell
(Port A)
Reads latched value on Input Macrocells
0C
Enable Out
(Port A)
Reads the status of the output enable control to the Port pin driver.
Bit = 0 indicates pin is in input mode.
01
Data In (Port B)
03
Control (Port B)
00
05
Data Out (Port B)
00
07
Direction (Port B)
00
09
Drive (Port B)
00
0B
Input Macrocell
(Port B)
0D
Enable Out
(Port B)
10
Data In (Port C)
12
Data Out (Port C)
00
14
Direction (Port C)
00
16
Drive (Port C)
00
18
Input Macrocell
(Port C)
1A
Enable Out
(Port C)
11
Data In (Port D)
*
*
*
*
*
*
13
Data Out (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
15
Direction (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
17
Drive (Port D)
*
*
*
*
*
*
00
Only Bit 1 and
2 are used
1B
Enable Out
(Port D)
*
*
*
*
*
*
20
Output
Macrocells AB
32/163
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Value
Comments
Only Bit 1 and
2 are used
Only Bit 1 and
2 are used
uPSD3212A, uPSD3212C, uPSD3212CV
CSIOP
Addr
Offset
Register Name
21
Output
Macrocells BC
22
Mask Macrocells
AB
23
Mask Macrocells
BC
C0
Primary Flash
Protection
C2
Bit Register Name
7
Secondary Flash Security
Protection
_Bit
B0
PMMR0
*
B4
PMMR2
*
E0
Page
E2
VM
Periphmode
6
*
*
5
*
*
3
*
PLD
array
Cntl2
FL_
data
2
1
0
Reset
Value
Comments
Sec3_ Sec2_ Sec1_
Prot
Prot
Prot
Sec0_
Prot
Bit = 1 sector
is protected
*
Sec1_
Prot
Sec0_
Prot
Security Bit =
1 device is
secured
*
APD
enable
*
00
Control PLD
power
consumption
PLD
array
Cntl0
*
*
00
Blocking
inputs to PLD
array
00
Page Register
*
PLD
PLD
PLD
Mcells arrayTurbo
clk
clk
PLD
array
Ale
*
4
PLD
array
Cntl1
Boot_
data
FL_
code
Boot_
code
SR_
code
Configure
8032 Program
and Data
Space
Note: (Register address = csiop address + address offset; where csiop address is defined by user in PSDsoft)
* indicates bit is not used and need to set to '0.'
33/163
uPSD3212A, uPSD3212C, uPSD3212CV
INTERRUPT SYSTEM
There are interrupt requests from 10 sources as
follows (see Figure 16., page 35).
■
INT0 External Interrupt
■
2nd USART Interrupt
■
Timer 0 Interrupt
■
I2C Interrupt
■
INT1 External Interrupt (or ADC Interrupt)
■
Timer 1 Interrupt
■
USB Interrupt
■
USART Interrupt
■
Timer 2 Interrupt
External Int0
– The INT0 can be either level-active or
transition-active depending on Bit IT0 in
register TCON. The flag that actually
generates this interrupt is Bit IE0 in TCON.
– When an external interrupt is generated, the
corresponding request flag is cleared by the
hardware when the service routine is vectored
to only if the interrupt was transition activated.
– If the interrupt was level activated then the
interrupt request flag remains set until the
requested interrupt is actually generated.
Then it has to deactivate the request before
the interrupt service routine is completed, or
else another interrupt will be generated.
Timer 0 and 1 Interrupts
– Timer 0 and Timer 1 Interrupts are generated
by TF0 and TF1 which are set by an overflow
of their respective Timer/Counter registers
(except for Timer 0 in Mode 3).
– These flags are cleared by the internal
hardware when the interrupt is serviced.
Timer 2 Interrupt
– Timer 2 Interrupt is generated by TF2 which is
set by an overflow of Timer 2. This flag has to
be cleared by the software - not by hardware.
– It is also generated by the T2EX signal (Timer
2 External Interrupt P1.1) which is controlled
34/163
by EXEN2 and EXF2 Bits in the T2CON
register.
2
I C Interrupt
– The interrupt of the I2C is generated by Bit
INTR in the register S2STA.
– This flag is cleared by hardware.
External Int1
– The INT1 can be either level active or
transition active depending on Bit IT1 in
register TCON. The flag that actually
generates this interrupt is Bit IE1 in TCON.
– When an external interrupt is generated, the
corresponding request flag is cleared by the
hardware when the service routine is vectored
to only if the interrupt was transition activated.
– If the interrupt was level activated then the
interrupt request flag remains set until the
requested interrupt is actually generated.
Then it has to deactivate the request before
the interrupt service routine is completed, or
else another interrupt will be generated.
– The ADC can take over the External INT1 to
generate an interrupt on conversion being
completed
USB Interrupt
– The USB Interrupt is generated when
endpoint0 has transmitted a packet or
received a packet, when endpoint1 or
endpoint2 has transmitted a packet, when the
suspend or resume state is detected and
every EOP received.
– When the USB Interrupt is generated, the
corresponding request flag must be cleared by
software. The interrupt service routine will
have to check the various USB registers to
determine the source and clear the
corresponding flag.
– Please see the dedicated interrupt control
registers for the USB peripheral for more
information.
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 16. Interrupt System
Interrupt
Sources
IP / IPA Priority
IE /
High
INT0
Low
USART
Timer
0
I2C
Interrupt Polling
INT1
Timer
1
USB
2nd
USART
Timer
2
Global
Enable
AI07427b
35/163
uPSD3212A, uPSD3212C, uPSD3212CV
USART Interrupt
– The USART Interrupt is generated by RI
(Receive Interrupt) OR TI (Transmit Interrupt).
– When the USART Interrupt is generated, the
corresponding request flag must be cleared by
the software. The interrupt service routine will
have to check the various USART registers to
determine the source and clear the
corresponding flag.
– Both USART’s are identical, except for the
additional interrupt controls in the Bit 4 of the
additional interrupt control registers (A7H,
B7H).
Interrupt Priority Structure
Each interrupt source can be assigned one of two
priority levels. Interrupt priority levels are defined
by the interrupt priority special function register IP
and IPA.
0 = low priority
1 = high priority
A low priority interrupt may be interrupted by a
high priority interrupt level interrupt. A high priority
interrupt routine cannot be interrupted by any other interrupt source. If two interrupts of different priority occur simultaneously, the high priority level
request is serviced. If requests of the same priority
are received simultaneously, an internal polling
sequence determines which request is serviced.
Thus, within each priority level, there is a second
priority structure determined by the polling sequence.
Interrupts Enable Structure
Each interrupt source can be individually enabled
or disabled by setting or clearing a bit in the interrupt enable special function register IE and IEA. All
interrupt source can also be globally disabled by
the clearing Bit EA in IE (see Table 19). Please
see Tables 20, 21, 22, and 23 for individual bit descriptions.
Table 18. Priority Levels
Source
Priority with Level
Int0
0 (highest)
2nd USART
1
Timer 0
2
I²C
3
Int1
4
reserved
5
Timer 1
6
USB
7
1st USART
8
Timer 2+EXF2
9 (lowest)
Table 19. SFR Register
Bit Register Name
SFR
Addr
Reg
Name
7
6
5
4
3
2
1
0
A7
IEA
—
—
—
ES2
—
—
EI2C
EUSB
00
Interrupt
Enable (2nd)
A8
IE
EA
—
ET2
ES
ET1
EX1
ET0
EX0
00
Interrupt
Enable
B7
IPA
—
—
—
PS2
—
—
PI2C
PUSB
00
Interrupt
Priority (2nd)
B8
IP
—
—
PT2
PS
PT1
PX1
PT0
PX0
00
Interrupt
Priority
36/163
Reset
Comments
Value
uPSD3212A, uPSD3212C, uPSD3212CV
Table 20. Description of the IE Bits.
Bit
Symbol
Function
7
EA
Disable all interrupts:
0: no interrupt with be acknowledged
1: each interrupt source is individually enabled or disabled by setting or clearing its
enable bit
6
—
Reserved
5
ET2
Enable Timer 2 Interrupt
4
ES
Enable USART Interrupt
3
ET1
Enable Timer 1 Interrupt
2
EX1
Enable External Interrupt (Int1)
1
ET0
Enable Timer 0 Interrupt
0
EX0
Enable External Interrupt (Int0)
Table 21. Description of the IEA Bits
Bit
Symbol
Function
7
—
Not used
6
—
Not used
5
—
Not used
4
ES2
3
—
Not used
2
—
Not used
1
EI2C
Enable I²C Interrupt
0
EUSB
Enable USB Interrupt
Enable 2nd USART Interrupt
Table 22. Description of the IP Bits
Bit
Symbol
Function
7
—
Reserved
6
—
Reserved
5
PT2
Timer 2 Interrupt priority level
4
PS
USART Interrupt priority level
3
PT1
Timer 1 Interrupt priority level
2
PX1
External Interrupt (Int1) priority level
1
PT0
Timer 0 Interrupt priority level
0
PX0
External Interrupt (Int0) priority level
37/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 23. Description of the IPA Bits
Bit
Symbol
Function
7
—
Not used
6
—
Not used
5
—
Not used
4
PS2
3
—
Not used
2
—
Not used
1
PI2C
I²C Interrupt priority level
0
PUSB
USB Interrupt priority level
2nd USART Interrupt priority level
How Interrupts are Handled
The interrupt flags are sampled at S5P2 of every
machine cycle. The samples are polled during following machine cycle. If one of the flags was in a
set condition at S5P2 of the preceding cycle, the
polling cycle will find it and the interrupt system will
generate an LCALL to the appropriate service routine, provided this H/W generated LCALL is not
blocked by any of the following conditions:
– An interrupt of equal priority or higher priority
level is already in progress.
– The current machine cycle is not the final cycle
in the execution of the instruction in progress.
– The instruction in progress is RETI or any
access to the interrupt priority or interrupt
enable registers.
The polling cycle is repeated with each machine
cycle, and the values polled are the values that
were present at S5P2 of the previous machine cycle.
Note: If an interrupt flag is active but being responded to for one of the above mentioned conditions, if the flag is still inactive when the blocking
condition is removed, the denied interrupt will not
be serviced. In other words, the fact that the interrupt flag was once active but not serviced is not remembered. Every polling cycle is new.
The processor acknowledges an interrupt request
by executing a hardware generated LCALL to the
appropriate service routine. The hardware generated LCALL pushes the contents of the Program
Counter on to the stack (but it does not save the
PSW) and reloads the PC with an address that depends on the source of the interrupt being vectored to as shown in Table 24.
38/163
Execution proceeds from that location until the
RETI instruction is encountered. The RETI instruction informs the processor that the interrupt routine
is no longer in progress, then pops the top two
bytes from the stack and reloads the Program
Counter. Execution of the interrupted program
continues from where it left off.
Note: A simple RET instruction would also return
execution to the interrupted program, but it would
have left the interrupt control system thinking an
interrupt was still in progress, making future interrupts impossible.
Table 24. Vector Addresses
Source
Vector Address
Int0
0003h
2nd USART
004Bh
Timer 0
000Bh
I²C
0043h
Int1
0013h
Timer 1
001Bh
USB
0033h
1st USART
0023h
Timer 2+EXF2
002Bh
uPSD3212A, uPSD3212C, uPSD3212CV
POWER-SAVING MODE
Two software selectable modes of reduced power
consumption are implemented (see Table 25).
Idle Mode
The following Functions are Switched Off.
– CPU (Halted)
The following Function Remain Active During Idle
Mode.
– External Interrupts
– Timer 0, Timer 1, Timer 2
– PWM Units
– USART
– 8-bit ADC
– I2C Interface
– USB Interface
Note: Interrupt or RESET terminates the Idle
Mode.
Power-Down Mode
– System Clock Halted
– LVD Logic Remains Active
– SRAM contents remains unchanged
– The SFRs retain their value until a RESET is
asserted
Note: The only way to exit Power-down Mode is a
RESET.
Power Control Register
The Idle and Power-down Modes are activated by
software via the PCON register (see Tables 26
and Table 27., page 40).
Idle Mode
The instruction that sets PCON.0 is the last instruction executed in the normal operating mode
before Idle Mode is activated. Once in the Idle
Mode, the CPU status is preserved in its entirety:
Stack pointer, Program counter, Program status
word, Accumulator, RAM and All other registers
maintain their data during Idle Mode.
There are three ways to terminate the Idle Mode.
– Activation of any enabled interrupt will cause
PCON.0 to be cleared by hardware
terminating Idle mode. The interrupt is
serviced, and following return from interrupt
instruction RETI, the next instruction to be
executed will be the one which follows the
instruction that wrote a logic '1' to PCON.0.
– External hardware reset: the hardware reset is
required to be active for two machine cycle to
complete the RESET operation.
– Internal reset: the microcontroller restarts after
3 machine cycles in all cases.
Power-Down Mode
Table 25. Power-Saving Mode Power Consumption
Mode
Addr/Data
Ports1,3,4
PWM
I2C
USB
Idle
Maintain Data
Maintain Data
Active
Active
Active
Power-down
Maintain Data
Maintain Data
Disable
Disable
Disable
Table 26. Pin Status During Idle and Power-down Mode
SFR
Reg
Addr Name
87
PCON
Bit Register Name
7
SMOD
6
5
4
3
SMOD1 LVREN ADSFINT RCLK1
2
1
0
TCLK1
PD
IDLE
Reset
Comments
Value
00
Power Ctrl
39/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 27. Description of the PCON Bits
Bit
Symbol
Function
7
SMOD
Double Baud Data Rate Bit UART
6
SMOD1
Double Baud Data Rate Bit 2nd UART
5
LVREN
LVR Disable Bit (active High)
4
ADSFINT
3
RCLK1
(1)
2
TCLK1(1)
1
PD
Activate Power-down Mode (High enable)
0
IDL
Activate Idle Mode (High enable)
Enable ADC Interrupt
Received Clock Flag (UART 2)
Transmit Clock Flag (UART 2)
Note: 1. See the T2CON register for details of the flag description
I/O PORTS (MCU MODULE)
The MCU Module has five ports: Port0, Port1,
Port2, Port3 and Port 4. (Refer to the PSD Module
section on I/O ports A,B,C and D). Ports P0 and
P2 are dedicated for the external address and data
bus and is not available in the 52-pin package devices.
Port1 - Port3 are the same as in the standard 8032
micro-controllers, with the exception of the addi-
tional special peripheral functions (see Table 28).
All ports are bi-directional. Pins of which the alternative function is not used may be used as normal
bi-directional I/O.
The use of Port1- Port4 pins as alternative functions are carried out automatically by the
uPSD321x Devices provided the associated SFR
Bit is set HIGH.
Table 28. I/O Port Functions
40/163
Port Name
Main Function
Alternate
Port 1
GPIO
Timer 2 - Bits 0,1
2nd UART - Bits 2,3
ADC - Bits 4..7
Port 3
GPIO
UART - Bits 0,1
Interrupt - Bits 2,3
Timers - Bits 4,5
I2C - Bits 6,7
Port 4
GPIO
PWM - Bits 3..7
uPSD3212A, uPSD3212C, uPSD3212CV
The following SFR registers (Tables 29, 30, and
31) are used to control the mapping of alternate
functions onto the I/O port bits. Port 1 alternate
functions are controlled using the P1SFS register,
except for Timer 2 and the 2nd UART which are
enabled by their configuration registers. P1.0 to
P1.3 are default to GPIO after reset.
Port 3 pins 6 and 7 have been modified from the
standard 8032. These pins that were used for
READ and WRITE control signals are now GPIO
or I2C bus pins. The READ and WRITE pins are
assigned to dedicated pins.
Port 3 (I2C) and Port 4 alternate functions are controlled using the P3SFS and P4SFS Special Function Selection registers. After a reset, the I/O pins
default to GPIO. The alternate function is enabled
if the corresponding bit in the PXSFS register is
set to '1.' Other Port 3 alternative functions (UART,
Interrupt, and Timer/Counter) are enabled by their
configuration register and do not require setting of
the bits in R3SFS.
Table 29. P1SFS (91H)
7
6
5
4
0=Port 1.7
1=ACH3
0=Port 1.6
1=ACH2
0=Port 1.5
1=ACH1
0=Port 1.4
1=ACH0
5
4
3
2
Bits Reserved
1
0
Bits Reserved
Table 30. P3SFS (93H)
7
6
0 = Port 3.7 0 = Port 3.6
1 = SDA
1 = SCL
from I2C unit from I2C unit
3
2
1
0
Bits are reserved.
Table 31. P4SFS (94H)
7
6
5
4
3
2
1
0
0=Port 4.7
1=PWM 4
0=Port 4.6
1=PWM 3
0=Port 4.5
1=PWM 2
0=Port 4.4
1=PWM 1
0=Port 4.3
1=PWM 0
0=Port 4.2
0=Port 4.1
0=Port 4.0
41/163
uPSD3212A, uPSD3212C, uPSD3212CV
PORT Type and Description
Figure 17. PORT Type and Description (Part 1)
Symbol
In /
Out
RESET
I
Circuit
Description
• Schmitt input with internal pull-up
CMOS compatible interface
NFC : 400ns
NFC
WR, RD,ALE,
PSEN
O
XTAL1,
XTAL2
I
Output only
On-chip oscillator
On-chip feedback resistor
Stop in the power down mode
External clock input available
CMOS compatible interface
xon
O
PORT0
I/O
Bidirectional I/O port
Schmitt input
Address Output ( Push-Pull )
CMOS compatible interface
AI07438
42/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 18. PORT Type and Description (Part 2)
Symbol
PORT1 <3:0>,
PORT3,
PORT4<7:3,1:0>
In/
Out
Circuit
Function
I/O
Bidirectional I/O port with
internal pull-ups
Schmitt input
CMOS compatible interface
I/O
Bidirectional I/O port with
internal pull-ups
Schmitt input
CMOS compatible interface
Analog input option
PORT2
PORT1 < 7:4 >
an_enb
PORT4.2
Bidirectional I/O port with internal
I/O
pull-ups
Schmitt input.
TTL compatible interface
USB–, USB+
Bidirectional I/O port
Schmitt input
TTL compatible interface
I/O
+
–
AI07428b
43/163
uPSD3212A, uPSD3212C, uPSD3212CV
OSCILLATOR
The oscillator circuit of the uPSD321x Devices is a
single stage inverting amplifier in a Pierce oscillator configuration (see Figure 19). The circuitry between XTAL1 and XTAL2 is basically an inverter
biased to the transfer point. Either a crystal or ceramic resonator can be used as the feedback ele-
ment to complete the oscillator circuit. Both are
operated in parallel resonance.
XTAL1 is the high gain amplifier input, and XTAL2
is the output. To drive the uPSD321x Devices externally, XTAL1 is driven from an external source
and XTAL2 left open-circuit.
Figure 19. Oscillator
XTAL1
XTAL2
XTAL1
XTAL2
8 to 40 MHz
External Clock
AI06620
44/163
uPSD3212A, uPSD3212C, uPSD3212CV
SUPERVISORY
before it is released. On initial power-up the LVR
is enabled (default). After power-up the LVR can
be disabled via the LVREN Bit in the PCON Register.
Note: The LVR logic is still functional in both the
Idle and Power-down Modes.
The reset threshold:
■
5V operation: 4V +/- 0.25V
■
3.3V operation: 2.5V +/-0.2V
This logic supports approximately 0.1V of hysteresis and 1µs noise-cancelling delay.
Watchdog Timer Overflow
The Watchdog Timer generates an internal reset
when its 22-bit counter overflows. See Watchdog
Timer section for details.
USB Reset
The USB reset is generated by a detection on the
USB bus RESET signal. A single-end zero on its
upstream port for 4 to 8 times will set RSTF Bit in
UISTA register. If Bit 6 (RSTE) of the UIEN Register is set, the detection will also generate the
RESET signal to reset the CPU and other peripherals in the MCU.
There are four ways to invoke a reset and initialize
the uPSD321x Devices.
■
Via the external RESET pin
■
Via the internal LVR Block.
■
Via Watch Dog timer
■
Via USB bus reset signalling
The RESET mechanism is illustrated in Figure 20.
Each RESET source will cause an internal reset
signal active. The CPU responds by executing an
internal reset and puts the internal registers in a
defined state. This internal reset is also routed as
an active low reset input to the PSD Module.
External Reset
The RESET pin is connected to a Schmitt trigger
for noise reduction. A RESET is accomplished by
holding the RESET pin LOW for at least 1ms at
power up while the oscillator is running. Refer to
AC spec on other RESET timing requirements.
Low VDD Voltage Reset
An internal reset is generated by the LVR circuit
when the VDD drops below the reset threshold. After VDD reaching back up to the reset threshold,
the RESET signal will remain asserted for 10ms
Figure 20. RESET Configuration
Reset
Noise
Cancel
CPU
Clock
Sync
CPU
&
PERI.
WDT
S
LVR
Q
R
RSTE
USB Reset
10ms
Timer
10ms at 40Mhz
50ms at 8Mhz
PSD_RST
"Active-Low"
AI07429b
45/163
uPSD3212A, uPSD3212C, uPSD3212CV
WATCHDOG TIMER
The hardware Watchdog Timer (WDT) resets the
uPSD321x Devices when it overflows. The WDT is
intended as a recovery method in situations where
the CPU may be subjected to a software upset. To
prevent a system reset the timer must be reloaded
in time by the application software. If the processor
suffers a hardware/software malfunction, the software will fail to reload the timer. This failure will result in a reset upon overflow thus preventing the
processor running out of control.
In the Idle Mode the watchdog timer and reset circuitry remain active. The WDT consists of a 22-bit
counter, the Watchdog Timer RESET (WDRST)
SFR and Watchdog Key Register (WDKEY).
Since the WDT is automatically enabled while the
processor is running. the user only needs to be
concerned with servicing it.
The 22-bit counter overflows when it reaches
4194304 (3FFFFFH). The WDT increments once
every machine cycle.
This means the user must reset the WDT at least
every 4194304 machine cycles (1.258 seconds at
40MHz). To reset the WDT the user must write a
value between 00-7EH to the WDRST register.
The value that is written to the WDRST is loaded
to the 7MSB of the 22-bit counter. This allows the
user to pre-loaded the counter to an initial value to
generate a flexible Watchdog time out period.
Writing a “00” to WDRST clears the counter.
The watchdog timer is controlled by the watchdog
key register, WDKEY. Only pattern 01010101
(=55H), disables the watchdog timer. The rest of
pattern combinations will keep the watchdog timer
enabled. This security key will prevent the watchdog timer from being terminated abnormally when
the function of the watchdog timer is needed.
In Idle Mode, the oscillator continues to run. To
prevent the WDT from resetting the processor
while in Idle, the user should always set up a timer
that will periodically exit Idle, service the WDT, and
re-enter Idle Mode.
Table 32. Watchdog Timer Key Register (WDKEY: 0AEH)
7
6
5
4
3
2
1
0
WDKEY7
WDKEY6
WDKEY5
WDKEY4
WDKEY3
WDKEY2
WDKEY1
WDKEY0
Table 33. Description of the WDKEY Bits
Bit
Symbol
7 to 0
WDKEY7 to
WDKEY0
46/163
Function
Enable or disable Watchdog Timer.
01010101 (=55h): disable watchdog timer. Others: enable watchdog timer
uPSD3212A, uPSD3212C, uPSD3212CV
Watchdog reset pulse width depends on the clock
frequency. The reset period is TfOSC x 12 x 222.
The RESET pulse width is TfOSC x 12 x 215.
Figure 21. RESET Pulse Width
Reset pulse width (about 10ms at 40Mhz, about 50ms at 8Mhz)
Reset period
(1.258 second at 40Mhz)
(about 6.291 seconds at 8Mhz)
AI06823
Table 34. Watchdog Timer Clear Register (WDRST: 0A6H)
7
6
5
4
3
2
1
0
Reserved
WDRST6
WDRST5
WDRST4
WDRST3
WDRST2
WDRST1
WDRST0
Table 35. Description of the WDRST Bits
Bit
Symbol
7
—
6 to 0
WDRST6 to
WDRST0
Function
Reserved
To reset Watchdog Timer, write any value beteen 00h and 7Eh to this register.
This value is loaded to the 7 most significant bits of the 22-bit counter.
For example: MOV WDRST,#1EH
Note: The Watchdog Timer (WDT) is enabled at power-up or reset and must be served or disabled.
47/163
uPSD3212A, uPSD3212C, uPSD3212CV
TIMER/COUNTERS (TIMER 0, TIMER 1 AND TIMER 2)
The uPSD321x Devices has three 16-bit Timer/
Counter registers: Timer 0, Timer 1 and Timer 2.
All of them can be configured to operate either as
timers or event counters and are compatible with
standard 8032 architecture.
In the “Timer” function, the register is incremented
every machine cycle. Thus, one can think of it as
counting machine cycles. Since a machine cycle
consists of 6 CPU clock periods, the count rate is
1/6 of the CPU clock frequency or 1/12 of Oscillator Frequency (fOSC).
In the “Counter” function, the register is incremented in response to a 1-to-0 transition at its corresponding external input pin, T0 or T1. In this
function, the external input is sampled during
S5P2 of every machine cycle. When the samples
show a high in one cycle and a low in the next cycle, the count is incremented. The new count value
appears in the register during S3P1 of the cycle
following the one in which the transition was detected. Since it takes 2 machine cycles (24 fOSC
clock periods) to recognize a 1-to-0 transition, the
maximum count rate is 1/24 of the fOSC. There are
no restrictions on the duty cycle of the external input signal, but to ensure that a given level is sampled at least once before it changes, it should be
held for at least one full cycle. In addition to the
“Timer” or “Counter” selection, Timer 0 and Timer
1 have four operating modes from which to select.
Timer 0 and Timer 1
The “Timer” or “Counter” function is selected by
control bits C/T in the Special Function Register
TMOD. These Timer/Counters have four operating modes, which are selected by bit-pairs (M1,
M0) in TMOD. Modes 0, 1, and 2 are the same for
Timers/ Counters. Mode 3 is different. The four operating modes are de-scribed in the following text.
Table 36. Control Register (TCON)
7
6
5
4
3
2
1
0
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
Table 37. Description of the TCON Bits
Bit
Symbol
Function
7
TF1
Timer 1 overflow Flag. Set by hardware on Timer/Counter overflow. Cleared by
hardware when processor vectors to interrupt routine
6
TR1
Timer 1 Run Control Bit. Set/cleared by software to turn Timer/Counter on or off
5
TF0
Timer 0 Overflow Flag. Set by hardier on Timer/Counter overflow. Cleared by hardware
when processor vectors to interrupt routine
4
TR0
Timer 0 Run Control Bit. Set/cleared by software to turn Timer/Counter on or off
3
IE1
Interrupt 1 Edge Flag. Set by hardware when external interrupt edge detected. Cleared
when interrupt processed
2
IT1
Interrupt 1 Type Control Bit. Set/cleared by software to specify falling-edge/low-level
triggered external interrupt
1
IE0
Interrupt 0 Edge Flag. Set by hardware when external interrupt edge detected. Cleared
when interrupt processed
0
IT0
Interrupt 0 Type Control Bit. Set/cleared by software to specify falling-edge/low-level
triggered external interrupt
Table 38. TMOD Register (TMOD)
7
6
5
4
3
2
1
0
Gate
C/T
M1
M0
Gate
C/T
M1
M0
48/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 39. Description of the TMOD Bits
Bit
Symbol
Timer
7
Gate
Gating control when set. Timer/Counter 1 is enabled only while INT1 pin is High and
TR1 control pin is set. When cleared, Timer 1 is enabled whenever TR1 control bit is set
6
C/T
Timer or Counter selector, cleared for timer operation (input from internal system clock);
set for counter operation (input from T1 input pin)
5
M1
4
M0
3
Gate
Gating control when set. Timer/Counter 0 is enabled only while INT0 pin is High and
TR0 control pin is set. When cleared, Timer 0 is enabled whenever TR0 control bit is set
2
C/T
Timer or Counter selector, cleared for timer operation (input from internal system clock);
set for counter operation (input from T0 input pin)
1
M1
0
M0
Timer 1
Timer 0
Function
(M1,M0)=(0,0): 13-bit Timer/Counter, TH1, with TL1 as 5-bit prescaler
(M1,M0)=(0,1): 16-bit Timer/Counter. TH1 and TL1 are cascaded. There is no prescaler.
(M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH1 holds a value which is to be
reloaded into TL1 each time it overflows
(M1,M0)=(1,1): Timer/Counter 1 stopped
(M1,M0)=(0,0): 13-bit Timer/Counter, TH0, with TL0 as 5-bit prescaler
(M1,M0)=(0,1): 16-bit Timer/Counter. TH0 and TL0 are cascaded. There is no prescaler.
(M1,M0)=(1,0): 8-bit auto-reload Timer/Counter. TH0 holds a value which is to be
reloaded into TL0 each time it overflows
(M1,M0)=(1,1): TL0 is an 8-bit Timer/Counter controlled by the standard TImer 0 control
bits. TH0 is an 8-bit timer only controlled by Timer 1 control bits
49/163
uPSD3212A, uPSD3212C, uPSD3212CV
Mode 0. Putting either Timer into Mode 0 makes
it look like an 8048 Timer, which is an 8-bit Counter
with a divide-by-32 prescaler. Figure 22 shows the
Mode 0 operation as it applies to Timer 1.
In this mode, the Timer register is configured as a
13-bit register. As the count rolls over from all '1s'
to all '0s,' it sets the Timer Interrupt Flag TF1. The
counted input is enabled to the Timer when TR1 =
1 and either GATE = 0 or /INT1 = 1. (Setting GATE
= 1 allows the Timer to be controlled by external input /INT1, to facilitate pulse width measurements).
TR1 is a control bit in the Special Function Register TCON (TCON Control Register). GATE is in
TMOD.
The 13-bit register consists of all 8 bits of TH1 and
the lower 5 bits of TL1. The upper 3 bits of TL1 are
indeterminate and should be ignored. Setting the
run flag does not clear the registers.
Mode 0 operation is the same for the Timer 0 as
for Timer 1. Substitute TR0, TF0, and /INT0 for the
corresponding Timer 1 signals in Figure 22. There
are two different GATE Bits, one for Timer 1 and
one for Timer 0.
Mode 1. Mode 1 is the same as Mode 0, except
that the Timer register is being run with all 16 bits.
