NCP707 200 mA, Very-Low Quiescent Current, IQ 25 mA, Low Noise, Low Dropout Regulator The NCP707 is 200 mA LDO that provides the engineer with a very stable, accurate voltage with very low noise suitable for space constrained, noise sensitive applications. In order to optimize performance for battery operated portable applications, the NCP707 employs the dynamic quiescent current adjustment for very low IQ consumption at no−load. MARKING DIAGRAM 1 XM XDFN4 MX SUFFIX CASE 711AJ Features • Operating Input Voltage Range: 1.9 V to 5.5 V • Available in Fixed Voltage Options: 1.5 V to 3.3 V • • • • • • • • • http://onsemi.com X M Contact Factory for Other Voltage Options Very Low Quiescent Current of Typ. 25 mA Very Low Noise: 22 mVRMS from 100 Hz to 100 kHz Very Low Dropout: 120 mV Typical at 200 mA ±2% Accuracy Over Load/Line/Temperature High Power Supply Ripple Rejection: 70 dB at 1 kHz Thermal Shutdown and Current Limit Protections Stable with a 1 mF Ceramic Output Capacitor Available in XDFN 1.0 x 1.0 mm Package These are Pb−Free Devices 1 = Specific Device Code = Date Code PIN CONNECTION IN EN 4 3 EPAD Typical Applicaitons • • • • PDAs, Mobile phones, GPS, Smartphones Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee® Portable Medical Equipment Other Battery Powered Applications VOUT CIN EN ON OFF OUT NCP707 GND 2 GND (Top View) VIN IN 1 OUT ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 18 of this data sheet. COUT 1 mF Ceramic Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. 1 1 Publication Order Number: NCP707/D NCP707 IN ENABLE LOGIC EN THERMAL SHUTDOWN VOLTAGE REFERENCE MOSFET DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE* EN GND *Active output discharge function is present only in NCP707AMXyyyTCG devices. yyy denotes the particular VOUT option. Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this pin to ground to assure stability. 2 GND Power supply ground. 3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 IN Input pin. A small 1 mF capacitor is needed from this pin to ground to assure stability. − EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC ∞ s TJ(MAX) 150 °C TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Input Voltage (Note 1) Maximum Junction Temperature Storage Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Machine Model tested per EIA/JESD22−A115 Latchup Current Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Rating Thermal Characteristics, XDFN4 1x1 mm Thermal Resistance, Junction−to−Air 3. Single component mounted on 2 oz, FR4 PCB with 100 mm2 Cu area. http://onsemi.com 2 Symbol Value Unit RqJA 250 °C/W NCP707 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.5 V or 1.9 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 1 mF, unless otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +125°C respectively (Note 4). Symbol Min Max Unit VIN 1.9 5.5 V VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 0 − 200 mA VOUT −2 +2 % Line Regulation VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA RegLINE 400 mV/V Load Regulation IOUT = 0 mA to 200 mA RegLOAD 10 mV/mA IOUT = 1 mA to 200 mA or 200 mA to 1 mA in 1 ms, COUT = 1 mF TranLOAD 75 mV Parameter Test Conditions Operating Input Voltage Load Transient Dropout voltage (Note 5) Output Current Limit VOUT = 1.5 V 415 490 VOUT = 1.8 V 221 380 VOUT = 1.85 V 218 370 118 175 114 170 VOUT = 3.0 V 111 165 VOUT = 3.1 V 107 160 VOUT = 3.3 V 100 150 379 500 mA 35 mA VOUT = 2.8 V IOUT = 200 mA Typ VOUT = 2.85 V VOUT = 90% VOUT(nom) VDO ICL 250 mV IOUT = 0 mA IQ 25 IOUT = 2 mA IGND 105 mA IOUT = 200 mA IGND 240 mA Shutdown Current VEN ≤ 0.4 V, VIN = 5.5 V IDIS 0.01 EN Pin Threshold Voltage