STMICROELECTRONICS STPS3045CFP

®
STPS3045CT/CG/CR/CP/CPI/CW/CFP
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
2 x 15 A
VRRM
45 V
Tj (max)
175 °C
VF
0.57 V
A1
K
A2
K
A2
A2
FEATURES AND BENEFITS
■
■
■
■
■
■
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
LOW THERMAL RESISTANCE
INSULATED PACKAGE: TOP-3I
Insulating voltage = 2500V RMS
Capacitance = 12pF
AVALANCHE CAPABILITY SPECIFIED
A1
A1
K
D2PAK
STPS3045CG
TO-220AB
STPS3045CT
A2
A1
DESCRIPTION
Dual center tap Schottky rectifier suited for
SwitchMode Power Supply and high frequency DC
to DC converters.
Packaged either in TO-220AB, TO-220FPAB,
D2PAK, I2PAK, TO-247, SOT93 or TOP-3I, this
device is especially intended for use in low voltage, high frequency inverters, free wheeling and
polarity protection applications.
A2
K
A1
Insulated
TOP-3I
STPS3045CPI
K
I2PAK
STPS3045CR
A2
A2
A1
SOT-93
STPS3045CP
K
K
A1
TO-247
STPS3045CW
A2
K
A1
TO-220FPAB
STPS3045CFP
July 2003 - Ed: 6E
1/9
STPS3045CT/CG/CR/CP/CPI/CW/CFP
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
RMS forward current
IF(AV)
Average forward
current
δ = 0.5
2
TO-220AB / D PAK /
I2PAK / SOT-93 / TO-247
Tc = 155°C
TO-220FPAB
Tc = 130°C
TOP-3I
Value
Unit
45
V
30
A
15
30
A
220
A
Per diode
Per device
Tc = 150°C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square
F = 1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
6000
W
-65 to +175
°C
175
°C
10000
V/µs
Tstg
Tj
Tj = 25°C
Storage temperature range
Maximum operating junction temperature *
dV/dt
Critical rate of rise of reverse voltage
1
dPtot
thermal runaway condition for a diode on its own heatsink
* :
<
dTj
Rth( j − a )
THERMAL RESISTANCES
Symbol
Rth(j-c)
Junction to case
Rth(c)
Parameter
2
2
Value
Unit
°C/W
TO-220AB / D PAK / I PAK
Per diode
Total
1.60
0.85
SOT-93 / TO-247
Per diode
Total
1.5
0.8
TO-220FPAB
Per diode
Total
4
3.2
TOP-3I
Per diode
Total
2.2
1.6
TO-220AB / D2PAK / I2PAK
SOT-93 / TO-247
Coupling
0.10
TO-220FPAB
Coupling
2.5
TOP-3I
Coupling
1.0
When the diodes 1 and 2 are used simultaneously:
∆ Tj (diode 1) = P (diode1) x Rth(j-c) (per diode) + P (diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (Per diode)
Symbol
Parameter
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Pulse test :
Forward voltage drop
Tj = 125°C
IF = 15 A
Tj = 25°C
IF = 30 A
Tj = 125°C
IF = 30 A
* tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.42 x IF(AV) + 0.01 IF2(RMS)
2/9
Typ.
Max.
Unit
200
µA
11
40
mA
0.5
0.57
V
VR = VRRM
Tj = 125°C
VF *
Min.
0.84
0.65
0.72
STPS3045CT/CG/CR/CP/CPI/CW/CFP
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
Fig. 2: Average current versus
temperature (δ = 0.5, per diode).
PF(AV)(W)
ambient
IF(AV)(A)
12
δ = 0.1
δ = 0.05
11
δ = 0.2
18
δ = 0.5
Rth(j-a)=Rth(j-c) (TO-220AB, I2PAK, D2PAK, SOT-93, TO-247)
16
10
14
δ=1
9
8
Rth(j-a)=Rth(j-c) (TO-220FPAB)
12
7
Rth(j-a)=Rth(j-c) (TOP-3I)
10
6
5
8
4
6
Rth(j-a)=15°C/W
T
T
3
4
2
1
δ=tp/T
IF(AV)(A)
2
tp
0
δ=tp/T
tp
Tamb(°C)
0
0
2
4
6
8
10
12
14
16
18
20
Fig. 3: Normalized avalanche power derating
versus pulse duration.