Figure 22. Timer/Counter Mode 0: 13-bit Counter
fOSC
÷ 12
C/T = 0
C/T = 1
T1 pin
TL1
(5 bits)
TH1
(8 bits)
TF1
Interrupt
Control
TR1
Gate
INT1 pin
AI06622
50/163
uPSD3212A, uPSD3212C, uPSD3212CV
Mode 2. Mode 2 configures the Timer register as
an 8-bit Counter (TL1) with automatic reload, as
shown in Figure 23. Overflow from TL1 not only
sets TF1, but also reloads TL1 with the contents of
TH1, which is preset by software. The reload
leaves TH1 unchanged. Mode 2 operation is the
same for Timer/Counter 0.
Timer 2
Like Timer 0 and 1, Timer 2 can operate as either
an event timer or as an event counter. This is selected by Bit C/T2 in the special function register
T2CON (see Table 40). It has three operating
modes: Capture, Auto-reload, and Baud Rate
Generator (see Table 41., page 52), which are selected by bits in the T2CON as shown in Table
42., page 52. In the Capture Mode there are two
options which are selected by Bit EXEN2 in
T2CON. if EXEN2 = 0, then Timer 2 is a 16-bit timer or counter which upon overflowing sets Bit TF2,
the Timer 2 overflow bit, which can be used to generate an interrupt. If EXEN2 = 1, then Timer 2 still
does the above, but with the added feature that a
1-to-0 transition at external input T2EX causes the
current value in the Timer 2 registers, TL2 and
TH2, to be captured into registers RCAP2L and
RCAP2H, respectively. In addition, the transition
at T2EX causes Bit EXF2 in T2CON to be set, and
EXF2 like TF2 can generate an interrupt. The Capture Mode is illustrated in Figure 24., page 53.
In the Auto-reload Mode, there are again two options, which are selected by bit EXEN2 in T2CON.
If EXEN2 = 0, then when Timer 2 rolls over it not
only sets TF2 but also causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2L and RCAP2H, which are preset by
software. If EXEN2 = 1, then Timer 2 still does the
above, but with the added feature that a 1-to-0
transition at external input T2EX will also trigger
the 16-bit reload and set EXF2. The Auto-reload
Mode is illustrated in Standard Serial Interface
(UART) Figure 25., page 53. The Baud Rate Generation Mode is selected by (RCLK, RCLK1) = 1
and/or (TCLK, TCLK1) = 1. It will be described in
conjunction with the serial port.
Figure 23. Timer/Counter Mode 2: 8-bit Auto-reload
fOSC
÷ 12
C/T = 0
C/T = 1
T1 pin
TL1
(8 bits)
TF1
Interrupt
Control
TR1
Gate
INT1 pin
TH1
(8 bits)
AI06623
Table 40. Timer/Counter 2 Control Register (T2CON)
7
6
5
4
3
2
1
0
TF2
EXF2
RCLK
TCLK
EXEN2
TR2
C/T2
CP/RL2
51/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 41. Timer/Counter 2 Operating Modes
T2CON
Mode
16-bit
Autoreload
Input Clock
RxCLK
or
TxCLK
CP/
RL2
TR2
T2MOD
DECN
T2CON
EXEN
P1.1
T2EX
0
0
1
0
0
x
reload upon overflow
0
0
1
0
1
↓
reload trigger (falling edge)
0
0
1
1
x
0
Down counting
0
0
1
1
x
1
Up counting
0
1
1
x
0
x
16-bit Timer/Counter
(only up counting)
16-bit
Capture
0
1
1
x
1
↓
Capture (TH1,TL2) →
(RCAP2H,RCAP2L)
1
x
1
x
0
x
No Overflow Interrupt
Request (TF2)
Baud Rate
Generator
Off
Remarks
1
x
1
x
1
↓
Extra External Interrupt
(Timer 2)
x
x
0
x
x
x
Timer 2 stops
Internal
External
(P1.0/T2)
fOSC/12
MAX
fOSC/24
fOSC/12
MAX
fOSC/24
fOSC/12
MAX
fOSC/24
—
—
Note: ↓ = falling edge
Table 42. Description of the T2CON Bits
Bit
Symbol
Function
7
TF2
Timer 2 Overflow Flag. Set by a Timer 2 overflow, and must be cleared by software. TF2
will not be set when either (RCLK, RCLK1)=1 or (TCLK, TCLK)=1
Timer 2 External Flag set when either a capture or reload is caused by a negative
transition on T2EX and EXEN2=1. When Timer 2 Interrupt is enabled, EXF2=1 will
cause the CPU to vector to the Timer 2 Interrupt routine. EXF2 must be cleared by
software
6
EXF2
5
RCLK(1)
Receive Clock Flag (UART 1). When set, causes the serial port to use Timer 2 overflow
pulses for its receive clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be
used for the receive clock
4
TCLK(1)
Transmit Clock Flag (UART 1). When set, causes the serial port to use Timer 2 overflow
pulses for its transmit clock in Modes 1 and 3. TCLK=0 causes Timer 1 overflow to be
used for the transmit clock
3
EXEN2
Timer 2 External Enable Flag. When set, allows a capture or reload to occur as a result
of a negative transition on T2EX if Timer 2 is not being used to clock the serial port.
EXEN2=0 causes Time 2 to ignore events at T2EX
2
TR2
Start/stop control for Timer 2. A logic 1 starts the timer
1
C/T2
Timer or Counter Select for Timer 2. Cleared for timer operation (input from internal
system clock, tCPU); set for external event counter operation (negative edge triggered)
CP/RL2
Capture/Reload Flag. When set, capture will occur on negative transition of T2EX if
EXEN2=1. When cleared, auto-reload will occur either with TImer 2 overflows, or
negative transitions of T2EX when EXEN2=1. When either (RCLK, RCLK1)=1 or (TCLK,
TCLK)=1, this bit is ignored, and timer is forced to auto-reload on Timer 2 overflow
0
Note: 1. The RCLK1 and TCLK1 Bits in the PCON Register control UART 2, and have the same function as RCLK and TCLK.
52/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 24. Timer 2 in Capture Mode
fOSC
÷ 12
C/T2 = 0
C/T2 = 1
T2 pin
TL2
(8 bits)
TH2
(8 bits)
TF2
Control
TR2
Timer 2
Interrupt
Capture
RCAP2L RCAP2H
Transition
Detector
T2EX pin
EXP2
Control
EXEN2
AI06625
Figure 25. Timer 2 in Auto-Reload Mode
fOSC
÷ 12
C/T2 = 0
C/T2 = 1
T2 pin
TL2
(8 bits)
TH2
(8 bits)
TF2
Control
TR2
Timer 2
Interrupt
Reload
RCAP2L RCAP2H
Transition
Detector
T2EX pin
EXP2
Control
EXEN2
AI06626
53/163
uPSD3212A, uPSD3212C, uPSD3212CV
Mode 3. Timer 1 in Mode 3 simply holds its count.
The effect is the same as setting TR1 = 0.
Timer 0 in Mode 3 establishes TL0 and TH0 as two
separate counters. The logic for Mode 3 on Timer
0 is shown in Figure 26. TL0 uses the Timer 0 control Bits: C/T, GATE, TR0, INT0, and TF0. TH0 is
locked into a timer function (counting machine cycles) and takes over the use of TR1 and TF1 from
Timer 1. Thus, TH0 now controls the “Timer 1“ Interrupt.
Mode 3 is provided for applications requiring an
extra 8-bit timer on the counter. With Timer 0 in
Mode 3, an uPSD321x Devices can look like it has
three Timer/Counters. When Timer 0 is in Mode 3,
Timer 1 can be turned on and off by switching it out
of and into its own Mode 3, or can still be used by
the serial port as a baud rate generator, or in fact,
in any application not requiring an interrupt.
Figure 26. Timer/Counter Mode 3: Two 8-bit Counters
fOSC
÷ 12
C/T = 0
C/T = 1
T0 pin
TL0
(8 bits)
TF0
Interrupt
TH1
(8 bits)
TF1
Interrupt
Control
TR0
Gate
INT0 pin
fOSC
÷ 12
Control
TR1
54/163
AI06624
uPSD3212A, uPSD3212C, uPSD3212CV
STANDARD SERIAL INTERFACE (UART)
The uPSD321x Devices provides two standard
8032 UART serial ports. The first port is connected
to pin P3.0 (RX) and P3.1 (TX). The second port is
connected to pin P1.2 (RX) and P1.3(TX). The operation of the two serial ports are the same and are
controlled by the SCON and SCON2 registers.
The serial port is full duplex, meaning it can transmit and receive simultaneously. It is also receivebuffered, meaning it can commence reception of a
second byte before a previously received byte has
been read from the register. (However, if the first
byte still has not been read by the time reception
of the second byte is complete, one of the bytes
will be lost.) The serial port receive and transmit
registers are both accessed at Special Function
Register SBUF (or SBUF2 for the second serial
port). Writing to SBUF loads the transmit register,
and reading SBUF accesses a physically separate
receive register.
The serial port can operate in 4 modes:
Mode 0. Serial data enters and exits through
RxD. TxD outputs the shift clock. 8 bits are transmitted/received (LSB first). The baud rate is fixed
at 1/12 the fOSC.
Mode 1. 10 bits are transmitted (through TxD) or
received (through RxD): a start Bit (0), 8 data bits
(LSB first), and a Stop Bit (1). On receive, the Stop
Bit goes into RB8 in Special Function Register
SCON. The baud rate is variable.
Mode 2. 11 bits are transmitted (through TxD) or
received (through RxD): start Bit (0), 8 data bits
(LSB first), a programmable 9th data bit, and a
Stop Bit (1). On Transmit, the 9th data bit (TB8 in
SCON) can be assigned the value of '0' or '1.' Or,
for example, the Parity Bit (P, in the PSW) could
be moved into TB8. On receive, the 9th data bit
goes into RB8 in Special Function Register SCON,
while the Stop Bit is ignored. The baud rate is programmable to either 1/32 or 1/64 the oscillator frequency.
Mode 3. 11 bits are transmitted (through TxD) or
received (through RxD): a Start Bit (0), 8 data bits
(LSB first), a programmable 9th data bit, and a
Stop Bit (1). In fact, Mode 3 is the same as Mode
2 in all respects except baud rate. The baud rate
in Mode 3 is variable.
In all four modes, transmission is initiated by any
instruction that uses SBUF as a destination register. Reception is initiated in Mode 0 by the condition RI = 0 and REN = 1. Reception is initiated in
the other modes by the incoming start bit if REN =
1.
Multiprocessor Communications
Modes 2 and 3 have a special provision for multiprocessor communications. In these modes, 9
data bits are received. The 9th one goes into RB8.
Then comes a Stop Bit. The port can be programmed such that when the Stop Bit is received,
the serial port interrupt will be activated only if RB8
= 1. This feature is enabled by setting Bit SM2 in
SCON. A way to use this feature in multi-processor systems is as follows:
When the master processor wants to transmit a
block of data to one of several slaves, it first sends
out an address byte which identifies the target
slave. An address byte differs from a data byte in
that the 9th bit is '1' in an address byte and 0 in a
data byte. With SM2 = 1, no slave will be interrupted by a data byte. An ad-dress byte, however, will
interrupt all slaves, so that each slave can examine the received byte and see if it is being addressed. The addressed slave will clear its SM2
Bit and prepare to receive the data bytes that will
be coming. The slaves that weren’t being addressed leave their SM2s set and go on about
their business, ignoring the coming data bytes.
SM2 has no effect in Mode 0, and in Mode 1 can
be used to check the validity of the Stop Bit. In a
Mode 1 reception, if SM2 = 1, the Receive Interrupt will not be activated unless a valid Stop Bit is
received.
55/163
uPSD3212A, uPSD3212C, uPSD3212CV
Serial Port Control Register
The serial port control and status register is the
Special Function Register SCON (SCON2 for the
second port), shown in Figure 27. This register
(see Tables 43 and 44) contains not only the mode
selection bits, but also the 9th data bit for transmit
and receive (TB8 and RB8), and the Serial Port Interrupt Bits (TI and RI).
Figure 27. Serial Port Mode 0, Block Diagram
Internal Bus
Write
to
SBUF
D S
Q
CL
RxD
P3.0 Alt
Output
Function
SBUF
Zero Detector
Shift
Start
Tx Control
S6
Tx Clock
T
Send
Serial
Port
Interrupt
Shift
Clock
REN
Start
R1
TxD
P3.1 Alt
Output
Function
Receive
R
Rx Clock
Shift
Rx Control
7 6 5 4 3 2 1 0
RxD
P3.0 Alt
Input
Function
Input Shift Register
Load
SBUF
Shift
SBUF
Read
SBUF
Internal Bus
AI06824
Table 43. Serial Port Control Register (SCON)
7
6
5
4
3
2
1
0
SM0
SM1
SM2
REN
TB8
RB8
TI
RI
56/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 44. Description of the SCON Bits
Bit
Symbol
7
SM0
6
SM1
Function
(SM1,SM0)=(0,0): Shift Register. Baud rate = fOSC/12
(SM1,SM0)=(1,0): 8-bit UART. Baud rate = variable
(SM1,SM0)=(0,1): 8-bit UART. Baud rate = fOSC/64 or fOSC/32
(SM1,SM0)=(1,1): 8-bit UART. Baud rate = variable
5
SM2
Enables the multiprocessor communication features in Mode 2 and 3. In Mode 2 or 3, if
SM2 is set to '1,' RI will not be activated if its received 8th data bit (RB8) is '0.' In Mode 1,
if SM2=1, RI will not be activated if a valid Stop Bit was not received. In Mode 0, SM2
should be '0'
4
REN
Enables serial reception. Set by software to enable reception. Clear by software to
disable reception
3
TB8
The 8th data bit that will be transmitted in Modes 2 and 3. Set or clear by software as
desired
2
RB8
In Modes 2 and 3, this bit contains the 8th data bit that was received. In Mode 1, if
SM2=0, RB8 is the Snap Bit that was received. In Mode 0, RB8 is not used
1
TI
Transmit Interrupt Flag. Set by hardware at the end of the 8th bit time in Mode 0, or at
the beginning of the Stop Bit in the other modes, in any serial transmission. Must be
cleared by software
0
RI
Receive Interrupt Flag. Set by hardware at the end of the 8th bit time in Mode 0, or
halfway through the Stop Bit in the other modes, in any serial reception (except for
SM2). Must be cleared by software
57/163
uPSD3212A, uPSD3212C, uPSD3212CV
Baud Rates. The baud rate in Mode 0 is fixed:
Mode 0 Baud Rate = fOSC / 12
The baud rate in Mode 2 depends on the value of
Bit SMOD = 0 (which is the value on reset), the
baud rate is 1/64 the oscillator frequency. If SMOD
= 1, the baud rate is 1/32 the oscillator frequency.
Mode 2 Baud Rate = (2SMOD / 64) x fOSC
In the uPSD321x Devices, the baud rates in
Modes 1 and 3 are determined by the Timer 1
overflow rate.
Using Timer 1 to Generate Baud Rates. When
Timer 1 is used as the baud rate generator, the
baud rates in Modes 1 and 3 are determined by
the Timer 1 overflow rate and the value of SMOD
as follows (see Table 45., page 59):
Mode 1,3 Baud Rate =
(2SMOD / 32) x (Timer 1 overflow rate)
The Timer 1 Interrupt should be disabled in this
application. The Timer itself can be configured for
either “timer” or “counter” operation, and in any of
its 3 running modes. In the most typical applications, it is configured for “timer” operation, in the
Auto-reload Mode (high nibble of TMOD = 0010B).
In that case the baud rate is given by the formula:
Mode 1,3 Baud Rate =
(2SMOD / 32) x (fOSC / (12 x [256 – (TH1)]))
One can achieve very low baud rates with Timer 1
by leaving the Timer 1 Interrupt enabled, and configuring the Timer to run as a 16-bit timer (high nibble of TMOD = 0001B), and using the Timer 1
Interrupt to do a 16-bit software reload. Figure
22., page 50 lists various commonly used baud
rates and how they can be obtained from Timer 1.
Using Timer/Counter 2 to Generate Baud
Rates. In the uPSD321x Devices, Timer 2 selected as the baud rate generator by setting TCLK
and/or RCLK (see Figure 22., page 50 Timer/
Counter 2 Control Register (T2CON)).
Note: The baud rate for transmit and receive can
be simultaneously different. Setting RCLK and/or
TCLK puts Timer into its Baud Rate Generator
Mode.
The RCLK and TCLK Bits in the T2CON register
configure UART 1. The RCLK1 and TCLK1 Bits in
the PCON register configure UART 2.
58/163
The Baud Rate Generator Mode is similar to the
Auto-reload Mode, in that a roll over in TH2 causes
the Timer 2 registers to be reloaded with the 16-bit
value in registers RCAP2H and RCAP2L, which
are preset by software.
Now, the baud rates in Modes 1 and 3 are determined at Timer 2’s overflow rate as follows:
Mode 1,3 Baud Rate = Timer 2 Overflow Rate / 16
The timer can be configured for either “timer” or
“counter” operation. In the most typical applications, it is configured for “timer” operation (C/T2 =
0). “Timer” operation is a little different for Timer 2
when it’s being used as a baud rate generator.
Normally, as a timer it would increment every machine cycle (thus at the 1/6 the CPU clock frequency). In the case, the baud rate is given by the
formula:
Mode 1,3 Baud Rate = fOSC / (32 x [65536 (RCAP2H, RCAP2L)]
where (RCAP2H, RCAP2L) is the content of
RC2H and RC2L taken as a 16-bit unsigned integer.
Timer 2 also be used as the Baud Rate Generating
Mode. This mode is valid only if RCLK + TCLK = 1
in T2CON or in PCON.
Note: A roll-over in TH2 does not set TF2, and will
not generate an interrupt. Therefore, the Timer interrupt does not have to be disabled when Timer 2
is in the Baud Rate Generator Mode.
Note: If EXEN2 is set, a 1-to-0 transition in T2EX
will set EXF2 but will not cause a reload from
(RCAP2H, RCAP2L) to (TH2, TL2). Thus when
Timer 2 is in use as a baud rate generator, T2EX
can be used as an extra external interrupt, if desired.
It should be noted that when Timer 2 is running
(TR2 = 1) in “timer” function in the Baud Rate Generator Mode, one should not try to READ or
WRITE TH2 or TL2. Under these conditions the
timer is being incremented every state time, and
the results of a READ or WRITE may not be accurate. The RC registers may be read, but should not
be written to, because a WRITE might overlap a
reload and cause WRITE and/or reload errors.
Turn the timer off (clear TR2) before accessing the
Timer 2 or RC registers, in this case.
uPSD3212A, uPSD3212C, uPSD3212CV
Table 45. Timer 1-Generated Commonly Used Baud Rates
Baud Rate
fOSC
SMOD
Timer 1
C/T
Mode
Reload Value
Mode 0 Max: 1MHz
12MHz
X
X
X
X
Mode 2 Max: 375K
12MHz
1
X
X
X
Modes 1, 3: 62.5K
12MHz
1
0
2
FFh
19.2K
11.059MHz
1
0
2
FDh
9.6K
11.059MHz
0
0
2
FDh
4.8K
11.059MHz
0
0
2
FAh
2.4K
11.059MHz
0
0
2
F4h
1.2K
11.059MHz
0
0
2
E8h
137.5
11.059MHz
0
0
2
1Dh
110
6MHz
0
0
2
72h
110
12MHz
0
0
1
FEEBh
More About Mode 0. Serial data enters and exits
through RxD. TxD outputs the shift clock. 8 bits are
transmitted/received: 8 data bits (LSB first). The
baud rate is fixed at 1/12 the fOSC.
Figure 27., page 56 shows a simplified functional
diagram of the serial port in Mode 0, and associated timing.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal at S6P2 also loads a '1' into the
9th position of the transmit shift register and tells
the TX Control block to commence a transmission.
The internal timing is such that one full machine
cycle will elapse between “WRITE to SBUF” and
activation of SEND.
SEND enables the output of the shift register to the
alternate out-put function line of RxD and also enable SHIFT CLOCK to the alternate output function line of TxD. SHIFT CLOCK is low during S3,
S4, and S5 of every machine cycle, and high during S6, S1, and S2. At S6P2 of every machine cycle in which SEND is active, the contents of the
transmit shift are shifted to the right one position.
As data bits shift out to the right, zeros come in
from the left. When the MSB of the data byte is at
the output position of the shift register, then the '1'
that was initially loaded into the 9th position, is just
to the left of the MSB, and all positions to the left
of that contain zeros. This condition flags the TX
Control block to do one last shift and then deactivate SEND and set T1. Both of these actions occur
at S1P1. Both of these actions occur at S1P1 of
the 10th machine cycle after “WRITE to SBUF.”
Reception is initiated by the condition REN = 1 and
R1 = 0. At S6P2 of the next machine cycle, the RX
Control unit writes the bits 11111110 to the receive
shift register, and in the next clock phase activates
RECEIVE.
RECEIVE enables SHIFT CLOCK to the alternate
output function line of TxD. SHIFT CLOCK makes
transitions at S3P1 and S6P1 of every machine
cycle in which RECEIVE is active, the contents of
the receive shift register are shifted to the left one
position. The value that comes in from the right is
the value that was sampled at the RxD pin at S5P2
of the same machine cycle.
As data bits come in from the right, '1s' shift out to
the left. When the '0' that was initially loaded into
the right-most position arrives at the left-most position in the shift register, it flags the RX Control
block to do one last shift and load SBUF. At S1P1
of the 10th machine cycle after the WRITE to
SCON that cleared RI, RECEIVE is cleared as RI
is set.
59/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 28. Serial Port Mode 0, Waveforms
Write to SBUF
Send
Shift
RxD (Data Out)
TxD (Shift Clock)
T
S6P2
D0
D1
S3P1
D2
D3
D4
D5
D6
Transmit
D7
S6P1
Write to SCON
RI
Receive
Shift
RxD (Data In)
TxD (Shift Clock)
Clear RI
Receive
D0
D1
D2
D3
D4
D5
D6
D7
AI06825
More About Mode 1. Ten bits are transmitted
(through TxD), or received (through RxD): a start
Bit (0), 8 data bits (LSB first). and a Stop Bit (1). On
receive, the Stop Bit goes into RB8 in SCON. In
the uPSD321x Devices the baud rate is determined by the Timer 1 or Timer 2 overflow rate.
Figure 29., page 61 shows a simplified functional
diagram of the serial port in Mode 1, and associated timings for transmit receive.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal also loads a '1' into the 9th bit position of the transmit shift register and flags the TX
Control unit that a transmission is requested.
Transmission actually commences at S1P1 of the
machine cycle following the next rollover in the divide-by-16 counter. (Thus, the bit times are synchronized to the divide-by-16 counter, not to the
“WRITE to SBUF” signal.)
The transmission begins with activation of SEND
which puts the start bit at TxD. One bit time later,
DATA is activated, which enables the output bit of
the transmit shift register to TxD. The first shift
pulse occurs one bit time after that.
As data bits shift out to the right, zeros are clocked
in from the left (see Figure 30., page 61). When
the MSB of the data byte is at the output position
of the shift register, then the '1' that was initially
loaded into the 9th position is just to the left of the
MSB, and all positions to the left of that contain zeros. This condition flags the TX Control unit to do
one last shift and then deactivate SEND and set
TI. This occurs at the 10th divide-by-16 rollover after “WRITE to SBUF.”
Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a
60/163
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH
is written into the input shift register. Resetting the
divide-by-16 counter aligns its roll-overs with the
boundaries of the incoming bit times.
The 16 states of the counter divide each bit time
into 16ths. At the 7th, 8th, and 9th counter states
of each bit time, the bit detector samples the value
of RxD. The value accepted is the value that was
seen in at least 2 of the 3 samples. This is done for
noise rejection. If the value accepted during the
first bit time is not '0,' the receive circuits are reset
and the unit goes back to looking for an-other 1-to0 transition. This is to provide rejection of false
start bits. If the start bit proves valid, it is shifted
into the input shift register, and reception of the reset of the rest of the frame will proceed.
As data bits come in from the right, '1s' shift out to
the left. When the start bit arrives at the left-most
position in the shift register (which in Mode 1 is a
9-bit register), it flags the RX Control block to do
one last shift, load SBUF and RB8, and set RI. The
signal to load SBUF and RB8, and to set RI, will be
generated if, and only if, the following conditions
are met at the time the final shift pulse is generated:
1. R1 = 0, and
2. Either SM2 = 0, or the received Stop Bit = 1.
If either of these two conditions is not met, the received frame is irretrievably lost. If both conditions
are met, the Stop Bit goes into RB8, the 8 data bits
go into SBUF, and RI is activated. At this time,
whether the above conditions are met or not, the
unit goes back to looking for a 1-to-0 transition in
RxD.
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 29. Serial Port Mode 1, Block Diagram
Timer1
Overflow
Timer2
Overflow
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
0
1
Shift
Start
TCLK
Tx Control
÷16
0
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
1
RCLK
÷16
Sample
Rx Clock
1-to-0
Transition
Detector
Load SBUF
RI
Shift
Rx Control
1FFh
Start
Rx Detector
Input Shift Register
Load
SBUF
RxD
Shift
SBUF
Read
SBUF
Internal Bus
AI06826
Figure 30. Serial Port Mode 1, Waveforms
Tx Clock
Write to SBUF
Send
S1P1
Transmit
Data
Shift
TxD
T1
Rx Clock
Start Bit
D0
D1
D2
D3
D4
D5
D6
D7
Stop Bit
D1
D2
D3
D4
D5
D6
D7
Stop Bit
÷16 Reset
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
AI06843
61/163
uPSD3212A, uPSD3212C, uPSD3212CV
More About Modes 2 and 3. Eleven bits are
transmitted (through TxD), or received (through
RxD): a Start Bit (0), 8 data bits (LSB first), a programmable 9th data bit, and a Stop Bit (1). On
transmit, the 9th data bit (TB8) can be assigned
the value of '0' or '1.' On receive, the data bit goes
into RB8 in SCON. The baud rate is programmable to either 1/16 or 1/32 the CPU clock frequency
in Mode 2. Mode 3 may have a variable baud rate
generated from Timer 1.
Figure 31., page 63 and Figure 33., page 64 show
a functional diagram of the serial port in Modes 2
and 3. The receive portion is exactly the same as
in Mode 1. The transmit portion differs from Mode
1 only in the 9th bit of the transmit shift register.
Transmission is initiated by any instruction that
uses SBUF as a destination register. The “WRITE
to SBUF” signal also loads TB8 into the 9th bit position of the transmit shift register and flags the TX
Control unit that a transmission is requested.
Transmission commences at S1P1 of the machine
cycle following the next roll-over in the divide-by16 counter. (Thus, the bit times are synchronized
to the divide-by-16 counter, not to the “WRITE to
SBUF” signal.)
The transmission begins with activation of SEND,
which puts the start bit at TxD. One bit time later,
DATA is activated, which enables the output bit of
the transmit shift register to TxD. The first shift
pulse occurs one bit time after that (see Figure
32., page 63 and Figure 34., page 64). The first
shift clocks a '1' (the Stop Bit) into the 9th bit position of the shift register. There-after, only zeros are
clocked in. Thus, as data bits shift out to the right,
zeros are clocked in from the left. When TB8 is at
the out-put position of the shift register, then the
Stop Bit is just to the left of TB8, and all positions
to the left of that contain zeros. This condition flags
the TX Control unit to do one last shift and then de-
62/163
activate SEND and set TI. This occurs at the 11th
divide-by 16 rollover after “WRITE to SUBF.”
Reception is initiated by a detected 1-to-0 transition at RxD. For this purpose RxD is sampled at a
rate of 16 times whatever baud rate has been established. When a transition is detected, the divide-by-16 counter is immediately reset, and 1FFH
is written to the input shift register.
At the 7th, 8th, and 9th counter states of each bit
time, the bit detector samples the value of R-D.
The value accepted is the value that was seen in
at least 2 of the 3 samples. If the value accepted
during the first bit time is not '0,' the receive circuits
are reset and the unit goes back to looking for another 1-to-0 transition. If the Start Bit proves valid,
it is shifted into the input shift register, and reception of the rest of the frame will proceed.
As data bits come in from the right, '1s' shift out to
the left. When the Start Bit arrives at the left-most
position in the shift register (which in Modes 2 and
3 is a 9-bit register), it flags the RX Control block
to do one last shift, load SBUF and RB8, and set
RI.
The signal to load SBUF and RB8, and to set RI,
will be generated if, and only if, the following conditions are met at the time the final shift pulse is
generated:
1. RI = 0, and
2. Either SM2 = 0, or the received 9th data bit = 1
If either of these conditions is not met, the received
frame is irretrievably lost, and RI is not set. If both
conditions are met, the received 9th data bit goes
into RB8, and the first 8 data bits go into SBUF.
One bit time later, whether the above conditions
were met or not, the unit goes back to looking for
a 1-to-0 transition at the RxD input.
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 31. Serial Port Mode 2, Block Diagram
Phase2 Clock
1/2*fOSC
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
Shift
Start
Tx Control
÷16
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
÷16
Sample
Load SBUF
RI
Rx Clock
1-to-0
Transition
Detector
Shift
Rx Control
1FFh
Start
Rx Detector
Input Shift Register
Load
SBUF
RxD
Shift
SBUF
Read
SBUF
Internal Bus
AI06844
Figure 32. Serial Port Mode 2, Waveforms
Tx Clock
Write to SBUF
Send
S1P1
Data
Transmit
Shift
TxD
TI
Stop Bit
Generator
Rx Clock
Start Bit
D0
D1
D2
D3
D4
D5
D6
D7
TB8
Stop Bit
D1
D2
D3
D4
D5
D6
D7
RB8
Stop Bit
÷16 Reset
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
AI06845
63/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 33. Serial Port Mode 3, Block Diagram
Timer1
Overflow
Timer2
Overflow
Internal Bus
TB8
Write
to
SBUF
D S
Q
CL
÷2
0
TxD
SBUF
1
Zero Detector
SMOD
0
1
Shift
Start
TCLK
Tx Control
÷16
0
Tx Clock
Data
Send
TI
Serial
Port
Interrupt
1
RCLK
÷16
Sample
Load SBUF
RI
Rx Clock
1-to-0
Transition
Detector
Shift
Rx Control
1FFh
Start
Rx Detector
Input Shift Register
Load
SBUF
RxD
Shift
SBUF
Read
SBUF
Internal Bus
AI06846
Figure 34. Serial Port Mode 3, Waveforms
Tx Clock
Write to SBUF
Send
S1P1
Data
Transmit
Shift
TxD
TI
Stop Bit
Generator
Rx Clock
Start Bit
D0
D1
D2
D3
D4
D5
D6
D7
TB8
Stop Bit
D1
D2
D3
D4
D5
D6
D7
RB8
Stop Bit
÷16 Reset
Start Bit
RxD
Bit Detector
Sample Times
Shift
RI
D0
Receive
AI06847
64/163
uPSD3212A, uPSD3212C, uPSD3212CV
ANALOG-TO-DIGITAL CONVERTOR (ADC)
The analog to digital (A/D) converter allows conversion of an analog input to a corresponding 8-bit
digital value. The A/D module has four analog inputs, which are multiplexed into one sample and
hold. The output of the sample and hold is the input into the converter, which generates the result
via successive approximation. The analog supply
voltage is connected to AVREF of ladder resistance of A/D module.
