STB60N55F3 - STD60N55F3 - STF60N55F3 STP60N55F3 - STU60N55F3 N-channel 55V - 6.5mΩ - 80A - DPAK - IPAK - D2PAK - TO-220/FP STripFET™ Power MOSFET General features Type VDSS RDS(on) ID Pw STB60N55F3 55V <8.5mΩ 80A 110W STD60N55F3 55V <8.5mΩ 80A 110W STF60N55F3 55V <8.5mΩ 42A 30W STP60N55F3 55V <8.5mΩ 80A 110W STU60N55F3 55V <8.5mΩ 80A 110W 3 1 ■ ■ 2 3 1 2 IPAK TO-220FP 3 1 DPAK 3 Standard threshold drive 1 3 D²PAK 100% avalanche tested 1 2 TO-220 Description This n-channel enhancement mode Power MOSFET is the latest refinement of STMicroelectronics' unique “Single Feature Size™“ strip-based process, which has decreased the critical alignment steps, offering remarkable manufacturing reproducibility. The outcome is a transistor with extremely high packing density for low onresistance, rugged avalanche characteristics and low gate charge. Internal schematic diagram Applications ■ Switching application Order codes Part number Marking Package Packaging STB60N55F3 60N55F3 D²PAK Tape & reel STD60N55F3 60N55F3 DPAK Tape & reel STF60N55F3 60N55F3 TO-220FP Tube STP60N55F3 60N55F3 TO-220 Tube STU60N55F3 60N55F3 IPAK Tube March 2007 Rev 3 1/19 www.st.com 19 Contents STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 ................................................ 9 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Value Symbol Parameter VDS Drain-source voltage (VGS=0) VGS Gate-source voltage DPAK/D²PAK TO-220FP TO-220/IPAK Unit 55 V ± 20 V ID Drain current (continuous) at TC = 25°C 80 42 A ID Drain current (continuous) at TC = 100°C 56 30 A IDM (1) Drain current (pulsed) 320 168 A PTOT Total dissipation at TC = 25°C 110 30 W Derating factor 0.73 0.2 W/°C dv/dt (2) Peak diode recovery voltage slope 11 V/ns EAS (3) Single pulse avalanche energy 390 mJ VISO Tj Tstg Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25°C) -- Operating junction temperature Storage temperature 2500 -55 to 175 V °C 1. Pulse width limited by safe operating area 2. ISD < 80A, di/dt < 300A/µs, VDD < V(BR)DSS. Tj < Tjmax 3. Starting Tj=25°C, Id=32A, Vdd=25V Table 2. Thermal resistance Value Symbol Parameter Unit DPAK IPAK D²PAK TO-220 TO-220FP Rthj-case Thermal resistance junctioncase max 1.36 5 °C/W -- °C/W Thermal resistance junctionRthj-pcb (1) pcb max 50 -- 35 Thermal resistance junctionambient max -- 100 -- 62.5 °C/W Maximum lead temperature for soldering purpose -- 275 -- 300 °C Rthj-a Tl -- 1. When mounted on FR-4 board of 1inch², 2oz Cu 3/19 Electrical characteristics STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol V(BR)DSS Static Parameter Drain-source breakdown voltage Test conditions ID = 250µA, VGS= 0 55 V VDS = Max rating, VDS = Max rating,Tc = 125°C 10 100 µA µA Gate body leakage current (VDS = 0) VGS = ±20V ±200 nA VGS(th) Gate threshold voltage VDS= VGS, ID = 250µA 4 V RDS(on) Static drain-source on resistance VGS= 10V, ID= 32A 8.5 mΩ IDSS Zero gate voltage drain current (VGS = 0) IGSS Table 4. Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd 2 6.5 Dynamic Parameter Test conditions Forward transconductance VDS =25V, ID=32A Input capacitance Output capacitance Reverse transfer capacitance VDS = 25V, f = 1MHz, VGS=0 Total gate charge Gate-source charge Gate-drain charge VDD = 27V, ID = 65A VGS =10V (see Figure 15) 1. Pulsed: pulse duration = 300µs, duty cycle 1.5% 4/19 Min. Typ. Max. Unit Min Typ. Max. Unit 50 S 2200 500 25 pF pF pF 33.5 12.5 9.5 45 nC nC nC STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Electrical characteristics Table 5. Switching on/off (inductive load) Symbol td(on) tr td(off) tf Table 6. Symbol ISD ISDM (1) ISD ISDM (1) VSD trr Qrr IRRM Parameter Test conditions Min. VDD = 27V, ID = 32A, Turn-on delay time Rise time RG = 4.7Ω, VGS = 10V (see Figure 17) VDD = 27V, ID = 32A, Turn-off delay time Fall time RG = 4.7Ω, VGS = 10V (see Figure 17) Typ. Max. Unit 20 50 ns ns 35 11.5 ns ns Source drain diode Parameter Test conditions Packages Min. Typ. Max. Unit Source-drain current Source-drain current (pulsed) DPAK-D2PAKI2PAK-TO-220 80 320 A A Source-drain current Source-drain current (pulsed) TO-220FP 42 168 A A 1.5 V Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 65A, VGS = 0 ISD = 65A, VDD = 30V di/dt = 100A/µs, Tj = 150°C (see Figure 16) 47 87 3.7 ns nC A 1. Pulsed: pulse duration = 300µs, duty cycle 1.5% 5/19 Electrical characteristics STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO-220 D²PAK / IPAK / DPAK Figure 2. Thermal impedance for TO-220 D²PAK / IPAK / DPAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP Figure 5. Output characteristics Figure 6. Transfer characteristics 6/19 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Electrical characteristics Figure 7. Normalized BVDSS vs temperature Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 8. Static drain-source on resistance Figure 12. Normalized on resistance vs temperature 7/19 Electrical characteristics STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Figure 13. Source-drain diode forward characteristics 8/19 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 3 Test circuit Test circuit Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit Figure 16. Test circuit for inductive load Figure 17. Unclamped Inductive load test switching and diode recovery times circuit Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform 9/19 Package mechanical dataSTB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/19 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3Package mechanical data DPAK MECHANICAL DATA mm. inch DIM. MIN. A A1 A2 B b4 C C2 D D1 E E1 e e1 H L (L1) L2 L4 R V2 TYP 2.2 0.9 0.03 0.64 5.2 0.45 0.48 6 MAX. MIN. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 6.6 0.252 5.1 6.4 0.260 0.090 4.6 10.1 0.173 0.368 0.039 2.8 0.8 0.181 0.397 0.110 0.031 1 0.023 0.2 0° 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.185 2.28 0.6 MAX. 0.200 4.7 4.4 9.35 1 TYP. 0.039 0.008 8° 0° 8° 0068772-F 11/19 Package mechanical dataSTB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 TO-251 (IPAK) MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 B5 0.033 0.3 0.012 B6 0.95 C 0.45 C2 0.48 D 6 E 6.4 6.6 0.037 0.6 0.017 0.023 0.6 0.019 0.023 6.2 0.236 0.244 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A1 C2 A3 A C H B B3 = 1 = 2 G = = = E B2 = 3 B5 L D B6 L2 L1 0068771-E 12/19 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MAX. MIN. A MIN. 4.4 TYP 4.6 0.173 TYP. 0.181 MAX. A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 4.88 5.28 0.192 0.208 D1 E 8 10 E1 G 0.315 8.5 0.334 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0º 0.015 4º 3 V2 0.4 1 13/19 Package mechanical dataSTB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 θP Q 14/19 Typ 4.40 0.61 1.14 0.49 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.85 2.95 0.147 0.104 0.151 0.116 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3Package mechanical data TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 F F1 L7 L2 L5 1 2 3 L4 15/19 Packaging mechanical data 5 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 16.4 N 50 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 16/19 inch MIN. MAX. 12.1 0.476 1.6 0.059 0.063 D 1.5 D1 1.5 E 1.65 1.85 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 0.153 0.161 0.059 0.065 0.073 P0 3.9 4.1 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 W 15.7 1.574 16.3 0.618 0.641 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 18.4 0.645 0.724 0.059 0.795 1.968 22.4 0.881 BASE QTY BULK QTY 2500 2500 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Packaging mechanical D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 MAX. K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 17/19 Revision history 6 STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Revision history Table 7. 18/19 Revision history Date Revision Changes 09-Feb-2007 1 First release 22-Feb-2007 2 Description has been updated 07-Mar-2007 3 The Figure 1, Figure 3, Figure 8 has been changed STB60N55F3 - STD60N55F3 - STF60N55F3 - STP60N55F3 - STU60N55F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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