FM820-T1 thru FM860-T1 SILICON EPITAXIAL PLANCE TYPE SMC-T1 0.283(7.2) 0.260(6.6) 0.012(0.3) Typ . 0.189(4.8) 0.165(4.2) 0.152(3.8 ) 0.144(3.6 ) 0.224(5.6) 0.208(5.2) 0.098(2.5) 0.075(1.9) 0.032(0.8 ) Typ . 0.040(1.0 ) Typ . 0.040(1.0 ) Typ . Dimensions in inches and (millimeters) FEATURES MECHANICAL DATA Plastic package has Underwriters Laboratory Flammability classification 94V-0 Utilizing Fame Retardant Epoxy Molding Compound For surface mount applications Exceeds environmental standards of MIL-S-19500/228 Low leakage current. Case Molded plastic, DO-214AB/SMC-T1 Terminals Solder plated, solderable per MIL-STD-750, Method 2026 Polarity Indicated by cathode band Mounting Position Any Weight 0.195grams MAXIMUM RATINGS (at TA=25 C unless otherwise noted) o PARAMETER CONDITIONS SYMBOL Forward rectified current See Fig.1 Forward surge current 8.3ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method) Reverse current Thermal resistance Max. UNITS 8.0 A IFSM 150 A 0.5 mA VR=VRRM TA=250C IR 0 VR=VRRM TA=100 C Junction to ambient Diode junction capacitance F=1MHz and applied 4vDC reverse voltage Storage temperature RJA 55 CJ 700 TSTG *1 50 *2 -55 *3 SYMBOLS MARKING CODE VRRM (V) VRMS (V) VR (V) FM820-T1 SS82 20 14 20 FM830-T1 SS83 30 21 30 FM840-T1 SS84 40 28 40 FM850-T1 SS85 50 35 50 FM860-T1 SS86 60 42 60 *1 Repetitive peak reverse peak reverse *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage www.paceleader.tw Typ. IO Min. 1 C/W pF +150 *4 VF (V) mA 0 0 Operating Temperature (0C) 0.5 -55 to + 125 0.7 C FM820-T1 thru FM860-T1 SILICON EPITAXIAL PLANCE TYPE RATING AND CHARACTERISTICS CURVES FM820-T1 THRU FM860-T1 www.paceleader.tw 2