High Threshold Low Threshold VEN Voltage increasing VEN Voltage decreasing VEN_HI VEN_LO VEN = 5.5 V IEN Turn−on Time COUT = 1.0 mF, From assertion of VEN to 98% VOUT(NOM) tON Power Supply Rejection Ratio VIN = 3.6 V, VOUT = 3.1 V IOUT = 150 mA Ground Current EN Pin Input Current f = 100 Hz f = 1 kHz f = 10 kHz 1 mA V 0.9 0.4 180 200 500 nA ms PSRR 58 70 55 dB Output Noise Voltage VOUT = 3.1 V, VIN = 3.6 V, IOUT = 200 mA f = 100 Hz to 100 kHz VN 22 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Temperature falling from TSD TSDH 20 °C VEN < 0.4 V, Version A only RDIS 1.2 kW Thermal Shutdown Hysteresis Active Output Discharge Resistance 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V. http://onsemi.com 3 1.510 1.860 1.505 1.855 1.500 IOUT = 10 mA 1.495 IOUT 1.490 CIN = COUT = 1 mF VIN = 2.0 V VOUT(NOM) = 1.5 V 1.485 1.480 −40 −20 0 20 40 60 80 100 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) NCP707 IOUT = 10 mA 1.850 IOUT = 200 mA 1.845 1.840 CIN = COUT = 1 mF VIN = 2.35 V VOUT(NOM) = 1.85 V 1.835 120 140 1.830 −40 −20 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.995 2.855 IOUT = 10 mA 2.850 IOUT = 200 mA 2.845 −20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) 120 140 100 120 140 IOUT = 200 mA 2.985 2.980 2.975 2.970 −40 CIN = COUT = 1 mF VIN = 3.5 V VOUT(NOM) = 3.0 V −20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) 120 140 Figure 6. Output Voltage vs. Temperature VOUT = 3.0 V 3.110 3.300 CIN = COUT = 1 mF VIN = 3.6 V VOUT(NOM) = 3.1 V 3.100 3.295 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 80 IOUT = 10 mA 2.990 Figure 5. Output Voltage vs. Temperature VOUT = 2.85 V IOUT = 10 mA IOUT = 200 mA 3.095 3.090 3.085 3.080 −40 60 3.000 CIN = COUT = 1 mF VIN = 3.35 V VOUT(NOM) = 2.85 V 2.860 3.105 40 Figure 4. Output Voltage vs. Temperature VOUT = 1.85 V 2.870 2.840 −40 20 JUNCTION TEMPERATURE (°C) JUNCTION TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature VOUT = 1.5 V 2.865 0 −20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) 120 140 3.290 IOUT = 10 mA 3.285 IOUT = 200 mA 3.280 CIN = COUT = 1 mF VIN = 3.8 V VOUT(NOM) = 3.3 V 3.275 3.270 −40 Figure 7. Output Voltage vs. Temperature VOUT = 3.1 V −20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) 120 140 Figure 8. Output Voltage vs. Temperature VOUT = 3.3 V http://onsemi.com 4 NCP707 35 30 TA = 125°C 25 TA = 25°C 20 TA = −40°C QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) 35 15 10 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 1.5 V 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 25 TA = 25°C TA = −40°C 20 15 10 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 1.8 V 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 9. Quiescent Current vs. Input Voltage VOUT = 1.5 V Figure 10. Quiescent Current vs. Input Voltage VOUT = 1.8 V 35 30 TA = 125°C QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) TA = 125°C 5.5 35 TA = 25°C TA = −40°C 25 20 15 10 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 2.8 V 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 30 TA = 125°C TA = 25°C 25 TA = −40°C 20 15 10 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.0 V 5 0 5.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 11. Quiescent Current vs. Input Voltage VOUT = 2.8 V Figure 12. Quiescent Current vs. Input Voltage VOUT = 3.0 V 35 35 30 TA = 125°C 25 QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) 30 TA = 25°C TA = −40°C 20 15 10 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.1 V 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.3 V 30 25 TA = 125°C TA = 25°C TA = −40°C 20 15 10 5 0 5.