FAIRCHILD FSA8009UMX

FSA8009
Audio Jack Send / End Detection with MIC / Video Switch
Description
Features
Accessory Plug-In
3- or 4-Pole Audio Jack
Send / End Key Pressed
Microphone & Video
2.5 to 4.3V
0.01% Typical
16kV
-40°C to 85°C
10-Lead UMLP
1.4x1.8x0.5mm, 0.4mm Pitch
KP
FSA8009UMX
Detection
Switch Type
VDD
THD (MIC)
ESD (Air Gap)
Operating Temperature
Package
Top Mark
Ordering Information
The FSA8009 is an audio jack microphone / video switch for
3- or 4-pole accessories with send / end (S/E) detection. In
addition to detection, the FSA8009 features an integrated
microphone / video switch that allows the processor to
configure the audio jack. The architecture is designed to
allow common third-party headphones to be used for
listening to music from mobile handsets, personal media
players, and portable peripheral devices.
 Determines When Send / End Button Key is Pressed
 Integrates a MIC / Video Switch for 4-Pole Configuration
 Reduces Pop / Click Caused by Microphone Bias
Related Resources
 For samples and questions, please contact:
Applications
[email protected]
 FSA8009 Demonstration Board
 3.5mm and 2.5mm Audio Jacks
 Cellular Phones, Smartphones
 MP3 and PMP
Typical Application
Baseband
Processor
VIO
GPIO
2.8V
VDD
10KΩ
TTL Level Input EN
REF
2 3 4
MIC
VID
J_MIC
CMIC
R SPKR
1
GND
16-32Ω
RMIC
MIC Bias
L SPKR
L R GND MIC
+
-
Audio
CODEC
MIC
Enable
Open Drain Output S/E
TTL Level Input SEL
16-32Ω
GPIO1
GPIO2
GPIO3
R_VDD
NC, S/E Key
VIO
Applications
Processor
Video Out
Figure 1. Mobile Phone Example
© 2010 Fairchild Semiconductor Corporation
FSA8009 • Rev. 1.0.1
www.fairchildsemi.com
FSA8009 – Audio Jack Send / End Detection with MIC / Video Switch
March 2012
FSA8009 – Audio Jack Send / End Detection with MIC / Video Switch
Physical Dimensions
1.40
0.15 C
A
1.70
B
2X
(9X)
0.563
0.663
1
2.10
1.80
PIN#1 IDENT
0.40
0.15 C
TOP VIEW
0.10 C
0.55 MAX.
(10X) 0.225
2X
RECOMMENDED
LAND PATTERN
0.152
1.45
0.08 C
0.55
SEATING C
PLANE
0.05
SIDE VIEW
9X
0.45
0.40
1.85
0.35
(9X)
0.45
3
(10X) 0.225
6
DETAIL A
OPTIONAL MINIMIAL
TOE LAND PATTERN
0.40
1
NOTES:
PIN#1 IDENT
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP10Arev3.
0.15
(10X)
0.25
10
BOTTOM VIEW
0.55
0.45
0.10 C A B
0.05 C
0.10
0.10
0.10
DETAIL A
SCALE : 2X
PACKAGE
EDGE
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
Figure 3. 10-Lead UMLP Package Drawing
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part Number
Operating Temperature Range
Top Mark
FSA8009UMX
-40 to +85°C
KP
© 2010 Fairchild Semiconductor Corporation
FSA8009 • Rev. 1.0.1
Package
10-Lead 1.4 x 1.8 x 0.55mm, 0.4mm Pitch,
Ultrathin Molded Leadless Package (UMLP)
www.fairchildsemi.com
7
FSA8009 – Audio Jack Send / End Detection with MIC / Video Switch
© 2010 Fairchild Semiconductor Corporation
FSA8009 • Rev. 1.0.1
www.fairchildsemi.com
8