NCEPOWER NCE55H11

Pb Free Product
NCE55H11
http://www.ncepower.com
NCE N-Channel Enhancement Mode Power MOSFET
DESCRIPTION
The NCE55H11 uses advanced trench technology and
design to provide excellent RDS(ON) with low gate charge. It
can be used in a wide variety of applications.
GENERAL FEATURES
● VDS =55V,ID =110A
RDS(ON) < 7.5mΩ @ VGS=10V (Typ:5.5mΩ)
Schematic diagram
● High density cell design for ultra low Rdson
● Fully characterized Avalanche voltage and current
● Good stability and uniformity with high EAS
● Excellent package for good heat dissipation
● Special process technology for high ESD capability
Application
●
Power switching application
●
Hard Switched and High Frequency Circuits
●
Uninterruptible Power Supply
Marking and pin Assignment
100% UIS TESTED!
100% ΔVds TESTED!
TO-220 top view
Package Marking And Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
NCE55H11
NCE55H11
TO-220
-
-
-
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Limit
Unit
55
V
±20
V
ID
110
A
ID (100℃)
80
A
Pulsed Drain Current
IDM
390
A
Maximum Power Dissipation
PD
200
W
1.33
W/℃
EAS
1100
mJ
TJ,TSTG
-55 To 175
℃
Drain Current-Continuous
Drain Current-Continuous(TC=100℃)
Derating factor
Single pulse avalanche energy (Note 5)
Operating Junction and Storage Temperature Range
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Thermal Characteristic
Thermal Resistance,Junction-to-Case(Note 2)
RθJC
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
0.75
Min
Typ
℃/W
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
55
V
Zero Gate Voltage Drain Current
IDSS
VDS=55V,VGS=0V
1
μA
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
±100
nA
Gate Threshold Voltage
VGS(th)
VDS=VGS,ID=250μA
3
4
V
Drain-Source On-State Resistance
RDS(ON)
VGS=10V, ID=40A
5.5
7.5
mΩ
gFS
VDS=25V,ID=40A
On Characteristics (Note 3)
Forward Transconductance
2
50
S
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS=25V,VGS=0V,
F=1.0MHz
3200
PF
780
PF
210
PF
15
nS
Switching Characteristics (Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=28V,ID=40A
100
nS
td(off)
VGS=10V,RGEN=4.5Ω
50
nS
62
nS
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=44V,ID=40A,
VGS=10V
76
140
nC
21
35
nC
30
50
nC
0.85
1.2
V
40
A
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
VGS=0V,IS=40A
Diode Forward Current (Note 2)
IS
Reverse Recovery Time
trr
TJ = 25°C, IF = 40A
65
100
nS
Reverse Recovery Charge
Qrr
di/dt = 100A/μs(Note3)
140
200
nC
Forward Turn-On Time
ton
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
5. EAS condition:Tj=25℃,VDD=28V,VG=10V,L=0.5mH,Rg=25Ω
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NCE55H11
Test circuit
1)EAS test Circuits
2)Gate charge test Circuit:
3)Switch Time Test Circuit:
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ID- Drain Current (A)
Normalized On-Resistance
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS (Curves)
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 4 Rdson-JunctionTemperature
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 1 Output Characteristics
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Figure 5 Gate Charge
Is- Reverse Drain Current (A)
Rdson On-Resistance(mΩ)
Vgs Gate-Source Voltage (V)
ID- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson- Drain Current
Wuxi NCE Power Semiconductor Co., Ltd
Figure 6 Source- Drain Diode Forward
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NCE55H11
C Capacitance (pF)
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TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 9
BVDSS vs Junction Temperature
ID- Drain Current (A)
Figure 7 Capacitance vs Vds
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Safe Operation Area
Figure 10
VGS(th) vs Junction Temperatur
r(t),Normalized Effective
Transient Thermal Impedance
Figure 8
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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NCE55H11
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TO-220-3L Package Information
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
4.470
4.670
0.176
0.184
A1
2.520
2.820
0.099
0.111
b
0.710
0.910
0.028
0.036
b1
1.170
1.370
0.046
0.054
c
0.330
0.650
0.013
0.026
c1
1.200
1.400
0.047
0.055
D
10.010
10.350
0.394
0.407
E
8.500
8.900
0.335
0.350
E1
12.060
12.460
0.475
0.491
2.540(TYP.)
e
0.100(TYP.)
e1
4.980
5.180
0.196
0.204
F
2.590
2.890
0.102
0.114
H
8.440 REF.
0.332 REF.
h
0.000
0.300
0.000
0.012
L
13.400
13.800
0.528
0.543
L1
3.560
3.960
0.140
0.156
V
6.360 REF.
0.250 REF.
I
6.300 REF.
0.248 REF.
Φ
3.735
Wuxi NCE Power Semiconductor Co., Ltd
3.935
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0.155
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NCE55H11
ATTENTION:
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Any and all NCE power products described or contained herein do not have specifications that can handle applications that
require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult
with your NCE power representative nearest you before using any NCE power products described or contained herein in
such applications.
NCE power assumes no responsibility for equipment failures that result from using products at values
that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters)
listed in products specifications of any and all NCE power products described or contained herein.
Specifications of any and all NCE power products described or contained herein stipulate the performance, characteristics,
and functions of the described products in the independent state, and are not guarantees of the performance, characteristics,
and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states
that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’s products or equipment.
NCE power Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could
cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or
events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe
design, redundant design, and structural design.
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Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. NCE power believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the NCE power
product that you intend to use.
This catalog provides information as of Sep.2010. Specifications and information herein are subject to change without notice.
Wuxi NCE Power Semiconductor Co., Ltd
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