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 13. Quiescent Current vs. Input Voltage VOUT = 3.1 V Figure 14. Quiescent Current vs. Input Voltage VOUT = 3.3 V http://onsemi.com 5 2.00 2.00 1.75 1.75 1.50 1.50 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) NCP707 1.25 1.00 0.75 TA = 125°C 0.50 TA = 25°C 0.25 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 1.5 V TA = −40°C 0.00 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 1.00 TA = 125°C 0.75 TA = 25°C 0.50 0.00 5.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 15. Output Voltage vs. Input Voltage VOUT = 1.5 V Figure 16. Output Voltage vs. Input Voltage VOUT = 1.8 V 5.5 3.50 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 2.8 V 2.50 2.00 1.50 TA = 125°C 1.00 TA = 25°C 0.50 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.0 V 3.00 OUTPUT VOLTAGE (V) 3.00 2.50 2.00 1.50 TA = 125°C 1.00 TA = 25°C 0.50 TA = −40°C 0.00 TA = −40°C 0.00 0 0.5 1 1.5 2 2.5 3 3.5 4 INPUT VOLTAGE (V) 4.5 5 5.5 0 Figure 17. Output Voltage vs. Input Voltage VOUT = 2.8 V 0.5 1 1.5 2 2.5 3 3.5 4 INPUT VOLTAGE (V) 4.5 5 5.5 Figure 18. Output Voltage vs. Input Voltage VOUT = 3.0 V 4.00 3.50 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.1 V 2.50 2.00 1.50 TA = 125°C 1.00 TA = 25°C 0.50 CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 3.3 V 3.50 OUTPUT VOLTAGE (V) 3.00 OUTPUT VOLTAGE (V) CIN = COUT = 1 mF IOUT = 0 mA VOUT(NOM) = 1.8 V TA = −40°C 0.25 3.50 OUTPUT VOLTAGE (V) 1.25 3.00 2.50 2.00 1.50 TA = 125°C 1.00 TA = 25°C 0.50 TA = −40°C 0.00 TA = −40°C 0.00 0 0.5 1 1.5 2 2.5 3 3.5 4 INPUT VOLTAGE (V) 4.5 5 0 5.5 Figure 19. Output Voltage vs. Input Voltage VOUT = 3.1 V 0.5 1 1.5 2 2.5 3 3.5 4 INPUT VOLTAGE (V) 4.5 5 Figure 20. Output Voltage vs. Input Voltage VOUT = 3.3 V http://onsemi.com 6 5.5 NCP707 0.7 0.5 0.4 TA = 125°C 0.3 0.2 TA = 25°C TA = −40°C 0.1 0 0 0.04 0.08 0.35 0.30 0.25 0.20 TA = 125°C 0.15 0.10 TA = 25°C 0.05 0.12 0.16 0 0.2 TA = −40°C 0 0.12 0.16 0.2 OUTPUT CURRENT (A) Figure 22. Dropout Voltage vs. Output Current VOUT = 1.85 V 0.200 DROPOUT VOLTAGE (V) 0.125 0.100 TA = 125°C 0.075 0.050 TA = 25°C 0 0.04 0.08 0.12 0.150 0.125 0.100 0.075 TA = 125°C TA = 25°C 0.050 0.025 TA = −40°C 0.000 CIN = COUT = 1 mF VOUT(NOM) = 3.0 V 0.175 0.150 0.025 TA = −40°C 0.000 0.16 0 0.2 0.04 0.08 0.12 0.16 0.2 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 23. Dropout Voltage vs. Output Current VOUT = 2.8 V Figure 24. Dropout Voltage vs. Output Current VOUT = 3.0 V 0.200 0.200 CIN = COUT = 1 mF VOUT(NOM) = 3.1 V 0.150 0.125 0.100 TA = 125°C 0.075 TA = 25°C 0.050 0.025 0.04 0.08 0.12 0.150 0.125 0.100 TA = 125°C 0.075 0.050 TA = 25°C 0.025 TA = −40°C 0 CIN = COUT = 1 mF VOUT(NOM) = 3.3 V 0.175 DROPOUT VOLTAGE (V) 0.175 DROPOUT VOLTAGE (V) 0.08 OUTPUT CURRENT (A) CIN = COUT = 1 mF VOUT(NOM) = 2.8 V 0.175 0.000 0.04 Figure 21. Dropout Voltage vs. Output Current VOUT = 1.5 V 0.200 DROPOUT VOLTAGE (V) CIN = COUT = 1 mF VOUT(NOM) = 1.85 V 0.40 DROPOUT VOLTAGE (V) 0.6 DROPOUT VOLTAGE (V) 0.45 CIN = COUT = 1 mF VOUT(NOM) = 1.5 V TA = −40°C 0.000 0.16 0.2 0 OUTPUT CURRENT (A) 0.04 0.08 0.12 0.16 0.2 OUTPUT CURRENT (A) Figure 25. Dropout Voltage vs. Output Current VOUT = 3.1 V Figure 26. Dropout Voltage vs. Output Current VOUT = 3.3 V http://onsemi.com 7 NCP707 CIN = COUT = 1 mF VIN = 2.0 V VOUT(NOM) = 1.5 V OUTPUT CURRENT (mA) 420 400 Short−Circuit Current: IOUT for VOUT = 0 V 380 360 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 340 320 300 −40 −20 0 20 40 60 80 100 440 420 OUTPUT CURRENT (mA) 440 Short−Circuit Current: IOUT for VOUT = 0 V 400 380 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 360 340 CIN = COUT = 1 mF VIN = 2.35 V VOUT(NOM) = 1.85 V 320 300 −40 120 140 −20 