VISHAY VJ1210A102

VJ OMD - C0G (NP0)
Vishay Vitramon
Surface Mount Multilayer Ceramic Chip Capacitor Solutions
for Boardflex Sensitive Applications
FEATURES
• Surface mountable. Precious metal technology,
wet build process
• OMD-Cap (Open Mode Design) reduce the risk
of shorts or low IR because of board flex cracks
RoHS
COMPLIANT
• High frequency filtering for switching power supplies
• Available with 100 % voltage condition,
process code “5H” is available for 630 V and lower. Contact
[email protected] for higher voltages
• Available with polymer termination for increase resistance
to board flex cracking
• Protective surface coating high voltage capacitors maybe
required to prevent surface arcing.
APPLICATIONS
• Input filter capacitors
• Output filter capacitors
• Snubber capacitors reduce MOSFET voltage spikes
• Lighting Ballasts
ELECTRICAL SPECIFICATIONS
Note: Electrical characteristics at + 25 °C unless otherwise stated.
Protective surface coating of high voltage capacitors maybe
required to prevent surface arcing.
Dielectric Withstanding Voltage (DWV):
Operating Temperature: - 55 °C to + 125 °C
This is the maximum voltage the capacitors are tested for a
Capacitance Range: 10 pF to 47 nF
1 to 5 second period and the charge/discharge current does
Voltage Rating: 50 Vdc to 3000 Vdc
not exceed 50 mA
Temperature Coefficient of Capacitance (TCC):
C0G: 0 ± 30 ppm/°C from - 55 °C to + 125 °C
500 Vdc: DWV at 200 % of rated voltage
≤ 200 Vdc: DWV at 250 % of rated voltage
630 Vdc: DWV at 150 % of rated voltage
Aging Rate: 0 % maximum per decade
Dissipation Factor:
0.1 % max. at 1.0 Vrms and 1 MHz for values ≤ 1000 pF
0.1 % max. at 1.0 Vrms and 1 kHz for values > 1000 pF
1000 Vdc: DWV at 150 % of rated voltage
1500 Vdc: DWV at 120 % of rated voltage
2000 Vdc: DWV at 120 % of rated voltage
3000 Vdc: DWV at 120 % of rated voltage
Insulation Resistance (IR):
At + 25 °C and rated voltage 100 000 MΩ minimum or
1000 ΩF, whichever is less
At + 125 °C and rated voltage 10 000 MΩ minimum or
100 ΩF, whichever is less
www.vishay.com
90
For technical questions, contact: [email protected]
Document Number: 45047
Revision: 20-Aug-08
VJ OMD - C0G (NP0)
Surface Mount Multilayer Ceramic Chip Capacitor Solutions Vishay Vitramon
for Boardflex Sensitive Applications
DIMENSIONS in inches [millimeters]
W
L
T
MAX.
P
PART
ORDERING
NUMBER
LENGTH (L)
MAXIMUM
THICKNESS
(T)
MINIMUM
MAXIMUM
VJ1206
0.126 ± 0.008
[3.20 ± 0.20]
0.063 ± 0.008
[1.60 ± 0.20]
0.067 [1.70]
0.010 [0.25]
0.028 [0.71]
VJ1210
0.126 ± 0.008
[3.20 ± 0.20]
0.098 ± 0.008
[2.50 ± 0.20]
0.067 [1.70]
0.010 [0.25]
0.028 [0.71]
VJ1808
0.180 ± 0.010
[4.57 ± 0.25]
0.080 ± 0.010
[2.03 ± 0.25]
0.086 [2.18]
0.010 [0.25]
0.030 [0.76]
VJ1812
0.177 ± 0.010
[4.50 ± 0.25]
0.126 ± 0.008
[3.20 ± 0.20]
0.086 [2.18]
0.010 [0.25]
0.030 [0.76]
VJ1825
0.177 ± 0.010
[4.50 ± 0.25]
0.252 ± 0.010
[6.40 ± 0.25]
0.086 [2.18]
0.010 [0.25]
0.030 [0.76]
VJ2220
0.220 ± 0.008
[5.59 ± 0.20]
0.200 ± 0.008
[5.08 ± 0.20]
0.086 [2.18]
0.010 [0.25]
0.030 [0.76]
VJ2225
0.220 ± 0.010
[5.59 ± 0.25]
0.250 ± 0.010
[6.35 ± 0.25]
0.086 [2.18]
0.010 [0.25]
0.030 [0.76]
WIDTH (W)
TERMINATION PAD (P)
ORDERING INFORMATION
VJ1206
A
CASE
DIELECTRIC
SIZE
101
J
CAPACITANCE CAPACITANCE
CODE
TOLERANCE
Expressed in
X
B
A
T
## (2)
TERMINATION
DC VOLTAGE
MARKING
PACKAGING
PROCESS
RATING (1)
F=±1%
X = Ni barrier
1210
picofarads (pF).