The A/D module has two registers which are the
control register ACON and A/D result register
ADAT. The register ACON, shown in Table 46 and
Table 47., page 66, controls the operation of the
A/D converter module. To use analog inputs, I/O is
selected by P1SFS register. Also an 8-bit prescaler ASCL divides the main system clock input down
to approximately 6MHz clock that is required for
the ADC logic. Appropriate values need to be loaded into the prescaler based upon the main MCU
clock frequency prior to use.
The processing of conversion starts when the
Start Bit ADST is set to '1.' After one cycle, it is
cleared by hardware. The register ADAT contains
the results of the A/D conversion. When conversion is completed, the result is loaded into the
ADAT the A/D Conversion Status Bit ADSF is set
to '1.'
The block diagram of the A/D module is shown in
Figure 35. The A/D Status Bit ADSF is set auto-
matically when A/D conversion is completed,
cleared when A/D conversion is in process.
The ASCL should be loaded with a value that results in a clock rate of approximately 6MHz for the
ADC using the following formula (see Table
48., page 66):
ADC clock input = (fOSC / 2) / (Prescaler register
value +1)
Where fOSC is the MCU clock input frequency
The conversion time for the ADC can be calculated as follows:
ADC Conversion Time = 8 clock * 8bits * (ADC
Clock) ~= 10.67usec (at 6MHz)
ADC Interrupt
The ADSF Bit in the ACON register is set to '1'
when the A/D conversion is complete. The status
bit can be driven by the MCU, or it can be configured to generate a falling edge interrupt when the
conversion is complete.
The ADSF Interrupt is enabled by setting the ADSFINT Bit in the PCON register. Once the bit is set,
the external INT1 Interrupt is disabled and the
ADSF Interrupt takes over as INT1. INT1 must be
configured as if it is an edge interrupt input. The
INP1 pin (p3.3) is available for general I/O functions, or Timer1 gate control.
Figure 35. A/D Block Diagram
Ladder
Resistor
Decode
AVREF
ACH0
ACH1
Input
MUX
Successive
Approximation
Circuit
S/H
Conversion
Complete
Interrupt
ACH2
ACH3
ACON
ADAT
INTERNAL BUS
AI06627
65/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 46. ADC SFR Memory Map
SFR
Addr
Reg
Name
95
ASCL
96
ADAT
97
ACON
Bit Register Name
7
ADAT7
6
ADAT6
5
4
ADAT5
3
ADAT4
ADEN
2
1
Reset
Comments
Value
0
00
8-bit
Prescaler for
ADC clock
ADAT3
ADAT2
ADAT1
ADAT0
00
ADC Data
Register
ADS1
ADS0
ADST
ADSF
00
ADC Control
Register
Table 47. Description of the ACON Bits
Bit
Symbol
7 to 6
—
ADEN
5
4
—
Function
Reserved
ADC Enable Bit: 0 : ADC shut off and consumes no operating current
1 : enable ADC
Reserved
ADS1, ADS0 Analog channel select
3 to 2
1
0
0,
0,
1,
1,
0
1
0
1
Channel0 (ACH0)
Channel1 (ACH1)
Channel2 (ACH2)
Channel3 (ACH3)
ADST
ADC Start Bit:
0 : force to zero
1 : start an ADC; after one cycle, bit is cleared to '0'
ADSF
ADC Status Bit:
0 : A/D conversion is in process
1 : A/D conversion is completed, not in process
Table 48. ADC Clock Input
66/163
MCU Clock Frequency
Prescaler Register Value
ADC Clock
40MHz
2
6.7MHz
36MHz
2
6MHz
24MHz
1
6MHz
12MHz
0
6MHz
uPSD3212A, uPSD3212C, uPSD3212CV
PULSE WIDTH MODULATION (PWM)
The PWM block has the following features:
■
Four-channel, 8-bit PWM unit with 16-bit
prescaler
■
One-channel, 8-bit unit with programmable
frequency and pulse width
■
PWM Output with programmable polarity
4-channel PWM Unit (PWM 0-3)
The 8-bit counter of a PWM counts module 256
(i.e., from 0 to 255, inclusive). The value held in
the 8-bit counter is compared to the contents of the
Special Function Register (PWM 0-3) of the corresponding PWM. The polarity of the PWM outputs
is programmable and selected by the PWML Bit in
PWMCON register. Provided the contents of a
PWM 0-3 register is greater than the counter value, the corresponding PWM output is set HIGH
(with PWML = 0). When the contents of this register is less than or equal to the counter value, the
corresponding PWM output is set LOW (with
PWML = 0). The pulse-width-ratio is therefore de-
fined by the contents of the corresponding Special
Function Register (PWM 0-3) of a PWM. By loading the corresponding Special Function Register
(PWM 0-3) with either 00H or FFH, the PWM output can be retained at a constant HIGH or LOW
level respectively (with PWML = 0).
For each PWM unit, there is a 16-bit Prescaler that
are used to divide the main system clock to form
the input clock for the corresponding PWM unit.
This prescaler is used to define the desired repetition rate for the PWM unit. SFR registers B1h B2h are used to hold the 16-bit divisor values.
The repetition frequency of the PWM output is given by:
fPWM8 = (fOSC / prescaler0) / (2 x 256)
And the input clock frequency to the PWM
counters is = fOSC / 2 / (prescaler data value + 1)
See I/O PORTS (MCU Module), page 40 for more
information on how to configure the Port 4 pin as
PWM output.
67/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 36. Four-Channel 8-bit PWM Block Diagram
DATA BUS
x4
8
8
CPU rd/wr
8-bit PWM0-PWM3
Data Registers
8
x4
8
load
8-bit PWM0-PWM3
Comparators Registers
8
x4
16-bit Prescaler
Register
(B2h,B1h)
CPU rd/wr
8-bit PWM0-PWM3
Comparators
4
Port4.3
Port4.4
Port4.5
Port4.6
PWMCON bit7 (PWML)
16
8
8-bit Counter
16-bit Prescaler
Counter
fOSC/2
clock
Overflow
load
PWMCON bit5 (PWME)
AI06647
68/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 49. PWM SFR Memory Map
SFR
Reg Name
Addr
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Value
Comment
s
PWML
PWMP
PWME
CFG4
CFG3
CFG2
CFG1
CFG0
00
PWM
Control
Polarity
A1
PWMCON
A2
PWM0
00
PWM0
Output
Duty Cycle
A3
PWM1
00
PWM1
Output
Duty Cycle
A4
PWM2
00
PWM2
Output
Duty Cycle
A5
PWM3
00
PWM3
Output
Duty Cycle
AA
PWM4P
00
PWM 4
Period
AB
PWM4W
00
PWM 4
Pulse
Width
B1
PSCL0L
00
Prescaler 0
Low (8-bit)
B2
PSCL0H
00
Prescaler 0
High (8-bit)
B3
PSCL1L
00
Prescaler 1
Low (8-bit)
B4
PSCL1H
00
Prescaler 1
High (8-bit)
PWMCON Register Bit Definition:
– PWML = PWM 0-3 polarity control
– PWMP = PWM 4 polarity control
– PWME = PWM enable (0 = disabled, 1=
enabled)
–
–
CFG3..CFG0 = PWM 0-3 Output (0 = Open
Drain; 1 = Push-Pull)
CFG4 = PWM 4 Output (0 = Open Drain; 1 =
Push-Pull)
69/163
uPSD3212A, uPSD3212C, uPSD3212CV
Programmable Period 8-bit PWM
The PWM 4 channel can be programmed to provide a PWM output with variable pulse width and
period. The PWM 4 has a 16-bit Prescaler, an 8bit Counter, a Pulse Width Register, and a Period
Register. The Pulse Width Register defines the
PWM pulse width time, while the Period Register
defines the period of the PWM. The input clock to
the Prescaler is fOSC/2. The PWM 4 channel is assigned to Port 4.7.
Figure 37. Programmable PWM 4 Channel Block Diagram
DATA BUS
8
CPU RD/WR
8
8
8-bit PWM4P
Register
(Period)
8-bit PWM4W
Register
(Width)
8
8
8-bit PWM4
Comparator
Register
8-bit PWM4
Comparator
Register
8
CPU RD/WR
16-bit Prescaler
Register
Load
Port 4.7
(B4h, B3h)
8
PWM4
Control
8
16
8-bit PWM4
Comparator
fOSC / 2
16-bit Prescaler
Counter
Load
8-bit PWM4
Comparator
Match
8
PWMCON
Bit 6 (PWMP)
8
PWMCON
Bit 5 (PWME)
8-bit Counter
Clock
Reset
AI07091
70/163
uPSD3212A, uPSD3212C, uPSD3212CV
PWM 4 Channel Operation
The 16-bit Prescaler1 divides the input clock
(fOSC/2) to the desired frequency, the resulting
clock runs the 8-bit Counter of the PWM 4 channel. The input clock frequency to the PWM 4
Counter is:
f PWM4 = (fOSC/2)/(Prescaler1 data value +1)
When the Prescaler1 Register (B4h, B3h) is set to
data value '0,' the maximum input clock frequency
to the PWM 4 Counter is fOSC/2 and can be as high
as 20MHz.
The PWM 4 Counter is a free-running, 8-bit
counter. The output of the counter is compared to
the Compare Registers, which are loaded with
data from the Pulse Width Register (PWM4W,
ABh) and the Period Register (PWM4P, AAh). The
Pulse Width Register defines the pulse duration or
the Pulse Width, while the Period Register defines
the period of the PWM. When the PWM 4 channel
is enabled, the register values are loaded into the
Comparator Registers and are compared to the
Counter output. When the content of the counter is
equal to or greater than the value in the Pulse
Width Register, it sets the PWM 4 output to low
(with PWMP Bit = 0). When the Period Register
equals to the PWM4 Counter, the Counter is
cleared, and the PWM 4 channel output is set to
logic 'high' level (beginning of the next PWM
pulse).
The Period Register cannot have a value of “00”
and its content should always be greater than the
Pulse Width Register.
The Prescaler1 Register, Pulse Width Register,
and Period Register can be modified while the
PWM 4 channel is active. The values of these registers are automatically loaded into the Prescaler
Counter and Comparator Registers when the current PWM 4 period ends.
The PWMCON Register (Bits 5 and 6) controls the
enable/disable and polarity of the PWM 4 channel.
Figure 38. PWM 4 With Programmable Pulse Width and Frequency
Defined by Period Register
PWM4
Defined by Pulse
Width Register
Switch Level
RESET
Counter
AI07090
71/163
uPSD3212A, uPSD3212C, uPSD3212CV
I2C INTERFACE
The serial port supports the twin line I2C-bus, consisting of a data line (SDA1), and a clock line
(SCL1) as shown in Figure 39. Depending on the
configuration, the SDA1 and SCL1 lines may require pull-up resistors.
These lines also function as I/O port lines if the I2C
bus is not enabled.
The system is unique because data transport,
clock generation, address recognition, and bus
control arbitration are all controlled by hardware.
The I2C serial I/O has complete autonomy in byte
handling and operates in 4 modes.
■
Master transmitter
■
Master receiver
Slave transmitter
Slave receiver
These functions are controlled by the SFRs (see
Tables 50, 51, and Table 52., page 73):
– S2CON: the control of byte handling and the
operation of 4 mode.
– S2STA: the contents of its register may also
be used as a vector to various service
routines.
– S2DAT: data shift register.
– S2ADR: slave address register. Slave
address recognition is performed by On-Chip
H/W.
■
■
Figure 39. Block Diagram of the I2C Bus Serial I/O
7
0
Slave Address
7
0
Shift Register
SDA1
Internal Bus
Arbitration and Sync. Logic
Bus Clock Generator
SCL1
7
0
Control Register
7
0
Status Register
AI07430
Table 50. Serial Control Register (S2CON)
7
6
5
4
3
2
1
0
CR2
ENII
STA
STO
ADDR
AA
CR1
CR0
72/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 51. Description of the S2CON Bits
Bit
Symbol
Function
7
CR2
This bit along with Bits CR1and CR0 determines the serial clock frequency when SIO is
in the Master Mode.
6
ENII
Enable IIC. When ENI1 = 0, the IIC is disabled. SDA and SCL outputs are in the high
impedance state.
5
STA
START Flag. When this bit is set, the SIO H/W checks the status of the I2C-bus and
generates a START condition if the bus free. If the bus is busy, the SIO will generate a
repeated START condition when this bit is set.
4
STO
STOP Flag. With this bit set while in Master Mode a STOP condition is generated.
When a STOP condition is detected on the I2C bus, the I2C hardware clears the STO
Flag.
Note: This bit have to be set before 1 cycle interrupt period of STOP. That is, if this bit is
set, STOP condition in Master Mode is generated after 1 cycle interrupt period.
3
ADDR
2
AA
1
CR1
0
CR0
This bit is set when address byte was received. Must be cleared by software.
Acknowledge enable signal. If this bit is set, an acknowledge (low level to SDA) is
returned during the acknowledge clock pulse on the SCL line when:
• Own slave address is received
• A data byte is received while the device is programmed to be a Master Receiver
• A data byte is received while the device is a selected Slave Receiver. When this bit is
reset, no acknowledge is returned.
SIO release SDA line as high during the acknowledge clock pulse.
These two bits along with the CR2 Bit determine the serial clock frequency when SIO is
in the Master Mode.
Table 52. Selection of the Serial Clock Frequency SCL in Master Mode
CR2
CR1
CR0
Bit Rate (kHz) at fOSC
fOSC Divisor
12MHz
24MHz
36MHz
40MHz
0
0
0
16
375
750
X
X
0
0
1
24
250
500
750
833
0
1
0
30
200
400
600
666
0
1
1
60
100
200
300
333
1
0
0
120
50
100
150
166
1
0
1
240
25
50
75
83
1
1
0
480
12.5
25
37.5
41
1
1
1
960
6.25
12.5
18.75
20
73/163
uPSD3212A, uPSD3212C, uPSD3212CV
Serial Status Register (S2STA)
S2STA is a “Read-only” register. The contents of
this register may be used as a vector to a service
routine. This optimized the response time of the
software and consequently that of the I2C bus. The
status codes for all possible modes of the I2C bus
interface are given Table 54.
This flag is set, and an interrupt is generated, after
any of the following events occur:
1. Own slave address has been received during
AA = 1: ack_int
2. The general call address has been received
while GC(S2ADR.0) = 1 and AA = 1:
3. A data byte has been received or transmitted
in Master Mode (even if arbitration is lost):
ack_int
4. A data byte has been received or transmitted
as selected slave: ack_int
5. A stop condition is received as selected slave
receiver or transmitter: stop_int
Data Shift Register (S2DAT)
S2DAT contains the serial data to be transmitted
or data which has just been received. The MSB
(Bit 7) is transmitted or received first; that is, data
shifted from right to left.
Table 53. Serial Status Register (S2STA)
7
6
5
4
3
2
1
0
GC
STOP
INTR
TX_MODE
BBUSY
BLOST
/ACK_REP
SLV
Table 54. Description of the S2STA Bits
Bit
Symbol
Function
7
GC
6
STOP
5
INTR(1,2)
4
TX_MODE
3
BBUSY
Bus Busy Flag.
This bit is set when the bus is being used by another master; otherwise, this bit is reset
2
BLOST
Bus Lost Flag.
This bit is set when the master loses the bus contention; otherwise this bit is reset
1
/ACK_REP
0
SLV
General Call Flag
Stop Flag. This bit is set when a STOP condition is received
Interrupt Flag. This bit is set when an I²C Interrupt condition is requested
Transmission Mode Flag.
This bit is set when the I²C is a transmitter; otherwise this bit is reset
Acknowledge Response Flag.
This bit is set when the receiver transmits the not acknowledge signal
This bit is reset when the receiver transmits the acknowledge signal
Slave Mode Flag.
This bit is set when the I²C plays role in the Slave Mode; otherwise this bit is reset
Note: 1. Interrupt Flag Bit (INTR, S2STA Bit 5) is cleared by Hardware as reading S2STA register.
2. I2C Interrupt Flag (INTR) can occur in below case.
Table 55. Data Shift Register (S2DAT)
7
6
5
4
3
2
1
0
S2DAT7
S2DAT6
S2DAT5
S2DAT4
S2DAT3
S2DAT2
S2DAT1
S2DAT0
74/163
uPSD3212A, uPSD3212C, uPSD3212CV
Address Register (S2ADR)
This 8-bit register may be loaded with the 7-bit
slave address to which the controller will respond
when programmed as a slave receive/transmitter.
The Start/Stop Hold Time Detection and System
Clock registers (Tables 57 and 58) are included in
the I2C unit to specify the start/stop detection time
to work with the large range of MCU frequency values supported. For example, with a system clock
of 40MHz.
Table 56. Address Register (S2ADR)
7
6
5
4
3
2
1
0
SLA6
SLA5
SLA4
SLA3
SLA2
SLA1
SLA0
—
Note: SLA6 to SLA0: Own slave address.
Table 57. Start /Stop Hold Time Detection Register (S2SETUP)
SFR
Address
Register Name
Reset Value
Note
D2h
S2SETUP
00h
To control the start/stop hold time detection for the multi-master
I²C module in Slave Mode
Table 58. System Cock of 40MHz
S1SETUP,
S2SETUP Register
Value
Number of Sample
Clock (fOSC/2 – >
50ns)
Required Start/
Stop Hold Time
00h
1EA
50ns
80h
1EA
50ns
81h
2EA
100ns
82h
3EA
150ns
...
...
...
8Bh
12EA
600ns
...
...
...
FFh
128EA
6000ns
Note
When Bit 7 (enable bit) = 0, the number of
sample clock is 1EA (ignore Bit 6 to Bit 0)
Fast Mode I²C Start/Stop hold time specification
Table 59. System Clock Setup Examples
System Clock
S1SETUP,
S2SETUP Register
Value
Number of Sample
Clock
Required Start/Stop Hold Time
40MHz (fOSC/2 – > 50ns)
8Bh
12 EA
600ns
30MHz (fOSC/2 – > 66.6ns)
89h
9 EA
600ns
20MHz (fOSC/2 – > 100ns)
86h
6 EA
600ns
8MHz (fOSC/2 – > 250ns)
83h
3 EA
750ns
75/163
uPSD3212A, uPSD3212C, uPSD3212CV
USB HARDWARE
The characteristics of USB hardware are as follows:
■
Complies with the Universal Serial Bus
specification Rev. 1.1
■
Integrated SIE (Serial Interface Engine), FIFO
memory and transceiver
■
Low speed (1.5Mbit/s) device capability
■
Supports control endpoint0 and interrupt
endpoint1 and 2
■
USB clock input must be 6MHz (requires MCU
clock frequency to be 12, 24, or 36MHz).
The analog front-end is an on-chip generic USB
transceiver. It is designed to allow voltage levels
equal to VDD from the standard logic to interface
with the physical layer of the Universal Serial Bus.
It is capable of receiving and transmitting serial
data at low speed (1.5Mb/s).
The SIE is the digital-front-end of the USB block.
This module recovers the 1.5MHz clock, detects
the USB sync word and handles all low-level USB
protocols and error checking. The bit-clock recovery circuit recovers the clock from the incoming
USB data stream and is able to track jitter and frequency drift according to the USB specification.
The SIE also translates the electrical USB signals
into bytes or signals. Depending upon the device
USB address and the USB endpoint.
Address, the USB data is directed to the correct
endpoint on SIE interface. The data transfer of this
H/W could be of type control or interrupt.
The device’s USB address and the enabling of the
endpoints are programmable in the SIE configuration header.
USB related registers
The USB block is controlled via seven registers in
the memory: (UADR, UCON0, UCON1, UCON2,
UISTA, UIEN, and USTA).
Three memory locations on chip which communicate the USB block are:
■
USB endpoint0 data transmit register (UDT0)
■
USB endpoint0 data receive register (UDR0)
■
USB endpoint1 data transmit register (UDT1)
Table 60. USB Address Register (UADR: 0EEh)
7
6
5
4
3
2
1
0
USBEN
UADD6
UADD5
UADD4
UADD3
UADD2
UADD1
UADD0
Table 61. Description of the UADR Bits
Bit
Symbol
R/W
Function
7
USBEN
R/W
USB Function Enable Bit.
When USBEN is clear, the USB module will not respond to any tokens
from host.
RESET clears this bit.
6 to 0
UADD6 to
UADD0
R/W
Specify the USB address of the device.
RESET clears these bits.
76/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 62. USB Interrupt Enable Register (UIEN: 0E9h)
7
6
5
4
3
2
1
0
SUSPNDI
RSTE
RSTFIE
TXD0IE
RXD0IE
TXD1IE
EOPIE
RESUMI
Table 63. Description of the UIEN Bits
Bit
Symbol
R/W
Function
7
SUSPNDI
R/W
Enable SUSPND Interrupt
6
RSTE
R/W
Enable USB Reset; also resets the CPU and PSD Modules when bit is
set to '1.'
5
RSTFIE
R/W
Enable RSTF (USB Bus Reset Flag) Interrupt
4
TXD0IE
R/W
Enable TXD0 Interrupt
3
RXD0IE
R/W
Enable RXD0 Interrupt
2
TXD1IE
R/W
Enable TXD1 Interrupt
1
EOPIE
R/W
Enable EOP Interrupt
0
RESUMI
R/W
Enable USB Resume Interrupt when it is the Suspend Mode
77/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 64. USB Interrupt Status Register (UISTA: 0E8h)
7
6
5
4
3
2
1
0
SUSPND
—
RSTF
TXD0F
RXD0F
TXD1F
EOPF
RESUMF
Table 65. Description of the UISTA Bits
Bit
Symbol
R/W
Function
USB Suspend Mode Flag.
To save power, this bit should be set if a 3ms constant idle state is
detected on USB bus. Setting this bit stops the clock to the USB and
causes the USB module to enter Suspend Mode. Software must clear
this bit after the Resume flag (RESUMF) is set while this Resume
Interrupt Flag is serviced
7
SUSPND
R/W
6
—
—
Reserved
R
USB Reset Flag.
This bit is set when a valid RESET signal state is detected on the D+ and
D- lines. When the RSTE bit in the UIEN Register is set, this reset
detection will also generate an internal reset signal to reset the CPU and
other peripherals including the USB module.
R/W
Endpoint0 Data Transmit Flag.
This bit is set after the data stored in Endpoint 0 transmit buffers has
been sent and an ACK handshake packet from the host is received.
Once the next set of data is ready in the transmit buffers, software must
clear this flag. To enable the next data packet transmission, TX0E must
also be set. If TXD0F Bit is not cleared, a NAK handshake will be
returned in the next IN transactions. RESET clears this bit.
R/W
Endpoint0 Data Receive Flag.
This bit is set after the USB module has received a data packet and
responded with ACK handshake packet. Software must clear this flag
after all of the received data has been read. Software must also set
RX0E Bit to one to enable the next data packet reception. If RXD0F Bit is
not cleared, a NAK handshake will be returned in the next OUT
transaction. RESET clears this bit.
5
4
3
RSTF
TXD0F
RXD0F
2
TXD1F
R/W
Endpoint1 / Endpoint2 Data Transmit Flag.
This bit is shared by Endpoints 1 and Endpoints 2. It is set after the data
stored in the shared Endpoint 1/ Endpoint 2 transmit buffer has been sent
and an ACK handshake packet from the host is received. Once the next
set of data is ready in the transmit buffers, software must clear this flag.
To enable the next data packet transmission, TX1E must also be set. If
TXD1F Bit is not cleared, a NAK handshake will be returned in the next
IN transaction. RESET clears this bit.
1
EOPF
R/W
End of Packet Flag.
This bit is set when a valid End of Packet sequence is detected on the D+
and D-line. Software must clear this flag. RESET clears this bit.
0
RESUMF
R/W
Resume Flag.
This bit is set when USB bus activity is detected while the SUSPND Bit is
set.
Software must clear this flag. RESET clears this bit.
78/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 66. USB Endpoint0 Transmit Control Register (UCON0: 0EAh)
7
6
5
4
3
2
1
0
TSEQ0
STALL0
TX0E
RX0E
TP0SIZ3
TP0SIZ2
TP0SIZ1
TP0SIZ0
Table 67. Description of the UCON0 Bits
Bit
7
6
5
Symbol
TSEQ0
STALL0
TX0E
R/W
Function
R/W
Endpoint0 Data Sequence Bit. (0=DATA0, 1=DATA1)
This bit determines which type of data packet (DATA0 or DATA1) will be
sent during the next IN transaction. Toggling of this bit must be controlled
by software. RESET clears this bit
R/W
Endpoint0 Force Stall Bit.
This bit causes Endpoint 0 to return a STALL handshake when polled by
either an IN or OUT token by the USB Host Controller. The USB
hardware clears this bit when a SETUP token is received. RESET clears
this bit.
R/W
Endpoint0 Transmit Enable.
This bit enables a transmit to occur when the USB Host Controller sends
an IN token to Endpoint 0. Software should set this bit when data is ready
to be transmitted. It must be cleared by software when no more Endpoint
0 data needs to be transmitted. If this bit is '0' or the TXD0F is set, the
USB will respond with a NAK handshake to any Endpoint 0 IN tokens.
RESET clears this bit.
4
RX0E
R/W
Endpoint0 receive enable.
This bit enables a receive to occur when the USB Host Controller sends
an OUT token to Endpoint 0. Software should set this bit when data is
ready to be received. It must be cleared by software when data cannot be
received. If this bit is '0' or the RXD0F is set, the USB will respond with a
NAK handshake to any Endpoint 0 OUT tokens. RESET clears this bit.
3 to 0
TP0SIZ3 to
TP0SIZ0
R/W
The number of transmit data bytes. These bits are cleared by RESET.
79/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 68. USB Endpoint1 (and 2) Transmit Control Register (UCON1: 0EBh)
7
6
5
4
3
2
1
0
TSEQ1
EP12SEL
TX1E
FRESUM
TP1SIZ3
TP1SIZ2
TP1SIZ1
TP1SIZ0
Table 69. Description of the UCON1 Bits
Bit
7
6
5
Symbol
TSEQ1
EP12SEL
TX1E
R/W
Function
R/W
Endpoint 1/ Endpoint 2 Transmit Data Packet PID. (0=DATA0, 1=DATA1)
This bit determines which type of data packet (DATA0 or DATA1) will be
sent during the next IN transaction directed to Endpoint 1 or Endpoint 2.
Toggling of this bit must be controlled by software. RESET clears this bit.
R/W
Endpoint 1/ Endpoint 2 Transmit Selection. (0=Endpoint 1, 1=Endpoint 2)
This bit specifies whether the data inside the registers UDT1 are used for
Endpoint 1 or Endpoint 2. If all the conditions for a successful Endpoint 2
USB response to a hosts IN token are satisfied (TXD1F=0, TX1E=1,
STALL2=0, and EP2E=1) except that the EP12SEL Bit is configured for
Endpoint 1, the USB responds with a NAK handshake packet. RESET
clears this bit.
R/W
Endpoint1 / Endpoint2 Transmit Enable.
This bit enables a transmit to occur when the USB Host Controller send
an IN token to Endpoint 1 or Endpoint 2. The appropriate endpoint
enable bit, EP1E or EP2E Bit in the UCON2 register, should also be set.
Software should set the TX1E Bit when data is ready to be transmitted. It
must be cleared by software when no more data needs to be transmitted.
If this bit is '0' or TXD1F is set, the USB will respond with a NAK
handshake to any Endpoint 1 or Endpoint 2 directed IN token.
RESET clears this bit.
4
FRESUM
R/W
Force Resume.
This bit forces a resume state (“K” on non-idle state) on the USB data
lines to initiate a remote wake-up. Software should control the timing of
the forced resume to be between 10ms and 15ms. Setting this bit will not
cause the RESUMF Bit to set.
3 to 0
TP1SIZ3 to
TP1SIZ0
R/W
The number of transmit data bytes. These bits are cleared by RESET.
80/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 70. USB Control Register (UCON2: 0ECh)
7
6
5
4
3
2
1
0
—
—
—
SOUT
EP2E
EP1E
STALL2
STALL1
Table 71. Description of the UCON2 Bits
Bit
Symbol
R/W
Function
7 to 5
—
—
4
SOUT
R/W
Status out is used to automatically respond to the OUT of a control
READ transfer
3
EP2E
R/W
Endpoint2 enable. RESET clears this bit
2
EP1E
R/W
Endpoint1 enable. RESET clears this bit
1
STALL2
R/W
Endpoint2 Force Stall Bit. RESET clears this bit
0
STALL1
R/W
Endpoint1 Force Stall Bit. RESET clears this bit
Reserved
Table 72. USB Endpoint0 Status Register (USTA: 0EDh)
7
6
5
4
3
2
1
0
RSEQ
SETUP
IN
OUT
RP0SIZ3
RP0SIZ2
RP0SIZ1
RP0SIZ0
Table 73. Description of the USTA Bits
Bit
Symbol
R/W
Function
7
RSEQ
R/W
6
SETUP
R
SETUP Token Detect Bit. This bit is set when the received token packet
is a SEPUP token, PID = b1101.
5
IN
R
IN Token Detect Bit.
This bit is set when the received token packet is an IN token.
4
OUT
R
OUT Token Detect Bit.
This bit is set when the received token packet is an OUT token.