JUNCTION TEMPERATURE (°C) 40 60 80 100 120 140 Figure 28. Short−Circuit Limit vs. Temperature VOUT = 1.85 V 440 440 420 Short−Circuit Current: IOUT for VOUT = 0 V 400 380 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 360 340 CIN = COUT = 1 mF VIN = 3.35 V VOUT(NOM) = 2.85 V 320 300 −40 −20 0 20 40 60 80 100 OUTPUT CURRENT (mA) 420 OUTPUT CURRENT (mA) 20 JUNCTION TEMPERATURE (°C) Figure 27. Short−Circuit Limit vs. Temperature VOUT = 1.5 V Short−Circuit Current: IOUT for VOUT = 0 V 400 380 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 360 340 CIN = COUT = 1 mF VIN = 3.5 V VOUT(NOM) = 3.0 V 320 300 −40 120 140 −20 JUNCTION TEMPERATURE (°C) 440 440 Short−Circuit Current: IOUT for VOUT = 0 V 400 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 360 CIN = COUT = 1 mF VIN = 3.6 V VOUT(NOM) = 3.1 V 340 320 −40 −20 0 20 40 60 80 100 OUTPUT CURRENT (mA) 460 380 20 40 60 80 100 120 140 Figure 30. Short−Circuit Limit vs. Temperature VOUT = 3.0 V 460 420 0 JUNCTION TEMPERATURE (°C) Figure 29. Short−Circuit Limit vs. Temperature VOUT = 2.85 V OUTPUT CURRENT (mA) 0 CIN = COUT = 1 mF VIN = 3.8 V VOUT(NOM) = 3.3 V 420 Short−Circuit Current: IOUT for VOUT = 0 V 400 380 Current Limit: IOUT for VOUT = VOUT(NOM) − 0.1 V 360 340 320 −40 120 140 −20 JUNCTION TEMPERATURE (°C) 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) Figure 31. Short−Circuit Limit vs. Temperature VOUT = 3.1 V Figure 32. Short−Circuit Limit vs. Temperature VOUT = 3.3 V http://onsemi.com 8 NCP707 LINE REGULATION (mV) 4.5 4.0 3.5 5.0 CIN = COUT = 1 mF VIN = 2.0 V to 5.5 V VOUT(NOM) = 1.5 V IOUT = 10 mA 4.5 LINE REGULATION (mV) 5.0 3.0 2.5 2.0 1.5 Line Regulation from VIN = 2 V to 5.5 V 1.0 0.5 0.0 −40 4.0 3.5 CIN = COUT = 1 mF VIN = 2.35 V to 5.5 V VOUT(NOM) = 1.85 V IOUT = 10 mA 3.0 2.5 2.0 1.5 Line Regulation from VIN = 2.35 V to 5.5 V 1.0 0.5 −20 0 20 40 60 80 100 0.0 −40 120 140 −20 JUNCTION TEMPERATURE (°C) 5.0 CIN = COUT = 1 mF VIN = 3.35 V to 5.5 V VOUT(NOM) = 2.85 V IOUT = 10 mA 4.5 LINE REGULATION (mV) LINE REGULATION (mV) 3.5 3.0 2.5 2.0 1.5 Line Regulation from VIN = 3.35 V to 5.5 V 1.0 0.5 0.0 −40 −20 0 20 40 60 80 100 3.5 100 120 140 3.5 CIN = COUT = 1 mF VIN = 3.5 V to 5.5 V VOUT(NOM) = 3.0 V IOUT = 10 mA 3.0 2.5 2.0 1.5 Line Regulation from VIN = 3.5 V to 5.5 V 1.0 −20 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) Figure 35. Line Regulation vs. Temperature VOUT = 2.85 V Figure 36. Line Regulation vs. Temperature VOUT = 3.0 V 5.0 CIN = COUT = 1 mF VIN = 3.6 V to 5.5 V VOUT(NOM) = 3.1 V IOUT = 10 mA 4.5 2.5 2.0 Line Regulation from VIN = 3.6 V to 5.5 V 1.0 0.5 0.0 −40 80 JUNCTION TEMPERATURE (°C) 3.0 1.5 4.0 0.0 −40 120 140 LINE REGULATION (mV) LINE REGULATION (mV) 4.0 60 0.5 5.0 4.5 40 Figure 34. Line Regulation vs. Temperature VOUT = 1.85 V 5.0 4.0 20 JUNCTION TEMPERATURE (°C) Figure 33. Line Regulation vs. Temperature VOUT = 1.5 V 4.5 0 4.0 3.5 CIN = COUT = 1 mF VIN = 3.8 V to 5.5 V VOUT(NOM) = 3.3 V IOUT = 10 mA 3.0 2.5 2.0 1.5 Line Regulation from VIN = 3.8 V to 5.5 V 1.0 0.5 −20 0 20 40 60 80 100 0.0 −40 120 140 −20 0 20 40 60 80 100 120 140 JUNCTION TEMPERATURE (°C) JUNCTION TEMPERATURE (°C) Figure 37. Line Regulation vs. Temperature VOUT = 3.1 V Figure 38. Line Regulation vs. Temperature VOUT = 3.3 V http://onsemi.com 9 NCP707 10 7 6 VOUT(NOM) = 1.5 V 5 4 3 VOUT(NOM) = 1.8 V 2 1 0 −40 300 GROUND CURRENT (mA) GROUND CURRENT (mA) 8 280 0 20 40 60 100 100 60 40 0 1 2 3 4 5 7 6 8 9 10 Figure 40. Ground Current vs. Output Current 100 CIN = COUT = 1 mF VIN = VOUT(NOM) + 0.5 V IOUT = 200 mA VOUT = 1.5 V VOUT = 3.3 V VOUT(NOM) = 1.5 V VOUT(NOM) = 1.85 V 10 UNSTABLE OPERATION 1 STABLE OPERATION 0.1 VOUT(NOM) = 3.3 V