Freescale Semiconductor Advance Information Document Number: MPC17510 Rev. 3.0, 1/2007 1.2 A 15 V H-Bridge Motor Driver IC 17510 The 17510 is a monolithic H-Bridge designed to be used in portable electronic applications such as digital and SLR cameras to control small DC motors. The 17510 can operate efficiently with supply voltages as low as 2.0 V to as high as 15 V. Its low RDS(ON) H-Bridge output MOSFETs (0.45 Ω typical) can provide continuous motor drive currents of 1.2 A and handle peak currents up to 3.8 A. It is easily interfaced to lowcost MCUs via parallel 5.0 V compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. This device contains an integrated charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry. The 17510 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). H-BRIDGE MOTOR DRIVER MTB SUFFIX EJ SUFFIX (Pb-FREE) 98ASH70455A 24-LEAD TSSOP ORDERING INFORMATION Features • • • • • • • • Device 2.0 V to 15 V Continuous Operation Output Current 1.2 A (DC), 3.8 A (Peak) 450 mΩ RDS(ON) H-Bridge MOSFETs 5.0 V TTL- / CMOS-Compatible Inputs PWM Frequencies up to 200 kHz Undervoltage Shutdown Cross-Conduction Suppression Pb-Free Packaging Designated by Suffix Code EJ Package -30°C to 65°C 24 TSSOPW MPC17510EJ/R2 MPC17510MTB MPC17510MTBEL 5.0 V 15 V 17510 VDD VM C1L GOUT C1H C2L C2H CRES OUT1 MCU Temperature Range (TA) EN GIN IN1 IN2 MOTOR OUT2 GND Figure 1. 17510 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2007. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM CRES 3 C2H C2L C1H C1L TOUT 14 13 11 12 15 Charge Pump 21 VM1 VDD 23 IN1 9 IN2 10 Low Voltage Detector Level Shifter Predriver 16 TINB 24 VM2 1 OUTA 5 OUTA' H-Bridge 17 OUTB' 18 OUTB Control Logic EN 8 6 LGND PGND1 19 PGND2 2 4 7 20 22 NC Figure 2. 17510 Simplified Internal Block Diagram 17510 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS OUT1 1 24 GIN LGND 2 23 VDD CRES 3 22 NC NC 4 21 VM OUT1 5 20 NC PGND 6 19 PGND NC 7 18 OUT2 VM 8 17 OUT2 IN1 9 16 EN IN2 10 15 GOUT C1H 11 14 C2H C1L 12 13 C2L Figure 3. 17510 Pin Connections Table 1. 17510 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 8. Pin Number Pin Name Formal Name Definition 1, 5 OUT1 Output 1 2 LGND Logic Ground 3 CRES Charge Pump Output Capacitor Connection 4, 7, 20, 22 NC No Connect 17, 18 OUT2 Output 2 6, 19 PGND Power Ground 8, 21 VM Motor Drive Power Supply 9 IN1 Input Control 1 Control signal input 1 pin. 10 IN2 Input Control 2 Control signal input 2 pin. 11 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole). 12 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole). 13 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole). 14 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole). 15 GOUT Gate Driver Output 16 EN Enable Control Enable control signal input pin. 23 VDD Logic Supply Control circuit power supply pin. 24 GIN Gate Driver Input Driver output 1 pins. Logic ground. Charge pump reservoir capacitor pin. No connection to these pins. Driver output 2 pins. Power ground. Motor power supply voltage input pins. Output gate driver signal to external MOSFET switch. LOW = True control signal for GOUT pin. 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Motor Supply Voltage Symbol Value Unit VM - 0.5 – - 16 V VCRES -0.5 to 13 V Logic Supply Voltage VDD -0.5 to 16 V Signal Input Voltage (EN, IN1, IN2, GIN) VIN -0.5 to VDD + 0.5 V IO 1.2 IOPK 3.8 Human Body Model VESD1 ±1900 Machine Model VESD2 ± 130 Storage Temperature TSTG -65 to 150 °C Operating Junction Temperature TJ -30 to 150 °C Operating Ambient Temperature TA -30 to 65 °C PD 1.0 W RθJA 120 °C/W TSOLDER 260 °C Charge Pump Output Voltage (1) Driver Output Current A Continuous Peak (2) ESD Voltage (3) Power Dissipation V (4) Thermal Resistance Soldering Temperature (5) Notes 1. When supplied externally, connect via 3.0 kΩ resistor. 2. TA = 25°C, 10 ms pulse at 200 ms interval. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 4. TA = 25°C, RθJA = 120°C/W, 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB). 