3 to 0
RP0SIZ3 to
RP0SIZ0
R
The number of data bytes received in a DATA packet
Endpoint0 receive data packet PID. (0=DATA0, 1=DATA1)
This bit will be compared with the type of data packet last received for
Endpoint0
Table 74. USB Endpoint0 Data Receive Register (UDR0: 0EFh)
7
6
5
4
3
2
1
0
UDR0.7
UDR0.6
UDR0.5
UDR0.4
UDR0.3
UDR0.2
UDR0.1
UDR0.0
Table 75. USB Endpoint0 Data Transmit Register (UDT0: 0E7h)
7
6
5
4
3
2
1
0
UDT0.7
UDT0.6
UDT0.5
UDT0.4
UDT0.3
UDT0.2
UDT0.1
UDT0.0
Table 76. USB Endpoint1 Data Transmit Register (UDT1: 0E6h)
7
6
5
4
3
2
1
0
UDT1.7
UDT1.6
UDT1.5
UDT1.4
UDT1.3
UDT1.2
UDT1.1
UDT1.0
81/163
uPSD3212A, uPSD3212C, uPSD3212CV
The USCL 8-bit Prescaler Register for USB is at
E1h. The USCL should be loaded with a value that
results in a clock rate of 6MHz for the USB using
the following formula:
USB clock input =
(fOSC / 2) / (Prescaler register value +1)
Where fOSC is the MCU clock input frequency.
Note: USB works ONLY with the MCU Clock frequencies of 12, 24, or 36MHz. The Prescaler values for these frequencies are 0, 1, and 2.
Table 77. USB SFR Memory Map
SFR Reg
Addr Name
Bit Register Name
7
6
5
4
3
2
1
0
Reset
Comments
Value
00
8-bit
Prescaler for
USB logic
UDT1.0
00
USB Endpt1
Data Xmit
UDT0.1
UDT0.0
00
USB Endpt0
Data Xmit
RXD1F
EOPF
RESUMF
00
USB
Interrupt
Status
TXD1IE
EOPIE RESUMIE
00
USB
Interrupt
Enable
TP0SIZ3 TP0SIZ2 TP0SIZ1 TP0SIZ0
00
USB Endpt0
Xmit Control
FRESUM TP1SIZ3 TP1SIZ2 TP1SIZ1 TP1SIZ0
00
USB Endpt1
Xmit Control
00
USB Control
Register
00
USB Endpt0
Status
E1
USCL
E6
UDT1
UDT1.7
UDT1.6
UDT1.5
UDT1.4
UDT1.3
UDT1.2
UDT1.1
E7
UDT0
UDT0.7
UDT0.6
UDT0.5
UDT0.4
UDT0.3
UDT0.2
E8
UISTA
SUSPND
—
RSTF
TXD0F
RXD0F
E9
UIEN SUSPNDIE
RSTE
RSTFIE
TXD0IE
RXD0IE
RX0E
EA UCON0
TSEQ0
STALL0
TX0E
EB UCON1
TSEQ1
EP12SEL
—
EC UCON2
—
—
—
SOUT
EP2E
EP1E
STALL2
STALL1
ED
USTA
RSEQ
SETUP
IN
OUT
EE
UADR
USBEN
UADD6
UADD5
UADD4
UADD3
UADD2
UADD1
UADD0
00
USB
Address
Register
EF
UDR0
UDR0.7
UDR0.6
UDR0.5 UDR0.4 UDR0.3
UDR0.2
UDR0.1
UDR0.0
00
USB Endpt0
Data Recv
82/163
RP0SIZ3 RP0SIZ2 RP0SIZ1 RP0SIZ0
uPSD3212A, uPSD3212C, uPSD3212CV
Transceiver
USB Physical Layer Characteristics. The following section describes the uPSD321x Devices
compliance to the Chapter 7 Electrical section of
the USB Specification, Revision 1.1. The section
contains all signaling, and physical layer specifications necessary to describe a low speed USB
function.
Low Speed Driver Characteristics. The
uPSD321x Devices use a differential output driver
to drive the Low Speed USB data signal onto the
USB cable. The output swings between the differential high and low state are well balanced to minimize signal skew. The slew rate control on the
driver minimizes the radiated noise and cross talk
on the USB cable. The driver’s outputs support
three-state operation to achieve bi-directional half
duplex operation. The uPSD321x Devices driver
tolerates a voltage on the signal pins of -0.5V to
3.6V with respect to local ground reference without
damage. The driver tolerates this voltage for
10.0µs while the driver is active and driving, and
tolerates this condition indefinitely when the driver
is in its high impedance state.
A low speed USB connection is made through an
unshielded, untwisted wire cable a maximum of 3
meters in length. The rise and fall time of the signals on this cable are well controlled to reduce RFI
emissions while limiting delays, signaling skews
and distortions. The uPSD321x Devices driver
reaches the specified static signal levels with
smooth rise and fall times, resulting in segments
between low speed devices and the ports to which
they are connected.
Figure 40. Low Speed Driver Signal Waveforms
One Bit
Time
1.5 Mb/s
VSE(max)
Driver
Signal Pins
Signal pins
pass output
spec levels
with minimal
reflections and
ringing
VSE(min)
VSS
AI06629
83/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 78. Transceiver DC Characteristics
Symb
Parameter
Test Conditions(1)
Min
Max
Unit
VOH
Static Output High
15kΩ ± 5% to GND(2,3)
2.8
3.6
V
VOL
Static Output Low
Notes 2, 3
—
0.3
V
VDI
Differential Input Sensitivity
|(D+) - (D-)|,
Figure 43., page 86
0.2
—
V
VCM
Differential Input Common Mode
Figure 43., page 86
0.8
2.5
V
VSE
Single Ended Receiver Threshold
—
0.8
2.0
V
CIN
Transceiver Capacitance
—
—
20
pF
IIO
Data Line (D+, D-) Leakage
0V < (D+,D-) < 3.3
–10
10
µA
RPU
External Bus Pull-up Resistance, D-
7.5kΩ ± 2% to VCC
7.35
7.65
kΩ
RPD
External Bus Pull-down Resistance
15kΩ ± 5%
14.25
15.75
kΩ
Test Conditions(1)
Min
Max
Unit
1.4775
1.5225
Mbit/s
Note: 1. VCC = 5V ± 10%; VSS = 0V; TA = 0 to 70°C.
2. Level guaranteed for range of VCC = 4.5V to 5.5V.
3. With RPU, external idle resistor, 7.5κ±2%, D- to VCC .
Table 79. Transceiver AC Characteristics
Symb
tDRATE
Parameter
Low Speed Data Rate
Ave. bit rate (1.5Mb/s ± 1.5%)
tDJR1
Receiver Data Jitter Tolerance
To next transition,
Figure 43., page 86(5)
–75
75
ns
tDJR2
Differential Input Sensitivity
For paired transition,
Figure 43., page 86(5)
–45
45
ns
tDEOP
Differential to EOP Transition Skew
Figure 44., page 87(5)
–40
100
ns
tEOPR1
EOP Width at Receiver
Rejects as EOP(5,6)
165
—
ns
tEOPR2
EOP Width at Receiver
Accepts as EOP(5)
675
—
ns
tEOPT
Source EOP Width
—
–1.25
1.50
µs
tUDJ1
Differential Driver Jitter
To next transition,
Figure 45., page 87
–95
95
ns
tUDJ2
Differential Driver Jitter
To paired transition,
Figure 45., page 87
–150
150
ns
tR
USB Data Transition Rise Time
Notes 2, 3, 4
75
300
ns
tF
USB Data Transition Fall Time
Notes 2, 3, 4
75
300
ns
tRFM
Rise/Fall Time Matching
tR / tF
80
120
%
VCRS
Output Signal Crossover Volt age
—
1.3
2.0
V
Note: 1.
2.
3.
4.
5.
6.
84/163
VCC = 5V ± 10%; VSS = 0V; TA = 0 to 70°C.
Level guaranteed for range of VCC = 4.5V to 5.5V.
With RPU, external idle resistor, 7.5κ±2%, D- to VCC .
CL of 50pF(75ns) to 350pF (300ns).
Measured at crossover point of differential data signals.
USB specification indicates 330ns.
uPSD3212A, uPSD3212C, uPSD3212CV
Receiver Characteristics
The uPSD321x Devices has a differential input receiver which is able to accept the USB data signal.
The receiver features an input sensitivity of at least
200mV when both differential data inputs are in
the range of at least 0.8V to 2.5V with respect to
its local ground reference. This is the common
mode range, as shown in Figure 41. The receiver
tolerates static input voltages between -0.5V to
3.8V with respect to its local ground reference
without damage. In addition to the differential receiver, there is a single-ended receiver for each of
the two data lines. The single-ended receivers
have a switching threshold between 0.8V and 2.0V
(TTL inputs).
Minimum Differential Sensitivity (volts)
Figure 41. Differential Input Sensitivity Over Entire Common Mode Range
1.0
0.8
0.6
0.4
0.2
0.0
0.0
0.2
0.4
0.6
0.8
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Common Mode Input Voltage (volts)
2.6
2.8
3.0
3.2
AI06630
85/163
uPSD3212A, uPSD3212C, uPSD3212CV
External USB Pull-Up Resistor
The USB system specifies a pull-up resistor on the
D- pin for low-speed peripherals. The USB
Spec 1.1 describes a 1.5kΩ pull-up resistor to a
3.3V supply. An approved alternative method is a
7.5kΩ pull-up to the USB VCC supply. This alterna-
tive is defined for low-speed devices with an integrated cable. The chip is specified for the 7.5kΩ
pull-up. This eliminates the need for an external
3.3V regulator, or for a pin dedicated to providing
a 3.3V output from the chip.
Figure 42. USB Data Signal Timing and Voltage Levels
tR
VOH
tF
D+
90%
90%
VCR
VOL
10%
10%
D-
AI06631
Figure 43. Receiver Jitter Tolerance
TPERIOD
Differential
Data Lines
TJR
TJR1
TJR2
Consecutive
Transitions
N*TPERIOD+TJR1
Paired
Transitions
N*TPERIOD+TJR2
86/163
AI06632
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 44. Differential to EOP Transition Skew and EOP Width
TPERIOD
Crossover
Point Extended
Crossover
Point
Differential
Data Lines
Diff. Data to
SE0 Skew
N*TPERIOD+TDEOP
Source EOP Width: TEOPT
Receiver EOP Width
TEOPR1, TEOPR2
AI06633
Figure 45. Differential Data Jitter
TPERIOD
Differential
Data Lines
Crossover
Points
Consecutive
Transitions
N*TPERIOD+TxJR1
Paired
Transitions
N*TPERIOD+TxJR2
AI06634
87/163
uPSD3212A, uPSD3212C, uPSD3212CV
PSD MODULE
The PSD Module provides configurable
Program and Data memories to the 8032 CPU
core (MCU). In addition, it has its own set of I/
O ports and a PLD with 16 macrocells for
general logic implementation.
■
Ports A,B,C, and D are general purpose
programmable I/O ports that have a port
architecture which is different from the I/O
ports in the MCU Module.
■
The PSD Module communicates with the MCU
Module through the internal address, data bus
(A0-A15, D0-D7) and control signals (RD, WR,
PSEN, ALE, RESET). The user defines the
Decoding PLD in the PSDsoft Development
Tool and can map the resources in the PSD
Module to any program or data address
space. Figure 46 shows the functional blocks
in the PSD Module.
Functional Overview
– 512Kbit Flash memory. This is the main Flash
memory. It is divided into 4 sectors (16KBytes
each) that can be accessed with userspecified addresses.
– Secondary 128Kbit Flash boot memory. It is
divided into 2 sectors (8KBytes each) that can
be accessed with user-specified addresses.
This secondary memory brings the ability to
execute code and update the main Flash
concurrently.
– 16Kbit SRAM. The SRAM’s contents can be
protected from a power failure by connecting
an external battery.
– CPLD with 16 Output Micro Cells (OMCs) and
up to 20 Input Micro Cells (IMCs). The CPLD
may be used to efficiently implement a variety
of logic functions for internal and external
control. Examples include state machines,
loadable shift registers, and loadable
counters.
■
88/163
–
Decode PLD (DPLD) that decodes address for
selection of memory blocks in the PSD
Module.
– Configurable I/O ports (Port A,B,C and D) that
can be used for the following functions:
MCU I/Os;
PLD I/Os;
Latched MCU address output; and
Special function I/Os.
Note: I/O ports may be configured as open drain
outputs.
– Built-in JTAG compliant serial port allows fullchip, In-System Programmability (ISP). With
it, you can program a blank device or
reprogram a device in the factory or the field.
– Internal page register that can be used to
expand the 8032 MCU Module address space
by a factor of 256.
– Internal programmable Power Management
Unit (PMU) that supports a low-power mode
called Power-down Mode. The PMU can
automatically detect a lack of the 8032 CPU
core activity and put the PSD Module into
Power-down Mode.
– Erase/WRITE cycles:
Flash memory - 100,000 minimum
PLD - 1,000 minimum
Data Retention: 15 year minimum (for Main
Flash memory, Boot, PLD and Configuration
bits)
D0 – D7
WR_, RD_,
PSEN_, ALE,
RESET_,
A0-A15
8032 Bus
CLKIN
(PD1)
GLOBAL
CONFIG. &
SECURITY
BUS
Interface
BUS
Interface
PLD
INPUT
BUS
CLKIN
73
8
CSIOP
CLKIN
16KBIT BATTERY
BACKUP SRAM
128KBIT SECONDARY
NON-VOLATILE MEMORY
(BOOT OR DATA)
2 SECTORS
2 EXT CS TO PORT D
JTAG
SERIAL
CHANNEL
PORT A ,B & C
20 INPUT MACROCELLS
PORT A ,B & C
16 OUTPUT MACROCELLS
PLD, CONFIGURATION
& FLASH MEMORY
LOADER
8 SECTORS
512KBIT PRIMARY
FLASH MEMORY
RUNTIME CONTROL
AND I/O REGISTERS
PERIP I/O MODE SELECTS
SRAM SELECT
SECTOR
SELECTS
FLASH ISP CPLD
(CPLD)
FLASH DECODE
PLD (DPLD)
SECTOR
SELECTS
EMBEDDED
ALGORITHM
MACROCELL FEEDBACK OR PORT INPUT
73
PAGE
REGISTER
ADDRESS/DATA/CONTROL BUS
PORT
D
PROG.
PORT
PORT
C
PROG.
PORT
PORT
B
PROG.
PORT
PORT
A
PROG.
PORT
POWER
MANGMT
UNIT
PD1 – PD2
PC0 – PC7
PB0 – PB7
PA0 – PA7
VSTDBY
(PC2)
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 46. PSD MODULE Block Diagram
AI07431
89/163
uPSD3212A, uPSD3212C, uPSD3212CV
In-System Programming (ISP)
Using the JTAG signals on Port C, the entire PSD
MODULE device can be programmed or erased
without the use of the MCU. The primary Flash
memory can also be programmed in-system by
the MCU executing the programming algorithms
out of the secondary memory, or SRAM. The secondary memory can be programmed the same
way by executing out of the primary Flash memory. The PLD or other PSD MODULE Configuration
blocks can be programmed through the JTAG port
or a device programmer. Table 80 indicates which
programming methods can program different functional blocks of the PSD MODULE.
Table 80. Methods of Programming Different Functional Blocks of the PSD MODULE
Functional Block
JTAG Programming
Device Programmer
Primary Flash Memory
Yes
Yes
Yes
Secondary Flash Memory
Yes
Yes
Yes
PLD Array (DPLD and CPLD)
Yes
Yes
No
PSD MODULE Configuration
Yes
Yes
No
90/163
IAP
uPSD3212A, uPSD3212C, uPSD3212CV
DEVELOPMENT SYSTEM
The uPSD3200 is supported by PSDsoft, a Windows-based software development tool (Windows-95, Windows-98, Windows-NT). A PSD
MODULE design is quickly and easily produced in
a point and click environment. The designer does
not need to enter Hardware Description Language
(HDL) equations, unless desired, to define PSD
MODULE pin functions and memory map information. The general design flow is shown in Figure
47. PSDsoft is available from our web site (the ad-
dress is given on the back page of this data sheet)
or other distribution channels.
PSDsoft directly supports a low cost device programmer from ST: FlashLINK (JTAG). The programmer may be purchased through your local
distributor/representative. The uPSD3200 is also
supported by third party device programmers. See
our web site for the current list.
Figure 47. PSDsoft Express Development Tool
Choose µPSD
Define µPSD Pin and
Node Functions
Point and click definition of
PSD pin functions, internal nodes,
and MCU system memory map
Define General Purpose
Logic in CPLD
C Code Generation
Point and click definition of combinatorial and registered logic in CPLD.
Access HDL is available if needed
GENERATE C CODE
SPECIFIC TO PSD
FUNCTIONS
Merge MCU Firmware with
PSD Module Configuration
A composite object file is created
containing MCU firmware and
PSD configuration
MCU FIRMWARE
HEX OR S-RECORD
FORMAT
USER'S CHOICE OF
8032
COMPILER/LINKER
*.OBJ FILE
PSD Programmer
FlashLINK (JTAG)
*.OBJ FILE
AVAILABLE
FOR 3rd PARTY
PROGRAMMERS
AI07432
91/163
uPSD3212A, uPSD3212C, uPSD3212CV
PSD MODULE REGISTER DESCRIPTION AND ADDRESS OFFSET
Table 81 shows the offset addresses to the PSD
MODULE registers relative to the CSIOP base address. The CSIOP space is the 256 bytes of address that is allocated by the user to the internal
PSD MODULE registers. Table 81 provides brief
descriptions of the registers in CSIOP space. The
following section gives a more detailed description.
Table 81. Register Address Offset
Register Name
Other1
Description
Port A
Port B
Port C
Port D
Data In
00
01
10
11
Control
02
03
Data Out
04
05
12
13
Stores data for output to Port pins, MCU I/O
Output Mode
Direction
06
07
14
15
Configures Port pin as input or output
Drive Select
08
09
16
17
Configures Port pins as either CMOS or Open
Drain on some pins, while selecting high slew rate
on other pins.
Input Macrocell
0A
0B
18
Enable Out
0C
0D
1A
Output Macrocells
AB
20
20
Output Macrocells
BC
Mask Macrocells AB
Mask Macrocells BC
21
22
Reads Port pin as input, MCU I/O Input Mode
Selects mode between MCU I/O or Address Out
Reads Input Macrocells
Reads the status of the output enable to the I/O
Port driver
1B
READ – reads output of macrocells AB
WRITE – loads macrocell flip-flops
READ – reads output of macrocells BC
WRITE – loads macrocell flip-flops
21
22
23
Blocks writing to the Output Macrocells AB
23
Blocks writing to the Output Macrocells BC
Primary Flash
Protection
C0
Read-only – Primary Flash Sector Protection
Secondary Flash
memory Protection
C2
Read-only – PSD MODULE Security and
Secondary Flash memory Sector Protection
PMMR0
B0
Power Management Register 0
PMMR2
B4
Power Management Register 2
Page
E0
Page Register
VM
E2
Places PSD MODULE memory areas in Program
and/or Data space on an individual basis.
Note: 1. Other registers that are not part of the I/O ports.
92/163
uPSD3212A, uPSD3212C, uPSD3212CV
PSD MODULE DETAILED OPERATION
As shown in Figure 15., page 27, the PSD MODULE consists of five major types of functional
blocks:
■
Memory Block
■
PLD Blocks
■
I/O Ports
■
Power Management Unit (PMU)
■
JTAG Interface
The functions of each block are described in the
following sections. Many of the blocks perform
multiple functions, and are user configurable.
MEMORY BLOCKS
The PSD MODULE has the following memory
blocks:
■
Primary Flash memory
■
Secondary Flash memory
■
SRAM
The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express.
Primary Flash Memory and Secondary Flash
memory Description
The primary Flash memory is divided into 4 sectors (16KBytes each). The secondary Flash memory is divided into 2 sectors (8KBytes each). Each
sector of either memory block can be separately
protected from Program and Erase cycles.
Flash memory may be erased on a sector-by-sector basis. Flash sector erasure may be suspended
while data is read from other sectors of the block
and then resumed after reading.
During a Program or Erase cycle in Flash memory,
the status can be output on Ready/Busy (PC3).
This pin is set up using PSDsoft Express Configuration.
Memory Block Select Signals
The DPLD generates the Select signals for all the
internal memory blocks (see PLDs, page 106).
Each of the eight sectors of the primary Flash
memory has a Select signal (FS0-FS3) which can
contain up to three product terms. Each of the 2
sectors of the secondary Flash memory has a Select signal (CSBOOT0-CSBOOT1) which can contain up to three product terms. Having three
product terms for each Select signal allows a given
sector to be mapped in Program or Data space.
Ready/Busy (PC3). This signal can be used to
output the Ready/Busy status of the Flash memory. The output on Ready/Busy (PC3) is a 0 (Busy)
when Flash memory is being written to, or when
Flash memory is being erased. The output is a 1
(Ready) when no WRITE or Erase cycle is in
progress.
Memory Operation. The primary Flash memory
and secondary Flash memory are addressed
through the MCU Bus. The MCU can access these
memories in one of two ways:
– The MCU can execute a typical bus WRITE or
READ operation.
– The MCU can execute a specific Flash
memory instruction that consists of several
WRITE and READ operations. This involves
writing specific data patterns to special
addresses within the Flash memory to invoke
an embedded algorithm. These instructions
are summarized in Table 82.
Typically, the MCU can read Flash memory using
READ operations, just as it would read a ROM device. However, Flash memory can only be altered
using specific Erase and Program instructions. For
example, the MCU cannot write a single byte directly to Flash memory as it would write a byte to
RAM. To program a byte into Flash memory, the
MCU must execute a Program instruction, then
test the status of the Program cycle. This status
test is achieved by a READ operation or polling
Ready/Busy (PC3).
93/163
uPSD3212A, uPSD3212C, uPSD3212CV
Instructions
An instruction consists of a sequence of specific
operations. Each received byte is sequentially decoded by the PSD MODULE and not executed as
a standard WRITE operation. The instruction is executed when the correct number of bytes are properly received and the time between two
consecutive bytes is shorter than the time-out period. Some instructions are structured to include
READ operations after the initial WRITE operations.
The instruction must be followed exactly. Any invalid combination of instruction bytes or time-out
between two consecutive bytes while addressing
Flash memory resets the device logic into READ
Mode (Flash memory is read like a ROM device).
The Flash memory supports the instructions summarized in Table 82., page 95:
Flash memory:
■
Erase memory by chip or sector
■
Suspend or resume sector erase
■
Program a Byte
■
RESET to READ Mode
■
Read Sector Protection Status
94/163
These instructions are detailed in Table 82. For efficient decoding of the instructions, the first two
bytes of an instruction are the coded cycles and
are followed by an instruction byte or confirmation
byte. The coded cycles consist of writing the data
AAh to address X555h during the first cycle and
data 55h to address XAAAh during the second cycle. Address signals A15-A12 are Don’t Care during the instruction WRITE cycles. However, the
appropriate
Sector
Select
(FS0-FS3
or
CSBOOT0-CSBOOT1) must be selected.
The primary and secondary Flash memories have
the same instruction set. The Sector Select signals
determine which Flash memory is to receive and
execute the instruction. The primary Flash memory is selected if any one of Sector Select (FS0FS3) is High, and the secondary Flash memory is
selected if any one of Sector Select (CSBOOT0CSBOOT1) is High.
uPSD3212A, uPSD3212C, uPSD3212CV
Table 82. Instructions
FS0-FS3 or
CSBOOT0CSBOOT1
Cycle 1
READ(5)
1
“Read”
RD @ RA
READ Sector
Protection(6,8,11)
1
Program a Flash
Byte(11)
Instruction
Cycle 2
Cycle 3
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Read status @
XX02h
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
[email protected] PA
Flash Sector
Erase(7,11)
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Flash Bulk
Erase(11)
1
[email protected]
X555h
[email protected]
XAAAh
[email protected]
X555h
Suspend Sector
Erase(9)
1
[email protected]
XXXXh
Resume Sector
Erase(10)
1
[email protected]
XXXXh
RESET(6)
1
[email protected]
XXXXh
Note: 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
Cycle 4
Cycle 5
Cycle 6
Cycle 7
[email protected] X555h
[email protected]
XAAAh
[email protected]
SA
30h(7)@
next SA
[email protected] X555h
[email protected]
XAAAh
[email protected]
X555h
All bus cycles are WRITE bus cycles, except the ones with the “Read” label
All values are in hexadecimal:
X = Don’t care. Addresses of the form XXXXh, in this table, must be even addresses
RA = Address of the memory location to be read
RD = Data READ from location RA during the READ cycle
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of WRITE Strobe (WR, CNTL0).
PA is an even address for PSD in Word Programming Mode.
PD = Data word to be programmed at location PA. Data is latched on the rising edge of WRITE Strobe (WR, CNTL0)
SA = Address of the sector to be erased or verified. The Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) of the sector to be
erased, or verified, must be Active (High).
Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1) signals are active High, and are defined in PSDsoft Express.
Only address Bits A11-A0 are used in instruction decoding.
No Unlock or instruction cycles are required when the device is in the READ Mode
The RESET Instruction is required to return to the READ Mode after reading the Sector Protection Status, or if the Error Flag Bit
(DQ5) goes High.
Additional sectors to be erased must be written at the end of the Sector Erase instruction within 80µs.
The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and
(A1,A0)=(1,0)
The system may perform READ and Program cycles in non-erasing sectors, read the Sector Protection Status when in the Suspend
Sector Erase Mode. The Suspend Sector Erase instruction is valid only during a Sector Erase cycle.
The Resume Sector Erase instruction is valid only during the Suspend Sector Erase Mode.
The MCU cannot invoke these instructions while executing code from the same Flash memory as that for which the instruction is
intended. The MCU must retrieve, for example, the code from the secondary Flash memory when reading the Sector Protection
Status of the primary Flash memory.
95/163
uPSD3212A, uPSD3212C, uPSD3212CV
Power-down Instruction and Power-up Mode
Power-up Mode. The PSD MODULE internal
logic is reset upon Power-up to the READ Mode.
Sector Select (FS0-FS3 and CSBOOT0CSBOOT1) must be held Low, and WRITE Strobe
(WR, CNTL0) High, during Power-up for maximum
security of the data contents and to remove the
possibility of a byte being written on the first edge
of WRITE Strobe (WR, CNTL0). Any WRITE cycle
initiation is locked when VCC is below VLKO.
READ
Under typical conditions, the MCU may read the
primary Flash memory or the secondary Flash
memory using READ operations just as it would a
ROM or RAM device. Alternately, the MCU may
use READ operations to obtain status information
about a Program or Erase cycle that is currently in
progress. Lastly, the MCU may use instructions to
read special data from these memory blocks. The
following sections describe these READ functions.
READ Memory Contents. Primary Flash memory and secondary Flash memory are placed in the
READ Mode after Power-up, chip reset, or a
Reset Flash instruction (see Table 82., page 95).
The MCU can read the memory contents of the primary Flash memory or the secondary Flash memory by using READ operations any time the READ
operation is not part of an instruction.
READ Memory Sector Protection Status. The
primary Flash memory Sector Protection Status is
read with an instruction composed of 4 operations:
3 specific WRITE operations and a READ operation (see Table 82). During the READ operation,
address Bits A6, A1, and A0 must be '0,' '1,' and
'0,' respectively, while Sector Select (FS0-FS3 or
CSBOOT0-CSBOOT1) designates the Flash
memory sector whose protection has to be verified. The READ operation produces 01h if the
Flash memory sector is protected, or 00h if the
sector is not protected.
The sector protection status for all NVM blocks
(primary Flash memory or secondary Flash memory) can also be read by the MCU accessing the
Flash Protection registers in PSD I/O space. See
96/163
Flash Memory Sector Protect, page 101, for register definitions.
Reading the Erase/Program Status Bits. The
Flash memory provides several status bits to be
used by the MCU to confirm the completion of an
Erase or Program cycle of Flash memory. These
status bits minimize the time that the MCU spends
performing these tasks and are defined in Table
83., page 97. The status bits can be read as many
times as needed.
For Flash memory, the MCU can perform a READ
operation to obtain these status bits while an
Erase or Program instruction is being executed by
the embedded algorithm. See Programming Flash
Memory, page 98, for details.
Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag
Bit (DQ7) outputs the complement of the bit being
entered for programming/writing on the DQ7 Bit.
Once the Program instruction or the WRITE operation is completed, the true logic value is read on
the Data Polling Flag Bit (DQ7) (in a READ operation).
– Data Polling is effective after the fourth WRITE
pulse (for a Program instruction) or after the
sixth WRITE pulse (for an Erase instruction). It
must be performed at the address being
programmed or at an address within the Flash
memory sector being erased.
– During an Erase cycle, the Data Polling Flag
Bit (DQ7) outputs a '0.' After completion of the
cycle, the Data Polling Flag Bit (DQ7) outputs
the last bit programmed (it is a '1' after
erasing).
– If the byte to be programmed is in a protected
Flash memory sector, the instruction is
ignored.
– If all the Flash memory sectors to be erased
are protected, the Data Polling Flag Bit (DQ7)
is reset to '0' for about 100µs, and then returns
to the previous addressed byte. No erasure is
performed.
uPSD3212A, uPSD3212C, uPSD3212CV
Toggle Flag (DQ6). The Flash memory offers another way for determining when the Program cycle
is completed. During the internal WRITE operation
and when either the FS0-FS3 or CSBOOT0CSBOOT1 is true, the Toggle Flag Bit (DQ6) toggles from 0 to 1 and 1 to 0 on subsequent attempts
to read any byte of the memory.
When the internal cycle is complete, the toggling
stops and the data READ on the Data Bus D0-D7
is the addressed memory byte. The device is now
accessible for a new READ or WRITE operation.
The cycle is finished when two successive Reads
yield the same output data.
– The Toggle Flag Bit (DQ6) is effective after the
fourth WRITE pulse (for a Program instruction)
or after the sixth WRITE pulse (for an Erase
instruction).
– If the byte to be programmed belongs to a
protected Flash memory sector, the
instruction is ignored.
– If all the Flash memory sectors selected for
erasure are protected, the Toggle Flag Bit
(DQ6) toggles to '0' for about 100µs and then
returns to the previous addressed byte.
Error Flag (DQ5). During a normal Program or
Erase cycle, the Error Flag Bit (DQ5) is to 0. This
bit is set to '1' when there is a failure during Flash
memory Byte Program, Sector Erase, or Bulk
Erase cycle.
In the case of Flash memory programming, the Error Flag Bit (DQ5) indicates the attempt to program
a Flash memory bit from the programmed state,
'0,' to the erased state, '1,' which is not valid. The
Error Flag Bit (DQ5) may also indicate a Time-out
condition while attempting to program a byte.
In case of an error in a Flash memory Sector Erase
or Byte Program cycle, the Flash memory sector in
which the error occurred or to which the programmed byte belongs must no longer be used.
Other Flash memory sectors may still be used.
The Error Flag Bit (DQ5) is reset after a Reset
Flash instruction.
