FREESCALE MPXV7002DPT1

MPXV7002
Rev 1.0, 09/2008
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPXV7002
SERIES
INTEGRATED
PRESSURE SENSOR
-2 to 2 kPa (-0.3 to 0.3 psi)
0.5 to 4.5 V OUTPUT
The MPXV7002 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
SMALL OUTLINE PACKAGE
Features
•
•
•
•
•
•
•
2.5% Typical Error over +10°C to +60°C with Auto Zero
6.25% Maximum Error over +10°C to +60°C without Auto Zero
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over +10° to +60°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
MPXV7002GC6U
CASE 482A-01
Typical Applications
•
•
•
•
Hospital Beds
HVAC
Respiratory Systems
Process Control
MPXV7002GP
CASE 1369-01
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
ORDERING INFORMATION
Device
Type
Case
No.
MPX Series
Order No.
Packing
Options
Ported Gauge, Axial Port, SMT
Elements
Gauge, Axial Port, SMT
482A
MPXV7002GC6U
Rails
482A
MPXV7002GC6T1 Tape & MPXV7002G
Reel
Gauge, Side Port, SMT
1369
MPXV7002GP
Trays MPXV7002G
Differential, Dual Port,
SMT
1351
MPXV7002DP
Trays MPXV7002DP
Differential, Dual Port,
SMT
1351
MPXV7002DPT1
Options
Device
Marking
MPXV7002G
1
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Tape & MPXV7002DP
Reel
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
MPXV7002DP
CASE 1351-01
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005, 2008. All rights reserved.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
75
kPa
Storage Temperature
Tstg
–30 to +100
°C
Operating Temperature
TA
10 to +60
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
–2.0
—
2.0
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
—
10
mAdc
Offset(3)
Pressure
@ VS = 5.0 Volts
(10 to 60°C)
Voff
2.25
2.5
2.75
Vdc
Full Scale Output(4)
@ VS = 5.0 Volts
(10 to 60°C)
VFSO
4.25
4.5
4.75
Vdc
Full Scale Span(5)
@ VS = 5.0 Volts
(10 to 60°C)
VFSS
3.5
4.0
4.5 V
Vdc
Accuracy(6)
(10 to 60°C)
—
—
±2.5(7)
±6.25
%VFSS
V/P
—
1.0
—-
V/kPa
tR
—
1.0
—-
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—-
mAdc
Warm-Up Time(9)
—
—
20
—-
ms
Sensitivity
Response
Time(8)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to
25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can
affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the
device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum
temperature change of ± 5°C between auto zero and measurement.
8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
MPXV7002
2
Sensors
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPXV7002 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
Fluoro Silicone
Gel Die Coat
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
10° to 60°C using the decoupling circuit shown in Figure 3.
The output will saturate outside of the specified pressure
range.
Stainless
Steel Cap
Die
+5 V
P1
Thermoplastic
Case
Wire Bond
Vout
OUTPUT
Vs
Lead
Frame
IPS
1.0 μF
P2
GND
470 pF
Die Bond
Differential Sensing
Element
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
5.0
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Transfer Function:
Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
VS = 5.0 Vdc
TA = 10 to 60°C
4.0
Output Voltage (V)
0.01 μF
3.0
TYPICAL
MAX
2.0
MIN
1.0
0
-2
-1
0
1
2
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
MPXV7002
Sensors
Freescale Semiconductor
3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
Part Number
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPXV7002GC6U/GC6T1
482A-01
Vertical Port Attached
MPXV7002GP
1369-01
Side with Port Attached
MPXV7002DP
1351-01
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7002
4
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
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CASE 1351-01
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Sensors
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PACKAGE DIMENSIONS
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ISSUE A
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Sensors
Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
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MPXV7002
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Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
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MPXV7002
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9
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MPXV7002
Rev. 1.0
09/2008
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