BB OPA654AM

®
OPA654
Wide Bandwidth, High Output Current
Difet ® OPERATIONAL AMPLIFIER
FEATURES
●
●
●
●
●
APPLICATIONS
HIGH SLEW RATE: 750V/µs
HIGH OUTPUT CURRENT: 200mA
WIDE GAIN-BANDWIDTH: 700MHz
FAST SETTLING: 150ns to 0.1%
FET INPUT: IB = 50pA max
● LINE DRIVERS
● PIN DRIVERS
● HIGH-SPEED DATA ACQUISITION
● WAVEFORM GENERATORS
DESCRIPTION
The OPA654 is a high-speed monolithic operational
amplifier featuring 200mA output current. Fabricated
using Burr-Brown’s Complementary-Bipolar, Difet process, it provides an excellent combination of high speed
and high output current.
The OPA654 is versatile, operating from power supplies ranging from ±5V to ±18V. It can deliver up to
±10V signals into a 50Ω load at slew rates of 750V/µs.
Its speed and output current make it useful for line
driver and automatic test applications.
VOS Trim
The OPA654 is externally compensated, allowing openloop gain and phase characteristics to be optimized for
the desired closed-loop gain, load and dynamic characteristics.
The OPA654 is available in an 8-pin metal TO-3
package that provides excellent thermal characteristics
and is specified for the industrial temperature range.
VOS Trim
V+
+In
–In
Thermal
Limit
V–
2Ω
Output
2Ω
Phase Compensation
Difet ®, Burr-Brown Corp.
International Airport Industrial Park • Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706
Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1990 Burr-Brown Corporation
PDS-1098B
Printed in U.S.A. October, 1993
SPECIFICATIONS
ELECTRICAL
TA = +25°C, VS = ±15V unless otherwise noted.
OPA654AM
PARAMETER
CONDITION
FREQUENCY RESPONSE
Gain-Bandwidth Product (2)
Slew Rate (2,3)
Settling Time (2) 0.01%
0.1%
1%
OFFSET VOLTAGE
Input Offset Voltage
Average Drift
Power Supply Rejection
INPUT BIAS CURRENT(1)
Input Bias Current
Input Offset Current
NOISE
Input Voltage Noise
Noise Density,
Voltage Noise,
Input Bias Current Noise
Current Noise Density, f = 0.1Hz to 20kHz
INPUT VOLTAGE RANGE
Common-Mode Input Range
Common-Mode Rejection
MIN
OUTPUT
Voltage Output
Current Output
Short Circuit Current
Output Resistance, Open-Loop
MAX
UNITS
G = –1, 20V Step
G = –1, 10V Step
G = –1, 10V Step
G = –1, 10V Step
See Typical Curve
750
240
150
85
±3
VS = ±5 to ±15V
±0.1
±40
82
mV
µV/°C
dB
VCM = 0V
VCM = 0V
3
2
50
25
pA
pA
f = 10Hz
f = 100Hz
f = 1kHz
f = 10kHz
fB = 10Hz to 1MHz
115
37
19
14
85
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
µVp-p
1
fA/√Hz
±13
76
V
dB
1012 || 2.5
1012 || 3.2
Ω || pF
Ω || pF
94
82
dB
dB
±12.3
200
325
800
V
mA
mA
Ω
72
±12
70
VCM = ±10V
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
TYP
VO = ±10V, RL = 1kΩ
VO = ±10V, RL = 50Ω
80
±11
RL = 50Ω
VO = ±10V
DC
POWER SUPPLY
Specified Operating Voltage
Operating Voltage Range
Quiescent Current
±5
TEMPERATURE RANGE
Specification
Operating
Storage
Thermal Resistance, θJC
θJA
±15
±38
–25
–55
–55
V/µs
ns
ns
ns
±18
±43
+85
+125
+150
15
45
V
V
mA
°C
°C
°C
°C/W
°C/W
NOTES: (1) High-speed test at TJ = 25°C. (2) Varies with external phase compensation, C1. See typical curves for performance with other gains and C1. (3) Slew rate
is rate of change from 10% to 90% of output voltage step.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
OPA654
2
PIN CONFIGURATION
"M" TO-3 Metal Package
PIN LIST
1. VO
2. V+
3. Compensation
4. VOS Trim
5. –In
6. +In
7. V–
8. VOS Trim
BOTTOM VIEW
V+
VOS
Trim
2
1
–In
3
5
2
4
4
5
8
7
+In
6
6
8
OPA654
1
VO
3
7
C1
Case is connected to IC substrate. Connect case to ground—see text.