Erase Time-out Flag (DQ3). The Erase Timeout Flag Bit (DQ3) reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase Time-out Flag Bit (DQ3) is
reset to 0 after a Sector Erase cycle for a time period of 100µs + 20% unless an additional Sector
Erase instruction is decoded. After this time period, or when the additional Sector Erase instruction
is decoded, the Erase Time-out Flag Bit (DQ3) is
set to '1.'
Table 83. Status Bit
Functional Block
Flash Memory
FS0-FS3/CSBOOT0CSBOOT1
VIH
DQ7
DQ6
Data
Polling
Toggle
Flag
DQ5
Error
Flag
DQ4
X
DQ3
Erase
Timeout
DQ2
X
DQ1
X
DQ0
X
Note: 1. X = Not guaranteed value, can be read either '1' or '0.'
2. DQ7-DQ0 represent the Data Bus bits, D7-D0.
3. FS0-FS3 and CSBOOT0-CSBOOT1 are active High.
97/163
uPSD3212A, uPSD3212C, uPSD3212CV
Programming Flash Memory
Flash memory must be erased prior to being programmed. A byte of Flash memory is erased to all
'1s' (FFh), and is programmed by setting selected
bits to '0.' The MCU may erase Flash memory all
at once or by-sector, but not byte-by-byte. However, the MCU may program Flash memory byte-bybyte.
The primary and secondary Flash memories require the MCU to send an instruction to program a
byte or to erase sectors (see Table 82).
Once the MCU issues a Flash memory Program or
Erase instruction, it must check for the status bits
for completion. The embedded algorithms that are
invoked support several means to provide status
to the MCU. Status may be checked using any of
three methods: Data Polling, Data Toggle, or
Ready/Busy (PC3).
Data Polling. Polling on the Data Polling Flag Bit
(DQ7) is a method of checking whether a Program
or Erase cycle is in progress or has completed.
Figure 48 shows the Data Polling algorithm.
When the MCU issues a Program instruction, the
embedded algorithm begins. The MCU then reads
the location of the byte to be programmed in Flash
memory to check status. The Data Polling Flag Bit
(DQ7) of this location becomes the complement of
b7 of the original data byte to be programmed. The
MCU continues to poll this location, comparing the
Data Polling Flag Bit (DQ7) and monitoring the Error Flag Bit (DQ5). When the Data Polling Flag Bit
(DQ7) matches b7 of the original data, and the Error Flag Bit (DQ5) remains '0,' the embedded algorithm is complete. If the Error Flag Bit (DQ5) is '1,'
the MCU should test the Data Polling Flag Bit
(DQ7) again since the Data Polling Flag Bit (DQ7)
may have changed simultaneously with the Error
Flag Bit (DQ5) (see Figure 48).
The Error Flag Bit (DQ5) is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte or if the MCU attempted to program a '1' to a bit that was not
erased (not erased is logic '0').
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
98/163
byte that was written to the Flash memory with the
byte that was intended to be written.
When using the Data Polling method during an
Erase cycle, Figure 48 still applies. However, the
Data Polling Flag Bit (DQ7) is '0' until the Erase cycle is complete. A '1' on the Error Flag Bit (DQ5) indicates a time-out condition on the Erase cycle; a
'0' indicates no error. The MCU can read any location within the sector being erased to get the Data
Polling Flag Bit (DQ7) and the Error Flag Bit
(DQ5).
PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms.
Figure 48. Data Polling Flowchart
START
READ DQ5 & DQ7
at VALID ADDRESS
DQ7
=
DATA
YES
NO
NO
DQ5
=1
YES
READ DQ7
DQ7
=
DATA
YES
NO
FAIL
PASS
AI01369B
uPSD3212A, uPSD3212C, uPSD3212CV
Data Toggle. Checking the Toggle Flag Bit
(DQ6) is a method of determining whether a Program or Erase cycle is in progress or has completed. Figure 49 shows the Data Toggle algorithm.
When the MCU issues a Program instruction, the
embedded algorithm begins. The MCU then reads
the location of the byte to be programmed in Flash
memory to check status. The Toggle Flag Bit
(DQ6) of this location toggles each time the MCU
reads this location until the embedded algorithm is
complete. The MCU continues to read this location, checking the Toggle Flag Bit (DQ6) and monitoring the Error Flag Bit (DQ5). When the Toggle
Flag Bit (DQ6) stops toggling (two consecutive
reads yield the same value), and the Error Flag Bit
(DQ5) remains '0,' the embedded algorithm is
complete. If the Error Flag Bit (DQ5) is '1,' the
MCU should test the Toggle Flag Bit (DQ6) again,
since the Toggle Flag Bit (DQ6) may have
changed simultaneously with the Error Flag Bit
(DQ5) (see Figure 49).
The Error Flag Bit(DQ5) is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte, or if the MCU attempted to program a '1' to a bit that was not
erased (not erased is logic '0').
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
byte that was written to Flash memory with the
byte that was intended to be written.
When using the Data Toggle method after an
Erase cycle, Figure 49 still applies. the Toggle
Flag Bit (DQ6) toggles until the Erase cycle is
complete. A '1' on the Error Flag Bit (DQ5) indicates a time-out condition on the Erase cycle; a '0'
indicates no error. The MCU can read any location
within the sector being erased to get the Toggle
Flag Bit (DQ6) and the Error Flag Bit (DQ5).
PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms.
Figure 49. Data Toggle Flowchart
START
READ
DQ5 & DQ6
DQ6
=
TOGGLE
NO
YES
NO
DQ5
=1
YES
READ DQ6
DQ6
=
TOGGLE
NO
YES
FAIL
PASS
AI01370B
99/163
uPSD3212A, uPSD3212C, uPSD3212CV
Erasing Flash Memory
Flash Bulk Erase. The Flash Bulk Erase instruction uses six WRITE operations followed by a
READ operation of the status register, as described in Table 82. If any byte of the Bulk Erase
instruction is wrong, the Bulk Erase instruction
aborts and the device is reset to the READ Flash
memory status.
During a Bulk Erase, the memory status may be
checked by reading the Error Flag Bit (DQ5), the
Toggle Flag Bit (DQ6), and the Data Polling Flag
Bit (DQ7), as detailed in Programming Flash
Memory, page 98. The Error Flag Bit (DQ5) returns a '1' if there has been an Erase Failure (maximum number of Erase cycles have been
executed).
It is not necessary to program the memory with
00h because the PSD MODULE automatically
does this before erasing to 0FFh.
During execution of the Bulk Erase instruction, the
Flash memory does not accept any instructions.
Flash Sector Erase. The Sector Erase instruction uses six WRITE operations, as described in
Table 82., page 95. Additional Flash Sector Erase
codes and Flash memory sector addresses can be
written subsequently to erase other Flash memory
sectors in parallel, without further coded cycles, if
the additional bytes are transmitted in a shorter
time than the time-out period of about 100µs. The
input of a new Sector Erase code restarts the timeout period.
The status of the internal timer can be monitored
through the level of the Erase Time-out Flag Bit
(DQ3). If the Erase Time-out Flag Bit (DQ3) is '0,'
the Sector Erase instruction has been received
and the time-out period is counting. If the Erase
Time-out Flag Bit (DQ3) is '1,' the time-out period
has expired and the embedded algorithm is busy
erasing the Flash memory sector(s). Before and
during Erase time-out, any instruction other than
Suspend Sector Erase and Resume Sector Erase
instructions abort the cycle that is currently in
progress, and reset the device to READ Mode.
During a Sector Erase, the memory status may be
checked by reading the Error Flag Bit (DQ5), the
Toggle Flag Bit (DQ6), and the Data Polling Flag
Bit (DQ7), as detailed in Programming Flash
Memory, page 98.
100/163
During execution of the Erase cycle, the Flash
memory accepts only RESET and Suspend Sector Erase instructions. Erasure of one Flash memory sector may be suspended, in order to read
data from another Flash memory sector, and then
resumed.
Suspend Sector Erase. When a Sector Erase
cycle is in progress, the Suspend Sector Erase instruction can be used to suspend the cycle by writing 0B0h to any address when an appropriate
Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1)
is High. (See Table 82., page 95). This allows
reading of data from another Flash memory sector
after the Erase cycle has been suspended. Suspend Sector Erase is accepted only during an
Erase cycle and defaults to READ Mode. A Suspend Sector Erase instruction executed during an
Erase time-out period, in addition to suspending
the Erase cycle, terminates the time out period.
The Toggle Flag Bit (DQ6) stops toggling when the
internal logic is suspended. The status of this bit
must be monitored at an address within the Flash
memory sector being erased. The Toggle Flag Bit
(DQ6) stops toggling between 0.1µs and 15µs after the Suspend Sector Erase instruction has been
executed. The Flash memory is then automatically
set to READ Mode.
If an Suspend Sector Erase instruction was executed, the following rules apply:
– Attempting to read from a Flash memory
sector that was being erased outputs invalid
data.
– Reading from a Flash sector that was not
being erased is valid.
– The Flash memory cannot be programmed,
and only responds to Resume Sector Erase
and Reset Flash instructions (READ is an
operation and is allowed).
– If a Reset Flash instruction is received, data in
the Flash memory sector that was being
erased is invalid.
Resume Sector Erase. If a Suspend Sector
Erase instruction was previously executed, the
erase cycle may be resumed with this instruction.
The Resume Sector Erase instruction consists of
writing 030h to any address while an appropriate
Sector Select (FS0-FS3 or CSBOOT0-CSBOOT1)
is High. (See Table 82., page 95.)
uPSD3212A, uPSD3212C, uPSD3212CV
Specific Features
Flash Memory Sector Protect. Each
primary
and secondary Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data
security because it disables all Program or Erase
cycles. This mode can be activated through the
JTAG Port or a Device Programmer.
Sector protection can be selected for each sector
using the PSDsoft Express Configuration program. This automatically protects selected sectors
when the device is programmed through the JTAG
Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their
contents using the JTAG Port or a Device Programmer. The MCU can read (but cannot change)
the sector protection bits.
Any attempt to program or erase a protected Flash
memory sector is ignored by the device. The Verify
operation results in a READ of the protected data.
This allows a guarantee of the retention of the Protection status.
The sector protection status can be read by the
MCU through the Flash memory protection registers (in the CSIOP block). See Tables 84 and 85.
Reset Flash. The Reset Flash instruction consists of one WRITE cycle (see Table
82., page 95). It can also be optionally preceded
by the standard two WRITE decoding cycles (writing AAh to 555h and 55h to AAAh). It must be executed after:
– Reading the Flash Protection Status or Flash
ID
– An Error condition has occurred (and the
device has set the Error Flag Bit (DQ5) to '1'
during a Flash memory Program or Erase
cycle.
The Reset Flash instruction puts the Flash memory back into normal READ Mode. If an Error condition has occurred (and the device has set the Error
Flag Bit (DQ5) to '1' the Flash memory is put back
into normal READ Mode within a few milliseconds
of the Reset Flash instruction having been issued.
The Reset Flash instruction is ignored when it is issued during a Program or Bulk Erase cycle of the
Flash memory. The Reset Flash instruction aborts
any on-going Sector Erase cycle, and returns the
Flash memory to the normal READ Mode within a
few milliseconds.
Table 84. Sector Protection/Security Bit Definition – Flash Protection Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
not used
not used
not used
not used
Sec3_Prot
Sec2_Prot
Sec1_Prot
Sec0_Prot
Note: Bit Definitions:
Sec<i>_Prot 1 = Primary Flash memory or secondary Flash memory Sector <i> is write-protected.
Sec<i>_Prot 0 = Primary Flash memory or secondary Flash memory Sector <i> is not write-protected.
Table 85. Sector Protection/Security Bit Definition – Secondary Flash Protection Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Security_Bit
not used
not used
not used
not used
not used
Sec1_Prot
Sec0_Prot
Note: Bit Definitions:
Sec<i>_Prot 1 = Secondary Flash memory Sector <i> is write-protected.
Sec<i>_Prot 0 = Secondary Flash memory Sector <i> is not write-protected.
Security_Bit 0 = Security Bit in device has not been set; 1 = Security Bit in device has been set.
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uPSD3212A, uPSD3212C, uPSD3212CV
SRAM
The SRAM is enabled when SRAM Select (RS0)
from the DPLD is High. SRAM Select (RS0) can
contain up to two product terms, allowing flexible
memory mapping.
The SRAM can be backed up using an external
battery. The external battery should be connected
to Voltage Standby (VSTBY, PC2). If you have an
external battery connected to the uPSD3200, the
contents of the SRAM are retained in the event of
a power loss. The contents of the SRAM are retained so long as the battery voltage remains at 2V
or greater. If the supply voltage falls below the battery voltage, an internal power switchover to the
battery occurs.
PC4 can be configured as an output that indicates
when power is being drawn from the external battery. Battery-on Indicator (VBATON, PC4) is High
with the supply voltage falls below the battery voltage and the battery on Voltage Standby (VSTBY,
PC2) is supplying power to the internal SRAM.
SRAM Select (RS0), Voltage Standby (VSTBY,
PC2) and Battery-on Indicator (VBATON, PC4) are
all configured using PSDsoft Express Configuration.
Sector Select and SRAM Select
Sector Select (FS0-FS3, CSBOOT0-CSBOOT1)
and SRAM Select (RS0) are all outputs of the
DPLD. They are setup by writing equations for
them in PSDsoft Express. The following rules apply to the equations for these signals:
1. Primary Flash memory and secondary Flash
memory Sector Select signals must not be
larger than the physical sector size.
2. Any primary Flash memory sector must not be
mapped in the same memory space as
another Flash memory sector.
3. A secondary Flash memory sector must not be
mapped in the same memory space as
another secondary Flash memory sector.
4. SRAM, I/O, and Peripheral I/O spaces must
not overlap.
5. A secondary Flash memory sector may
overlap a primary Flash memory sector. In
case of overlap, priority is given to the
secondary Flash memory sector.
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6. SRAM, I/O, and Peripheral I/O spaces may
overlap any other memory sector. Priority is
given to the SRAM, I/O, or Peripheral I/O.
Example. FS0 is valid when the address is in the
range of 8000h to BFFFh, CSBOOT0 is valid from
8000h to 9FFFh, and RS0 is valid from 8000h to
87FFh. Any address in the range of RS0 always
accesses the SRAM. Any address in the range of
CSBOOT0 greater than 87FFh (and less than
9FFFh) automatically addresses secondary Flash
memory segment 0. Any address greater than
9FFFh accesses the primary Flash memory segment 0. You can see that half of the primary Flash
memory segment 0 and one-fourth of secondary
Flash memory segment 0 cannot be accessed in
this example.
Note: An equation that defined FS1 to anywhere
in the range of 8000h to BFFFh would not be valid.
Figure 50 shows the priority levels for all memory
components. Any component on a higher level can
overlap and has priority over any component on a
lower level. Components on the same level must
not overlap. Level one has the highest priority and
level 3 has the lowest.
Figure 50. Priority Level of Memory and I/O
Components in the PSD MODULE
Highest Priority
Level 1
SRAM, I /O, or
Peripheral I /O
Level 2
Secondary
Non-Volatile Memory
Level 3
Primary Flash Memory
Lowest Priority
AI02867D
uPSD3212A, uPSD3212C, uPSD3212CV
Memory Select Configuration in Program and
Data Spaces. The MCU Core has separate address spaces for Program memory and Data
memory. Any of the memories within the PSD
MODULE can reside in either space or both spaces. This is controlled through manipulation of the
VM Register that resides in the CSIOP space.
The VM Register is set using PSDsoft Express to
have an initial value. It can subsequently be
changed by the MCU so that memory mapping
can be changed on-the-fly.
For example, you may wish to have SRAM and primary Flash memory in the Data space at Boot-up,
and secondary Flash memory in the Program
space at Boot-up, and later swap the primary and
secondary Flash memories. This is easily done
with the VM Register by using PSDsoft Express
Configuration to configure it for Boot-up and having the MCU change it when desired. Table 86 describes the VM Register.
Table 86. VM Register
Bit 7
PIO_EN
Bit 6
Bit 5
Bit 4
Primary
FL_Data
0 = disable
PIO Mode
not used
not used
0 = RD
can’t
access
Flash
memory
1= enable
PIO Mode
not used
not used
1 = RD
access
Flash
memory
Bit 3
Secondary Data
Bit 2
Primary
FL_Code
Bit 1
Secondary Code
Bit 0
SRAM_Code
0 = RD can’t
access Secondary
Flash memory
0 = PSEN
can’t
access
Flash
memory
0 = PSEN can’t
access Secondary
Flash memory
0 = PSEN
can’t
access
SRAM
1 = RD access
Secondary Flash
memory
1 = PSEN
access
Flash
memory
1 = PSEN access
Secondary Flash
memory
1 = PSEN
access
SRAM
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uPSD3212A, uPSD3212C, uPSD3212CV
Separate Space Mode. Program space is separated from Data space. For example, Program Select Enable (PSEN) is used to access the program
code from the primary Flash memory, while READ
Strobe (RD) is used to access data from the secondary Flash memory, SRAM and I/O Port blocks.
This configuration requires the VM Register to be
set to 0Ch (see Figure 51).
Combined Space Modes. The Program and
Data spaces are combined into one memory
space that allows the primary Flash memory, secondary Flash memory, and SRAM to be accessed
by either Program Select Enable (PSEN) or READ
Strobe (RD). For example, to configure the primary Flash memory in Combined space, Bits b2 and
b4 of the VM Register are set to '1' (see Figure 52).
Figure 51. Separate Space Mode
DPLD
Secondary
Flash
Memory
Primary
Flash
Memory
RS0
SRAM
CSBOOT0-1
FS0-FS3
CS
CS
OE
CS
OE
OE
PSEN
RD
AI07433
Figure 52. Combined Space Mode
DPLD
RD
RS0
Primary
Flash
Memory
Secondary
Flash
Memory
SRAM
CSBOOT0-1
FS0-FS3
CS
CS
OE
CS
OE
OE
VM REG BIT 3
VM REG BIT 4
PSEN
VM REG BIT 1
VM REG BIT 2
RD
VM REG BIT 0
AI07434
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uPSD3212A, uPSD3212C, uPSD3212CV
Page Register
The 8-bit Page Register increases the addressing
capability of the MCU Core by a factor of up to 256.
The contents of the register can also be read by
the MCU. The outputs of the Page Register
(PGR0-PGR7) are inputs to the DPLD decoder
and can be included in the Sector Select (FS0FS3, CSBOOT0-CSBOOT1), and SRAM Select
(RS0) equations.
If memory paging is not needed, or if not all 8 page
register bits are needed for memory paging, then
these bits may be used in the CPLD for general
logic.
Figure 53 shows the Page Register. The eight flipflops in the register are connected to the internal
data bus D0-D7. The MCU can write to or read
from the Page Register. The Page Register can be
accessed at address location CSIOP + E0h.
Figure 53. Page Register
RESET
D0
D0 - D7
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
PGR0
INTERNAL PSD MODULE
SELECTS
AND LOGIC
PGR1
PGR2
PGR3
PGR4
DPLD
AND
CPLD
PGR5
PGR6
PGR7
R/W
PAGE
REGISTER
PLD
AI05799
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uPSD3212A, uPSD3212C, uPSD3212CV
PLDS
The PLDs bring programmable logic functionality
to the uPSD. After specifying the logic for the
PLDs in PSDsoft Express, the logic is programmed into the device and available upon Power-up.
Table 87. DPLD and CPLD Inputs
Input Source
Input Name
Number
of
Signals
MCU Address Bus
A15-A0
16
MCU Control Signals
PSEN, RD, WR,
ALE
4
RESET
RST
1
Power-down
PDN
1
Port A Input
Macrocells1
PA7-PA0
8
Port B Input
Macrocells
PB7-PB0
8
Port C Input
Macrocells
PC7, PC4-PC2
4
Port D Inputs
PD2-PD1
2
Page Register
PGR7-PGR0
8
Macrocell AB
Feedback
MCELLAB.FB7FB0
8
Macrocell BC
Feedback
MCELLBC.FB7FB0
8
Flash memory
Program Status Bit
Ready/Busy
1
Note: 1. These inputs are not available in the 52-pin package.
106/163
The PSD MODULE contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD).
The PLDs are briefly discussed in the next few
paragraphs, and in more detail in Decode PLD
(DPLD), page 108,
and
Complex
PLD
(CPLD), page 109. Figure 54., page 107 shows
the configuration of the PLDs.
The DPLD performs address decoding for Select
signals for PSD MODULE components, such as
memory, registers, and I/O ports.
The CPLD can be used for logic functions, such as
loadable counters and shift registers, state machines, and encoding and decoding logic. These
logic functions can be constructed using the Output Macrocells (OMC), Input Macrocells (IMC),
and the AND Array. The CPLD can also be used
to generate External Chip Select (ECS1-ECS2)
signals.
The AND Array is used to form product terms.
These product terms are specified using PSDsoft.
The PLD input signals consist of internal MCU signals and external inputs from the I/O ports. The input signals are shown in Table 87.
The Turbo Bit in PSD MODULE
The PLDs can minimize power consumption by
switching off when inputs remain unchanged for
an extended time of about 70ns. Resetting the
Turbo Bit to '0' (Bit 3 of PMMR0) automatically
places the PLDs into standby if no inputs are
changing. Turning the Turbo Mode off increases
propagation delays while reducing power consumption.
See POWER MANAGEMENT, page 122, on how
to set the Turbo Bit.
Additionally, five bits are available in PMMR2 to
block MCU control signals from entering the PLDs.
This reduces power consumption and can be used
only when these MCU control signals are not used
in PLD logic equations.
Each of the two PLDs has unique characteristics
suited for its applications. They are described in
the following sections.
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 54. PLD Diagram
8
PAGE
REGISTER
DECODE PLD
73
4
PRIMARY FLASH MEMORY SELECTS
2
SECONDARY NON-VOLATILE MEMORY SELECTS
1
SRAM SELECT
1
CSIOP SELECT
PLD INPUT BUS
2
16
PERIPHERAL SELECTS
DIRECT MACROCELL ACCESS FROM MCU DATA BUS
OUTPUT MACROCELL FEEDBACK
CPLD
16 OUTPUT
MACROCELL
PT
ALLOC.
73
20 INPUT MACROCELL
(PORT A,B,C)
MACROCELL
ALLOC.
I/O PORTS
DATA
BUS
MCELLAB
TO PORT A OR B1
8
MCELLBC
TO PORT B OR C
8
2
EXTERNAL CHIP SELECTS
TO PORT D
DIRECT MACROCELL INPUT TO MCU DATA BUS
20
INPUT MACROCELL & INPUT PORTS
2
PORT D INPUTS
AI07435
Note: 1. Ports A is not available in the 52-pin package
107/163
uPSD3212A, uPSD3212C, uPSD3212CV
Decode PLD (DPLD)
The DPLD, shown in Figure 55, is used for decoding the address for PSD MODULE and external
components. The DPLD can be used to generate
the following decode signals:
– 4 Sector Select (FS0-FS3) signals for the
primary Flash memory (three product terms
each)
–
–
–
–
2 Sector Select (CSBOOT0-CSBOOT1)
signals for the secondary Flash memory (three
product terms each)
1 internal SRAM Select (RS0) signal (two
product terms)
1 internal CSIOP Select signal (selects the
PSD MODULE registers)
2 internal Peripheral Select signals
(Peripheral I/O Mode).
Figure 55. DPLD Logic Array
(INPUTS)
I /O PORTS (PORT A,B,C)1
3
CSBOOT 0
3
CSBOOT 1
3
FS0
(20)
3
MCELLAB.FB [7:0] (FEEDBACKS)
FS1
(8)
3
MCELLBC.FB [7:0] (FEEDBACKS)
(8)
PGR0 - PGR7
(8)
FS2
3
A[15:0]2
(16)
PD[2:1]
(2)
PDN (APD OUTPUT)
(1)
PSEN, RD, WR, ALE2
(4)
2
(1)
RD_BSY
(1)
RESET
4 PRIMARY FLASH
MEMORY SECTOR
SELECTS
FS3
2
RS0
1
CSIOP
1
PSEL0
1
PSEL1
SRAM SELECT
I/O DECODER
SELECT
PERIPHERAL I/O
MODE SELECT
AI07436
Note: 1. Port A inputs are not available in the 52-pin package
2. Inputs from the MCU module
108/163
uPSD3212A, uPSD3212C, uPSD3212CV
Complex PLD (CPLD)
The CPLD can be used to implement system logic
functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols,
state machines, and random logic. The CPLD can
also be used to generate External Chip Select
(ECS1-ECS2), routed to Port D.
Although External Chip Select (ECS1-ECS2) can
be produced by any Output Macrocell (OMC),
these External Chip Select (ECS1-ECS2) on Port
D do not consume any Output Macrocells (OMC).
As shown in Figure 54, the CPLD has the following
blocks:
■
20 Input Macrocells (IMC)
■
16 Output Macrocells (OMC)
■
Macrocell Allocator
■
Product Term Allocator
AND Array capable of generating up to 137
product terms
■
Four I/O Ports.
Each of the blocks are described in the sections
that follow.
The Input Macrocells (IMC) and Output Macrocells
(OMC) are connected to the PSD MODULE internal data bus and can be directly accessed by the
MCU. This enables the MCU software to load data
into the Output Macrocells (OMC) or read data
from both the Input and Output Macrocells (IMC
and OMC).
This feature allows efficient implementation of system logic and eliminates the need to connect the
data bus to the AND Array as required in most
standard PLD macrocell architectures.
■
Figure 56. Macrocell and I/O Port
PLD INPUT BUS
PRODUCT TERMS
FROM OTHER
MACROCELLS
MCU ADDRESS / DATA BUS
TO OTHER I/O PORTS
CPLD MACROCELLS
I/O PORTS
DATA
LOAD
CONTROL
PT PRESET
MCU DATA IN
PRODUCT TERM
ALLOCATOR
LATCHED
ADDRESS OUT
DATA
MCU LOAD
I/O PIN
Q
D
MUX
POLARITY
SELECT
MUX
CPLD OUTPUT
PR DI LD
D/T
MUX
PT
CLOCK
GLOBAL
CLOCK
CK
CL
CLOCK
SELECT
SELECT
Q
D/T/JK FF
SELECT
COMB.
/REG
SELECT
CPLD
OUTPUT
PDR
MACROCELL
TO
I/O PORT
ALLOC.
INPUT
Q
DIR
REG.
D
WR
PT CLEAR
PT OUTPUT ENABLE (OE)
MACROCELL FEEDBACK
INPUT MACROCELLS
I/O PORT INPUT
MUX
PLD INPUT BUS
MACROCELL
OUT TO
MCU
PT INPUT LATCH GATE/CLOCK
ALE
MUX
AND ARRAY
WR
UP TO 10
PRODUCT TERMS
Q D
Q D
G
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uPSD3212A, uPSD3212C, uPSD3212CV
Output Macrocell (OMC)
Eight of the Output Macrocells (OMC) are connected to Ports A and B pins and are named as
McellAB0-McellAB7. The other eight macrocells
are connected to Ports B and C pins and are
named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in PSDsoft, the
Macrocell Allocator block assigns it to either Port A
or B. The same is true for a McellBC output on Port
B or C. Table 88 shows the macrocells and port
assignment.
The Output Macrocell (OMC) architecture is
shown in Figure 57. As shown in the figure, there
are native product terms available from the AND
Array, and borrowed product terms available (if
unused) from other Output Macrocells (OMC). The
polarity of the product term is controlled by the
XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop
element, or combinatorial logic. The multiplexer
selects between the sequential or combinatorial
logic outputs. The multiplexer output can drive a
port pin and has a feedback path to the AND Array
inputs.
The flip-flop in the Output Macrocell (OMC) block
can be configured as a D, T, JK, or SR type in PSDsoft. The flip-flop’s clock, preset, and clear inputs
may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for
the clock input to the flip-flop. The flip-flop is
clocked on the rising edge of CLKIN (PD1). The
preset and clear are active High inputs. Each clear
input can use up to two product terms.
Table 88. Output Macrocell Port and Data Bit Assignments
Output
Macrocell
Port
Assignment(1)
Native Product Terms
Maximum Borrowed
Product Terms
Data Bit for Loading or
Reading
McellAB0
Port A0, B0
3
6
D0
McellAB1
Port A1, B1
3
6
D1
McellAB2
Port A2, B2
3
6
D2
McellAB3
Port A3, B3
3
6
D3
McellAB4
Port A4, B4
3
6
D4
McellAB5
Port A5, B5
3
6
D5
McellAB6
Port A6, B6
3
6
D6
McellAB7
Port A7, B7
3
6
D7
McellBC0
Port B0(2)
4
5
D0
McellBC1
Port B1(2)
4
5
D1
McellBC2
Port B2, C2
4
5
D2
McellBC3
Port B3, C3
4
5
D3
McellBC4
Port B4, C4
4
6
D4
McellBC5
Port B5(2)
4
6
D5
McellBC6
Port B6(2)
4
6
D6
McellBC7
Port B7, C7
4
6
D7
Note: 1. McellAB0-McellAB7 can only be assigned to Port B in the 52-pin package.
2. Port PC0, PC1, PC5 and PC6 are assigned to JTAG pins, and are not available as macrocell outputs
110/163
uPSD3212A, uPSD3212C, uPSD3212CV
Product Term Allocator
The CPLD has a Product Term Allocator. PSDsoft
uses the Product Term Allocator to borrow and
place product terms from one macrocell to another. The following list summarizes how product
terms are allocated:
– McellAB0-McellAB7 all have three native
product terms and may borrow up to six more
– McellBC0-McellBC3 all have four native
product terms and may borrow up to five more
– McellBC4-McellBC7 all have four native
product terms and may borrow up to six more.
Each macrocell may only borrow product terms
from certain other macrocells. Product terms already in use by one macrocell are not available for
another macrocell.
If an equation requires more product terms than
are available to it, then “external” product terms
are required, which consume other Output Macrocells (OMC). If external product terms are used,
extra delay is added for the equation that required
the extra product terms.
This is called product term expansion. PSDsoft
Express performs this expansion as needed.
Loading and Reading the Output Macrocells
(OMC). The Output Macrocells (OMC) block occupies a memory location in the MCU address
space, as defined by the CSIOP block (see I/O
PORTS (PSD MODULE), page 113). The flipflops in each of the 16 Output Macrocells (OMC)
can be loaded from the data bus by a MCU. Loading the Output Macrocells (OMC) with data from
the MCU takes priority over internal functions. As
such, the preset, clear, and clock inputs to the flipflop can be overridden by the MCU. The ability to
load the flip-flops and read them back is useful in
such applications as loadable counters and shift
registers, mailboxes, and handshaking protocols.