G=±2%
1808
The first two
H=±3%
1812
digits are
J=±5%
1825
significant, the
100 %Tin plate
matte finish
F = AgPd
B = Polymer
100 % Tinplate
matte finish
1206
A = C0G (NP0)
2220
third is a
2225
multiplier.
Example:
101= 100 pF
K = ± 10 %
M = ± 20 %
CODE
A = 50 V
A = Unmarked T = 7" Reels
4X = OMD Cap
B = 100 V
R = 11 1/4"
5H = OMD Cap
C = 200 V
Reels
100 % Voltage
E = 500 V
B = Bulk
condition
L = 630 V
W = Waffle
G = 1000 V
tray
R = 1500 V
F = 2000 V
H = 3000 V
Notes:
(1) DC voltage rating should not be exceeded in application
(2) Process code with 2 digits has to be added
• Polymer plus termination “B” termination part number code length dimensions positive tolerances (including bandwidth) above are allowed to
increase by the following amounts.
1206 and smaller case sizes: Length 0.002" (0.05 mm)
1210 and larger case sizes: Length 0.004" (0.1 mm)
Document Number: 45047
Revision: 20-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
91
VJ OMD - C0G (NP0)
Vishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitor Solutions
for Boardflex Sensitive Applications
OMD - C0G (NP0) CAPACITANCE RANGE
VJ1206 (1)
EIA CODE
VOLTAGE (Vdc)
CAP.
CODE
50
VJ1210 (1)
VJ1808 (1)
100 200 500 630 1000 1500 50 100 200 500 630 1000 1500 2000 50
100 200 500 630 1000 1500 2000 3000
CAP.
100
10 pF
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120
12 pF
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150
15 pF
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180
18 pF
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220
22 pF
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270
27 pF
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330
33 pF
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390
39 pF
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470
47 pF
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560
56 pF
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680
68 pF
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820
82 pF
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101
100 pF
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121
120 pF
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151
150 pF
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181
180 pF
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221
220 pF
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271
270 pF
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331
330 pF
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391
390 pF
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471
470 pF
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561
560 pF
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681
680 pF
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821
820 pF
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102
1000 pF
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122
1200 pF
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152
1500 pF
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182
1800 pF
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222
2200 pF
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272
2700 pF
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332
3300 pF
•
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392
3900 pF
•
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•
472
4700 pF
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562
5600 pF
•
682
6800 pF
•
822
8200 pF
•
103
0.010 µF
123
0.012 µF
153
0.015 µF
183
0.018 µF
223
0.022 µF
273
0.027 µF
333
0.033 µF
393
0.039 µF
473
0.047 µF
563
0.056 µF
683
0.068 µF
823
0.082 µF
104
0.1 µF
Note:
(1) See soldering recommendations within this data book, or visit www.vishay.com/doc?45034
www.vishay.com
92
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For technical questions, contact: [email protected]
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Document Number: 45047
Revision: 20-Aug-08
VJ OMD - C0G (NP0)
Surface Mount Multilayer Ceramic Chip Capacitor Solutions Vishay Vitramon
for Boardflex Sensitive Applications
OMD - C0G (NP0) CAPACITANCE RANGE
VJ1812 (1)
EIA CODE
VOLTAGE
(VDC)
CAP. CAP.