V–
ABSOLUTE MAXIMUM RATINGS
PACKAGE INFORMATION(1)
Power Supply Voltage ........................................................................ ±18V
Input Voltage ................................................................................. ±Vs ±1V
Output Short Circuit (to ground) ........................................................... 10s
Operating Temperature ................................................... –55°C to +125°C
Storage Temperature ...................................................... –55°C to +150°C
Junction Temperature .................................................................... +165°C
Lead Temperature (soldering, 10s) ................................................ +300°C
MODEL
OPA654AM
PACKAGE
PACKAGE DRAWING
NUMBER
8-Pin Metal TO-3
030
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
ORDERING INFORMATION
MODEL
OPA654AM
PACKAGE
TEMPERATURE RANGE
8-Pin Metal TO-3
–25°C to +85°C
®
3
OPA654
TYPICAL PERFORMANCE CURVES
TA = +25°C, VS = ±15V unless otherwise noted.
40
20
0
120
C1 = 0.5pF,C 2 = 0pF
C1 = 0pF
OPA654AM
Open-Loop Voltage Gain (dB)
Voltage Gain (dB)
60
OPEN-LOOP GAIN vs FREQUENCY
CLOSED-LOOP GAIN vs FREQUENCY
80
G = 1000
C 1 = 1pF,C 2 = 0pF
G = 100
C 1 = 3pF,C2 = 0pF
G = 10
C 1 = 18pF,C2 = 30pF
G=1
–20
100k
C 1 = 0.5pF
80
C1 = 3pF
C 1 = 1pF
60
C1 = 18pF,C 2 = 30pF
40
20
0
1M
10M
100M
100
1k
10k
Frequency (Hz)
100k
1M
10M
100M
Frequency (Hz)
OPEN-LOOP PHASE vs FREQUENCY
SLEW RATE vs COMPENSATION CAPACITOR
45
1000
OPA654AM
R L = 100Ω
900
0
800
–45
Slew Rate (V/µs)
Phase (degrees)
OPA654AM
100
C1 = 0.5pF
C1 = 1pF
C1 = 3pF
C1 = 0
–90
C1 = 18pF,C 2 = 30pF
–135
700
600
500
400
300
200
–180
100
0
–225
100
1k
10k
100k
1M
10M
100M
0
Frequency (Hz)
5
10
15
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY
25
30
SETTLING TIME vs CLOSED-LOOP GAIN
2000
1000
R L = 100Ω
1800
1600
800
Settling Time (ns)
Output Resistance ( Ω)
20
C 1 Capacitance (pF)
C1 = 0pF
600
400
C1 = 3pF
200
1400
0.05%
1200
1000
800
600
400
1%
200
0
0
100
1k
10k
100k
1M
10M
1
100M
®
OPA654
10
100
Gain (V/V)
Frequency (Hz)
4
1000
TYPICAL PERFORMANCE CURVES (CONT)
TA = +25°C, VS = ±15V unless otherwise noted.
OUTPUT VOLTAGE vs OUTPUT CURRENT
OUTPUT VOLTAGE vs FREQUENCY
Output Voltage (Vp-p)
25
40
VS = ±18V
RL = 100 Ω
VS = ±15V
Output Voltage (Vp-p)
30
20
VS = ±12V
15
C1 = 0pF
C1 = 20pF
C1 = 5pF
10
5
C1 = 10pF
V S = ±5V
35
VS = ±18V
30
VS = ±15V
25
VS = ±12V
20
15
VS = ±5V
10
5
0
0
100k
1M
10M
100M
0
50
Frequency (Hz)
200
250
300
350
400
INPUT BIAS CURRENT vs TEMPERATURE
INPUT BIAS CURRENT
1000
Normalized Input Bias Current
Normalized Input Bias Current
150
Output Current (mA)
1000
100
10
1
0.1
0.01
0.001
100
10
IB
1
IOS Relative
to I B
0.1
0.01
0.001
–15
–10
–5
0
+5
Input Voltage (V)
+10
–55
+15
+5
+35
+65
+95
+125
QUIESCENT CURRENT vs POWER SUPPLY VOLTAGE
INPUT VOLTAGE NOISE SPECTRAL DENSITY
50
45
Quiescent Current (mA)
10,000
1,000
100
10
40
TA = –25°C
35
TA = +85°C
30
TA = +25°C
25
1
0.1
0.01
–25
Temperature (°C)
100,000
Input Noise Voltage (nV/ Hz)
100
20
0.1
1
10
100
1k
±5
10k 100k 1M 10M 100M
±10
±15
±20
Supply Voltage (±V)
Frequency (Hz)
®
5
OPA654
TYPICAL PERFORMANCE CURVES (CONT)
TA = +25°C, VS = ±15V unless otherwise noted.
