MPVZ2202 Rev 0, 09/2006 Freescale Semiconductor Technical Data 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors MPVZ2202 SERIES The MPVZ2202 device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching and respiratory equipment. 0 TO 200 kPA (0 TO 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGE SURFACE MOUNT Features • Temperature Compensated Over 0°C to +85°C • Easy-to-Use Chip Carrier Package Options • Increased media compatibility fluorocarbon gel Typical Applications • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Respiratory Equipment MPVZ2202GC6T1 CASE 482A-01 SMALL OUTLINE PACKAGE PIN NUMBERS ORDERING INFORMATION Device Type Options MPVZ2202GC7U CASE 482C-03 Case No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE (MPVZ2202 SERIES) Ported Gauge, Vertical Port, Elements Surface Mount 482A MPVZ2202GC6T1 Tape and Reel MPVZ2202G Gauge, Vertical Port, Through Hole 482C MPVZ2202GC7U MPVZ2202G Tube © Freescale Semiconductor, Inc., 2006. All rights reserved. 1 GND(1) 5 N/C 2 +VOUT 6 N/C 3 VS 7 N/C 4 VS 8 N/C 1. Pin 1 is noted by the notch in the lead. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation And Calibration Circuitry Sensing Element 2 V out+ 4 V out- 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 800 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPVZ2202 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 200 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Voff -1.0 — 1.0 mV ∆V/∆P — 0.2 — mV/kPa — -0.6 — 0.4 %VFSS Pressure Hysteresis(5) (0 to 200 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (-40°C to +125°C) — — ± 0.5 — %VFSS TCVFSS -2.0 — 2.0 %VFSS TCVoff -1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 W Output Impedance Zout 1400 — 3000 W Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) MPVZ2202D Serie 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: • • • • Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPVZ2202 Sensors Freescale Semiconductor 3 Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Least Square Deviation Least Squares Fit Exaggerated Performance Curve Relative Voltage Output Straight Line Deviation End Point Straight Line Fit Offset 50 Pressure (% Fullscale) 0 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the output characteristics of the MPVZ2202 series at 25×C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 VS = 10 Vdc TA = 25°C P1 > P2 35 30 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Output (mVdc) 25 20 Span Range (TYP) MAX 15 MIN 10 5 0 kPa PSI -5 0 25 50 7.25 100 14.5 Pressure 75 125 150 21.75 175 200 29 Offset (TYP) Figure 3. Output versus Pressure Differential MPVZ2202 4 Sensors Freescale Semiconductor Stainless Steel Cap Die Gel Die Coat P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 4. Cross-Sectional Diagram (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number Case Type Pressure (P1) Side Identifier MPVZ2202GC6T1 482A Top with Port Attached MPVZ2202GC7U 482C Top with Port Attached MPVZ2202 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– PIN 1 IDENTIFIER M K SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 4 5 N –B– G 0.25 (0.010) 8 M T B D 8 PL S A S 1 DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C –T– INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ2202 6 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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