STMICROELECTRONICS SPBT2563C1

SPBT2563C1
Bluetooth™ class 1 module
Preliminary Data
Features
■
BluetoothTM specification compliant V2.0
■
Output power class 1 ( 20 dBm max)
■
Transmission rate up to 721 Kbps in BR
■
Point-to-point, point-to-multi-point (up to 7
slaves) and scatternet capability
■
Asynchronous Connection Oriented (ACL)
logical transport link
■
Synchronous Connection Oriented link: 2
simultaneous SCO channels capability
Order code
■
Pitch-Period Error Concealment (PPEC)
improves speech quality in the vicinity of
interference like e.g. WLAN
■
■
Extended SCO (eSCO) links
■
Packet types supported:
– ACL: DM1, DM3, DM5, DH1, DH3, DH5
– SCO: HV1, HV3 and DV
– eSCO: EV3, EV4, EV5
SPBT2563C1, class 1 radio module is highly
integrated for easy implementation in embedded
applications. Class 1 module enables wireless
communication with other Bluetooth enabled
devices up to 100 m away. The SPBT2563C1
integrates on a unique FR4 PCB support: BT 2.0
radio, 32.768 kHz and 26 MHz oscillators, Vreg as
well as PA function. The antenna has not been
included in order to grant a degree of freedom to
the user in selecting the most suitable design and
placement between external and integrated
antenna that could be SMA aerial or a low cost
antenna trace designed on PCB. The module is
based on the ST Bluetooth Transceiver
STLC2500C and can be interfaced by the host
processor by means of a UART or SPI line
(selectable by a pin) for HCI transport, and PCM
for voice. SPBT2563C1 module implements an
add-on feature perfectly fitting in systems
equipped with host processor capable to manage
upper and lower Bluetooth stack layers, including
profiles. ST Bluetooth SPBT2563 series is
specifically targeting all those applications
requiring Bluetooth devices integrating up to HCI
level. Conformance testing through Bluetooth
qualification program enables a fast time to
market after system integration, by ensuring a
high degree of compliance and interoperability.
Description
Adaptive Frequency Hopping (AFH): hopping
kernel, channel assessment as master and as
slave
■
Efficient and flexible support for WLAN
coexistence in collocated scenario
■
Communication interfaces:
– Fast UART up to 4 Mbit/s
– SPI interface
– PCM interface
■
Memory organization:
– On chip RAM, including provision for
patches
– On chip ROM, preloaded with FW up to
HCI
■
3.3 V single supply voltage
■
No external oscillator required
■
Integrated voltage regulator with Inhibit
function.
■
Module size: 17 x 29 mm
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November 2007
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SPBT2563C1
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Rev 1
This is preliminary information on a new product now in development or undergoing evaluation.
Details are subject to change without notice.
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www.st.com
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Contents
SPBT2563C1
Contents
1
Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2
Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Bluetooth section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6
Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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8.1
Low-power improvements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8.2
Low power clock startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8.3
PCB layout of the antenna output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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SPBT2563C1
1
Certifications
Certifications
●
1.1
BQB qualified component, listed as STLC2563: BQB ID B012391
RoHS compliance
ST modules are RoHS complaint and being based on ST devices comply with ECOPACK®
norms implemented by ST.
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Block diagram
2
SPBT2563C1
Block diagram
Figure 1.
Block diagram
Inhibit
VCC
Supply voltage
regulator
PCM
ANT
SW
PA
STLC2500C
UART/ SPI
UART/SPI SEL
RESET
32.768
Xtal
26 Mhz
oscillator
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32.768 kHz
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SPBT2563C1
Maximum ratings
3
Maximum ratings
3.1
Absolute maximum ratings
Table 1.
Absolute maximum ratings
Values
Symbol
Parameter
Unit
Min
VCC
Module supply voltage
VIN
Input voltage on any digital pin
TSTG
H
Tsold
3.2
Max
4
V
Vss - 0.3 Vcc + 0.3
Storage temperature
Humidity (Not condensing)
V
-40
+85
°C
0
95
%
250
°C
Soldering temperature < 10s
Operating ranges
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Operating ranges define the limits for functional operation and parametrics characteristics of
the module.
Functionality outside these limits is not implied
Table 2.
Symbol
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Operating ranges
Parameter
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Values
Conditions
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Unit
Min
Typ
Max
3.1
3.3
3.6
V
+70
°C
VCC
Module supply voltage
TSTG
Operating ambient
temperature
ITXBR
Total supply current in Tx
BR
Basic rate, DH1 173kbps
(master/slave)
46
mA
IRX
Total supply current in Rx
BR
Basic rate, DH1 173kbps
(master/slave)
33
mA
Idisable
Module disabled current.
Enable = L
1
µA
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(t s)
-20°C < T < 70°C
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DC I/O specification
4
SPBT2563C1
DC I/O specification
(Vdd = 3.3V, T = 25°C, unless otherwise specified)
Table 3.