MAXIMUM POWER DISSIPATION vs TEMPERATURE
7
400
6
Internal Dissipation (W)
± Current Limit (mA)
OUTPUT CURRENT LIMIT vs TEMPERATURE
450
350
300
250
OPA654AM
Metal TO-3
For case Temp
θJC =15°C/W
5
4
3
2
200
For ambient Temp
θ JA = 45°C/W
1
150
0
–55
–25
+5
+35
+65
+95
+125
0
25
50
Temperature (°C)
75
100
125
CIRCUIT LAYOUT
With any wide-bandwidth circuitry, careful circuit layout
will ensure best performance. Make short, direct circuit
interconnections and avoid stray wiring capacitance—especially at the inverting input pin. A component-side ground
plane will help ensure low ground impedance. Do not place
the ground plane under or near the inputs and feedback
network.
these sensitive nodes, making the type and location of the
potentiometer less critical. This also reduces the trim range,
providing more adjustment resolution. Do not use an offset
voltage adjustment to correct for offsets produced in other
circuitry since this can introduce large offset voltage drift.
COMPENSATION
The OPA654 uses external compensation capacitors. This
tailors the open-loop response characteristics to the application. Its effect can be seen in the open-loop gain and phase
curves.
Power supplies should be bypassed with good high-frequency capacitors positioned close to the op amp pins. In
most cases, a 2.2µF solid tantalum capacitor for each power
supply is adequate. The OPA654 can deliver load currents
up to 200mA. Even if steady-state load currents are lower,
signal transients may demand large current transients from
the power supplies. It is the power supply bypass capacitors
which must supply these current transients. Larger bypass
capacitors such as 10µF solid tantalum capacitors may
improve dynamic performance in these applications.
V+
V+
50k Ω to
100kΩ
10k Ω to
100kΩ
2.2kΩ
CASE CONNECTION
The case of the TO-3 metal package should be connected to
ground. Failure to connect the case to ground will not
damage the device but will degrade its AC performance. The
case is internally connected to the substrate of the
dielectrically isolated IC. This substrate is DC-neutral—it is
not connected to the V– power supply as it would be with
most analog ICs. In principle, it could be connected to any
AC ground potential such as one of the power supplies, but
DC ground is usually most convenient. Do not connect the
case to DC potentials which exceed the power supply voltages, ±VS.
4
5
2.2kΩ
4
5
8
1
6
Trim Range ~
~ ±100mV
(a)
8
1
6
Trim Range ~ ±20mV
(b)
FIGURE 1. Optional Offset Voltage Trim Circuits.
Figures 2 shows typical capacitor values for various closedloop gains. This chart should be considered a starting point
for optimizing an application. Many variables including
circuit layout, source and load characteristics, and desired
dynamic behavior will affect the optimum capacitor values.
Capacitive loads change op amp behavior and higher compensation capacitor values are generally required. Resistor
RS, shown in Figure 3, can improve the ability to drive a
capacitive load. Typical values for RS range from 5Ω to
50Ω, depending on the load and how much voltage drop can
be tolerated.
