ETC UNR7231|UN7231

Transistors with built-in Resistor
UNR7231 (UN7231)
Silicon NPN epitaxial planar type
Unit: mm
4.5±0.1
1.6±0.2
1.5±0.1
3
2
0.5±0.08
1.5±0.1
■ Absolute Maximum Ratings Ta = 25°C
3˚
1
0.4±0.08
1.0+0.1
–0.2
• High forward current transfer ratio hFE
• Costs can be reduced through downsizing of the equipment and
reduction of the number of parts.
4.0+0.25
–0.20
■ Features
2.5±0.1
For low-frequency amplification
0.4±0.04
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
20
V
Collector-emitter voltage (Base open)
VCEO
20
V
Collector current
IC
0.7
A
Peak collector current
ICP
1.5
A
Total power dissipation *
PT
1.0
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Note) *: Printed circuit board: Copper foil area of 1 cm2 or more, and the
board thickness of 1.7 mm for the collector portion
0.4 max.
Parameter
2.6±0.1
3˚
45˚
3.0±0.15
1: Base
2: Collector
3: Emitter
MiniP3-F1 Package
Marking Symbol: IC
Internal Connection
R1(1 kΩ)
B
C
R2
(47 kΩ)
E
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
20
V
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
20
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 15 V, IE = 0
1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 15 V, IB = 0
10
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 14 V, IC = 0
0.5
mA
Forward current transfer ratio *
hFE
VCE = 10 V, IC = 150 mA
2 100

VCE(sat)
IC = 500 mA, IB = 5 mA
Collector-emitter saturation voltage
*
Input resistance
R1
Resistance ratio
R1/R2
Transition frequency
fT
Conditions
VCB = 20 V, IE = −20 mA, f = 200 MHz
Min
Typ
800
Max
Unit
0.4
V
0.7
1.0
1.3
kΩ
0.016
0.021
0.025
55

MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Note) The part number in the parenthesis shows conventional part number.
Publication date: January 2004
SJH00032BED
1
UNR7231
IC  VCE
1.2
Ta = 25°C
IB = 1.2 mA
1.0
1.2
Collector current IC (A)
Total power dissipation PT (W)
Copper foil area of 1cm2 or
more and thickness of
1.7mm for the collector
portion.
0.8
0.4
1.0 mA
0.8 mA
0.8
0.6 mA
0.6
0.4 mA
0.4
0.2 mA
0.2
0
0
0
40
80
120
160
0
Forward current transfer ratio hFE
VCE = 10 V
2 000
Ta = 75°C
1 600
25°C
1 200
−25°C
800
400
0
10−2
10−1
4
6
8
10
12
Cob  VCB
1
Collector current IC (A)
10
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
hFE  IC
2 400
2
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
2
VCE(sat)  IC
Collector-emitter saturation voltage VCE(sat) (V)
PT  Ta
1.6
30
25
20
15
10
5
0
10−1
1
10
Collector-base voltage VCB (V)
SJH00032BED
102
102
IC /IB = 100
10
1
Ta = 75°C
25°C
−25°C
10−1
10−2
10−2
10−1
1
Collector current IC (A)
10
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP