TSC TSM12N02

TSM12N02
20V N-Channel MOSFET
TO-252
PRODUCT SUMMARY
VDS (V)
RDS(on)(mΩ)
Pin Definition:
1. Gate
2. Drain
3. Source
20
Features
●
●
ID (A)
30 @ VGS = 10V
8
40 @ VGS = 4.5V
6
Block Diagram
Advance Trench Process Technology
High Density Cell Design for Ultra Low On-resistance
Application
●
●
Load Switch
PA Switch
Ordering Information
Part No.
TSM12N02CP RO
Package
Packing
TO-252
T&R
N-Channel MOSFET
Absolute Maximum Rating (Ta = 25 oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
20
V
Gate-Source Voltage
VGS
±12
V
Continuous Drain Current, VGS @4.5V.
ID
12
A
Pulsed Drain Current, VGS @4.5V
IDM
30
A
IS
1.7
A
Continuous Source Current (Diode Conduction)
a,b
o
Maximum Power Dissipation
Ta = 25 C
PD
o
Ta = 70 C
Operating Junction Temperature
W
23
+150
o
TJ, TSTG
-55 to +150
o
Symbol
Limit
10
TJ
Operating Junction and Storage Temperature Range
60
C
C
Thermal Performance
Parameter
Lead Temperature (1/8” from case)
Junction to Case Thermal Resistance
TL
RӨJC
Junction to Ambient Thermal Resistance (PCB mounted)
Notes:
a. Maximum DC current limited by the package
b. Surface Mounted on 1” x 1” FR4 Board, t ≤ 10 sec.
RӨJA
1/6
Unit
S
2.2
o
50
o
C/W
C/W
Version: A07
TSM12N02
20V N-Channel MOSFET
Electrical Specifications
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
BVDSS
20
--
--
V
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
0.6
--
--
V
Gate Body Leakage
VGS = ±12V, VDS = 0V
IGSS
--
--
±100
nA
Zero Gate Voltage Drain Current
VDS = 20V, VGS = 0V
IDSS
--
--
1.0
uA
On-State Drain Current
VDS ≥5V, VGS = 10V
ID(ON)
12
--
--
A
--
30
40
--
21
30
Drain-Source On-State Resistance
VGS = 4.5V, ID = 6A
VGS = 10V, ID = 8A
RDS(ON)
mΩ
Forward Transconductance
VDS = 10V, ID = 6A
gfs
7
13
--
S
Diode Forward Voltage
IS = 1.7A, VGS = 0V
VSD
--
--
1.2
V
Qg
--
4.86
--
Qgs
--
0.92
--
Qgd
--
1.4
--
Ciss
--
562
--
Coss
--
106
--
Crss
--
75
--
td(on)
--
8.1
--
tr
--
9.95
--
td(off)
--
21.85
--
--
5.35
--
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VDS = 10V, ID = 6A,
VGS = 4.5V
VDS = 8V, VGS = 0V,
f = 1.0MHz
nC
pF
c
Switching
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
VDD = 10V, ID = 1A,
VGEN = 10V,
RG = 16Ω
Turn-Off Fall Time
tf
Notes:
a. pulse test: PW ≤300µS, duty cycle ≤2%
b. For DESIGN AID ONLY, not subject to production testing.
b. Switching time is essentially independent of operating temperature.
2/6
nS
Version: A07
TSM12N02
20V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25 oC, unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/6
Version: A07
TSM12N02
20V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25 oC, unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Single Pulse Power
Normalized Thermal Transient Impedance, Junction-to-Ambient
4/6
Version: A07
TSM12N02
20V N-Channel MOSFET
SOT-252 Mechanical Drawing
TO-252 DIMENSION
DIM
5/6
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
A
2.3BSC
0.09BSC
A1
4.6BSC
0.18BSC
B
6.80
7.20
0.268
0.283
C
5.40
5.60
0.213
0.220
D
6.40
6.65
0.252
0.262
E
2.20
2.40
0.087
0.094
F
0.00
0.20
0.000
0.008
G
5.20
5.40
0.205
0.213
G1
0.75
0.85
0.030
0.033
G2
0.55
0.65
0.022
0.026
H
0.35
0.65
0.014
0.026
I
0.90
1.50
0.035
0.059
J
2.20
2.80
0.087
0.110
K
0.50
1.10
0.020
0.043
L
0.90
1.50
0.035
0.059
M
1.30
1.70
0.051
0.67
Version: A07
TSM12N02
20V N-Channel MOSFET
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
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and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability,
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6/6
Version: A07