STMICROELECTRONICS E

STLC4370
Single Chip 802.11b/g WLAN Radio for Mobile Applications
DATA BRIEF
Features
■
Extremely small footprint
■
Ultra Low Power consumption
■
Fully compliant with the IEEE 802.11b and
802.11g WLAN standards
■
Support for 54, 48, 36, 24, 18, 12, 9, and
6Mbps OFDM, 11 and 5.5Mbps CCK and
legacy 2 and 1Mbps data rates
■
Single Chip 802.11b/g WLAN solution with
fully integrated:
– Zero IF (ZIF) transceiver,
– Voltage Controlled Oscillator (VCO),
– High-speed A/D and D/A converters,
– Radio Power Management Unit (PMU),
– OFDM and CCK baseband processor,
– ARM9 Media Access Controller (MAC),
– SPI serial host interface (up to 48Mbps)
■
Intelligent power control, including 802.11
power save mode
■
Fully integrated Bluetooth coexistence
LFBGA (12.5 mm x 7 mm x 1.6 mm)
Order codes
Part Number
E-STLC4370A
Cellular phones
■
Personal Digital Assistants (PDA)
■
Portable computers
■
Hand-held data transfer devices
■
Cameras
■
Computer peripherals
■
Cable replacement
Lead-free LFBGA228
Description
The STLC4370 is a single chip 802.11b/g WLAN
radio for embedded, low-power and very small
form factor mobile applications. The product
conforms to the IEEE 802.11b and 802.11g
protocols operating in the 2.45GHz ISM
frequency band supporting OFDM data rates of
54, 48, 36, 24, 18, 12, 9, and 6Mbps as well as
CCK data rates of 11 and 5.5Mbps and legacy
data rates of 2 and 1Mbps.
Applications
■
Package
The STLC4370 is a fully integrated wireless radio
including a ZIF transceiver, RF Synthesizer/VCO,
high-speed data converters, an OFDM/CCK
digital baseband processor, an ARM9-based
MAC and a complete Power Management Unit.
Host control is provided by a flexible serial
interface (SPI) supporting bit rates of 48Mbps. For
maximum flexibility, the STLC4370 accepts
system reference clock frequencies of 19.2, 26,
38.4 and 40MHz.
A reference design evaluation platform of
hardware and software is provided to system
integrators to rapidly enable wireless connectivity
to mobile platforms.
January 2006
Rev. 1
For further information contact your local STMicroelectronics sales office.
1/5
www.st.com
5
Block diagram
STLC4370
Block diagram
Figure 1.
STLC4370 block diagram
Power Management Unit (PMU)
STLC4370
RF ZIF Section:
FEM
PA, Switches,
Balun, Passives
FEM I/F
RF VCO
RX Down converter
TX Up converter
Baseband Filters
High -Speed
Data Converters
Switch
Control
2/5
Rev. 1
SPI I/F
Baseband
Processor
MAC
OFDM/CCK
Modulation
ARM9
WEP
CXS I/F
Host
CPU
Bluetooth
Device
STLC4370
Package information
Package information
Figure 2.
LFBGA228 mechanical data and package dimensions
mm
inch
DIM.
MIN.
TYP.
A
A1
MAX.
MIN.
TYP.
1.60
0.006
1.02
0.040
b
0.25
0.30
0.35
0.010
0.012
0.014
D
12.35
12.50
12.65
0.486
0.492
0.498
D1
E
11.50
6.85
OUTLINE AND
MECHANICAL DATA
0.062
0.15
A2
MAX.
7.00
0.453
7.15
0.270
0.275
E1
6.00
0.236
e
0.50
0.020
F
0.50
0.020
0.281
Body: 12.5 x 7 x 1.6mm
ddd
0.08
0.003
eee
0.15
0.006
fff
0.05
0.002
LFBGA228 (207+21)
Low Profile Ball Grid Array
7611496 A
Rev. 1
3/5
Revision history
STLC4370
Revision history
Table 1.
4/5
Document revision history
Date
Revision
13-Jan-2006
1
Changes
Initial release.
Rev. 1
STLC4370
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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Rev. 1
5/5