NP396 Series (Open Top) Shrink Ball Grid Array (1.27mm Pitch) Specifications Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C –40°C to +170°C 13g per pin approx. Contact Force: 3.2 Kg Operationg Force: 10,000 insetions Mating Cycles: NP396 Materials and Finish Features Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel í Open top type sockets for BGA packages íCoverless shrink version í2-point Tweezer Contact System - 500 * Series No. No. of Contact Pins Design Number Outline Dimensions Recommended PC Board Layout Recommended PC Board Layout Arrays Top View from Socket SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In