CODE
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
10 pF
12 pF
15 pF
18 pF
22 pF
27 pF
33 pF
39 pF
47 pF
56 pF
68 pF
82 pF
100 pF
120 pF
150 pF
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1000 pF
1200 pF
1500 pF
1800 pF
2200 pF
2700 pF
3300 pF
3900 pF
4700 pF
5600 pF
6800 pF
8200 pF
0.010 µF
0.012 µF
0.015 µF
0.018 µF
0.022 µF
0.027 µF
0.033 µF
0.039 µF
0.047 µF
0.056 µF
0.068 µF
0.082 µF
0.1 µF
VJ1825 (1)
VJ2220 (1)
VJ2225 (1)
50 100 200 500 630 1000 1500 2000 3000 50 100 200 500 630 1000 50 100 200 500 630 1000 50 100 200 500 630 1000
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Note:
(1) See soldering recommendations within this data book, or visitwww.vishay.com/doc?45034
Document Number: 45047
Revision: 20-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
93
VJ OMD - C0G (NP0)
Vishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitor Solutions
for Boardflex Sensitive Applications
OMD - C0G (NP0) CAPACITORS - TYPICAL PARAMETERS
MINIMUM INSULATION
RESISTANCE VS. TEMPERATURE
TEMPERATURE COEFFICIENT OF CAPACITANCE
10 000
1.5
INSULATION RESISTANCE
(Ω FARADS)
% CAPACITANCE CHANGE
2.0
1.0
0.5
0.0
- 0.5
NP0
- 1.0
- 1.5
- 2.0
1000
100
10
- 75 - 50
- 25
0
25
50
75
100 125
10
25
TEMPERATURE °C
AGING RATE - NP0
VOLTAGE COEFFICIENT OF CAPACITANCE - 1000 V RATED
0.2
30
% CAPACITANCE CHANGE
% CAPACITANCE CHANGE
100 125
TEMPERATURE °C
0.1
0.0
- 0.1
- 0.2
20
10
0
- 10
- 20
- 30
1
10
100
1000
10 000
0
100 200 300
HOURS
www.vishay.com
94
For technical questions, contact: [email protected]
400 500
600 700
800 900 1000
DC VOLTS APPLIED
Document Number: 45047
Revision: 20-Aug-08
VJ OMD - C0G (NP0)
Surface Mount Multilayer Ceramic Chip Capacitor Solutions Vishay Vitramon
for Boardflex Sensitive Applications
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create a
path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one end of
the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage - low
Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted capacitors
can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap series) reduce
the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the opposing electrode.
VJ OMD - Cap MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component.
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Components can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate.
STANDARD TERMINATION
OMD CAP PLUS POLYMER TERMINATION
Exposed Electrodes = Electrical short
No Exposed Electrodes = No Electrical short
BEND TEST RESULTS 2220 CASE SIZE
FAILED PERCENTAGE OF PARTS
100 %
Standard Termination
Polymer Termination
Log. (Standard Termination)
Log. (Polymer Termination)
90 %
80 %
70 %
60 %
50 %
40 %
30 %
20 %
10 %
0%
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
BOARD FLEXURE in mm
Document Number: 45047
Revision: 20-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
95
VJ OMD - C0G (NP0)
Vishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitor Solutions
for Boardflex Sensitive Applications
STANDARD PACKAGING QUANTITIES
(1)(2)(3)
7" REEL
QUANTITIES
11 1/4" AND 13" REEL
QUANTITIES
BULK QUANTITIES
BODY
SIZE
TAPE
SIZE
PAPER TAPE
PACKAGING
CODE “C”
PLASTIC TAPE
PACKAGING
CODE “T”
PAPER TAPE
PACKAGING
CODE “P”
PLASTIC TAPE
PACKAGING
CODE “R”
VIAL
PACKAGING
CODE “B”
WAFFLE
PACKAGING
CODE “W”
1206
8 mm
N/a
3000
N/a
10 000
5000
N/a
1210
8 mm
N/a
3000
N/a
10 000
5000
N/a
1808
12 mm
N/a
3000
N/a
10 000
1000
N/a
1812
12 mm
N/a
1000
N/a
5000
1000
N/a
1825
12 mm
N/a
1000
N/a
5000
1000
1000
2220
12 mm
N/a
1000
N/a
5000
N/a
1000
2225
12 mm
N/a
1000
N/a
5000
N/a
1000
Notes:
(1) Vishay Vitramon uses embossed plastic carrier tape
(2)
REFERENCE: EIA Standard RS 481 - “Taping of Surfance Mount Components for Automatic Placement”
(3)
N/a = Not available
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For technical questions, contact: [email protected]
Document Number: 45047
Revision: 20-Aug-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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