STMICROELECTRONICS STESB01STR

STESB01
ESBT Base Driver
Feature summary
■
Controls ESBT base current in every line/load
condition
■
Supply voltage range: 8V to 20 V
■
Storage time controlled by closed loop
architecture (from 150ns to 1.5µs)
■
Under voltage lockout with hysteresis
SOT23-6L
SO-8
Description
The STESB01 is a dedicated base current biasing
transistor for the Emitter-Switched Bipolar
Transistor (ESBT) family of power switches. The
device is able to control the ESBT storage time
(from 150ns to 1.5ìs) using closed loop
architecture. This guarantees proper operation of
the ESBT in every line and load condition,
avoiding oversaturation of the device and, at the
same time, ensuring the correct base current
when a higher load is required. The storage time
can be adjusted with an external resistor, which
allows maximum flexibility in different applications.
The optimization of the base current value also
reduces the base current losses to minimum level.
Order code
Part number
Package
Packaging
STESB01STR
SOT23-6L
3000 Parts per Reel
STESB01DR
SO-8
2500 Parts per Reel
October 2006
Rev. 3
1/14
www.st.com
14
STESB01
Contents
Contents
1
Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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STESB01
1
Figure 1.
Schematic diagram
Schematic diagram
Schematic diagram
3/14
STESB01
Pin configuration
2
Pin configuration
Figure 2.
Pin Connections (Top View)
SOT23-6L
Table 1.
Pin description
Pin N°
for SO-8
Pin N°
for
SOT23
Symbol
8
1
DRIVE
6, 7
2
GND
5
3
STGADJ
4
4
VCOLL
2
5
PWM
1
6
VCC
3
4/14
SO-8
N.C.
Name and function
This is the base current driver for the external PNP transistor (see Application
Schematic) which determines the ESBT base current value.
Ground. Reference for all the signal of the IC.
Adjustable Storage (adjusted by connecting a resistor between this pin and GND
pin). A minimum value of 150ns can be achieved with 10kΩ resistor. See note 4.
Collector Voltage.
This pin must be connected to the ESBT collector through a resistor divider. The
rising edge of this signal provides end-of-storage time information.
Pulse Width Modulation.
This pin must be connected to the PWM controller output. The falling edge of this
signal provides beginning-of-storage time information.
Supply Voltage.
It range is from 8V to 20V. A ceramic Bypass capacitor must be connected
between VCC and GND.
Not Connected.
STESB01
3
Maximum ratings
Maximum ratings
Table 2.
Absolute maximum ratings
Symbol
VCC
Drive
STGADJ
Parameter
DC Input voltage
Drive output voltage
Value
Unit
-0.3 to 22
-0.3 to VCC
V
-0.3 to 5
-0.3 to 15
-0.6 to 5
±2
TBD
V
V
V
kV
mW
V
ESD
PTOT
Storage time adjust voltage
PWM Input voltage
Collector input voltage
Human body model
Continuous power dissipation (at TA = 105°C)
TSTG
Storage temperature range
-40 to 150
°C
TOP
Operating junction temperature range
-40 to 125
°C
PWM
VCOLL
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied.
Table 3.
Symbol
Thermal data
Parameter
SOT23-6L
SO-8
Unit
RthJC
Thermal resistance junction-case
81
20
°C/W
RthJA
Thermal resistance junction-ambient
255
55
°C/W
This value is referred to 1 layer PCB board with minimum copper connections for the leads.
5/14
STESB01
Electrical characteristics
4
Electrical characteristics
Table 4.
