FAIRCHILD FSA8049

FSA8049
Audio Jack Detection and Configuration, MIC / GND
Cross Point Switch
Features
Description
Detection
Audio Plug GND & MIC Polarity
VDD
2.5 to 4.4V
THD (MIC)
0.002% Typical
ESD (IEC 61000-4-2)
(Air Gap)
15kV
Operating Temperature
-40°C to 85°C
9-Ball WLCSP 3x3 Array, 0.4mm
Terminal Pitch, 250µm Ball
Package
Top Mark
M3
Ordering Information
FSA8049UCX
Detects 3- or 4-pole audio accessories
Detects polarity of GND and MIC on 4-pole plugs
Automatically routes GND and MIC to audio jack terminals
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Related Resources
 For evaluation boards and questions, please contact:
Applications


The FSA8049 is an audio jack detection switch for 3- or
4-pole accessories. The FSA8049 detects the locations of
ground (GND) and microphone (MIC) poles on the audio
plug and automatically routes them to the appropriate
connections. This allows the end user to plug accessories,
such as headsets with different audio pole configurations,
into the mobile device and have them operate correctly.
[email protected]
Cellular Phones, Smart Phones
MP3 and Portable Multimedia Player
Typical Application
To Audio Plug
Detection Circuit
VDD
Baseband
Processor
GPIO
EN
Audio Jack
Oscillator &
Logic
Detection
LSPKR
CEXT
Audio
Sub System
RSPKR
Switch Enable
Timing
3Pole
4Pole
MIC Bias
RMIC
MIC
CMIC
GND/MIC1
MIC
GND/MIC2
5Ω
tOn/Off
Capacitor
100mΩ
GND
GNDA
Figure 1. Mobile Phone Example
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.1
www.fairchildsemi.com
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
April 2012
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Physical Dimensions
F
0.03 C
A
E
2X
0.40
B
A1
PIN A1
INDEX AREA
0.40
D
Ø0.20
Cu Pad
Ø0.30
Solder Mask
0.03 C
2X
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)
TOP VIEW
0.06 C
0.05 C
0.625
0.547
C
SEATING PLANE
D
0.378±0.018
E
0.208±0.021
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
Ø0.260±0.020
9X
0.40
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
C
B
A
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
(Y)±0.018
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F
1 2 3
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC009ABrev2
Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Ordering Information
Part
Number
FSA8049UCX
Operating
Top
Temperature
Mark
Range
-40 to +85°C
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.1
M3
Package
D
E
X
Y
9-Ball, Wafer-Level Chip-Scale Package
1.16mm 1.16mm 0.18mm 0.18mm
(WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball
www.fairchildsemi.com
7
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.1
www.fairchildsemi.com
8
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.1
www.fairchildsemi.com
9
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
© 2011 Fairchild Semiconductor Corporation
FSA8049 • Rev. 1.0.1
www.fairchildsemi.com
10