ONSEMI CM1442-06LP

LCD and Camera EMI Filter Array
with ESD Protection
CM1442-06LP
Features
•
•
Functional Description
Six channels of EMI filtering with integrated ESD
The CM1442-06LP is part of a family of pi-style EMI filter
protection
arrays with ESD protection, which integrates six filters (C-
0.4mm pitch, 15-bump, 2.360mm x 1.053mm
R-C) in a Chip Scale Package (CSP) form factor with
footprint Chip Scale Package (CSP)
0.40mm pitch. The CM1442-06LP (low profile) has
Pi-style EMI filters in a capacitor-resistor-capacitor
component values of 15pF-100Ω-15pF per channel. The
(C-R-C) network
CM1442-06LP has a cut-off frequency of 120MHz and can
±15kV ESD protection on each channel
be used in applications where the data rates are as high as
(IEC 61000-4-2 Level 4, contact discharge)
48Mbps. The parts include avalanche-type ESD diodes on
•
±30kV ESD protection on each channel (HBM)
every pin, which provide a very high level of protection for
•
Greater than 30dB attenuation (typical) at 1 GHz
sensitive
•
RoHS-compliant, lead-free packaging
electrostatic discharge (ESD). The ESD protection diodes
•
•
electronic
components
against
potential
safely dissipate ESD strikes of ±15kV, well beyond the
Applications
•
•
•
•
•
•
LCD and camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
maximum requirement of the IEC61000-4-2 international
standard.
Using
the
MIL-STD-883
(Method
3015)
specification for Human Body Model (HBM) ESD, the pins
are protected for contact discharges at greater than ±30kV.
The CM1442-06LP is available in a space-saving, lowprofile CSP with RoHS-compliant, lead-free finishing. It is
manufactured with a 0.40mm pitch and 0.15mm CSP
solder ball to provide up to 28% board space saving versus
competing CSP devices with 0.50mm pitch and 0.30mm
CSP solder ball.
Package/Pinout Diagrams
©2010 SCILLC. All rights reserved.
March 2010 Rev. 3
Publication Order Number:
CM1442-06LP/D
CM1442-06LP
Pin Descriptions
PIN(s)
NAME
A1
FILTER1
A2
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
Filter + ESD Channel 1
C1
FILTER1
Filter + ESD Channel 1
FILTER2
Filter + ESD Channel 2
C2
FILTER2
Filter + ESD Channel 2
A3
FILTER3
Filter + ESD Channel 3
C3
FILTER3
Filter + ESD Channel 3
A4
FILTER4
Filter + ESD Channel 4
C4
FILTER4
Filter + ESD Channel 4
A5
FILTER5
Filter + ESD Channel 5
C5
FILTER5
Filter + ESD Channel 5
A6
FILTER6
Filter + ESD Channel 6
C6
FILTER6
Filter + ESD Channel 6
B1-B3
GND
Device Ground
Ordering Information
Bumps
Package
15
CSP
1
Order Part Number
CM1442-06LP
Note 1: Parts are shipped in tape and reel form unless otherwise specified.
Rev. 3 | Page 2 of 10 | www.onsemi.com
Part Marking
N4
CM1442-06LP
Absolute Maximum Ratings
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
Standard Operating Conditions
PARAMETER
Operating Temperature Range
Electrical Specifications
SYMBOL
R
PARAMETER
CONDITIONS
Resistance
CTOTAL
MIN
TYP
MAX
UNITS
80
100
120
Ω
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
24
30
36
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
12
15
18
pF
VDIODE
Standoff Voltage
IDIODE=10µA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE= +3.3V
0.1
1
µA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
VESD
RDYN
f
C
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
Notes 2 and 3
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
5.6
-1.5
V
±30
kV
±15
kV
2.3
0.9
Ω
Ω
115
MHz
R=100Ω, C=15pF
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open.
Rev. 3 | Page 3 of 10 | www.onsemi.com
CM1442-06LP
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Rev. 3 | Page 4 of 10 | www.onsemi.com
CM1442-06LP
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. 3 | Page 5 of 10 | www.onsemi.com
CM1442-06LP
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
Rev. 3 | Page 6 of 10 | www.onsemi.com
CM1442-06LP
Performance Information (cont’d)
DC Voltage
Figure 7. Filter Capacitance vs. Input Voltage
(Normalized to capacitance at 2.5VDC and 25°C)
Rev. 3 | Page 7 of 10 | www.onsemi.com
CM1442-06LP
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 8 of 10 | www.onsemi.com
260°C
CM1442-06LP
Package Dimensions
The CM1442-06LP is supplied in custom Chip Scale
Packages (CSP). Dimensions are presented below.
Package
Custom CSP
Bumps
15
Millimeters
Dim
Inches
Min
Nom
Max
Min
A1
2.315
2.360
2.405
0.911
A2
1.008
1.053
1.098
0.0397 0.0415 0.0432
B1
0.395
0.4000
0.405
0.0156 0.0157 0.0159
B2
0.195
0.2000
0.205
0.0076 0.0078 0.0080
B3
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1
0.130
0.1800
0.230
0.0051 0.0071 0.0091
C2
0.130
0.1800
0.230
0.0051 0.0071 0.0091
D1
0.224
0.262
0.300
0.088
D2
0.191
0.203
0.216
0.0075 0.0080 0.0085
# per tape and
reel
Nom
Max
0.0929 0.0947
0.0103 0.0118
Package Dimensions for CM1442-06LP Chip Scale
Package
3500 pieces
Controlling dimension: millimeters
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1442-06LP
2.36 X 1.053 X 0.262
2.59 X 1.15 X 0.40
8mm
178mm (7")
3500
4mm
4mm
Figure 10. Tape and Reel Mechanical Data
Rev. 3 | Page 9 of 10 | www.onsemi.com
CM1442-06LP
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Rev. 3 | Page 10 of 10 | www.onsemi.com
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