MB2S thru MB10S Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers Reverse Voltage 200 to 1000 Volts Forward Current 0.5 Ampere Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260oC/10 seconds. Mechanical Data Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g Package outline dimensions in inches (millimeters) Maximum Ratings and Electrical Characteristics (TA=25oC unless otherwise noted) Parameter Symbols MB2S MB4S MB6S MB8S MB10S Maximum repetitive peak reverse voltage VRRM 200 400 Maximum RMS voltage VRMS 140 280 200 400 600 Units 600 800 1000 Volts 420 560 700 Volts 800 1000 Volts Maximum DC blocking voltage V DC Maximum average forward output rectified current (see Fig.1) on glass-epoxy P.C.B. on aluminum substrate IF(AV) 0.5 0.8 Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 35.0 Amps 2 5.0 A 2 se c VF 1.0 Volt IR 5.0 100 uA Rating for fusing (t < 8.3ms) It Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg TA = 25oC TA = 125oC Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range Notes: RθJA RθJA RθJL 85 70 20 (1) (1) (2) o C/W (1) CJ 13 TJ, TSTG -55 to +150 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad 405 Amp (2) pF o C RATINGS AND CHARACTERISTIC CURVES (TA = 25oC unless otherwise noted) 406