VOUT(NOM) = 2.85 V −20 0 20 40 60 80 100 0.01 120 140 100 0 200 300 JUNCTION TEMPERATURE (°C) OUTPUT CURRENT (mA) Figure 41. Ground Current vs. Temperature Figure 42. Stability vs. Output Capacitor ESR 100 80 90 70 80 IOUT = 1 mA 60 PSRR (dB) 40 30 100 1k 10k 100k 1M 40 10 0 10 10M IOUT = 10 mA 50 20 IOUT = 150 mA IOUT = 1 mA 60 30 COUT = 1 mF CIN = none, VIN = 2.0 V ± 50 mVAC VOUT(NOM) = 1.5 V IOUT = 150 mA 70 IOUT = 10 mA 50 0 10 TA = −40°C Figure 39. Load Regulation vs. Temperature 220 10 TA = 25°C 80 0 120 140 90 PSRR (dB) 120 OUTPUT CURRENT (mA) 240 20 TA = 125°C 140 JUNCTION TEMPERATURE (°C) 260 200 −40 80 160 20 VOUT(NOM) = 3.3 V −20 CIN = COUT = 1 mF VIN = VOUT(NOM) + 0.5 V 180 CAPACITOR ESR (W) LOAD REGULATION (mV) 9 200 CIN = COUT = 1 mF VIN = VOUT(NOM) + 0.5 V IOUT = 0 mA to 200 mA COUT = 1 mF CIN = none, VIN = 2.35 V ± 50 mVAC VOUT(NOM) = 1.85 V 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 43. PSRR vs. Frequency VOUT = 1.5 V Figure 44. PSRR vs. Frequency VOUT = 1.85 V http://onsemi.com 10 10M NCP707 100 90 90 80 80 70 IOUT = 150 mA PSRR (dB) 60 50 40 30 20 10 0 10 OUTPUT VOLTAGE NOISE (mV/rtHz) IOUT = 1 mA COUT = 1 mF CIN = none, VIN = 3.5 V ± 50 mVAC VOUT(NOM) = 3.0 V 100 1k 10k 100k 1M 0 10 10M COUT = 1 mF CIN = none, VIN = 3.6 V ± 50 mVAC VOUT(NOM) = 3.1 V 100 1k IOUT = 10 mA 10k 100k 1M FREQUENCY (Hz) Figure 46. PSRR vs. Frequency VOUT = 3.1 V IOUT = 10 mA IOUT = 200 mA 0.010 IOUT = 1 mA 100 1k 10k 100k 1M 10M CIN = COUT = 1 mF VIN = 3.6 V VOUT = 3.1 V MLCC, X7R 1206 size 1.000 IOUT = 10 mA 0.100 IOUT = 200 mA 0.010 IOUT = 1 mA 0.001 10 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 47. Output Noise Density vs. Frequency VOUT = 1.5 V Figure 48. Output Noise Density vs. Frequency VOUT = 3.1 V 0.35 0.9 TA = 125°C ENABLE CURRENT (mA) 0.25 0.2 TA = 25°C 0.15 TA = −40°C 0.1 CIN = COUT = 1 mF VIN = 2 V VOUT(NOM) = 1.5 V 0.05 0.5 1 1.5 2 2.5 3 VIN = 2 V CIN = COUT = 1 mF VOUT(NOM) = 1.5 V 0.85 0.3 ENABLE CURRENT (mA) 30 FREQUENCY (Hz) 0.100 0 40 Figure 45. PSRR vs. Frequency VOUT = 3.0 V 1.000 0 50 10 IOUT = 10 mA CIN = COUT = 1 mF VIN = 2.0 V VOUT = 1.5 V MLCC, X7R 1206 size 0.001 10 IOUT = 1 mA 60 20 OUTPUT VOLTAGE NOISE (mV/rtHz) PSRR (dB) 70 IOUT = 150 mA 3.5 4 4.5 5 0.8 VEN = Low to High 0.75 0.7 VEN = High to Low 0.65 0.6 0.55 0.5 −40 5.5 −20 0 20 40 60 80 100 120 140 ENABLE VOLTAGE (V) JUNCTION TEMPERATURE (°C) Figure 49. Enable Input Current vs. Enable Voltage Figure 50. Enable Threshold Voltage vs. Temperature http://onsemi.com 11 NCP707 300 CIN = COUT = 1 mF VIN = VOUT(NOM) + 0.5 V VEN = 0 V 0.16 280 VOUT TURN−ON TIME (ms) SHUTDOWN CURRENT (mA) 0.2 0.12 0.08 0.04 260 240 200 −20 0 20 40 60 80 100 VOUT = 1.5 V 180 160 140 120 0 −40 VOUT = 3.3 V 220 CIN = COUT = 1 mF VIN = VOUT(NOM) + 0.5 V VEN = Step from 0 V to 1 V / 1 ms 100 −40 120 140 −20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) JUNCTION TEMPERATURE (°C) Figure 51. Shutdown Current vs. Temperature Figure 52. VOUT Turn−on Time vs. Temperature http://onsemi.com 12 120 140 NCP707 50 mV/div IOUT VOUT IOUT VOUT 20 ms / div 20 ms / div Figure 53. Load Transient Response IOUT = 1 mA to 200 mA, COUT = 1 mF Figure 54. Load Transient Response IOUT = 1 mA to 200 mA, COUT = 4.7 mF IOUT 200 mA VIN = 3.6 V VOUT(nom) = 3.1 V CIN = COUT = 4.7 mF 10 mA 30 mV/div 100 mA / div 10 mA 100 mA / div VIN = 3.6 V VOUT(nom) = 3.1 V CIN = COUT = 1 mF 200 mA 50 mV/div VOUT IOUT VOUT 10 ms / div 20 ms / div Figure 55. Load Transient Response IOUT = 10 mA to 200 mA, COUT = 1 mF Figure 56. Load Transient Response IOUT = 10 mA to 200 mA, COUT = 4.7 mF VIN = 2.3 V VOUT(nom) = 1.8 V CIN = COUT = 1 mF VOUT = 1.8 V 1 V/div 1 V/div 100 mA/div 1 mA 30 