STMICROELECTRONICS STTH8003CY

STTH8003CY
®
HIGH FREQUENCY SECONDARY RECTIFIERS
MAJOR PRODUCTS CHARACTERISTICS
IF(AV)
2x40 A
VRRM
300 V
VF (max)
1V
trr (max)
60 ns
FEATURES AND BENEFITS
n
n
n
COMBINES HIGHEST RECOVERY AND
VOLTAGE PERFORMANCE.
ULTRA-FAST, SOFT AND NOISE-FREE
RECOVERY.
HIGH OPERATING TEMPERATURE THANKS
TO LOW LEAKAGE CURRENT.
A2
K
A1
DESCRIPTION
Dual rectifiers suited for Switch Mode Power
Supply and high frequency DC to DC converters.
Packaged in Max247, this device is intended for
use in low voltage, high frequency inverters, free
wheeling operation, welding equipment and
telecom power supplies.
Max247
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
300
V
IF(RMS)
RMS forward current
50
A
IF(AV)
Average forward current
Per diode
Per device
40
80
A
IFSM
Surge non repetitive forward current
tp = 10 ms
sinusoidal
400
A
IRSM
Non repetitive avalanche current
tp = 100 µs
square
4
A
Tstg
Storage temperature range
-55 +175
°C
+ 175
°C
Tj
Tc = 105°C
δ = 0.5
Maximum operating junction temperature
September 2002 - Ed: 3A
1/5
STTH8003CY
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case thermal resistance
Rth (c)
Value
Unit
Per diode
Total
0.8
0.5
°C/W
Coupling
0.2
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
IR *
Parameter
Reverse leakage current
Tests Conditions
VR = 300 V
Min.
Tj = 25°C
Tj = 125°C
VF **
Forward voltage drop
IF = 40 A
Typ.
80
Tj = 25°C
Max.
Unit
80
µA
800
1.25
Tj = 125°C
V
0.85
1
Typ.
Max.
Unit
50
ns
Pulse test : * tp = 5 ms, δ < 2 %
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.75 x IF(AV) + 0.0062 IF(RMS)2
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
trr
Tests Conditions
IF = 0.5 A
IF = 1 A
IRM
Irr = 0.25 A
dIF/dt = - 50 A/µs
IR = 1 A
Min.
Tj = 25°C
VR = 30 V
Vcc = 200 V IF = 40 A dIF/dt = -200 A/µs
60
Tj = 125°C
0.3
Sfactor
tfr
VFP
2/5
13
IF = 40 A dIF/dt = 200 A/µs,
VFR = 1.1 x VF max
Tj = 25°C
A
-
450
ns
5
V
STTH8003CY
Fig. 1: Conduction losses versus average current
(per diode)
Fig. 2: Forward voltage drop versus forward
current (per diode)
P(W)
55
50
45
40
35
30
25
20
15
10
5
0
IFM(A)
200
δ = 0.5
Tj=125°C
Typical values
100
δ = 0.2
δ = 0.1
Tj=125°C
Maximum values
δ=1
δ = 0.05
Tj=25°C
Maximum values
10
T
IF(av) (A)
0
5
10
15
20
25
δ=tp/T
30
35
VFM(V)
tp
40
45
1
0.2
50
Fig. 3: Relative variation of thermal impedance
junction to case versus pulse duration
0.4
0.6
0.8
1.0
1.2
1.4
1.8
2.0
2.2
Fig. 4: Peak reverse recovery current versus
dIF/dt (90% confidence, per diode)
Zth(j-c)/Rth(j-c)
IRM(A)
1.0
25
VR=200V
Tj=125°C
0.8
0.6
1.6
20
IF=2 x IF(av)
IF=IF(av)
δ = 0.5
15
IF=0.5 x IF(av)
0.4
δ = 0.2
10
δ = 0.1
0.2
T
Single pulse
0.0
1E-3
5
tp(s)
1E-2
δ=tp/T
1E-1
dIF/dt(A/µs)
tp
1E+0
Fig. 5: Reverse recovery time versus dIF/dt
(90% confidence, per diode)
0
0
100 150 200 250 300 350 400 450 500
Fig. 6: Softness factor (tb/ta) versus dIF/dt
(typical values, per diode)
S factor
trr(ns)
180
160
140
120
100
80
60
40
20
0
50
VR=200V
Tj=125°C
0.6
VR=200V
Tj=125°C
0.5
0.4
IF=2 x IF(av)
IF=IF(av)
0.3
0.2
IF=0.5 x IF(av)
0.1
dIF/dt(A/µs)
dIF/dt(A/µs)
0
50
100 150 200 250 300 350 400 450 500
0.0
0
50
100 150 200 250 300 350 400 450 500
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STTH8003CY
Fig. 7: Relative variation of dynamic parameters
versus junction temperature (Reference: Tj = 125°C)
VFP(V)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
10
IF=IF(av)
Tj=125°C
S factor
8
6
4
IRM
2
Tj(°C)
50
75
dIF/dt(A/µs)
100
125
Fig. 9: Forward recovery time versus dIF/dt
(90% confidence, per diode)
tfr(ns)
500
IF=IF(av)
VFR=1.1 x VFmax
Tj=125°C
400
300
200
100
dIF/dt(A/µs)
0
4/5
0
Fig. 8: Transient peak forward voltage versus
dIF/dt (90% confidence, per diode)
50
100 150 200 250 300 350 400 450 500
0
0
50
100 150 200 250 300 350 400 450 500
STTH8003CY
PACKAGE MECHANICAL DATA
Max247
DIMENSIONS
REF.
E
A
D
L1
A1
L
b1
b2
e
n
n
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.70
5.30
0.185
0.209
A1
2.20
2.60
0.087
0.102
b
1.00
1.40
0.038
0.055
b1
2.00
2.40
0.079
0.094
b2
3.00
3.40
0.118
0.133
c
0.40
0.80
0.016
0.031
D
19.70
10.30
0.776
0.799
e
5.35
5.55
0.211
0.219
E
15.30
15.90
0.602
0.626
L
14.20
15.20
0.559
0.598
L1
3.70
4.30
0.146
0.169
c
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH8003CY
STTH8003CY
Max247
4.4 g.
30
Tube
Cooling method: C
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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