Electrical characteristics
(VCC = 20V, CI = 3.3µF, TJ= -40°C to 125°C unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
7.5
8
Unit
Supply Input and Under Voltage Lock Out
VCC
ICC
Turn On Threshold
VCC rising
Turn Off Threshold after Turn On VCC falling
PWM=VCOLL=0V
Supply Current
See Note 1
6.5
7
V
2
2
mA
50
mV
0.25
A
Driver Output (TJ = 27°C)
VOL
Low Level Voltage
IDRIVE(OL) Drive Current in open loop
IDRIVE =10mA
VDRIVE = 1.25V, RSTGadj=150 kΩ
See Note 2, Note 4
Storage Control
VPWML
PWM Low Level Threshold
See Note 3
VPWMH
PWM High Level Threshold
See Note 3
3.5
-0.1
IPWM
PWM input bias current
PWM = 0V to 15V
VCOLL(L)
Collector Low Level Threshold
See Note 3
VCOLL(H)
Collector High Level Threshold
VCOLL input bias current
See Note 3
VCOLL = 0V to 5V
ICOLL
1.5
0.1
µA
0.8
V
0.1
µA
2.5
-0.1
V
V
V
1 To the PWM pin must be applied a 5V to 0V falling edge while the voltage level on the VCOLL pin
must be 0V. After 300 ns, to the VCOLL pin must be applied a 0V to 5V rising edge. The
maximum frequency of signals applied to PWM and VCOLL pins must be 300 kHz.
2 To the PWM pin must be applied a 5V to 0V falling edge while the voltage level on the VCOLL pin
must be 0V. After 200 ns, to the VCOLL pin must be applied a 0V to 5V raising edge. The
maximum frequency of signals applied to PWM and VCOLL pins must be 300 kHz.
3 Guaranteed by Design.
4 In parallel to the resistor a low-leakage/low-ESR capacitor could be necessary for bypassing
purpose.
6/14
STESB01
5
Diagram
Diagram
Figure 3.
Block diagram
Figure 4.
Typical operating characteristics
7/14
Package mechanical data
6
STESB01
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
8/14
STESB01
Package mechanical data
SOT23-6L MECHANICAL DATA
mm.
mils
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
0.90
1.45
35.4
57.1
A1
0.00
0.15
0.0
5.9
A2
0.90
1.30
35.4
51.2
b
0.35
0.50
13.7
19.7
C
0.09
0.20
3.5
7.8
D
2.80
3.00
110.2
118.1
E
2.60
3.00
102.3
118.1
E1
1.50
1.75
59.0
68.8
e
0.95
37.4
e1
1.9
74.8
L
0.35
0.55
13.7
21.6
9/14
STESB01
Package mechanical data
SO-8 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
inch
MAX.
MIN.
TYP.
MAX.
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.04
0.010
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
e
1.27
0.050
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
ddd
8˚ (max.)
0.1
0.04
0016023/C
10/14
STESB01
Package mechanical data
Tape & Reel SOT23-xL MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
A
MAX.
MIN.
TYP.
180
13.0
7.086
C
12.8
D
20.2
0.795
N
60
2.362
T
13.2
MAX.
0.504
0.512
14.4
0.519
0.567
Ao
3.13
3.23
3.33
0.123
0.127
0.131
Bo
3.07
3.17
3.27
0.120
0.124
0.128
Ko
1.27
1.37
1.47
0.050
0.054
0.0.58
Po
3.9
4.0
4.1
0.153
0.157
0.161
P
3.9
4.0
4.1
0.153
0.157
0.161
11/14
STESB01
Package mechanical data
Tape & Reel SO-8 MECHANICAL DATA
mm.
inch
DIM.
MIN.
A
MAX.
MIN.
330
13.2
TYP.
MAX.
12.992
C
12.8
D
20.2
0.795
N
60
2.362
T
12/14
TYP
0.504
22.4
0.519
0.882
Ao
8.1
8.5
0.319
0.335
Bo
5.5
5.9
0.216
0.232
Ko
2.1
2.3
0.082
0.090
Po
3.9
4.1
0.153
0.161
P
7.9
8.1
0.311
0.319
STESB01
7
Revision history
Revision history
Table 5.
Revision history
Date
Revision
Changes
16-Nov-2005
1
Initial release.
26-Jul-2006
2
Mistake on table 3 function of pin 3.
03-Oct-2006
3
Add new package SO-8.
13/14
STESB01
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