mV/div 100 mA / div 1 mA VIN = 3.6 V VOUT(nom) = 3.1 V CIN = COUT = 4.7 mF 200 mA 100 mA / div VIN = 3.6 V VOUT(nom) = 3.1 V CIN = COUT = 1 mF 200 mA VOUT = 0 V VOUT = 1.8 V RL = 1.8 kW RL = 180 kW VOUT = 0 V IIN = 1 mA IIN VEN = 1 V VIN = 2.3 V VOUT(nom) = 1.8 V CIN = COUT = 1 mF VEN = 1 V VEN = 0 V VEN = 0 V 500 ms / div 500 ms / div Figure 57. Enable Turn−On Response VOUT = 1.8 V, COUT = 1 mF Figure 58. Enable Turn−Off Response VOUT = 1.8 V, COUT = 1 mF http://onsemi.com 13 100 mA/div VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VOUT = 1.8 V 1 V/div 1 V/div NCP707 VOUT = 1.8 V RL = 1.8 kW RL = 180 kW VOUT = 0 V VOUT = 0 V IIN IIN = 1 mA VEN = 1 V VEN = 1 V VEN = 0 V VEN = 0 V 50 ms / div 500 ms / div VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF Figure 60. Enable Turn−Off Response VOUT = 3.3 V, COUT = 1 mF 500 mV/div Figure 59. Enable Turn−On Response VOUT = 3.3 V, COUT = 1 mF VIN = 2.3 V 500 mV/div VOUT = 1.8 V VOUT = 1.8 V VIN = 0 V VOUT = 0 V VIN = 0 V VOUT = 0 V IIN = 1 mA 2 ms / div Figure 61. Enable Turn−On Response VOUT = 1.8 V, COUT = 1 mF Figure 62. Enable Turn−Off Response VOUT = 1.8 V, COUT = 1 mF VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VIN = 3.8 V VIN = 0 V VOUT = 0 V 1 V/div VOUT = 3.3 V 1 V/div VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VIN = 2.3 V 500 ms / div 100 mA/div VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VIN = 3.8 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VIN = 3.8 V VOUT = 3.3 V VIN = 0 V VOUT = 0 V IIN = 1 mA Figure 63. Enable Turn−On Response VOUT = 3.3 V, COUT = 1 mF Figure 64. Enable Turn−Off Response VOUT = 3.3 V, COUT = 1 mF http://onsemi.com 14 NCP707 2 V/div VOUT = 3.3 V Output Short−Circuit VOUT = 0 V VOUT = 0 V VIN = 5.5 V VOUT(nom) = 3.3 V CIN = COUT = 1 mF VIN = 5.5 V VOUT(nom) = 1.5 V CIN = COUT = 1 mF 200 mA/div IOUT = 402 mA IOUT = 398 mA 200 mA/div 1 V/div Output Short−Circuit VOUT = 1.5 V IOUT = 1 mA 200 ms / div Figure 65. Short−Circuit Response VOUT = 1.5 V, COUT = 1 mF Figure 66. Short−Circuit Response VOUT = 1.5 V, COUT = 1 mF 1 V/div 200 ms / div VIN = 2.0 V VOUT(nom) = 1.5 V CIN = COUT = 1 mF VOUT = 1.5 V VOUT = 0 V Thermal Shutdown 200 mA/div IOUT = 398 mA IOUT = 1 mA 5 ms / div Figure 67. Short−Circuit Response VOUT = 1.5 V, COUT = 1 mF http://onsemi.com 15 NCP707 APPLICATIONS INFORMATION The NCP707 is a high performance, small package size, 200 mA LDO voltage regulator. This device delivers very good noise and dynamic performance. Thanks to its adaptive ground current feature the device consumes only 25 mA of quiescent current at no−load condition. The regulator features very*low noise of 22 mVRMS, PSRR of typ. 70dB at 1kHz and very good load/line transient response. The device is an ideal choice for space constrained portable applications. A logic EN input provides ON/OFF control of the output voltage. When the EN is low the device consumes as low as typ. 10 nA from the IN pin. The device is fully protected in case of output overload, output short circuit condition and overheating, assuring a very robust design. to GND through a 1.2 kW resistor. In the disable state the device consumes as low as typ. 10 nA from the VIN. If the EN pin voltage > 0.9 V the device is guaranteed to be enabled. The NCP707 regulates the output voltage and the active discharge transistor is turned*off. The EN pin has an internal pull−down current source with typ. value of 180 nA which assures that the device is turned−off when the EN pin is not connected. A build in 56 mV of hysteresis and deglitch time in the EN block prevents from periodic on/off oscillations that can occur due to noise on EN line. In the case that