FMS Chip Silicon Rectifier FM4003 Glass passivated type Features PATENT PUBLICATION NO. 37116 0.185(4.8) 0.177(4.4) Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.012(0.3) Typ. 0.110(2.8) 0.094(2.4) For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 0.165(4.2) 0.150(3.8) Low leakage current. 0.067(1.7) 0.060(1.5) 0.040(1.0) Typ. 0.040 (1.0) Typ. Mechanical data SMA Case : Molded plastic, JEDEC DO-214AC Terminals : Solder plated, s olderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting Position : Any Weight : 0.0015 ounce, 0.05 gr am MARKING CODE : A3 MAXIMUM RATINGS (AT TA=25oC unless otherwise noted) MAX. UNIT Repetitive peak reverse voltage PARAMETER CONDITIONS Symbol VRRM 200 V RMS voltage VRMS 140 V VR 200 V IO 1.0 A A Continuous reverse voltage o MIN. TYP. Forward rectified current Lead temperature = 70 C Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) IFSM 30 Thermal resistance Junction to ambient RqJA 100 Diode junction capacitance f=1MHz and applied 4vDC reverse voltage Operating temperature Storage temperature CJ 15 o C / w pF TJ -55 +150 o C TSTG -55 +150 o C ELECTRICAL CHARACTERISTICS (AT TA=25oC unless otherwise noted) PARAMETER Forward voltage Reverse current CONDITIONS Symbol IF = 1.0 AMPERE DC VR = Peak reverse voltage TA = VF o 25 C VR = Peak reverse voltage TA = 125oC IR MIN. TYP. MAX. UNIT 1.10 V 5 uA 50 uA