OFFSET ADJUSTMENT
Many applications require no external offset voltage adjustment. Figure 1a shows connection of an optional offset
voltage trimming potentiometer. Use a small, non-inductive
potentiometer with short connections to the trim pins. Avoid
stray capacitance from the input or output nodes. The added
resistors in Figure 1b help decouple the potentiometer from
®
OPA654
150
Temperature (°C)
6
R1
R2
R2
R1
5
6
OPA654
1
Comp
50 Ω
Termination
50 Ω
Termination
RL
100Ω
3
C2
5
VOUT
6
1
OPA654
Comp
3
C1
C2
VOUT
RL
100Ω
C1
CLOSED-LOOP
GAIN
C1
C2
R1
R2
CLOSED-LOOP
GAIN
C1
C2
R1
R2
+1000
+100
+10
+1
0.5pF
1pF
3pF
18pF
0
0
0
30pF
10Ω
100Ω
100Ω
—
10kΩ
10kΩ
900Ω
0
–1000
–100
–10
–1
0.5pF
1pF
3pF
18pF
0
0
0
20pF
10Ω
100Ω
100Ω
1kΩ
10kΩ
10kΩ
1kΩ
1kΩ
G = –10 SMALL-SIGNAL RESPONSE, RL =100Ω
G = +10 SMALL-SIGNAL RESPONSE, RL =100Ω
+200
VOUT (mV)
VOUT (mV)
+200
0
FPO
–200
0
FPO
–200
G = +10 LARGE-SIGNAL RESPONSE, RL =100Ω
G = –10 LARGE-SIGNAL RESPONSE, RL =100Ω
+10
VOUT (V)
VOUT (V)
+10
0
0
FPO
FPO
–10
–10
FIGURE 2. Basic Amplifier Circuits.
®
7
OPA654
Figure 3 also demonstrates a compensation technique using
an additional network, R3-C3. This allows use of a smaller
value for C1, producing a corresponding increase in slew
rate. It reduces the high frequency loop gain by placing the
op amp in a higher noise gain at high frequency. This
technique improves large-signal response at the sacrifice of
small-signal behavior. Settling time is increased and high
frequency noise performance will be somewhat degraded.
1000pF
470Ω
470Ω
5
6
OPA654
1
Comp
50 Ω
R TERM
G = +1
10Ω
VOUT
RL
100Ω
3
C1
7pF
2pF
R2
2k Ω
R3
680Ω
C3
1000pF
5
6
G = +1 LARGE-SIGNAL RESPONSE, RL =100Ω
2k Ω
OPA654
3
1
RS
G = –1
VOUT
+10
RL
100Ω
Comp
VOUT (V)
R1
VI
C1
3pF
RS = 5Ω to 50Ω
(see text)
0
–10
FPO
FIGURE 3. High Slew Rate Compensation Circuit.
Figure 4 shows an alternative compensation network for
unity gain. This technique provides a small amount of
positive feedback, reducing the net negative feedback factor.
Large signal response and load driving capability is improved with this approach.
The compensation for a given application can be evaluated
by observing amplifier pulse response. Both small-signal
and large-signal response should be checked to assure that
both are acceptable. Large overshoot or many cycles of
ringing in the small-signal response is a sign of instability
and the circuit may require further optimization. Good
practice dictates a somewhat conservative approach to allow
for device-to-device variation.
FIGURE 4. G = +1 Amplifier with Alternative Compensation.
The OPA654 may be operated at reduced power supply
voltage, thus reducing internal power dissipation. This can
eliminate the need for heat sinking in some applications.
OUTPUT CURRENT LIMIT
Output current is limited by internal circuitry to approximately 325mA at 25°C. The limit current decreases with
increasing junction temperature as shown in the typical
curves. The combination of current limit and thermal limit
protects the device from short circuits to ground.
POWER DISSIPATION
Many applications do not require an external heat sink.
However, with high ambient temperature or heavy load
conditions, a heat sink may be required. The heat sink should
be electrically connected to ground—see “Connections to
Case”. Operate within the power derating curve (Maximum
Power Dissipation vs Temperature) shown in the typical
performance curve section.
Exceeding the maximum die temperature of 165°C may
activate the internal thermal limit circuitry, disabling the
output stage. This thermal limit is set for a junction temperature of approximately 185°C.
INPUT BIAS CURRENT
The OPA654 is fabricated with Burr-Brown’s dielectrically
isolated Difet process, giving it very low input bias current.
Like other FET amplifiers, input bias current doubles for
every 10°C increase in junction temperature. This increase
can be minimized by providing a heat sink and, if possible,
operating with reduced power supply voltage to minimize
power dissipation.
®
OPA654
8