the EN function isn’t required the EN pin should be tied directly to IN. Reverse Current The PMOS pass transistor has an inherent body diode which will be forward biased in the case that VOUT > VIN. Due to this fact in cases where the extended reverse current condition is anticipated the device may require additional external protection. Input Capacitor Selection (CIN) It is recommended to connect a minimum of 1 μF Ceramic X5R or X7R capacitor close to the IN pin of the device. Larger input capacitors may be necessary if fast and large load transients are encountered in the application. There is no requirement for the min./max. ESR of the input capacitor but it is recommended to use ceramic capacitors for their low ESR and ESL. Output Current Limit Output Current is internally limited within the IC to a typical 379 mA. The NCP707 will source this amount of current measured with the output voltage 100 mV lower than the nominal VOUT. If the Output Voltage is directly shorted to ground (VOUT = 0 V), the short circuit protection will limit the output current to 390 mA (typ). The current limit and short circuit protection will work properly up to VIN =5.5 V at TA = 25°C. There is no limitation for the short circuit duration. Output Capacitor Selection (COUT) The NCP707 is designed to be stable with small 1.0 mF and larger ceramic capacitors on the output. The minimum effective output capacitance for which the LDO remains stable is 100 nF. The safety margin is provided to account for capacitance variations due to DC bias voltage, temperature, initial tolerance. There is no requirement for the minimum value of Equivalent Series Resistance (ESR) for the COUT but the maximum value of ESR should be less than 700 mΩ. Larger output capacitors could be used to improve the load transient response or high frequency PSRR characteristics. It is not recommended to use tantalum capacitors on the output due to their large ESR. The equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. The tantalum capacitors are generally more costly than ceramic capacitors. Thermal Shutdown When the die temperature exceeds the Thermal Shutdown threshold (TSD * 160°C typical), Thermal Shutdown event is detected and the device is disabled. The IC will remain in this state until the die temperature decreases below the Thermal Shutdown Reset threshold (TSDU − 140°C typical). Once the IC temperature falls below the 140°C the LDO is enabled again. The thermal shutdown feature provides protection from a catastrophic device failure due to accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Power Dissipation No−load Operation As power dissipated in the NCP707 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCP707 can handle is given by: The regulator remains stable and regulates the output voltage properly within the ±2% tolerance limits even with no external load applied to the output. Enable Operation The NCP707 uses the EN pin to enable/disable its output and to control the active discharge function. If the EN pin voltage is < 0.4 V the device is guaranteed to be disabled. The pass transistor is turned*off so that there is virtually no current flow between the IN and OUT. In case of the option equipped with active discharge − the active discharge transistor is turned−on and the output voltage VOUT is pulled P D(MAX) + http://onsemi.com 16 ƪ125 * T Aƫ q JA (eq. 1) NCP707 For reliable operation junction temperature should be limited to +125°C. The power dissipated by the NCP707 for given application conditions can be calculated as follows: P D(MAX) + V INI GND ) I OUTǒV IN * V OUTǓ point of load can easily approach 100 mW which will cause a 20 