0
50
75
100
125
150
175
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
25
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
Fig. 5-1: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
25
50
75
100
125
150
Fig. 5-2: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
IM(A)
IM(A)
200
160
TO-220AB, I2PAK, D2PAK, SOT-93, TO-247
180
TOP-3I
140
160
120
140
100
120
100
80
TC=75°C
80
TC=100°C
60
40
TC=125°C
IM
t
20
40
20
δ=0.5
t(s)
0
1.E-03
TC=75°C
60
TC=100°C
TC=125°C
IM
t
δ=0.5
t(s)
0
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
3/9
STPS3045CT/CG/CR/CP/CPI/CW/CFP
Fig. 5-3: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
Fig. 6-1: Relative variation of thermal transient
impedance junction to case versus pulse duration.
IM(A)
Zth(j-c)/Rth(j-c)
120
1.0
TO-220FPAB
2
2
TO-220AB, I PAK, D PAK, SOT-93, TOP-3I, TO-247
0.9
100
0.8
0.7
80
δ = 0.5
TC=75°C
0.6
60
0.5
TC=100°C
40
TC=125°C
δ = 0.2
0.3
δ = 0.1
T
IM
20
0.4
0.2
Single pulse
t
δ=0.5
0.1
t(s)
tp(s)
δ=tp/T
0.0
0
1.E-03
1.E-02
1.E-01
1.E+00
Fig. 6-2: Relative variation of thermal transient
impedance junction to case versus pulse duration.
1.E-03
1.E-01
1.E+00
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
Zth(j-c)/Rth(j-c)
IR(µA)
1.0
1.E+05
TO-220FPAB
0.9
Tj=150°C
1.E+04
0.8
0.7
0.6
1.E-02
tp
Tj=125°C
Tj=100°C
1.E+03
Tj=75°C
δ = 0.5
0.5
1.E+02
Tj=50°C
0.4
0.3
0.2
1.E+01
δ = 0.2
Tj=25°C
T
δ = 0.1
1.E+00
0.1
tp(s)
Single pulse
0.0
1.E-03
1.E-02
1.E-01
δ=tp/T
1.E+00
VR(V)
tp
1.E-01
0
1.E+01
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
5
10
15
20
25
30
35
40
45
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
C(nF)
1000
10000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=125°C
(maximum values)
100
Tj=125°C
(typical values)
1000
Tj=25°C
(maximum values)
10
VR(V)
VFM(V)
100
1
1
4/9
10
100
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
STPS3045CT/CG/CR/CP/CPI/CW/CFP
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
board FR4, Cu=35µm).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(cm²)
0
0
5
10
15
20
25
30
35
40
PACKAGE MECHANICAL DATA
TO-220AB
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
5/9
STPS3045CT/CG/CR/CP/CPI/CW/CFP
PACKAGE MECHANICAL DATA
I2PAK
REF.
DIMENSIONS
Millimeters
A
E
c2
L2
D
L1
A1
b2
L
b1
b
c
e
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
PACKAGE MECHANICAL DATA
TOP-3I (isolated)
DIMENSIONS
REF.
Millimeters
Min.
Max.
Min.
Typ.
Max.
A
4.4
4.6
0.173
0.181
B
1.45
1.55 0.057
0.061
C
14.35
15.60 0.565
0.614
D
0.5
0.7
0.020
0.028
E
2.7
2.9
0.106
0.114
F
15.8
16.5 0.622
0.650
G
20.4
21.1 0.815
0.831
H
15.1
15.5 0.594
0.610
J
5.4
5.65 0.213
0.222
K
3.4
3.65 0.134
0.144
L
4.08
4.17 0.161
0.164
P
1.20
1.40 0.047
0.055
R
6/9
Typ.
Inches
4.60
0.181
STPS3045CT/CG/CR/CP/CPI/CW/CFP
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
Min.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
Millimeters
V2
* FLAT ZONE NO LESS THAN 2mm
Max.
Inches
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
FOOTPRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/9
STPS3045CT/CG/CR/CP/CPI/CW/CFP
PACKAGE MECHANICAL DATA
TO-247
DIMENSIONS
V
REF.
Dia.
V
A
H
L5
L
L2 L4
F2
F1
L1
F3
V2
F4
D
L3
F(x3)
M
G
=
=
E
Millimeters
Inches
Min. Typ. Max. Min.
A
4.85
5.15 0.191
D
2.20
2.60 0.086
E
0.40
0.80 0.015
F
1.00
1.40 0.039
F1
3.00
F2
2.00
F3
2.00
2.40 0.078
F4
3.00
3.40 0.118
G
10.90
H
15.45
15.75 0.608
L
19.85
20.15 0.781
L1
3.70
4.30 0.145
L2
18.50
L3 14.20
14.80 0.559
L4
34.60
L5
5.50
M
2.00
3.00 0.078
V
5°
V2
60°
Dia. 3.55
3.65 0.139
Typ. Max.
0.203
0.102
0.031
0.055
0.118
0.078
0.094
0.133
0.429
0.620
0.793
0.169
0.728
0.582
1.362
0.216
0.118
5°
60°
0.143
PACKAGE MECHANICAL DATA
SOT-93
DIMENSIONS
REF.
Millimeters
Min.
A
4.70
C
1.90
Max.
Min.
Typ.
4.90 1.185
Max.
0.193
2.10 0.075
0.083
D
2.50
0.098
D1
2.00
0.078
E
0.50
0.78 0.020
0.031
F
1.10
1.30 0.043
0.051
F3
1.75
0.069
F4
2.10
0.083
G
10.80
11.10 0.425
0.437
H
14.70
15.20 0.279
0.598
L
12.20
0.480
L2
16.20
0.638
L3
L5
18.0
3.95
L6
O
8/9
Typ.
Inches
0.709
4.15 0.156
31.00
4.00
0.163
1.220
4.10 0.157
0.161
STPS3045CT/CG/CR/CP/CPI/CW/CFP
PACKAGE MECHANICAL DATA
TO-220FPAB
REF.
A
B
H
Dia
L6
L2
L7
L3
L5
D
F1
L4
F2
F
E
G1
G
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS3045CT
STPS3045CT
TO-220AB
2.23 g.
50
Tube
2
1.48 g.
50
Tube
2
1.48 g.
1000
Tape & reel
2
STPS3045CG
STPS3045CG-TR
■
■
■
■
■
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.018
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.205
2.4
2.7
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.205
9.8
10.6
0.386
0.417
2.9
3.6
0.114
0.142
15.9
16.4
0.626
0.646
9.00
9.30
0.354
0.366
3.00
3.20
0.118
0.126
STPS3045CG
STPS3045CG
D PAK
D PAK
STPS3045CR
STPS3045CR
I PAK
1.48 g
50
Tube
STPS3045CP
STPS3045CP
SOT-93
3.97 g.
30
Tube
STPS3045CPI
STPS3045CPI
TOP-3I
4.46 g.
120
Bulk
STPS3045CW
STPS3045CW
TO-247
4.46 g.
30
Tube
STPS3045CFP
STPS3045CFP TO-220FPAB
2.0 g.
50
Tube
Cooling method: by conduction (C)
Recommended torque value (SOT-93, TOP-3I, TO-247): 0.8 N.m.
Recommended torque value (TO-220AB): 0.55 N.m.
Maximum torque value (SOT-93, TOP-3I, TO-247): 1.0 N.m.
Maximum torque value (TO-220AB): 0.7 N.m.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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