DC input / output specification
Values
Symbol
Parameter
Conditions
Unit
Min
Low level input voltage
VIH
High level input voltage
VOL
Low level output voltage
VOH
High level output voltage
2.55
V
LP_CKH
32.768kHz out high level
output voltage
2.4
V
LP_CKL
32.768kHz out low level
output voltage
INH_L
Inhibit signal low level
INH_H
Inhibit signal high level
Inhibit input current
2.15
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V
2.85
V
0.15
V
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0.3
2
Vinh = 3.3V
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Max
VIL
Iinh
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38
V
0.15
V
Vcc
V
55
µA
SPBT2563C1
5
Bluetooth section
Bluetooth section
TA = 25 °C, VCC = 3.3 V (parameters are given at antenna pin)
Table 4.
Bluetooth parameters
Values
Symbol
Parameter
Conditions
Unit
Min
Pout-BR
RXsensBR
RXmax
Freq
Output power
Basic rate
Sensitivity
Basic rate, clean Tx
Max useable input level
Frequency range
Max
+16.5
18
dBm
-82
dBm
10
dBm
2402
2480
MHz
-75
+75
kHz
ÄF
Initial CF tolerance
|∆f-p1|
CFD 1 slot packet
15
25
kHz
|∆f-p3|
CFD 3 slot packet
15
40
kHz
|∆f-p5|
CFD 5 slot packet
15
|∆f/50us|
CFD rate
Hop
Hopping
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System clock
SYS_CK
System clock precision
System clock stability
LP_CK
Low power clock
25 °C
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-20 °C to 70°C
Low power clock accuracy
Z
Note:
Typ
(t s)
Antenna port impedance
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Tx and Rx
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40
kHz
20
kHz/µs
1600
hops/
sec
26
MHz
-10
+10
ppm
-20
+20
ppm
32.768
-200
kHz
+200
50
ppm
Ω
Details about Bluetooth features are available at www.st.com, out of the STLC2500C data
sheet.
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Pin settings
6
SPBT2563C1
Pin settings
Table 5.
Pin description
Pin N°
Name
I/O
Description
Power / GND/enable
12
VCC
-
2
GND
-
11
GND
-
3
Inhibit
I
DC power input 3.3 ± 0.3 V
Module inhibit pin , active low.
To be connected to VCC for module enabling ; if left open or
connected to GND the module is disabled
UART / SPI Interface / Selection
8
TXD
O
UART serial data output / SPI data out
5
RXD
I
UART serial data input / SPI data in
7
CTS
I
UART clear to send
6
RTS
O
UART request to send / SPI CSN
I
UART / SPI selection
When connected to VCC UART is selected
When connected to GND or left open , SPI is selected
17
UART / SPI
/ SPI CK
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PCM interface
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15
PCMIN
I
PCM data in
14
PCMOUT
O
PCM data output (tri-state capability)
13
PCMSYNC
I
PCM sync signal
16
PCMBCLK
I
PCM bit clock
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RF interface
1
G1
ANT
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ANT_GND
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G2
ANT_GND
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I/O Antenna interface, 50 Ω impedance
-
Antenna Ground
-
Antenna Ground
System control and clock interface
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4
RESET_N
I
Reset ( active low )
9
BT_WAKEUP
I
Wake-up signal to Bluetooth
10
HOST_WAKEUP
O
Wake-up signal to host
18
NC1
19
LP_CK_OUT
Spare signal (pin G7 of STLC2500C)
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LP clock out
The 32.768 kHz low power clock is available at this pin
WLAN/BT coexistence
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20
BT_PRIORITY
O
WLAN/BT coexistence function
21
WL_ACTIVE
I
WLAN/BT coexistence function
22
RF REQ1
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pin E6 of STLC2500C
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SPBT2563C1
7
Mechanical dimensions
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Figure 2.
Mechanical dimensions
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Application
SPBT2563C1
8
Application
8.1
Low-power improvements
In low power modes,due to the oscillators continuously runnig, the module current is
roughly 2.5 mA ( measured at pin 12).
This current consumption can be drastically improved by switching off the two oscillators
during low power phases.
This can be done by means of Inhibit function (pin 3) which act directly on the internal
power supply regulator ; in this mode the module is no more powered and the current
consumption becomes < 1 µA instead of 2.5mA.
8.2
Low power clock startup time
Due to 32.768 Khz oscillator stabilization , when the module is powered on or when
enabled ( Inhibit from Low to High state) a waiting time of at least 500ms must be
observed ( Reset signal could be kept Low for the waiting1 time or given after it).
8.3
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PCB layout of the antenna output
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The microstrip track connected to the antenna (pin 1) should respect a characteristic
impedance of 50 Ω. It should be verified particularly if some variations in the final project:
dielectric material, tolerances, layout changes.
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The RF ground island around the antenna is connected only to G1 and G2 pins of the
module. This ground island is isolated from other grounds. The ground plane at lower PCB
layer should also be isolated from other grounds.
Vias every 5 millimeters should connect together RF ground islands of each layer.
Figure 3.
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Layout of the RF track to antenna pin of SPBT2563C1
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Isolated RF GND
connected to G1 and G2
4
3
2
G2
1
G1
SPBT2563C1
9
Ordering information scheme
Ordering information scheme
Table 6.
Ordering information scheme
SPBT
2563
C1
Bluetooth modules
V 2.0 compliant
Class 1
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Revision history
10
SPBT2563C1
Revision history
Table 7.
Document revision history
Date
Revision
14-Nov-2007
1
Changes
First release
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SPBT2563C1
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