mV voltage drop at full load current, deteriorating the excellent load regulation. Line Regulation (eq. 2) The IC features very good line regulation of 0.4 mV/V measured from VIN = VOUT + 0.5 V to 5.5 V. Figure 68 shows the typical values of θJA vs. heat spreading area. Power Supply Rejection Ratio At low frequencies the PSRR is mainly determined by the feedback open−loop gain. At higher frequencies in the range 100 kHz – 10 MHz it can be tuned by the selection of COUT capacitor and proper PCB layout. Load Regulation The NCP707 features very good load regulation of typical 2 mV in the 0 mA to 200 mA range. In order to achieve this very good load regulation a special attention to PCB design is necessary. The trace resistance from the OUT pin to the 0,9 500 Theta JA curve with PCB cu thk 1,0 oz Power curve with PCB cu thk 2,0 oz 400 qJA (oC/W) 0,8 Theta JA curve with PCB cu thk 2,0 oz 0,7 Power curve with PCB cu thk 1,0 oz 350 0,6 300 0,5 250 0,4 200 0,3 150 0,2 100 0,1 50 0 100 200 300 400 500 600 PD(MAX) (W) 450 0 COPPER AREA (mm2) Figure 68. Thermal Parameters vs. Copper Area Output Noise voltage overshoots and assures monotonic ramp−up of the output voltage. The IC is designed for very−low output voltage noise. The typical noise performance of 22 mVRMS makes the device suitable for noise sensitive applications. PCB Layout Recommendations To obtain good transient performance and good regulation characteristics place CIN and COUT capacitors close to the device pins and make the PCB traces wide. In order to minimize the solution size use 0402 capacitors. Larger copper area connected to the pins will also improve the device thermal resistance. The actual power dissipation can be calculated by the formula given in Equation 2. Internal Soft Start The Internal Soft*Start circuitry will limit the inrush current during the LDO turn−on phase. Please refer to typical characteristics section for typical inrush current values. The soft*start function prevents from any output http://onsemi.com 17 NCP707 ORDERING INFORMATION Voltage Option Marking Marking Rotation NCP707AMX150TCG 1.5 V A 0° NCP707AMX180TCG 1.8 V D 0° NCP707AMX185TCG 1.85 V E 0° NCP707AMX280TCG 2.8 V F 0° NCP707AMX285TCG 2.85 V J 0° NCP707AMX300TCG 3.0 V K 0° NCP707AMX310TCG 3.1 V L 0° NCP707AMX330TCG 3.3 V P 0° NCP707BMX150TCG 1.5 V A 90° NCP707BMX180TCG 1.8 V D 90° NCP707BMX185TCG 1.85 V E 90° NCP707BMX280TCG 2.8 V F 90° NCP707BMX285TCG 2.85 V J 90° NCP707BMX300TCG 3.0 V K 90° NCP707BMX310TCG 3.1 V L 90° NCP707BMX330TCG 3.3 V P 90° Device Option Package Shipping† XDFN4 (Pb-Free) 3000 / Tape & Reel With active output discharge function Without active output discharge function †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 18 NCP707 PACKAGE DIMENSIONS XDFN4 1.0x1.0, 0.65P CASE 711AJ ISSUE O PIN ONE REFERENCE 2X 0.05 C 0.05 C 2X 4X A B D ÉÉ ÉÉ E 4X L2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM THE TERMINAL TIPS. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. b2 DETAIL A DIM A A1 A3 b b2 D D2 E e L L2 TOP VIEW (A3) 0.05 C A 0.05 C NOTE 4 A1 SIDE VIEW e DETAIL A e/2 1 4X 2 SEATING PLANE RECOMMENDED MOUNTING FOOTPRINT* L 2X 0.65 PITCH D2 45 5 C MILLIMETERS MIN MAX 0.33 0.43 0.00 0.05 0.10 REF 0.15 0.25 0.02 0.12 1.00 BSC 0.43 0.53 1.00 BSC 0.65 BSC 0.20 0.30 0.07 0.17 D2 4 PACKAGE OUTLINE 3 4X b 0.05 0.52 4X M BOTTOM VIEW 4X 0.39 0.11 1.20 C A B NOTE 3 4X 4X 0.24 0.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Bluetooth is a registered trademark of Bluetooth SIG. ZigBee is a registered trademark of ZigBee Alliance. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 19 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP707/D