Data can be loaded to the Output Macrocells
(OMC) on the trailing edge of WRITE Strobe (WR,
edge loading) or during the time that WRITE
Strobe (WR) is active (level loading). The method
of loading is specified in PSDsoft Express Configuration.
Figure 57. CPLD Output Macrocell
MASK
REG.
MACROCELL CS
MCU DATA BUS
D[7:0]
RD
PT
ALLOCATOR
WR
DIRECTION
REGISTER
ENABLE (.OE)
AND ARRAY
PLD INPUT BUS
PRESET(.PR)
COMB/REG
SELECT
PT
PT
DIN PR
MUX
PT
LD
POLARITY
SELECT
I/O PIN
MACROCELL
ALLOCATOR
IN
CLEAR (.RE)
CLR
PORT
DRIVER
PROGRAMMABLE
FF (D/T/JK /SR)
PT CLK
CLKIN
Q
MUX
FEEDBACK (.FB)
PORT INPUT
INPUT
MACROCELL
AI06617
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uPSD3212A, uPSD3212C, uPSD3212CV
The OMC Mask Register. There is one Mask
Register for each of the two groups of eight Output
Macrocells (OMC). The Mask Registers can be
used to block the loading of data to individual Output Macrocells (OMC). The default value for the
Mask Registers is 00h, which allows loading of the
Output Macrocells (OMC). When a given bit in a
Mask Register is set to a '1,' the MCU is blocked
from writing to the associated Output Macrocells
(OMC). For example, suppose McellAB0McellAB3 are being used for a state machine. You
would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you
would want to load the Mask Register for McellAB
(Mask Macrocell AB) with the value 0Fh.
The Output Enable of the OMC. The
Output
Macrocells (OMC) block can be connected to an I/
O port pin as a PLD output. The output enable of
each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon
Power-up if no output enable equation is defined
and if the pin is declared as a PLD output in PSDsoft Express.
If the Output Macrocell (OMC) output is declared
as an internal node and not as a port pin output in
the PSDabel file, the port pin can be used for other
I/O functions. The internal node feedback can be
routed as an input to the AND Array.
Input Macrocells (IMC)
The CPLD has 20 Input Macrocells (IMC), one for
each pin on Ports A and B, and four on Port C. The
architecture of the Input Macrocells (IMC) is
shown in Figure 58. The Input Macrocells (IMC)
are individually configurable, and can be used as
a latch, register, or to pass incoming Port signals
prior to driving them onto the PLD input bus. The
outputs of the Input Macrocells (IMC) can be read
by the MCU through the internal data bus.
The enable for the latch and clock for the register
are driven by a multiplexer whose inputs are a
product term from the CPLD AND Array or the
MCU Address Strobe (ALE). Each product term
output is used to latch or clock four Input Macrocells (IMC). Port inputs 3-0 can be controlled by
one product term and 7-4 by another.
Configurations for the Input Macrocells (IMC) are
specified by equations written in PSDsoft (see Application Note AN1171). Outputs of the Input Macrocells (IMC) can be read by the MCU via the IMC
buffer.
See I/O PORTS (PSD MODULE), page 113.
Figure 58. Input Macrocell
D [ 7:0]
MCU DATA BUS
INPUT MACROCELL _ RD
DIRECTION
REGISTER
ENABLE ( .OE )
AND ARRAY
PLD INPUT BUS
PT
OUTPUT
MACROCELLS BC
AND
MACROCELL AB
I/O PIN
PT
PORT
DRIVER
MUX
Q
D
PT
MUX
ALE
D FF
FEEDBACK
Q
D
G
LATCH
INPUT MACROCELL
AI06603
112/163
uPSD3212A, uPSD3212C, uPSD3212CV
I/O PORTS (PSD MODULE)
There are four programmable I/O ports: Ports A, B,
C, and D in the PSD MODULE. Each of the ports
is eight bits except Port D, which is 3 bits. Each
port pin is individually user configurable, thus allowing multiple functions per port. The ports are
configured using PSDsoft Express Configuration
or by the MCU writing to on-chip registers in the
CSIOP space. Port A is not available in the 52-pin
package.
The topics discussed in this section are:
■
General Port architecture
■
Port operating modes
■
Port Configuration Registers (PCR)
■
Port Data Registers
■
Individual Port functionality.
General Port Architecture
The general architecture of the I/O Port block is
shown in Figure 59. Individual Port architectures
are shown in Figure 61., page 118 to Figure
64., page 121. In general, once the purpose for a
port pin has been defined, that pin is no longer
available for other purposes. Exceptions are noted.
As shown in Figure 59, the ports contain an output
multiplexer whose select signals are driven by the
configuration bits in the Control Registers (Ports A
and B only) and PSDsoft Express Configuration.
Inputs to the multiplexer include the following:
■
Output data from the Data Out register
■
Latched address outputs
■
CPLD macrocell output
■
External Chip Select (ECS1-ECS2) from the
CPLD.
The Port Data Buffer (PDB) is a tri-state buffer that
allows only one source at a time to be read. The
Port Data Buffer (PDB) is connected to the Internal
Data Bus for feedback and can be read by the
MCU. The Data Out and macrocell outputs, Direction and Control Registers, and port pin input are
all connected to the Port Data Buffer (PDB).
Figure 59. General I/O Port Architecture
DATA OUT
REG.
D
Q
D
Q
DATA OUT
WR
ADDRESS
ALE
ADDRESS
PORT PIN
OUTPUT
MUX
G
MACROCELL OUTPUTS
EXT CS
READ MUX
MCU DATA BUS
P
OUTPUT
SELECT
D
DATA IN
B
CONTROL REG.
D
Q
ENABLE OUT
WR
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD- INPUT
AI06604
113/163
uPSD3212A, uPSD3212C, uPSD3212CV
The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come
from the CPLD AND Array enable product term
and the Direction Register. If the enable product
term of any of the Array outputs are not defined
and that port pin is not defined as a CPLD output
in the PSDsoft, then the Direction Register has
sole control of the buffer that drives the port pin.
The contents of these registers can be altered by
the MCU. The Port Data Buffer (PDB) feedback
path allows the MCU to check the contents of the
registers.
Ports A, B, and C have embedded Input Macrocells (IMC). The Input Macrocells (IMC) can be
configured as latches, registers, or direct inputs to
the PLDs. The latches and registers are clocked
by Address Strobe (ALE) or a product term from
the PLD AND Array. The outputs from the Input
Macrocells (IMC) drive the PLD input bus and can
be
read
by
the
MCU.
See
Input
Macrocell, page 112.
Port Operating Modes
The I/O Ports have several modes of operation.
Some modes can be defined using PSDsoft, some
by the MCU writing to the Control Registers in
CSIOP space, and some by both. The modes that
can only be defined using PSDsoft must be programmed into the device and cannot be changed
unless the device is reprogrammed. The modes
that can be changed by the MCU can be done so
dynamically at run-time. The PLD I/O, Data Port,
Address Input, and Peripheral I/O Modes are the
only modes that must be defined before programming the device. All other modes can be changed
by the MCU at run-time. See Application Note
AN1171 for more detail.
Table 89., page 115 summarizes which modes
are available on each port. Table 92., page 116
shows how and where the different modes are
configured. Each of the port operating modes are
described in the following sections.
MCU I/O Mode
In the MCU I/O Mode, the MCU uses the I/O Ports
block to expand its own I/O ports. By setting up the
CSIOP space, the ports on the PSD MODULE are
mapped into the MCU address space. The addresses of the ports are listed in Table
81., page 92.
A port pin can be put into MCU I/O Mode by writing
a '0' to the corresponding bit in the Control Register. The MCU I/O direction may be changed by
writing to the corresponding bit in the Direction
Register, or by the output enable product term.
See Peripheral I/O Mode, page 114. When the pin
114/163
is configured as an output, the content of the Data
Out Register drives the pin. When configured as
an input, the MCU can read the port input through
the Data In buffer. See Figure 59., page 113.
Ports C and D do not have Control Registers, and
are in MCU I/O Mode by default. They can be used
for PLD I/O if equations are written for them in PSDabel.
PLD I/O Mode
The PLD I/O Mode uses a port as an input to the
CPLD’s Input Macrocells (IMC), and/or as an output from the CPLD’s Output Macrocells (OMC).
The output can be tri-stated with a control signal.
This output enable control signal can be defined
by a product term from the PLD, or by resetting the
corresponding bit in the Direction Register to '0.'
The corresponding bit in the Direction Register
must not be set to '1' if the pin is defined for a PLD
input signal in PSDsoft. The PLD I/O Mode is
specified in PSDsoft by declaring the port pins,
and then writing an equation assigning the PLD I/
O to a port.
Address Out Mode
Address Out Mode can be used to drive latched
MCU addresses on to the port pins. These port
pins can, in turn, drive external devices. Either the
output enable or the corresponding bits of both the
Direction Register and Control Register must be
set to a '1' for pins to use Address Out Mode. This
must be done by the MCU at run-time. See Table
91., page 115 for the address output pin assignments on Ports A and B for various MCUs.
Peripheral I/O Mode
Peripheral I/O Mode can be used to interface with
external peripherals. In this mode, all of Port A
serves as a tri-state, bi-directional data buffer for
the MCU. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a '1.' Figure
60., page 115 shows how Port A acts as a bi-directional buffer for the MCU data bus if Peripheral
I/O Mode is enabled. An equation for PSEL0 and/
or PSEL1 must be written in PSDsoft. The buffer is
tri-stated when PSEL0 or PSEL1 is low (not active). The PSEN signal should be “ANDed” in the
PSEL equations to disable the buffer when PSEL
resides in the data space.
JTAG In-System Programming (ISP)
Port C is JTAG compliant, and can be used for InSystem Programming (ISP). For more information
on the JTAG Port, see PROGRAMMING IN-CIRCUIT
USING
THE
JTAG
SERIAL
INTERFACE, page 127.
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 60. Peripheral I/O Mode
RD
PSEL0
PSEL
PSEL1
D0 - D7
VM REGISTER BIT 7
PA0 - PA7
DATA BUS
WR
AI02886
Table 89. Port Operating Modes
Port A(2)
Port Mode
Port B
Port C
Port D
MCU I/O
Yes
Yes
Yes
Yes
PLD I/O
McellAB Outputs
McellBC Outputs
Additional Ext. CS Outputs
PLD Inputs
Yes
No
No
Yes
Yes
Yes
No
Yes
No
Yes(3)
No
Yes
No
No
Yes
Yes
Address Out
Yes (A7 – 0)
Yes (A7 – 0)
No
No
Peripheral I/O
Yes
No
No
No
JTAG ISP
No
No
Yes(1)
No
Note: 1. JTAG pins (TMS, TCK, TDI, TDO) are dedicated pins.
2. Port A is not available in the 52-pin package.
3. On pins PC2, PC3, PC4 and PC7 only.
Table 90. Port Operating Mode Settings
Mode
Control Register
Setting
Defined in PSDsoft
Direction Register
Setting
VM Register Setting
MCU I/O
Declare pins only
0
1 = output,
0 = input (Note 1)
N/A
PLD I/O
Logic equations
N/A
(Note 1)
N/A
Address Out
(Port A,B)
Declare pins only
1
1 (Note 1)
N/A
Peripheral I/O
(Port A)
Logic equations
(PSEL0 & 1)
N/A
N/A
PIO Bit = 1
Note: N/A = Not Applicable
Note: 1. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product
term (.oe) from the CPLD AND Array.
Table 91. I/O Port Latched Address Output Assignments
Port A (PA3-PA0)
Address a3-a0
Port A (PA7-PA4)
Address a7-a4
Port B (PB3-PB0)
Address a3-a0
Port B (PB7-PB4)
Address a7-a4
115/163
uPSD3212A, uPSD3212C, uPSD3212CV
Port Configuration Registers (PCR)
Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of
the registers can be accessed by the MCU through
normal READ/WRITE bus cycles at the addresses
given in Table 81., page 92. The addresses in Table 81 are the offsets in hexadecimal from the
base of the CSIOP register.
The pins of a port are individually configurable and
each bit in the register controls its respective pin.
For example, Bit 0 in a register refers to Bit 0 of its
port. The three Port Configuration Registers
(PCR), shown in Table 92, are used for setting the
Port configurations. The default Power-up state for
each register in Table 92 is 00h.
Control Register. Any bit reset to '0' in the Control Register sets the corresponding port pin to
MCU I/O Mode, and a '1' sets it to Address Out
Mode. The default mode is MCU I/O. Only Ports A
and B have an associated Control Register.
Direction Register. The Direction Register, in
conjunction with the output enable (except for Port
D), controls the direction of data flow in the I/O
Ports. Any bit set to '1' in the Direction Register
causes the corresponding pin to be an output, and
any bit set to '0' causes it to be an input. The default mode for all port pins is input.
Figure 61., page 118 and Figure 62., page 119
show the Port Architecture diagrams for Ports A/B
and C, respectively. The direction of data flow for
Ports A, B, and C are controlled not only by the direction register, but also by the output enable
product term from the PLD AND Array. If the output enable product term is not active, the Direction
Register has sole control of a given pin’s direction.
An example of a configuration for a Port with the
three least significant bits set to output and the remainder set to input is shown in Table 95. Since
Port D only contains two pins (shown in Figure
64., page 121), the Direction Register for Port D
has only two bits active.
Drive Select Register. The Drive Select Register
configures the pin driver as Open Drain or CMOS
for some port pins, and controls the slew rate for
the other port pins. An external pull-up resistor
should be used for pins configured as Open Drain.
A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a
'1.' The default pin drive is CMOS.
116/163
Note: The slew rate is a measurement of the rise
and fall times of an output. A higher slew rate
means a faster output response and may create
more electrical noise. A pin operates in a high slew
rate when the corresponding bit in the Drive Register is set to '1.' The default rate is slow slew.
Table 96., page 117 shows the Drive Register for
Ports A, B, C, and D. It summarizes which pins can
be configured as Open Drain outputs and which
pins the slew rate can be set for.
Table 92. Port Configuration Registers (PCR)
Register Name
Port
MCU Access
Control
A,B
WRITE/READ
Direction
A,B,C,D
WRITE/READ
Drive Select(1)
A,B,C,D
WRITE/READ
Note: 1. See Table 96., page 117 for Drive Register Bit definition.
Table 93. Port Pin Direction Control, Output
Enable P.T. Not Defined
Direction Register Bit
Port Pin Mode
0
Input
1
Output
Table 94. Port Pin Direction Control, Output
Enable P.T. Defined
Direction
Register Bit
Output Enable
P.T.
Port Pin Mode
0
0
Input
0
1
Output
1
0
Output
1
1
Output
Table 95. Port Direction Assignment Example
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
1
1
1
uPSD3212A, uPSD3212C, uPSD3212CV
Port Data Registers
The Port Data Registers, shown in Table 97, are
used by the MCU to write data to or read data from
the ports. Table 97 shows the register name, the
ports having each register type, and MCU access
for each register type. The registers are described
below.
Data In. Port pins are connected directly to the
Data In buffer. In MCU I/O Input Mode, the pin input is read through the Data In buffer.
Data Out Register. Stores output data written by
the MCU in the MCU I/O Output Mode. The contents of the Register are driven out to the pins if the
Direction Register or the output enable product
term is set to '1.' The contents of the register can
also be read back by the MCU.
Output Macrocells (OMC). The CPLD Output
Macrocells (OMC) occupy a location in the MCU’s
address space. The MCU can read the output of
the Output Macrocells (OMC). If the OMC Mask
Register Bits are not set, writing to the macrocell
loads data to the macrocell flip-flops. See
PLDs, page 106.
OMC Mask Register. Each OMC Mask Register
Bit corresponds to an Output Macrocell (OMC) flipflop. When the OMC Mask Register Bit is set to a
'1,' loading data into the Output Macrocell (OMC)
flip-flop is blocked. The default value is '0' or unblocked.
Input Macrocells (IMC). The Input Macrocells
(IMC) can be used to latch or store external inputs.
The outputs of the Input Macrocells (IMC) are routed to the PLD input bus, and can be read by the
MCU. See PLDs, page 106.
Enable Out. The Enable Out register can be read
by the MCU. It contains the output enable values
for a given port. A '1' indicates the driver is in output mode. A '0' indicates the driver is in tri-state
and the pin is in input mode.
Table 96. Drive Register Pin Assignment
Drive
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Port A
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Slew
Rate
Slew
Rate
Slew
Rate
Slew
Rate
Port B
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Slew
Rate
Slew
Rate
Slew
Rate
Slew
Rate
Port C
Open
Drain
NA(1)
NA(1)
Open
Drain
Open
Drain
Open
Drain
NA(1)
NA(1)
Port D
NA(1)
NA(1)
NA(1)
NA(1)
NA(1)
Slew
Rate
Slew
Rate
NA(1)
Note: 1. NA = Not Applicable.
Table 97. Port Data Registers
Register Name
Port
MCU Access
Data In
A,B,C,D
READ – input on pin
Data Out
A,B,C,D
WRITE/READ
Output Macrocell
A,B,C
READ – outputs of macrocells
WRITE – loading macrocells flip-flop
Mask Macrocell
A,B,C
WRITE/READ – prevents loading into a given
macrocell
Input Macrocell
A,B,C
READ – outputs of the Input Macrocells
Enable Out
A,B,C
READ – the output enable control of the port driver
117/163
uPSD3212A, uPSD3212C, uPSD3212CV
Ports A and B – Functionality and Structure
Ports A and B have similar functionality and structure, as shown in Figure 61. The two ports can be
configured to perform one or more of the following
functions:
■
MCU I/O Mode
■
CPLD Output – Macrocells McellAB7McellAB0 can be connected to Port A or Port
B. McellBC7-McellBC0 can be connected to
Port B or Port C.
■
■
■
■
CPLD Input – Via the Input Macrocells (IMC).
Latched Address output – Provide latched
address output as per Table 91., page 115.
Open Drain/Slew Rate – pins PA3-PA0 and
PB3-PB0 can be configured to fast slew rate,
pins PA7-PA4 and PB7-PB4 can be
configured to Open Drain Mode.
Peripheral Mode – Port A only (80-pin
package)
Figure 61. Port A and Port B Structure
DATA OUT
REG.
D
Q
D
Q
DATA OUT
WR
ADDRESS
ALE
ADDRESS
A[ 7:0]
G
PORT
A OR B PIN
OUTPUT
MUX
MACROCELL OUTPUTS
READ MUX
MCU DATA BUS
P
OUTPUT
SELECT
D
DATA IN
B
CONTROL REG.
D
Q
ENABLE OUT
WR
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD-INPUT
AI06605
118/163
uPSD3212A, uPSD3212C, uPSD3212CV
Port C – Functionality and Structure
Port C can be configured to perform one or more
of the following functions (see Figure 62):
■
MCU I/O Mode
■
CPLD Output – McellBC7-McellBC0 outputs
can be connected to Port B or Port C.
■
CPLD Input – via the Input Macrocells (IMC)
■
In-System Programming (ISP) – JTAG pins
(TMS, TCK, TDI, TDO) are dedicated pins for
device programming. (See PROGRAMMING
IN-CIRCUIT USING THE JTAG SERIAL
INTERFACE, page 127, for more information
on JTAG programming.)
Open Drain – Port C pins can be configured in
Open Drain Mode
■
Battery Backup features – PC2 can be
configured for a battery input supply, Voltage
Standby (VSTBY).
PC4 can be configured as a Battery-on
Indicator (VBATON), indicating when VCC is
less than VBAT.
Port C does not support Address Out Mode, and
therefore no Control Register is required.
■
Figure 62. Port C Structure
DATA OUT
REG.
D
DATA OUT
Q
WR
SPECIAL FUNCTION
PORT C PIN
1
OUTPUT
MUX
MCELLBC[ 7:0]
MCU DATA BUS
READ MUX
P
OUTPUT
SELECT
D
DATA IN
B
ENABLE OUT
DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
INPUT
MACROCELL
CPLD - INPUT
SPECIAL FUNCTION
1
CONFIGURATION
BIT
AI06618
Note: 1. ISP or battery back-up
119/163
uPSD3212A, uPSD3212C, uPSD3212CV
Port D – Functionality and Structure
Port D has two I/O pins (only one pin, PD1, in the
52-pin package). See Figure 63 and Figure
64., page 121. This port does not support Address
Out Mode, and therefore no Control Register is required. Of the eight bits in the Port D registers,
only Bits 2 and 1 are used to configure pins PD2
and PD1.
Port D can be configured to perform one or more
of the following functions:
■
MCU I/O Mode
■
CPLD Output – External Chip Select (ECS1ECS2)
CPLD Input – direct input to the CPLD, no
Input Macrocells (IMC)
■
Slew rate – pins can be set up for fast slew
rate
Port D pins can be configured in PSDsoft Express
as input pins for other dedicated functions:
■
CLKIN (PD1) as input to the macrocells flipflops and APD counter
■
PSD Chip Select Input (CSI, PD2). Driving this
signal High disables the Flash memory, SRAM
and CSIOP.
■
Figure 63. Port D Structure
DATA OUT
REG.
DATA OUT
D
Q
WR
PORT D PIN
OUTPUT
MUX
ECS [ 2:1]
MCU DATA BUS
READ MUX
OUTPUT
SELECT
P
D
DATA IN
B
ENABLE PRODUCT
TERM (.OE)
DIR REG.
D
WR
120/163
Q
CPLD-INPUT
AI06606
uPSD3212A, uPSD3212C, uPSD3212CV
External Chip Select
The CPLD also provides two External Chip Select
(ECS1-ECS2) outputs on Port D pins that can be
used to select external devices. Each External
Chip Select (ECS1-ECS2) consists of one product
term that can be configured active High or Low.
The output enable of the pin is controlled by either
the output enable product term or the Direction
Register. (See Figure 64.)
Figure 64. Port D External Chip Select Signals
ENABLE (.OE)
PD1 PIN
ECS1
POLARITY
BIT
CPLD AND ARRAY
PLD INPUT BUS
PT1
DIRECTION
REGISTER
ENABLE (.OE)
PT2
DIRECTION
REGISTER
ECS2
POLARITY
BIT
PD2 PIN
AI06607
121/163
uPSD3212A, uPSD3212C, uPSD3212CV
POWER MANAGEMENT
All PSD MODULE offers configurable power saving options. These options may be used individually or in combinations, as follows:
– The primary and secondary Flash memory,
and SRAM blocks are built with power
management technology. In addition to using
special silicon design methodology, power
management technology puts the memories
into Standby Mode when address/data inputs
are not changing (zero DC current). As soon
as a transition occurs on an input, the affected
memory “wakes up,” changes and latches its
outputs, then goes back to standby. The
designer does not have to do anything special
to achieve Memory Standby Mode when no
inputs are changing—it happens
automatically.
The PLD sections can also achieve Standby
Mode when its inputs are not changing, as
described in the sections on the Power
Management Mode Registers (PMMR).
– As with the Power Management Mode, the
Automatic Power Down (APD) block allows
the PSD MODULE to reduce to standby
current automatically. The APD Unit can also
block MCU address/data signals from
reaching the memories and PLDs. The APD
Unit is described in more detail in POWER
MANAGEMENT, page 122.
Built in logic monitors the Address Strobe of
the MCU for activity. If there is no activity for a
certain time period (MCU is asleep), the APD
Unit initiates Power-down Mode (if enabled).
–
–
Once in Power-down Mode, all address/data
signals are blocked from reaching memory
and PLDs, and the memories are deselected
internally. This allows the memory and PLDs
to remain in Standby Mode even if the
address/data signals are changing state
externally (noise, other devices on the MCU
bus, etc.). Keep in mind that any unblocked
PLD input signals that are changing states
keeps the PLD out of Standby Mode, but not
the memories.
PSD Chip Select Input (CSI, PD2) can be
used to disable the internal memories, placing
them in Standby Mode even if inputs are
changing. This feature does not block any
internal signals or disable the PLDs. This is a
good alternative to using the APD Unit. There
is a slight penalty in memory access time
when PSD Chip Select Input (CSI, PD2)
makes its initial transition from deselected to
selected.
The PMMRs can be written by the MCU at runtime to manage power. The PSD MODULE
supports “blocking bits” in these registers that
are set to block designated signals from
reaching both PLDs. Current consumption of
the PLDs is directly related to the composite
frequency of the changes on their inputs (see
Figure 68 and Figure 69., page 128).
Significant power savings can be achieved by
blocking signals that are not used in DPLD or
CPLD logic equations.
Figure 65. APD Unit
APD EN
PMMR0 BIT 1=1
TRANSITION
DETECTION
DISABLE BUS
INTERFACE
ALE
CLR
RESET
CSI
CSIOP SELECT
FLASH SELECT
EDGE
DETECT
CLKIN
PD
PLD
SRAM SELECT
POWER DOWN
(PDN) SELECT
DISABLE
FLASH/SRAM
122/163
PD
APD
COUNTER
AI06608
uPSD3212A, uPSD3212C, uPSD3212CV
The PSD MODULE has a Turbo Bit in PMMR0.
This bit can be set to turn the Turbo Mode off (the
default is with Turbo Mode turned on). While Turbo
Mode is off, the PLDs can achieve standby current
when no PLD inputs are changing (zero DC current). Even when inputs do change, significant
power can be saved at lower frequencies (AC current), compared to when Turbo Mode is on. When
the Turbo Mode is on, there is a significant DC current component and the AC component is higher.
Automatic Power-down (APD) Unit and Powerdown Mode. The APD Unit, shown in Figure
65., page 122, puts the PSD MODULE into Power-down Mode by monitoring the activity of Address Strobe (ALE). If the APD Unit is enabled, as
soon as activity on Address Strobe (ALE) stops, a
four-bit counter starts counting. If Address Strobe
(ALE/AS, PD0) remains inactive for fifteen clock
periods of CLKIN (PD1), Power-down (PDN) goes
High, and the PSD MODULE enters Power-down
Mode, as discussed next.
Power-down Mode. By default, if you enable the
APD Unit, Power-down Mode is automatically enabled. The device enters Power-down Mode if Address Strobe (ALE) remains inactive for fifteen
periods of CLKIN (PD1).
The following should be kept in mind when the
PSD MODULE is in Power-down Mode:
– If Address Strobe (ALE) starts pulsing again,
the PSD MODULE returns to normal
Operating mode. The PSD MODULE also
returns to normal Operating mode if either
PSD Chip Select Input (CSI, PD2) is Low or
the RESET input is High.
– The MCU address/data bus is blocked from all
memory and PLDs.
– Various signals can be blocked (prior to
Power-down Mode) from entering the PLDs by
setting the appropriate bits in the PMMR
registers. The blocked signals include MCU
control signals and the common CLKIN (PD1).
Note: Blocking CLKIN (PD1) from the PLDs
does not block CLKIN (PD1) from the APD
Unit.
– All memories enter Standby Mode and are
drawing standby current. However, the PLD
and I/O ports blocks do not go into Standby
Mode because you don’t want to have to wait
for the logic and I/O to “wake-up” before their
outputs can change. See Table 98 for Powerdown Mode effects on PSD MODULE ports.
–
Typical standby current is of the order of
microamperes. These standby current values
assume that there are no transitions on any
PLD input.
Other Power Saving Options. The PSD MODULE offers other reduced power saving options
that are independent of the Power-down Mode.
Except for the SRAM Standby and PSD Chip Select Input (CSI, PD2) features, they are enabled by
setting bits in PMMR0 and PMMR2.
Figure 66. Enable Power-down Flow Chart
RESET
Enable APD
Set PMMR0 Bit 1 = 1
OPTIONAL
Disable desired inputs to PLD
by setting PMMR0 bits 4 and 5
and PMMR2 bits 2 through 6.
ALE idle
for 15 CLKIN
clocks?
No
Yes
PSD Module in Power
Down Mode
AI06609
Table 98. Power-down Mode’s Effect on Ports
Port Function
Pin Level
MCU I/O
No Change
PLD Out
No Change
Address Out
Undefined
Peripheral I/O
Tri-State
123/163
uPSD3212A, uPSD3212C, uPSD3212CV
PLD Power Management
The power and speed of the PLDs are controlled
by the Turbo Bit (Bit 3) in PMMR0 (see Table 99).
By setting the bit to '1,' the Turbo Mode is off and
the PLDs consume the specified standby current
when the inputs are not switching for an extended
time of 70ns. The propagation delay time is increased by 10ns (for a 5V device) after the Turbo
Bit is set to '1' (turned off) when the inputs change
at a composite frequency of less than 15MHz.
When the Turbo Bit is reset to '0' (turned on), the
PLDs run at full power and speed. The Turbo Bit
affects the PLD’s DC power, AC power, and propagation delay. When the Turbo Mode is off, the
uPSD3200 input clock frequency is reduced by
5MHz from the maximum rated clock frequency.
Blocking MCU control signals with the bits of
PMMR2 (see Table 100., page 125) can further
reduce PLD AC power consumption.
SRAM Standby Mode (Battery Backup). The
SRAM in the PSD MODULE supports a battery
backup mode in which the contents are retained in
the event of a power loss. The SRAM has Voltage
Standby (VSTBY, PC2) that can be connected to an
external battery. When VCC becomes lower than
VSTBY then the SRAM automatically connects to
Voltage Standby (VSTBY, PC2) as a power source.
The SRAM Standby Current (ISTBY) is typically 0.5
µA. The SRAM data retention voltage is 2V minimum. The Battery-on Indicator (VBATON) can be
routed to PC4. This signal indicates when the VCC
has dropped below VSTBY.
PSD Chip Select Input (CSI, PD2)
PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low,
the signal selects and enables the PSD MODULE
Flash memory, SRAM, and I/O blocks for READ or
WRITE operations. A High on PSD Chip Select Input (CSI, PD2) disables the Flash memory, and
SRAM, and reduces power consumption. However, the PLD and I/O signals remain operational
when PSD Chip Select Input (CSI, PD2) is High.
Input Clock
CLKIN (PD1) can be turned off, to the PLD to save
AC power consumption. CLKIN (PD1) is an input
to the PLD AND Array and the Output Macrocells
(OMC).
During Power-down Mode, or, if CLKIN (PD1) is
not being used as part of the PLD logic equation,
the clock should be disabled to save AC power.
CLKIN (PD1) is disconnected from the PLD AND
Array or the Macrocells block by setting Bits 4 or 5
to a '1' in PMMR0.
