IC595 Series Dual Inline Memory Module (DIMM, 184 & 240 pins) Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. –55°C to +170°C 10,000 insertions minimum 184 contact pins IC-595 - * - MF Series No. 1 = 184 Pins 2 = 240 Pins MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Card thickness 1.27mm í For 184 contact pins with 1.00mm pitch Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 162.70 ±0.1 122.00 ±0.2 122.0 ±0.1 32.00 ±0.2 1.00x45=45.00 ±0.2 1.00x45=45.00 ±0.2 1.00x45=45.00 ±0.1 Æ3.20 Thru hole 1.00x45=45.00 ±0.1 184-Æ0.80 Thru hole 1.00±0.05 + 0.1 0 8.00±0.05 1.00 ±0.15 1.00 ±0.1 108.00 + 0.2 0 153.70 ±0.4 4.80±0.05 13.00 11.50±0.1 17.00 32.0 ±0.1 1.00 ±0.05 Æ3.20 0 Thru hole + 0.1 162.70 ±0.2 171.70 ±0.4 Matching Module Dimensions 153.70 ref 128.00 ref 2.00±0.1 4.00±0.15 3.00 Section "A" w0.30 x t0.30 3.50 ±0.5 2.99±0.05 17.78 4.00 4.50 1.00x45=45.00 ±0.1 11.50 1.00x45=45.00 ±0.1 1.27±0.1 27.50 102.87 133.35±0.15 0 1.60 -0.1 R 0.80 0.80 2.30±0.1 34.10 11.00 6.00 15.48 ±0.1 3.00 Section "A" SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In B-5