SMA6F High junction temperature Transil™ Features ■ ECOPACK®2 compliant product ■ Peak pulse power: – 600 W (10/1000 µs) – 4 kW (8/20 µs) ■ Stand off voltage: 5, 12 or 13 V ■ Unidirectional type ■ Low clamping voltage versus standard series ■ Low leakage current, 0.2 µA at 25 °C ■ Operating Tj max: 175 °C ■ JEDEC registered package outline A K Unidirectional SMAflat Complies with the following standards ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) ■ MIL STD 883G-Method 3015-7: class3B – 25 kV (human body model) Description The SMA6F Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 600 W 10/1000 µs. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provides a better safety margin to protect sensitive circuits with extended life time expectancy. Packaged in SMAflat non exposed pad, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). September 2011 TM: Transil is a trademark of STMicroelectronics Doc ID 14996 Rev 2 1/9 www.st.com 9 Characteristics SMA6F 1 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Parameter Value Unit 600 W Peak pulse power dissipation (1) Tj initial = Tamb Power dissipation on infinite heatsink Tlead = 55 °C 6 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10 ms Tj initial = Tamb 60 A Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Value Unit 20 °C/W PPP P 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistance Symbol Rth (j-l) Table 3. Symbol Parameter Junction to leads Electrical characteristics - definitions (Tamb = 25 °C) Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop RD Dynamic resistance 2/9 I IF VF VCL VBR VRM IRM IR IPP Doc ID 14996 Rev 2 V SMA6F Characteristics Table 4. Electrical characteristics - values (Tamb = 25 °C) VBR @IR(1) IRM max@VRM Type 25 °C 85 °C µA (Max) min V typ max V VCL @IPP RD(2) VCL @IPP RD(2) 10/1000 µs 10/1000 µs 8/20 µs 8/20 µs αT(3) max max mA max V A Ω V A Ω 10-4/°C SMA6F5.0A 10 50 5.0 6.40 6.74 7.07 10 9.2 68 0.029 13.4 298 0.021 5.7 SMA6F12AVCL 0.2 1 12 13.2 13.7 14.3 1 18.5 31 0.135 22.9 157 0.055 7.8 SMA6F13A 0.2 1 13 14.4 15.2 15.9 1 20.4 29 0.154 23.9 147 0.054 8.3 1. Pulse test: tp <50ms. 2. To calculate maximum clamping voltage at other surge currents, use the following formula VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature, use the following formula: VBR @ Tj = VBR @ 25 °C x (1 + αT x (Tj - 25)) Figure 1. Definition of Ipp pulse %IPP Repetitive peak pulse current tr = rise time (µs) tp = pulse duration time (µs) 100 50 0 tr Figure 2. t tp Relative peak power dissipation versus initial junction temperature Figure 3. PPP[T j initial] / PPP[T j initial=25°C] Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) PPP(kW) 1.1 100.0 Tj initial = 25 °C 1.0 0.9 0.8 10.0 0.7 0.6 0.5 0.4 1.0 0.3 0.2 Tj initial (°C) 0.1 tp(ms) 0.0 0.1 0 25 50 75 100 125 150 175 200 1.0E-03 Doc ID 14996 Rev 2 1.0E-02 1.0E-01 1.0E+00 1.0E+01 3/9 Characteristics SMA6F Figure 4. 1000.0 Clamping voltage versus peak pulse current (exponential waveform, maximum values) IPP(A) Tj initial=25 °C SMA6F5.0A SMA6F12AVCL 100.0 SMA6F13A 10.0 1.0 tp = 8/20 µs tp = 10/1000 µs VCL(V) 0.1 5 Figure 5. 10 15 20 Junction capacitance versus reverse applied voltage (typical values) 10000 C(pF) F=1 MHz VOSC=30 mVRMS Tj=25 °C SMA6F5.0A 1000 SMA6F12AVCL SMA6F13A VR(V) 100 1 4/9 10 Doc ID 14996 Rev 2 100 25 SMA6F Figure 6. Characteristics Peak forward voltage drop versus peak forward current (typical values) Figure 7. IFM(A) 1.00 1.0E+02 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) On recommended pad layout. Printed circuit board, FR4 copper thickness = 35 µm copper surface = 1 cm² 1.0E+01 0.10 1.0E+00 Tj =125 °C Tj =25 °C 0.01 1.0E-01 VFM(V) tp(S) 1.0E-02 0.0 Figure 8. 0.5 1.0 1.5 2.0 Thermal resistance junction to ambient versus copper surface under each lead 0.00 1.0E-03 Figure 9. Rth(j-a)(°C/W) 1.E+04 200 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Leakage current versus junction temperature (typical values) IR(nA) Printed circuit board, FR4 copper thickness = 35 µm 180 160 1.E+03 140 VBR=11.7V 120 1.E+02 100 80 VBR>11.7V 60 1.E+01 40 20 SCU(cm2) VR=VRM Tj(°C) 1.E+00 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 25 Doc ID 14996 Rev 2 50 75 100 125 150 175 5/9 Ordering information scheme 2 SMA6F Ordering information scheme Figure 10. Ordering information scheme SM Surface mount Package A = SMAflat package Surge rating 6F = 600 W Stand off voltage example: 5.0 = 5.0 V Type A = Unidirectional Delivery mode TR = Tape and reel 6/9 Doc ID 14996 Rev 2 A 6F xx A - TR SMA6F 3 Package information Package information ● Case: JEDEC DO-221AC molded plastic over Planar junction ● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 ● Polarity: Band indicates cathode ● Flammability: Epoxy rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMAflat (non exposed pad) dimensions Dimensions Ref. A Min. Typ. Max. c D L 2x L1 2x E E1 L L2 2x b Millimeters Inches Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 0.50 0.019 L2 0.50 0.019 Figure 11. SMAflat footprint dimensions Figure 12. Marking information 5.52 (0.217) Cathode bar (unidirectional devices only ) 1.52 (0.060) x x x z y ww 1.20 (0.047) 3.12 (0.123) ECOPACK status XXX: Marking Z: Manufacturing location Y: Year WW: week 1.20 (0.047) millimeters (inches) Doc ID 14996 Rev 2 7/9 Ordering information 4 SMA6F Ordering information Table 6. Ordering information Order code Marking SMA6F5.0A-TR SUA SMA6F12AVCL SUJ SMA6F13A-TR SUG Package Weight SMAflat 0.035 g Base qty Delivery mode 10000 Tape and reel For the latest information on available order codes see the product pages on www.st.com. 5 Revision history Rev 2 Table 7. 8/9 Document revision history Date Revision Changes 04-Sep-2008 1 First issue. 01-Sep-2011 2 Updated order code in Table 6. 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