Input Control Signals
The PSD MODULE provides the option to turn off
the MCU signals (WR, RD, PSEN, and Address
Strobe (ALE)) to the PLD to save AC power consumption (see Table 101., page 125). These control signals are inputs to the PLD AND Array.
During Power-down Mode, or, if any of them are
not being used as part of the PLD logic equation,
these control signals should be disabled to save
AC power. They are disconnected from the PLD
AND Array by setting Bits 2, 3, 4, 5, and 6 to a '1'
in PMMR2.
Table 99. Power Management Mode Registers PMMR0
Bit 0
X
Bit 1
APD Enable
0
Not used, and should be set to zero.
0 = off Automatic Power-down (APD) is disabled.
1 = on Automatic Power-down (APD) is enabled.
Bit 2
X
0
Not used, and should be set to zero.
0 = on PLD Turbo Mode is on
Bit 3
Bit 4
PLD Turbo
1 = off
PLD Turbo Mode is off, saving power.
uPSD3200 operates at 5MHz below the maximum rated clock frequency
0 = on
CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN
(PD1) Powers-up the PLD when Turbo Bit is '0.'
PLD Array clk
1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power.
0 = on CLKIN (PD1) input to the PLD macrocells is connected.
Bit 5
PLD MCell clk
1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power.
Bit 6
X
0
Not used, and should be set to zero.
Bit 7
X
0
Not used, and should be set to zero.
124/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 100. Power Management Mode Registers PMMR2
Bit 0
X
0
Not used, and should be set to zero.
Bit 1
X
0
Not used, and should be set to zero.
PLD Array
WR
0 = on WR input to the PLD AND Array is connected.
Bit 2
PLD Array
RD
0 = on RD input to the PLD AND Array is connected.
Bit 3
1 = off WR input to PLD AND Array is disconnected, saving power.
1 = off RD input to PLD AND Array is disconnected, saving power.
PLD Array
PSEN
0 = on PSEN input to the PLD AND Array is connected.
PLD Array
ALE
0 = on ALE input to the PLD AND Array is connected.
Bit 6
X
0
Not used, and should be set to zero.
Bit 7
X
0
Not used, and should be set to zero.
Bit 4
Bit 5
1 = off PSEN input to PLD AND Array is disconnected, saving power.
1 = off ALE input to PLD AND Array is disconnected, saving power.
Note: The bits of this register are cleared to zero following Power-up. Subsequent RESET pulses do not clear the registers.
Table 101. APD Counter Operation
APD Enable Bit
ALE Level
APD Counter
0
X
Not Counting
1
Pulsing
Not Counting
1
0 or 1
Counting (Generates PDN after 15 Clocks)
125/163
uPSD3212A, uPSD3212C, uPSD3212CV
RESET TIMING AND DEVICE STATUS AT RESET
Upon Power-up, the PSD MODULE requires a Reset (RESET) pulse of duration tNLNH-PO after VCC
is steady. During this period, the device loads internal configurations, clears some of the registers
and sets the Flash memory into operating mode.
After the rising edge of Reset (RESET), the PSD
MODULE remains in the Reset Mode for an additional period, tOPR, before the first memory access
is allowed.
The Flash memory is reset to the READ Mode
upon Power-up. Sector Select (FS0-FS3 and
CSBOOT0-CSBOOT1) must all be Low, WRITE
Strobe (WR, CNTL0) High, during Power-on
RESET for maximum security of the data contents
and to remove the possibility of a byte being written on the first edge of WRITE Strobe (WR). Any
Flash memory WRITE cycle initiation is prevented
automatically when VCC is below VLKO.
Warm RESET
Once the device is up and running, the PSD MODULE can be reset with a pulse of a much shorter
duration, tNLNH. The same tOPR period is needed
before the device is operational after a Warm RESET. Figure 67 shows the timing of the Power-up
and Warm RESET.
I/O Pin, Register and PLD Status at RESET
Table 102 shows the I/O pin, register and PLD status during Power-on RESET, Warm RESET, and
Power-down Mode. PLD outputs are always valid
during Warm RESET, and they are valid in Poweron RESET once the internal Configuration bits are
loaded. This loading is completed typically long
before the VCC ramps up to operating level. Once
the PLD is active, the state of the outputs are determined by the PLD equations.
Figure 67. Reset (RESET) Timing
VCC(min)
VCC
tNLNH-PO
Power-On Reset
tOPR
tNLNH
tOPR
Warm Reset
RESET
AI07437
Table 102. Status During Power-on RESET, Warm RESET and Power-down Mode
Port Configuration
Power-on RESET
Warm RESET
Power-down Mode
MCU I/O
Input mode
Input mode
Unchanged
PLD Output
Valid after internal PSD
configuration bits are
loaded
Valid
Depends on inputs to PLD
(addresses are blocked in
PD Mode)
Address Out
Tri-stated
Tri-stated
Not defined
Peripheral I/O
Tri-stated
Tri-stated
Tri-stated
Register
Power-on RESET
Warm RESET
Power-down Mode
PMMR0 and PMMR2
Cleared to '0'
Unchanged
Unchanged
Macrocells flip-flop status
Cleared to '0' by internal
Power-on RESET
Depends on .re and .pr
equations
Depends on .re and .pr
equations
VM Register(1)
Initialized, based on the
selection in PSDsoft
Configuration menu
Initialized, based on the
selection in PSDsoft
Configuration menu
Unchanged
All other registers
Cleared to '0'
Cleared to '0'
Unchanged
Note: 1. The SR_cod and PeriphMode Bits in the VM Register are always cleared to '0' on Power-on RESET or Warm RESET.
126/163
uPSD3212A, uPSD3212C, uPSD3212CV
PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE
The JTAG Serial Interface pins (TMS, TCK, TDI,
TDO) are dedicated pins on Port C (see Table
103). All memory blocks (primary and secondary
Flash memory), PLD logic, and PSD MODULE
Configuration Register Bits may be programmed
through the JTAG Serial Interface block. A blank
device can be mounted on a printed circuit board
and programmed using JTAG.
The standard JTAG signals (IEEE 1149.1) are
TMS, TCK, TDI, and TDO. Two additional signals,
TSTAT and TERR, are optional JTAG extensions
used to speed up Program and Erase cycles.
By default, on a blank device (as shipped from the
factory or after erasure), four pins on Port C are
the basic JTAG signals TMS, TCK, TDI, and TDO.
Standard JTAG Signals
At power-up, the standard JTAG pins are inputs,
waiting for a JTAG serial command from an external JTAG controller device (such as FlashLINK or
Automated Test Equipment). When the enabling
command is received, TDO becomes an output
and the JTAG channel is fully functional. The
same command that enables the JTAG channel
may optionally enable the two additional JTAG signals, TSTAT and TERR.
The RESET input to the uPS3200 should be active
during JTAG programming. The active RESET
puts the MCU module into RESET Mode while the
PSD Module is being programmed. See Application Note AN1153 for more details on JTAG InSystem Programming (ISP).
The uPSD321x Devices supports JTAG In-System-Configuration (ISC) commands, but not
Boundary Scan. The PSDsoft Express software
tool and FlashLINK JTAG programming cable implement the JTAG In-System-Configuration (ISC)
commands.
Table 103. JTAG Port Signals
Port C Pin
JTAG Signals
Description
JTAG Extensions
TSTAT and TERR are two JTAG extension signals
enabled by an “ISC_ENABLE” command received
over the four standard JTAG signals (TMS, TCK,
TDI, and TDO). They are used to speed Program
and Erase cycles by indicating status on uPDS
signals instead of having to scan the status out serially using the standard JTAG channel. See Application Note AN1153.
TERR indicates if an error has occurred when
erasing a sector or programming a byte in Flash
memory. This signal goes Low (active) when an
Error condition occurs, and stays Low until an
“ISC_CLEAR” command is executed or a chip Reset (RESET) pulse is received after an
“ISC_DISABLE” command.
TSTAT behaves the same as Ready/Busy described in Ready/Busy (PC3), page 93. TSTAT is
High when the PSD MODULE device is in READ
Mode (primary and secondary Flash memory contents can be read). TSTAT is Low when Flash
memory Program or Erase cycles are in progress,
and also when data is being written to the secondary Flash memory.
TSTAT and TERR can be configured as “open
drain” type signals during an “ISC_ENABLE” command.
Security and Flash memory Protection
When the Security Bit is set, the device cannot be
read on a Device Programmer or through the
JTAG Port. When using the JTAG Port, only a Full
Chip Erase command is allowed.
All other Program, Erase and Verify commands
are blocked. Full Chip Erase returns the part to a
non-secured blank state. The Security Bit can be
set in PSDsoft Express Configuration.
All primary and secondary Flash memory sectors
can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft Express Configuration.
PC0
TMS
Mode Select
INITIAL DELIVERY STATE
PC1
TCK
Clock
PC3
TSTAT
Status (optional)
PC4
TERR
Error Flag (optional)
PC5
TDI
Serial Data In
PC6
TDO
Serial Data Out
When delivered from ST, the uPSD321x Devices
have all bits in the memory and PLDs set to '1.'
The code, configuration, and PLD logic are loaded
using the programming procedure. Information for
programming the device is available directly from
ST. Please contact your local sales representative.
127/163
uPSD3212A, uPSD3212C, uPSD3212CV
AC/DC PARAMETERS
The following are issues concerning the parameters presented:
– In the DC specification the supply current is
given for different modes of operation.
– The AC power component gives the PLD,
Flash memory, and SRAM mA/MHz
specification. Figures 68 and 69 show the PLD
mA/MHz as a function of the number of
Product Terms (PT) used.
– In the PLD timing parameters, add the
required delay when Turbo Bit is '0.'
These tables describe the AD and DC parameters
of the uPSD321x Devices:
➜ DC Electrical Specification
➜ AC Timing Specification
■
PLD Timing
– Combinatorial Timing
– Synchronous Clock Mode
– Asynchronous Clock Mode
– Input Macrocell Timing
■
MCU Module Timing
– READ Timing
– WRITE Timing
– Power-down and RESET Timing
Figure 68. PLD ICC /Frequency Consumption (5V range)
110
VCC = 5V
100
)
00%
N (1
O
BO
TUR
90
FF
70
BO
TUR
O
O
60
RB
50
ON
(25%
)
TU
ICC – (mA)
80
40
30
20
O
RB
TU
10
F
OF
PT 100%
PT 25%
0
0
5
10
15
20
25
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
AI02894
Figure 69. PLD ICC /Frequency Consumption (3V range)
60
VCC = 3V
B
TUR
40
O
FF
30
TU
RB
O
ICC – (mA)
)
100%
N(
O O
50
20
O
TU R B
10
O
RB
TU
5
ON (2
%)
PT 100%
PT 25%
F
OF
0
0
5
10
15
20
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
128/163
25
AI03100
uPSD3212A, uPSD3212C, uPSD3212CV
Table 104. PSD MODULE Example, Typ. Power Calculation at VCC = 5.0V (Turbo Mode Off)
Conditions
MCU Clock Frequency
= 12MHz
Highest Composite PLD input frequency
(Freq PLD)
MCU ALE frequency (Freq ALE)
= 8MHz
= 2MHz
% Flash memory Access
= 80%
% SRAM access
= 15%
% I/O access
= 5% (no additional power above base)
Operational Modes
% Normal
= 40%
% Power-down Mode
= 60%
Number of product terms used
(from fitter report)
= 45 PT
% of total product terms
= 45/182 = 24.7%
Turbo Mode
= Off
Calculation (using typical values)
ICC total
= ICC(MCUactive) x %MCUactive + ICC(PSDactive) x %PSDactive + IPD(pwrdown) x %pwrdown
ICC(MCUactive)
= 20mA
IPD(pwrdown)
= 250µA
ICC(PSDactive)
= ICC(ac) + ICC(dc)
= %flash x 2.5mA/MHz x Freq ALE
+ %SRAM x 1.5mA/MHz x Freq ALE
+ % PLD x (from graph using Freq PLD)
= 0.8 x 2.5mA/MHz x 2MHz + 0.15 x 1.5mA/MHz x 2MHz + 24mA
= (4 + 0.45 + 24) mA
= 28.45mA
ICC total
= 20mA x 40% + 28.45mA x 40% + 250µA x 60%
= 8mA + 11.38mA + 150µA
= 19.53mA
This is the operating power with no Flash memory Erase or Program cycles in progress. Calculation is based on all I/O
pins being disconnected and IOUT = 0mA.
129/163
uPSD3212A, uPSD3212C, uPSD3212CV
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 105. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering (20 seconds max.)(1)
Min.
Max.
Unit
–65
125
°C
235
°C
VIO
Input and Output Voltage (Q = VOH or Hi-Z)
–0.5
6.5
V
VCC
Supply Voltage
–0.5
6.5
V
VPP
Device Programmer Supply Voltage
–0.5
14.0
V
–2000
2000
V
VESD
Electrostatic Discharge Voltage (Human Body Model) (2)
Note: 1. IPC/JEDEC J-STD-020A
2. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 Ω, R2=500 Ω)
130/163
uPSD3212A, uPSD3212C, uPSD3212CV
EMC CHARACTERISTICS
Susceptibility test are performed on a sample basis during product characterization.
Functional EMS (Electromagnetic
Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electromagnetic events
until a failure occurs (indicated by the LEDs).
ESD. Electro-Static Discharge (positive and negative) is applied on all pins of the device until a
functional disturbance occurs. This test conforms
with the IEC 1000-4-2 Standard.
FTB. A burst of Fast Transient voltage (positive
and negative) is applied to VDD and VSS through a
100pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
Standard.
A device reset allows normal operations to be resumed. The test results are given in Table 106,
based on the EMS levels and classes defined in
Application Note AN1709.
Designing Hardened Software To Avoid Noise
Problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Therefore, it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
the user’s application.
Software Recommendations. The
software
flowchart must include the management of ‘runaway’ conditions, such as:
– Corrupted program counter
– Unexpected reset
– Critical data corruption (e.g., control registers)
Prequalification trials. Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a
low state on the RESET pin or the oscillator pins
for 1 second.
To complete these trials, ESD stress can be applied directly on the device over the range of specification values. When unexpected behavior is
detected, the software can be hardened to prevent
unrecoverable errors occurring (see Application
Note AN1015).
Absolute Maximum Ratings (Electrical
Sensitivity)
Based on three different tests (ESD, LU, and DLU)
and using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity. For more
details, refer to the Application Note AN1181.
Electro-Static Discharge (ESD). Electro-Static
discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each
sample according to each pin combination. The
sample size depends on the number of supply pins
in the device (3 parts*(n+1) supply pin). The Human Body Model is simulated (see Table 107).
This test conforms to the JESD22-A114A Standard.
Table 106. EMS Test Results
Symbol
Parameter
Conditions
Level/
Class(1)
VFESD
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
VDD = 4V; TA = 25°C; fOSC = 40MHz;
WDT off conforms to IEC 1000-4-2
3C
Note: 1. Data based on characterization results, not tested in production.
Table 107. ESD Absolute Maximum Ratings
Symbol
VESD(HBM)
Parameter
Electro-static discharge voltage (Human
Body Model)
Conditions
Maximum Value(1)
Unit
TA = 25°C
2000
V
Note: 1. Data based on characterization results, not tested in production
131/163
uPSD3212A, uPSD3212C, uPSD3212CV
LU. 3 complementary static tests are required on
10 parts to assess the latch-up performance. A
supply overvoltage (applied to each power supply
pin) and a current injection (applied to each input,
output, and configurable I/O pin) are performed on
each sample. This test conforms to the EIA/JESD
78 IC Latch-up Standard (see Table 108). For
more details, refer to the Application Note,
AN1181.
DLU. Electro-static discharges (one positive then
one negative test) are applied to each pin of 3
samples when the micro is running to assess the
latch-up performance in dynamic mode. Power
supplies are set to the typical values, the oscillator
is connected as near as possible to the pins of the
micro, and the component is put in reset mode.
This test conforms to the IEC 1000-4-2 and
SAEJ1752/3 Standards (see Table 108). For more
details, refer to the Application Note, AN1181.
Table 108. Latch-up and Dynamic Latch-up Electrical Sensitivities
Symbol
LU
DLU
Parameter
Static Latch-up Class
Dynamic Latch-up Class
Conditions
Level/
Class(1)
TA = 25°C
A
VDD = 5V; TA = 25°C; fOSC = 40MHz
A
Note: 1. Class description: A Class is an STMicroelectronics internal specification. All of its limits are higher than the JEDEC specifications.
This means when a device belongs to “Class A,” it exceeds the JEDEC standard. “Class B” strictly covers all of the JEDEC criteria
(International standards).
132/163
uPSD3212A, uPSD3212C, uPSD3212CV
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 109. Operating Conditions (5V Devices)
Symbol
VCC
Parameter
Min.
Max.
Unit
Supply Voltage
4.5
5.5
V
Ambient Operating Temperature (Industrial)
–40
85
°C
0
70
°C
Min.
Max.
Unit
Supply Voltage
3.0
3.6
V
Ambient Operating Temperature (Industrial)
–40
85
°C
0
70
°C
TA
Ambient Operating Temperature (Commercial)
Table 110. Operating Conditions (3V Devices)
Symbol
VCC
Parameter
TA
Ambient Operating Temperature (Commercial)
Table 111. AC Signal Letter Symbols for
Signal Letters
Timing
Note: Example: tAVLX = Time from Address Valid to ALE Invalid.
A
Address
C
Clock
D
Input Data
I
Instruction
t
Time
L
ALE
L
Logic Level Low or ALE
N
RESET Input or Output
H
Logic Level High
P
PSEN signal
V
Valid
Q
Output Data
X
No Longer a Valid Logic Level
R
RD signal
Z
Float
W
WR signal
B
VSTBY Output
M
Output Macrocell
Table 112. AC Signal Behavior Symbols for
Timing
Signal Behavior
PW
Pulse Width
Note: Example: tAVLX = Time from Address Valid to ALE Invalid.
133/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 70. Switching Waveforms – Key
WAVEFORMS
INPUTS
OUTPUTS
STEADY INPUT
STEADY OUTPUT
MAY CHANGE FROM
HI TO LO
WILL BE CHANGING
FROM HI TO LO
MAY CHANGE FROM
LO TO HI
WILL BE CHANGING
LO TO HI
DON'T CARE
CHANGING, STATE
UNKNOWN
OUTPUTS ONLY
CENTER LINE IS
TRI-STATE
AI03102
134/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 113. Major Parameters
Parameters/Conditions/
Comments
5V Test
Conditions
5.0V Value
3.3V Test
Conditions
3.3V Value
Operating Voltage
–
4.5 to 5.5
–
3.0 to 3.6
V
Operating Temperature
–
–40 to 85
–
–40 to 85
°C
MCU Frequency
12MHz (min) for USB;
8MHz (min) for I2C
–
1 Min, 40 Max
–
24MHz MCU clock,
12MHz PLD input
frequency, 4MHz ALE
72
12MHz MCU clock,
6MHz PLD input
frequency, 2MHz ALE
21
mA
Idle Current, Typical
(CPU halted but some peripherals
active; 25°C operation; 45 PLD
product terms used; PLD Turbo
mode Off)
24MHz MCU clock,
12MHz PLD input
frequency
25
12MHz MCU clock,
1MHz PLD input
frequency
7
mA
Standby Current, Typical
(Power-down Mode, requires reset
to exit mode; without Low-Voltage
Detect (LVD) Supervisor)
180µA with LVD
110
100µA with LVD
60
µA
SRAM Backup Current, Typical
(If external battery is attached.)
–
0.5
–
0.5
µA
VOL = 0.25V (max);
VOH = 3.9V (min)
IOL = 8 (max);
IOH = –2 (min)
VOL = 0.15V (max);
VOH = 2.6V (min)
IOL = 4 (max);
IOH = –1 (min)
mA
PLD Macrocells
(For registered or combinatorial
logic)
–
16
–
16
–
PLD Inputs
(Inputs from pins, macrocell
feedback, or MCU addresses)
–
69
–
69
–
PLD Outputs
(Output to pins or internal
feedback)
–
16
–
16
–
PLD Propagation Delay, Typical
(PLD input to output, Turbo Mode)
–
15
–
22
ns
Active Current, Typical
(25°C operation; 80% Flash and
15% SRAM accesses, 45 PLD
product terms used; PLD Turbo
mode Off)
I/O Sink/Source Current
Ports A, B, C, and D
Unit
1 Min, 24 Max MHz
135/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 114. DC Characteristics (5V Devices)
Symbol
Parameter
Test Condition
(in addition to those
in Table
109., page 133)
Min.
VIH
Input High Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
4.5V < VCC < 5.5V
VIH1
Input High Voltage (Ports A, B,
C, D, 4[Bit 2])
VIL
VIL1
VOL
Max.
Unit
0.7VCC
VCC + 0.5
V
4.5V < VCC < 5.5V
2.0
VCC + 0.5
V
Input Low Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
4.5V < VCC < 5.5V
VSS – 0.5
0.3VCC
V
Input Low Voltage
(Ports A, B, C, D)
4.5V < VCC < 5.5V
–0.5
0.8
V
Input Low Voltage
(Port 4[Bit 2])
4.5V < VCC < 5.5V
VSS – 0.5
0.8
V
Output Low Voltage
(Ports A,B,C,D)
Typ.
IOL = 20µA
VCC = 4.5V
0.01
0.1
V
IOL = 8mA
VCC = 4.5V
0.25
0.45
V
VOL1
Output Low Voltage
(Ports 1,2,3,4, WR, RD)
IOL = 1.6mA
0.45
V
VOL2
Output Low Voltage
(Port 0, ALE, PSEN)
IOL = 3.2mA
0.45
V
VOH
Output High Voltage
(Ports A,B,C,D)
IOH = –20µA
VCC = 4.5V
4.4
4.49
V
IOH = –2mA
VCC = 4.5V
2.4
3.9
V
IOH = –80µA
2.4
V
IOH = –10µA
4.05
V
Output High Voltage (Port 0 in
ext. Bus Mode, ALE, PSEN)
IOH = –800µA
2.4
V
IOH = –80µA
4.05
V
VOH3
Output High Voltage VSTBYON
IOH = –1µA
VSTBY – 0.8
V
VLVR
Low Voltage RESET
0.1V hysteresis
3.75
VOP
XTAL Open Bias Voltage
(XTAL1, XTAL2)
IOL = 3.2mA
VLKO
VOH1
VOH2
Output High Voltage
(Ports 1,2,3,4, WR, RD)
4.25
V
2.0
3.0
V
VCC(min) for Flash Erase and
Program
2.5
4.2
V
VSTBY
SRAM (PSD) Standby Voltage
2.0
VCC – 0.2
V
VDF
SRAM (PSD) Data Retention
Voltage
IIL
Logic '0' Input Current
(Ports 1,2,3,4)
ITL
Logic 1-to-0 Transition Current
(Ports 1,2,3,4)
136/163
4.0
Only on VSTBY
2
VIN = 0.45V
(0V for Port 4[pin 2])
–10
–50
µA
VIN = 3.5V
(2.5V for Port 4[pin 2])
–65
–650
µA
V
uPSD3212A, uPSD3212C, uPSD3212CV
Symbol
Parameter
Test Condition
(in addition to those
in Table
109., page 133)
ISTBY
SRAM (PSD) Standby Current
(VSTBY input)
VCC = 0V
IIDLE
SRAM (PSD) Idle Current
(VSTBY input)
VCC > VSTBY
IRST
Reset Pin Pull-up Current
(RESET)
IFR
XTAL Feedback Resistor
Current (XTAL1)
ILI
Input Leakage Current
ILO
IPD
(1)
Typ.
Max.
Unit
0.5
1
µA
–0.1
0.1
µA
VIN = VSS
–10
–55
µA
XTAL1 = VCC
XTAL2 = VSS
–20
–50
µA
VSS < VIN < VCC
–1
1
µA
Output Leakage Current
0.45 < VOUT < VCC
–10
10
µA
250
µA
Power-down Mode
VCC = 5.5V
LVD logic disabled
LVD logic enabled
380
µA
20
30
mA
8
10
mA
30
38
mA
15
20
mA
40
62
mA
20
30
mA
Active (12MHz)
VCC = 5V
Idle (12MHz)
ICC_CPU(2,3,5)
Active (24MHz)
VCC = 5V
Idle (24MHz)
Active (40MHz)
VCC = 5V
Idle (40MHz)
PLD Only
ICC_PSD
(DC)(5)
Operating
Supply Current
Flash
memory
SRAM
PLD AC Base
ICC_PSD
(AC)(5)
Note: 1.
2.
3.
4.
5.
6.
7.
8.
9.
Min.
PLD_TURBO = Off,
f = 0MHz(4)
0
PLD_TURBO = On,
f = 0MHz
400
700
µA/PT
During Flash memory
WRITE/Erase Only
15
30
mA
Read only, f = 0MHz
0
0
mA
f = 0MHz
0
0
mA
µA/PT(5)
Note 4
Flash memory AC Adder
2.5
3.5
mA/
MHz
SRAM AC Adder
1.5
3.0
mA/
MHz
IPD (Power-down Mode) is measured with:
XTAL1=VSS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo Mode.
ICC_CPU (active mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all
other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA).
ICC_CPU (Idle Mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC– 0.5V, XTAL2 = not connected; Port 0 = VCC;
RESET=VCC; all other pins are disconnected.
See Figure 68., page 128 for the PLD current calculation.
I/O current = 0mA, all I/O pins are disconnected.
137/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 115. DC Characteristics (3V Devices)
Symbol
Parameter
Test Condition
(in addition to those
in Table
110., page 133)
Min.
VIH
Input High Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], A, B, C,
D, XTAL1, RESET)
3.0V < VCC < 3.6V
VIH1
Input High Voltage (Port 4[Bit
2])
VIL
VIL1
VOL
VOL1
VOL2
VOH
VOH1
VOH2
Max.
Unit
0.7VCC
VCC + 0.5
V
3.0V < VCC < 3.6V
2.0
VCC + 0.5
V
Input High Voltage (Ports 1, 2,
3, 4[Bits 7,6,5,4,3,1,0], XTAL1,
RESET)
3.0V < VCC < 3.6V
VSS – 0.5
0.3VCC
V
Input Low Voltage
(Ports A, B, C, D)
3.0V < VCC < 3.6V
–0.5
0.8
V
Input Low Voltage
(Port 4[Bit 2])
3.0V < VCC < 3.6V
VSS – 0.5
0.8
V
Output Low Voltage
(Ports A,B,C,D)
Output Low Voltage
(Ports 1,2,3,4, WR, RD)
Output Low Voltage
(Port 0, ALE, PSEN)
Output High Voltage
(Ports A,B,C,D)
Output High Voltage
(Ports 1,2,3,4, WR, RD)
Output High Voltage (Port 0 in
ext. Bus Mode, ALE, PSEN)
VOH3
Output High Voltage VSTBYON
VLVR
Low Voltage Reset
VOP
XTAL Open Bias Voltage
(XTAL1, XTAL2)
VLKO
Typ.
IOL = 20µA
VCC = 3.0V
0.01
0.1
V
IOL = 4mA
VCC = 3.0V
0.15
0.45
V
IOL = 1.6mA
0.45
V
IOL = 100µA
0.3
V
IOL = 3.2mA
0.45
V
IOL = 200µA
0.3
V
IOH = –20µA
VCC = 3.0V
2.9
2.99
V
IOH = –1mA
VCC = 3.0V
2.4
2.6
V
IOH = –20µA
2.0
V
IOH = –10µA
2.7
V
IOH = –800µA
2.0
V
IOH = –80µA
2.7
V
IOH = –1µA
VSTBY – 0.8
V
0.1V hysteresis
2.3
IOL = 3.2mA
2.7
V
1.0
2.0
V
VCC(min) for Flash Erase and
Program
1.5
2.2
V
VSTBY
SRAM (PSD) Standby Voltage
2.0
VCC – 0.2
V
VDF
SRAM (PSD) Data Retention
Voltage
IIL
138/163
Logic '0' Input Current
(Ports 1,2,3,4)
Only on VSTBY
2
VIN = 0.45V
(0V for Port 4[pin 2])
–1
2.5
V
–50
µA
uPSD3212A, uPSD3212C, uPSD3212CV
Symbol
Parameter
Test Condition
(in addition to those
in Table
110., page 133)
ITL
Logic 1-to-0 Transition Current
(Ports 1,2,3,4)
VIN = 3.5V
(2.5V for Port 4[pin 2])
ISTBY
SRAM (PSD) Standby Current
(VSTBY input)
VCC = 0V
IIDLE
SRAM (PSD) Idle Current
(VSTBY input)
VCC > VSTBY
IRST
Reset Pin Pull-up Current
(RESET)
IFR
XTAL Feedback Resistor
Current (XTAL1)
ILI
Input Leakage Current
ILO
IPD
(1)
Max.
Unit
–250
µA
1
µA
–0.1
0.1
µA
VIN = VSS
–10
–55
µA
XTAL1 = VCC
XTAL2 = VSS
–20
–50
µA
VSS < VIN < VCC
–1
1
µA
Output Leakage Current
0.45 < VOUT < VCC
–10
10
µA
VCC = 3.6V
LVD logic disabled
110
µA
Power-down Mode
LVD logic enabled
180
µA
8
10
mA
4
5
mA
15
20
mA
8
10
mA
Active (12MHz)
ICC_CPU(2,3,5)
VCC = 3.6V
Idle (12MHz)
Active (24MHz)
VCC = 3.6V
Idle (24MHz)
PLD Only
ICC_PSD
(DC)(5)
Operating
Supply Current
Flash
memory
SRAM
PLD AC Base
ICC_PSD
(AC)(5)
Note: 1.
2.
3.
4.
5.
6.
7.
8.
9.
Min.
–25
Typ.
0.5
PLD_TURBO = Off,
f = 0MHz(4)
0
PLD_TURBO = On,
f = 0MHz
200
400
µA/PT
During Flash memory
WRITE/Erase Only
10
25
mA
Read only, f = 0MHz
0
0
mA
f = 0MHz
0
0
mA
µA/PT(5)
Note 4
Flash memory AC Adder
1.5
2.0
mA/MHz
SRAM AC Adder
0.8
1.5
mA/MHz
IPD (Power-down Mode) is measured with:
XTAL1=VSS; XTAL2=not connected; RESET=VCC; Port 0 =VCC; all other pins are disconnected. PLD not in Turbo mode.
ICC_CPU (active mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC – 0.5V, XTAL2 = not connected; RESET=VSS; Port 0=VCC; all
other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (approximately 1mA).