5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 17510 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions TA = 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit Motor Supply Voltage VM 2.0 – 15 V Logic Supply Voltage VDD 4.0 – 5.5 V C1, C2, C3 0.001 – 0.1 µF POWER Capacitor for Charge Pump Standby Power Supply Current (6) Motor Supply Standby Current I Logic Supply Standby Current I VMSTBY – – 1.0 µA VDDSTBY – 0.3 1.0 mA I VDD – 3.3 4.0 mA VDDDET 1.5 2.5 3.5 VMDET 4.0 5.0 6.0 – 0.45 0.55 12 13 13.5 10 11.2 – V CRES 0.5 V CRES 0.1 LGND LGND + 0.1 VIN 0 – High-Level Input Voltage VIH VDD x 0.7 Low-Level Input Voltage VIL – High-Level Input Current IIH Low-Level Input Current Logic Supply Current (7) Low-Voltage Detection Circuit Detection Voltage (VDD) (8) Detection Voltage (VM) Driver Output ON Resistance (9) V Ω RDS(ON) VM = 2.0 V, 8.0 V, 15 V GATE DRIVE Gate Drive Voltage (10) VCRES No Current Load Gate Drive Ability (Internally Supplied) I V VCRESLOAD CRES = -1.0 mA V Gate Drive Output V IOUT = -50 µA VGOUTHIGH IIN = 50 µA VGOUTLOW V CRES LGND +0.5 CONTROL LOGIC Logic Input Voltage (EN, IN1, IN2, GIN) VDD V – – V – VDD x 0.3 V – – 1.0 µA IIL -1.0 – – µA IIL - 200 - 50 – µA Logic Input Function (4.0 V < VDD < 5.5 V) EN / GIN Pin Notes 6. Excluding pull-up resistor current, including current of gate-drive circuit. 7. fIN = 100 kHz. 8. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When the gate voltage VCRES is applied from an external source, VCRES = 7.5 V. 9. IO = 1.2 A source + sink. 10. Input logic signal not present. 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions TA = 25°C, VM = 15 V, VDD = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit fIN – – 200 kHz tR – – 1.0 µs tF – Turn-ON Time tPZH – 0.3 1.0 Turn-ON Time tPLH – 1.2 2.0 Turn-OFF Time tPHL – 0.5 1.0 Turn-ON Time tTON – – 10 Turn-OFF Time tTOFF – – 10 fOSC INPUT (EN, IN1, IN2, GIN) Pulse Input Frequency Input Pulse Rise Time (11) Input Pulse Fall Time (13) (12) – 1.0 µs (12) OUTPUT µs Propagation Delay Time GOUT Output Delay Time (14) µs Charge Pump Circuit Oscillator Frequency Rise Time (15) Low-Voltage Detection Time Notes 11. 12. 13. 14. 15. 100 200 400 kHz CRESON – 0.1 1.0 ms tVDDDET – – 10 ms tV Time is defined between 10% and 90%. That is, the input waveform slope must be steeper than this. Time is defined between 90% and 10%. Load is 500 pF. Time to charge CRES to 11 V after application of VDD. 17510 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS IN1, IN2, EN (GIN) VDDDETON 50% VDDDETOFF 3.5 V VDD 50% tPZH*, tPLH (tTON) tPHL 1.5 V (tTOFF) t tV VDDDET 90% OUTn (GOUT) DDDET 90% 10% IM 0% (<1.0 µA) * The last state is “Z”. Figure 4. tPLH, tPHL, and tPZH Timing Figure 5. Low-Voltage Detection Timing Table 5. Truth Table INPUT OUTPUT EN IN1 IN2 GIN OUT1 OUT2 GOUT H L L X Z Z X H H L X H L X H L H X L H X H H H X L L X L X X X L L L H X X L X X H H X X H X X L H = High. L = Low. Z = High impedance. X = Don’t care. The GIN pin and EN pin are pulled up to VDD with internal resistance. 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 7 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 17510 is a monolithic H-Bridge power IC applicable to small DC motors used in portable electronics. The 17510 can operate efficiently with supply voltages as low as 2.0 V to as high as 15 V, and it can provide continuos motor drive currents of 1.2 A while handling peak currents up to 3.8 A. It is easily interfaced to low-cost MCUs via parallel 5.0 Vcompatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17510 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). Basic protection and operational features (direction, dynamic braking, PWM control of speed and torque, main power supply undervoltage detection and shutdown, logic power supply undervoltage detection and shutdown), in addition to the 1.0 A rms output current capability, make the 17510 a very attractive, cost-effective solution for controlling a broad range of small DC motors. In addition, a pair of 17510 devices can be used to control bipolar stepper motors. The 17510 can also be used to excite transformer primary windings with a switched square wave to produce secondary winding AC currents. As shown in Figure 2, 17510 Simplified Internal Block Diagram, page 2, the 17510 is a monolithic H-Bridge with built-in charge pump circuitry. For a DC motor to run, the input conditions need to be set as follows: ENable input logic HIGH, one INput logic LOW, and the other INput logic HIGH (to define output polarity). The 17510 can execute dynamic braking by setting both IN1 and IN2 logic HIGH, causing both low-side MOSFETs in the output H-Bridge to turn ON. Dynamic braking can also implemented by taking the ENable logic LOW. The output of the H-Bridge can be set to an opencircuit high-impedance (Z) condition by taking both IN1 and IN2 logic LOW. (refer to Table 5, Truth Table, page 7). The 17510 outputs are capable of providing a continuous DC load current of up to 1.2 A. An internal charge pump supports PWM frequencies to 200 kHz. The EN pin also controls the charge pump, turning it off when EN = LOW, thus allowing the 17510 to be placed in a power-conserving sleep mode. FUNCTIONAL PIN DESCRIPTION OUTPUT 1 AND OUTPUT2 (OUT1, OUT2) MOTOR SUPPLY VOLTAGE INPUT (VM) The OUT1 and OUT2 pins provide the connection to the internal power MOSFET H-Bridge of the IC. A typical load connected between these pins would be a small DC motor. These outputs will connect to either VM or PGND, depending on the states of the control inputs (refer to Table 5, Truth Table, page 7). The VM pins carry the main supply voltage and current into the power sections of the IC. This supply then becomes controlled and/or modulated by the IC as it delivers the power to the load attached between OUT1 and OUT2. All VM pins must be connected together on the printed circuit board with as short as possible traces offering as low impedance as possible between pins. VM has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. POWER GROUND AND LOGIC GROUND (PGND, LGND) The power and logic ground pins (PGND and LGND) should be connected together with a very low-impedance connection. CHARGE PUMP RESERVOIR CAPACITOR (CRES) The CRES pin provides the connection for the external reservoir capacitor (output of the charge pump). Alternatively this pin can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. The voltage at the CRES pin will be approximately three times the VDD voltage, as the internal charge pump utilizes a voltage tripler circuit. The VCRES voltage is used by the IC to supply gate drive for the internal power MOSFET H-Bridge. CONTROL SIGNAL INPUT AND ENABLE CONTROL SIGNAL INPUT (IN1, IN2, EN) The IN1, IN2, and EN pins are input control pins used to control the outputs. These pins are 5.0 V CMOS-compatible inputs with hysteresis. The IN1, IN2, and EN work together to control OUT1 and OUT2 (refer to Table 5, Truth Table). GATE DRIVER INPUT (GIN) The GIN input controls the GOUT pin. When GIN is set logic LOW, GOUT supplies a level-shifted high-side gate drive signal to an external MOSFET. When GIN is set logic HIGH, GOUT is set to GND potential. 17510 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION CHARGE PUMP BUCKET CAPACITOR (C1L, C1H, C2L, C2H) These two pairs of pins, the C1L and C1H and the C2L and C2H, connect to the external bucket capacitors required by the internal charge pump. The typical value for the bucket capacitors is 0.1 µF. GATE DRIVER OUTPUT (GOUT) The GOUT output pin provides a level-shifted, high-side gate drive signal to an external MOSFET with CISS up to 500 pF. CONTROL CIRCUIT POWER SUPPLY (VDD) The VDD pin carries the 5.0 V supply voltage and current into the logic sections of the IC. VDD has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 9 TYPICAL APPLICATIONS FUNCTIONAL PIN DESCRIPTION TYPICAL APPLICATIONS Figure 6 shows a typical application for the 17510. 5.0 V 17510 VDD C1L C1H C2L C2H CRES MCU VM GOUT OUT1 Motor EN GIN IN1 IN2 Solenoid OUT2 GND Figure 6. 17510 Typical Application Diagram CEMF SNUBBING TECHNIQUES Care must be taken to protect the IC from potentially damaging CEMF spikes induced when commutating currents in inductive loads. Typical practice is to provide snubbing of voltage transients by placing a capacitor or zener at the supply pin (VM) (see Figure 7). 5.0 V 15 V 17510 VM VDD 5.0 V 15 V 17510 VM VDD C1L C1H OUT1 C2L C2H CRES C1L C1H OUT1 C2L C2H CRES GND GND OUT2 OUT2 Figure 7. CEMF Snubbing Techniques 17510 10 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. MTB SUFFIX EJ SUFFIX (PB-FREE) 24-PIN PLASTIC PACKAGE 98ASH70455A ISSUE B 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (continued) MTB SUFFIX EJ SUFFIX (PB-FREE) 24-PIN PLASTIC PACKAGE 98ASH70455A ISSUE B 17510 12 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 2.0 7/2006 • Implemented a Revision History page. • Converted to Freescale format, and updated to the prevaiing form and style • Added EJ Pb-FREE package 3.0 1/2007 • Corrected symbol in Table 3, Driver Output ON Resistance from “W” to "Ω" 17510 Analog Integrated Circuit Device Data Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. 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