ICC_CPU (Idle Mode) is measured with:
XTAL1 driven with tCLCH, tCHCL = 5ns, VIL = VSS+0.5V, VIH = VCC– 0.5V, XTAL2 = not connected; Port 0 = VCC;
RESET=VCC; all other pins are disconnected.
See Figure 68., page 128 for the PLD current calculation.
I/O current = 0mA, all I/O pins are disconnected.
139/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 71. External Program Memory READ Cycle
tLLPL
tLHLL
ALE
tAVLL
tPLPH
tLLIV
tPLIV
PSEN
tPXAV
tLLAX
tPXIZ
tAZPL
PORT 0
INSTR
IN
A0-A7
tAVIV
A0-A7
tPXIX
A8-A11
PORT 2
A8-A11
AI06848
Table 116. External Program Memory AC Characteristics (with the 5V MCU Module)
Symbol
Parameter(1)
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Unit
Max
tLHLL
ALE pulse width
35
2tCLCL – 15
ns
tAVLL
Address set up to ALE
10
tCLCL – 15
ns
tLLAX
Address hold after ALE
10
tCLCL – 15
ns
tLLIV
ALE Low to valid instruction in
tLLPL
ALE to PSEN
10
tCLCL – 15
ns
tPLPH
PSEN pulse width
60
3tCLCL – 15
ns
tPLIV
PSEN to valid instruction in
tPXIX
Input instruction hold after PSEN
tPXIZ(2)
Input instruction float after PSEN
tPXAV(2)
Address valid after PSEN
tAVIV
Address to valid instruction in
tAZPL
Address float to PSEN
4tCLCL – 45
55
3tCLCL – 45
30
0
0
tCLCL – 5
20
–5
–5
ns
ns
5tCLCL – 55
70
ns
ns
tCLCL – 10
15
ns
ns
ns
Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF;
CL for other outputs is 80pF
2. Interfacing the uPSD321x Devices to devices with float times up to 20ns is permissible. This limited bus contention does not cause
any damage to Port 0 drivers.
140/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 117. External Program Memory AC Characteristics (with the 3V MCU Module)
Symbol
(1)
24MHz Oscillator
Parameter
Min
Max
Variable Oscillator
1/tCLCL = 8 to 24MHz
Min
Unit
Max
tLHLL
ALE pulse width
43
2tCLCL – 40
ns
tAVLL
Address set up to ALE
17
tCLCL – 25
ns
tLLAX
Address hold after ALE
17
tCLCL – 25
ns
tLLIV
ALE Low to valid instruction in
tLLPL
ALE to PSEN
22
tCLCL – 20
ns
tPLPH
PSEN pulse width
95
3tCLCL – 30
ns
tPLIV
PSEN to valid instruction in
tPXIX
Input instruction hold after PSEN
tPXIZ(2)
Input instruction float after PSEN
tPXAV(2)
Address valid after PSEN
tAVIV
Address to valid instruction in
tAZPL
Address float to PSEN
4tCLCL – 87
80
3tCLCL – 65
60
0
0
tCLCL – 5
37
–10
–10
ns
ns
5tCLCL – 60
148
ns
ns
tCLCL – 10
32
ns
ns
ns
Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF,
for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
2. Interfacing the uPSD321x Devices to devices with float times up to 35ns is permissible. This limited bus contention does not cause
any damage to Port 0 drivers.
141/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 72. External Data Memory READ Cycle
ALE
tLHLL
tWHLH
PSEN
tLLDV
tLLWL
tRLRH
RD
tLLAX2
tRLAZ
A0-A7 from
RI or DPL
PORT 0
tRHDZ
tRLDV
tAVLL
tRHDX
DATA IN
A0-A7 from PCL
INSTR IN
tAVWL
tAVDV
PORT 2
P2.0 to P2.3 or A8-A11 from DPH
A8-A11 from PCH
AI07088
Table 118. External Clock Drive (with the 5V MCU Module)
Parameter(1)
Symbol
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Max
Unit
tRLRH
Oscillator period
25
41.7
ns
tWLWH
High time
10
tCLCL – tCLCX
ns
tLLAX2
Low time
10
tCLCL – tCLCX
ns
tRHDX
Rise time
10
ns
tRHDX
Fall time
10
ns
Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF;
CL for other outputs is 80pF
Table 119. External Clock Drive (with the 3V MCU Module)
Parameter(1)
Symbol
24MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 8 to 24MHz
Unit
Min
Max
41.7
125
ns
tRLRH
Oscillator period
tWLWH
High time
12
tCLCL – tCLCX
ns
tLLAX2
Low time
12
tCLCL – tCLCX
ns
tRHDX
Rise time
12
ns
tRHDX
Fall time
12
ns
Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF,
for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
142/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 73. External Data Memory WRITE Cycle
ALE
tLHLL
tWHLH
PSEN
tLLWL
tWLWH
WR
tLLAX
A0-A7 from
RI or DPL
PORT 0
tWHQX
tQVWX
tAVLL
tQVWH
DATA OUT
A0-A7 from PCL
INSTR IN
tAVWL
PORT 2
P2.0 to P2.3 or A8-A11 from DPH
A8-A11 from PCH
AI07089
Table 120. External Data Memory AC Characteristics (with the 5V MCU Module)
Symbol
Parameter(1)
40MHz Oscillator
Min
Max
Variable Oscillator
1/tCLCL = 24 to 40MHz
Min
Unit
Max
tRLRH
RD pulse width
120
6tCLCL – 30
ns
tWLWH
WR pulse width
120
6tCLCL – 30
ns
tLLAX2
Address hold after ALE
10
tCLCL – 15
ns
tRHDX
RD to valid data in
tRHDX
Data hold after RD
tRHDZ
Data float after RD
38
2tCLCL – 12
ns
tLLDV
ALE to valid data in
150
8tCLCL – 50
ns
tAVDV
Address to valid data in
150
9tCLCL – 75
ns
tLLWL
ALE to WR or RD
60
tCLCL + 15
ns
tAVWL
Address valid to WR or RD
70
tWHLH
WR or RD High to ALE High
10
tQVWX
Data valid to WR transition
5
tCLCL – 20
ns
tQVWH
Data set up before WR
125
7tCLCL – 50
ns
tWHQX
Data hold after WR
5
tCLCL – 20
ns
tRLAZ
Address float after RD
5tCLCL – 50
75
0
0
90
3tCLCL – 15
ns
4tCLCL – 30
40
0
tCLCL – 15
ns
ns
tCLCL + 15
0
ns
ns
Note: 1. Conditions (in addition to those in Table 109., page 133, VCC = 4.5 to 5.5V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF;
CL for other outputs is 80pF
143/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 121. External Data Memory AC Characteristics (with the 3V MCU Module)
Symbol
Parameter(1)
Variable Oscillator
1/tCLCL = 8 to 24MHz
24MHz Oscillator
Min
Max
Min
Unit
Max
tRLRH
RD pulse width
180
6tCLCL – 70
ns
tWLWH
WR pulse width
180
6tCLCL – 70
ns
tLLAX2
Address hold after ALE
56
2tCLCL – 27
ns
tRHDX
RD to valid data in
tRHDX
Data hold after RD
tRHDZ
Data float after RD
63
2tCLCL – 20
ns
tLLDV
ALE to valid data in
200
8tCLCL – 133
ns
tAVDV
Address to valid data in
220
9tCLCL – 155
ns
tLLWL
ALE to WR or RD
75
tCLCL + 50
ns
tAVWL
Address valid to WR or RD
67
tWHLH
WR or RD High to ALE High
17
tQVWX
Data valid to WR transition
5
tCLCL – 37
ns
tQVWH
Data set up before WR
170
7tCLCL – 122
ns
tWHQX
Data hold after WR
15
tCLCL – 27
ns
tRLAZ
Address float after RD
5tCLCL – 90
118
0
0
3tCLCL – 50
175
ns
4tCLCL – 97
tCLCL – 25
67
ns
ns
tCLCL + 25
0
0
ns
ns
Note: 1. Conditions (in addition to those in Table 110., page 133, VCC = 3.0 to 3.6V): VSS = 0V; CL for Port 0, ALE and PSEN output is 100pF,
for 5V devices, and 50pF for 3V devices; CL for other outputs is 80pF, for 5V devices, and 50pF for 3V devices)
Table 122. A/D Analog Specification
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
AVREF
Analog Power Supply Input
Voltage Range
VSS
VCC
V
VAN
Analog Input Voltage Range
VSS – 0.3
AVREF + 0.3
V
IAVDD
Current Following between VCC
and VSS
200
µA
CAIN
Overall Accuracy
±2
l.s.b.
NNLE
Non-Linearity Error
±2
l.s.b.
NDNLE
Differential Non-Linearity Error
±2
l.s.b.
NZOE
Zero-Offset Error
±2
l.s.b.
NFSE
Full Scale Error
±2
l.s.b.
NGE
Gain Error
±2
l.s.b.
20
µs
TCONV
144/163
Conversion Time
at 8MHz clock
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 74. Input to Output Disable / Enable
INPUT
tER
tEA
INPUT TO
OUTPUT
ENABLE/DISABLE
AI02863
Table 123. CPLD Combinatorial Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Slew
rate(1)
Unit
+2
+ 10
–2
ns
tPD(2)
CPLD Input Pin/Feedback to
CPLD Combinatorial Output
20
tEA
CPLD Input to CPLD Output
Enable
21
+ 10
–2
ns
tER
CPLD Input to CPLD Output
Disable
21
+ 10
–2
ns
tARP
CPLD Register Clear or Preset
Delay
21
+ 10
–2
ns
tARPW
CPLD Register Clear or Preset
Pulse Width
tARD
CPLD Array Delay
10
Any
macrocell
+ 10
11
ns
+2
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount
2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial
output (80-pin package only)
Table 124. CPLD Combinatorial Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Slew
rate(1)
Unit
+4
+ 20
–6
ns
tPD(2)
CPLD Input Pin/Feedback to
CPLD Combinatorial Output
40
tEA
CPLD Input to CPLD Output
Enable
43
+ 20
–6
ns
tER
CPLD Input to CPLD Output
Disable
43
+ 20
–6
ns
tARP
CPLD Register Clear or
Preset Delay
40
+ 20
–6
ns
tARPW
CPLD Register Clear or
Preset Pulse Width
tARD
CPLD Array Delay
25
Any
macrocell
+ 20
25
+4
ns
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount
2. tPD for MCU address and control signals refers to delay from pins on Port 0, Port 2, RD WR, PSEN and ALE to CPLD combinatorial
output (80-pin package only)
145/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 75. Synchronous Clock Mode Timing – PLD
tCH
tCL
CLKIN
tS
tH
INPUT
tCO
REGISTERED
OUTPUT
AI02860
Table 125. CPLD Macrocell Synchronous Clock Mode Timing (5V Devices)
Symbol
Parameter
Maximum Frequency
External Feedback
fMAX
Maximum Frequency
Internal Feedback (fCNT)
Maximum Frequency
Pipelined Data
Conditions
Min
Max
PT
Aloc
Turbo
Off
Slew
rate(1)
Unit
1/(tS+tCO)
40.0
MHz
1/(tS+tCO–10)
66.6
MHz
1/(tCH+tCL)
83.3
MHz
tS
Input Setup Time
12
tH
Input Hold Time
0
ns
tCH
Clock High Time
Clock Input
6
ns
tCL
Clock Low Time
Clock Input
6
ns
tCO
Clock to Output Delay
Clock Input
13
tARD
CPLD Array Delay
Any
macrocell
11
tMIN
Minimum Clock Period(2)
tCH+tCL
+2
+ 10
–2
+2
12
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount.
2. CLKIN (PD1) tCLCL = tCH + tCL.
146/163
ns
ns
ns
ns
uPSD3212A, uPSD3212C, uPSD3212CV
Table 126. CPLD Macrocell Synchronous Clock Mode Timing (3V Devices)
Symbol
Parameter
Maximum Frequency
External Feedback
fMAX
Maximum Frequency
Internal Feedback (fCNT)
Maximum Frequency
Pipelined Data
Conditions
Min
Max
PT
Aloc
Turbo
Off
Slew
rate(1)
Unit
1/(tS+tCO)
22.2
MHz
1/(tS+tCO–10)
28.5
MHz
1/(tCH+tCL)
40.0
MHz
tS
Input Setup Time
20
tH
Input Hold Time
0
ns
tCH
Clock High Time
Clock Input
15
ns
tCL
Clock Low Time
Clock Input
10
ns
tCO
Clock to Output Delay
Clock Input
25
tARD
CPLD Array Delay
Any
macrocell
25
tMIN
Minimum Clock Period(2)
tCH+tCL
+4
+ 20
ns
–6
+4
ns
ns
25
ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD1. Decrement times by given amount.
2. CLKIN (PD1) tCLCL = tCH + tCL.
Figure 76. Asynchronous RESET / Preset
tARPW
RESET/PRESET
INPUT
tARP
REGISTER
OUTPUT
AI02864
Figure 77. Asynchronous Clock Mode Timing (Product Term Clock)
tCHA
tCLA
CLOCK
tSA
tHA
INPUT
tCOA
REGISTERED
OUTPUT
AI02859
147/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 127. CPLD Macrocell Asynchronous Clock Mode Timing (5V Devices)
Symbol
fMAXA
Slew
Rate
Maximum Frequency
External Feedback
1/(tSA+tCOA)
38.4
MHz
1/(tSA+tCOA–10)
62.5
MHz
1/(tCHA+tCLA)
71.4
MHz
Maximum Frequency
Pipelined Data
Max
Turbo
Off
Conditions
Maximum Frequency
Internal Feedback (fCNTA)
Min
PT
Aloc
Parameter
Unit
tSA
Input Setup Time
7
tHA
Input Hold Time
8
tCHA
Clock Input High Time
9
+ 10
ns
tCLA
Clock Input Low Time
9
+ 10
ns
tCOA
Clock to Output Delay
tARDA
CPLD Array Delay
tMINA
Minimum Clock Period
+2
1/fCNTA
ns
ns
21
Any macrocell
+ 10
11
+ 10
–2
+2
ns
ns
16
ns
Table 128. CPLD Macrocell Asynchronous Clock Mode Timing (3V Devices)
Symbol
fMAXA
Slew
Rate
Maximum Frequency
External Feedback
1/(tSA+tCOA)
21.7
MHz
1/(tSA+tCOA–10)
27.8
MHz
1/(tCHA+tCLA)
33.3
MHz
Maximum Frequency
Pipelined Data
Max
Turbo
Off
Conditions
Maximum Frequency
Internal Feedback (fCNTA)
Min
PT
Aloc
Parameter
Unit
tSA
Input Setup Time
10
tHA
Input Hold Time
12
tCHA
Clock High Time
17
+ 20
ns
tCLA
Clock Low Time
13
+ 20
ns
tCOA
Clock to Output Delay
tARD
CPLD Array Delay
tMINA
Minimum Clock Period
148/163
+4
1/fCNTA
25
36
ns
ns
36
Any macrocell
+ 20
+ 20
+4
–6
ns
ns
ns
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 78. Input Macrocell Timing (Product Term Clock)
t INH
t INL
PT CLOCK
t IS
t IH
INPUT
OUTPUT
t INO
AI03101
Table 129. Input Macrocell Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Unit
tIS
Input Setup Time
(Note 1)
0
tIH
Input Hold Time
(Note 1)
15
tINH
NIB Input High Time
(Note 1)
9
ns
tINL
NIB Input Low Time
(Note 1)
9
ns
tINO
NIB Input to Combinatorial Delay
(Note 1)
ns
+ 10
34
+2
+ 10
ns
ns
Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX.
Table 130. Input Macrocell Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Unit
tIS
Input Setup Time
(Note 1)
0
tIH
Input Hold Time
(Note 1)
25
tINH
NIB Input High Time
(Note 1)
12
ns
tINL
NIB Input Low Time
(Note 1)
12
ns
tINO
NIB Input to Combinatorial Delay
(Note 1)
ns
+ 20
46
+4
+ 20
ns
ns
Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to tAVLX and tLXAX.
149/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 131. Program, WRITE and Erase Times (5V Devices)
Symbol
Parameter
Min.
Flash Program
Typ.
8.5
Flash Bulk Erase(1) (pre-programmed)
3
Flash Bulk Erase (not pre-programmed)
5
tWHQV3
Sector Erase (pre-programmed)
1
tWHQV2
Sector Erase (not pre-programmed)
2.2
tWHQV1
Byte Program
14
Program / Erase Cycles (per Sector)
tWHWLO
tQ7VQV
Max.
s
30
s
s
30
s
s
150
100,000
Sector Erase Time-out
Unit
µs
cycles
100
(2)
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)
µs
30
ns
Max.
Unit
Note: 1. Programmed to all zero before erase.
2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
Table 132. Program, WRITE and Erase Times (3V Devices)
Symbol
Parameter
Min.
Flash Program
Typ.
8.5
Flash Bulk Erase(1) (pre-programmed)
3
Flash Bulk Erase (not pre-programmed)
5
tWHQV3
Sector Erase (pre-programmed)
1
tWHQV2
Sector Erase (not pre-programmed)
2.2
tWHQV1
Byte Program
14
Program / Erase Cycles (per Sector)
tWHWLO
tQ7VQV
30
Sector Erase Time-out
s
s
30
s
s
150
100,000
µs
cycles
100
(2)
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)
Note: 1. Programmed to all zero before erase.
2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
150/163
s
µs
30
ns
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 79. Peripheral I/O READ Timing
ALE
ADDRESS
A/D BUS
DATA VALID
tAVQV (PA)
tSLQV (PA)
CSI
tRLQV (PA)
tRHQZ (PA)
RD
tDVQV (PA)
DATA ON PORT A
AI06610
Table 133. Port A Peripheral Data Mode READ Timing (5V Devices)
Symbol
Parameter
tAVQV–PA
Address Valid to Data
Valid
tSLQV–PA
CSI Valid to Data Valid
tRLQV–PA
RD to Data Valid
tDVQV–PA
tRHQZ–PA
Conditions
Min
(Note 1)
Max
Turbo
Off
Unit
37
+ 10
ns
27
+ 10
ns
32
ns
Data In to Data Out Valid
22
ns
RD to Data High-Z
23
ns
(Note 2)
Note: 1. Any input used to select Port A Data Peripheral Mode.
2. Data is already stable on Port A.
Table 134. Port A Peripheral Data Mode READ Timing (3V Devices)
Symbol
Parameter
tAVQV–PA
Address Valid to Data Valid
tSLQV–PA
CSI Valid to Data Valid
tRLQV–PA
RD to Data Valid
tDVQV–PA
tRHQZ–PA
Conditions
(Note 1)
Min
Max
Turbo
Off
Unit
50
+ 20
ns
37
+ 20
ns
45
ns
Data In to Data Out Valid
38
ns
RD to Data High-Z
36
ns
(Note 2)
Note: 1. Any input used to select Port A Data Peripheral Mode.
2. Data is already stable on Port A.
151/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 80. Peripheral I/O WRITE Timing
ALE
A / D BUS
ADDRESS
DATA OUT
tWLQV
tWHQZ (PA)
(PA)
WR
tDVQV (PA)
PORT A
DATA OUT
AI06611
Table 135. Port A Peripheral Data Mode WRITE Timing (5V Devices)
Symbol
Parameter
tWLQV–PA
WR to Data Propagation Delay
tDVQV–PA
Data to Port A Data Propagation Delay
tWHQZ–PA
WR Invalid to Port A Tri-state
Conditions
Min
(Note 1)
Max
Unit
25
ns
22
ns
20
ns
Max
Unit
42
ns
38
ns
33
ns
Note: 1. Data stable on Port 0 pins to data on Port A.
Table 136. Port A Peripheral Data Mode WRITE Timing (3V Devices)
Symbol
Parameter
tWLQV–PA
WR to Data Propagation Delay
tDVQV–PA
Data to Port A Data Propagation Delay
tWHQZ–PA
WR Invalid to Port A Tri-state
Note: 1. Data stable on Port 0 pins to data on Port A.
152/163
Conditions
(Note 1)
Min
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 81. Reset (RESET) Timing
VCC
VCC(min)
tNLNH-PO
Power-On Reset
tOPR
tNLNH
tOPR
Warm Reset
RESET
AI07437
Table 137. Reset (RESET) Timing (5V Devices)
Symbol
Parameter
tNLNH
RESET Active Low Time(1)
tNLNH–PO
Power-on Reset Active Low Time
tOPR
RESET High to Operational Device
Conditions
Min
Max
Unit
150
ns
1
ms
120
ns
Max
Unit
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.
Table 138. Reset (RESET) Timing (3V Devices)
Symbol
Parameter
tNLNH
RESET Active Low Time(1)
tNLNH–PO
Power-on Reset Active Low Time
tOPR
RESET High to Operational Device
Conditions
Min
300
ns
1
ms
300
ns
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.
Table 139. VSTBYON Definitions Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tBVBH
VSTBY Detection to VSTBYON Output High
(Note 1)
20
µs
tBXBL
VSTBY Off Detection to VSTBYON Output
Low
(Note 1)
20
µs
Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms.
Table 140. VSTBYON Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tBVBH
VSTBY Detection to VSTBYON Output High
(Note 1)
20
µs
tBXBL
VSTBY Off Detection to VSTBYON Output
Low
(Note 1)
20
µs
Note: 1. VSTBYON timing is measured at VCC ramp rate of 2ms.
153/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 82. ISC Timing
t ISCCH
TCK
t ISCCL
t ISCPSU
t ISCPH
TDI/TMS
t ISCPZV
t ISCPCO
ISC OUTPUTS/TDO
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
Table 141. ISC Timing (5V Devices)
Symbol
Parameter
Conditions
Min
Max
Unit
20
MHz
tISCCF
Clock (TCK, PC1) Frequency (except for PLD)
(Note 1)
tISCCH
Clock (TCK, PC1) High Time (except for PLD)
(Note 1)
23
ns
tISCCL
Clock (TCK, PC1) Low Time (except for PLD)
(Note 1)
23
ns
tISCCFP
Clock (TCK, PC1) Frequency (PLD only)
(Note 2)
tISCCHP
Clock (TCK, PC1) High Time (PLD only)
(Note 2)
240
ns
tISCCLP
Clock (TCK, PC1) Low Time (PLD only)
(Note 2)
240
ns
tISCPSU
ISC Port Set Up Time
7
ns
tISCPH
ISC Port Hold Up Time
5
ns
tISCPCO
ISC Port Clock to Output
21
ns
tISCPZV
ISC Port High-Impedance to Valid Output
21
ns
tISCPVZ
ISC Port Valid Output to High-Impedance
21
ns
Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode.
2. For Program or Erase PLD only.
154/163
2
MHz
uPSD3212A, uPSD3212C, uPSD3212CV
Table 142. ISC Timing (3V Devices)
Symbol
Parameter
Conditions
Min
Max
Unit
12
MHz
tISCCF
Clock (TCK, PC1) Frequency (except for PLD)
(Note 1)
tISCCH
Clock (TCK, PC1) High Time (except for PLD)
(Note 1)
40
ns
tISCCL
Clock (TCK, PC1) Low Time (except for PLD)
(Note 1)
40
ns
tISCCFP
Clock (TCK, PC1) Frequency (PLD only)
(Note 2)
tISCCHP
Clock (TCK, PC1) High Time (PLD only)
(Note 2)
240
ns
tISCCLP
Clock (TCK, PC1) Low Time (PLD only)
(Note 2)
240
ns
tISCPSU
ISC Port Set Up Time
12
ns
tISCPH
ISC Port Hold Up Time
5
ns
tISCPCO
ISC Port Clock to Output
30
ns
tISCPZV
ISC Port High-Impedance to Valid Output
30
ns
tISCPVZ
ISC Port Valid Output to High-Impedance
30
ns
2
MHz
Note: 1. For non-PLD Programming, Erase or in ISC By-pass Mode.
2. For Program or Erase PLD only.
Figure 83. MCU Module AC Measurement I/O Waveform
VCC – 0.5V
0.2 VCC + 0.9V
Test Points
0.2 VCC – 0.1V
0.45V
AI06650
Note: AC inputs during testing are driven at VCC–0.5V for a logic '1,' and 0.45V for a logic '0.'
Timing measurements are made at VIH(min) for a logic '1,' and VIL(max) for a logic '0'
Figure 84. PSD MODULE AC Float I/O Waveform
VOH – 0.1V
VLOAD + 0.1V
Test Reference Points
VLOAD – 0.1V
0.2 VCC – 0.1V
VOL + 0.1V
AI06651
Note: For timing purposes, a Port pin is considered to be no longer floating when a 100mV change from load voltage occurs, and begins to
float when a 100mV change from the loaded VOH or VOL level occurs
IOL and IOH ≥ 20mA
155/163
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 85. External Clock Cycle
Figure 86. Recommended Oscillator Circuits
Note: C1, C2 = 30pF ± 10pF for crystals
For ceramic resonators, contact resonator manufacturer
Oscillation circuit is designed to be used either with a ceramic resonator or crystal oscillator. Since each crystal and ceramic resonator
have their own characteristics, the user should consult the crystal manufacturer for appropriate values of external components.
Figure 87. PSD MODULE AC Measurement I/O
Waveform
Figure 88. PSD MODULEAC Measurement
Load Circuit
2.01 V
195 Ω
3.0V
Test Point
1.5V
Device
Under Test
0V
CL = 30 pF
(Including Scope and
Jig Capacitance)
AI03103b
AI03104b
Table 143. Capacitance
Symbol
Parameter
Test Condition
Typ.(1)
Max.
Unit
CIN
Input Capacitance (for input pins)
VIN = 0V
4
6
pF
VOUT = 0V
8
12
COUT
Output Capacitance (for input/
output pins)
Note: Sampled only, not 100% tested.
1. Typical values are for TA = 25°C and nominal supply voltages.
156/163
pF
uPSD3212A, uPSD3212C, uPSD3212CV
PACKAGE MECHANICAL INFORMATION
Figure 89. TQFP52 – 52-lead Plastic Thin, Quad, Flat Package Outline
D
D1
D2
A2
e
E2 E1 E
Ne
b
N
1
A
Nd
CP
L1
c
QFP-A
A1
α
L
Note: Drawing is not to scale.
157/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 144. TQFP52 – 52-lead Plastic Thin, Quad, Flat Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A
–
–
1.75
–
–
0.069
A1
–
0.05
0.020
–
0.002
0.008
A2
–
1.25
1.55
–
0.049
0.061
b
–
0.02
0.04
–
0.007
0.016
c
–
0.07
0.23
–
0.002
0.009
D
12.00
–
–
0.473
–
–
D1
10.00
–
–
0.394
–
–
E
12.00
–
–
0.473
–
–
E1
10.00
–
–
0.394
–
–
e
0.65
–
–
0.026
–
–
L
–
0.45
0.75
–
0.018
0.030
L1
1.00
–
–
0.039
–
–
α
–
0°
7°
–
0°
7°
D2
E2
n
52
52
Nd
13
13
Ne
13
13
CP
158/163
–
–
0.10
–
–
0.004
uPSD3212A, uPSD3212C, uPSD3212CV
Figure 90. TQFP80 – 80-lead Plastic Thin, Quad, Flat Package Outline
D
D1
D2
A2
e
E2 E1 E
Ne
b
N
1
A
Nd
CP
L1
c
QFP-A
A1
α
L
Note: Drawing is not to scale.
159/163
uPSD3212A, uPSD3212C, uPSD3212CV
Table 145. TQFP80 – 80-lead Plastic Thin, Quad, Flat Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A
–
–
1.60
–
–
0.063
A1
–
0.05
0.15
–
0.002
0.006
A2
1.40
1.35
1.45
0.055
0.053
0.057
b
0.22
0.17
0.27
0.009
0.007
0.011
c
–
0.09
0.20
–
0.004
0.008
D
14.00
–
–
0.551
–
–
D1
12.00
–
–
0.472
–
–
D2
9.50
–
–
0.374
–
–
E
14.00
–
–
0.551
–
–
E1
12.00
–
–
0.472
–
–
E2
9.50
–
–
0.374
–
–
e
0.50
–
–
0.020
–
–
L
0.60
0.45
0.75
0.024
0.018
0.030
L1
1.00
–
–
0.039
–
–
α
3.5
0°
7°
3.5
0°
7°
n
80
80
Nd
20
20
Ne
20
20
CP
160/163
–
–
0.08
–
–
0.003
uPSD3212A, uPSD3212C, uPSD3212CV
PART NUMBERING
Table 146. Ordering Information Scheme
Example:
uPSD
3
2
1
2
C
V
– 24
U
6
T
Device Type
uPSD = Microcontroller PSD
Family
3 = 8032 core
PLD Size
2 = 16 Macrocells
SRAM Size
1 = 2K bytes
Main Flash Memory Size
2 = 64K bytes
IP Mix
A = USB, I2C, PWM, ADC, (2) UARTs
Supervisor (Reset Out, Reset In, LVD, WD)
C = I2C, PWM, ADC, (2) UARTs
Supervisor (Reset Out, Reset In, LVD, WD)
Operating Voltage
blank = VCC = 4.5 to 5.5V
V = VCC = 3.0 to 3.6V
Speed
–24 = 24MHz
–40 = 40MHz
Package
T = 52-pin TQFP
U = 80-pin TQFP
Temperature Range
6 = –40 to 85°C
Shipping Option
T = Tape and Reel Packing
For other options, or for more information on any aspect of this device, please contact the ST Sales Office
nearest you.
161/163
uPSD3212A, uPSD3212C, uPSD3212CV
REVISION HISTORY
Table 147. Document Revision History
Date
Version
18-Dec-2002
1.0
First Issue
04-Mar-03
1.1
Updates: port information (Table 30); interface information (Figure 30, Table 44); remove
programming guide; PSD Module information (Table 82); PLD information (Figure 55);
electrical characteristics (Table 114, 115, 131, 132)
02-Sep-03
1.2
Update references for Product Catalog
03-Feb-04
2.0
Reformatted; correct package dimensions (Table 145)
02-July-04
3.0
Reformatted; add EMC characteristics information (Table 106, 107, 108)
04-Nov-04
4.0
Updates per requested data brief changes (Figure 3, 4; Table 1, 2, 113)
03-Dec-04
5.0
Add USB feature to document (Figure 2, 3, 4, 15, 16, 18, 20, 40, 41, 42, 43, 44, 45; Table
1, 2, 15, 16, 18, 19, 21, 23, 24, 25, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73,
74, 75, 76, 77, 78, 79, 146)
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Revision Details
uPSD3212A, uPSD3212C, uPSD3212CV
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