2SA1337 Silicon PNP Epitaxial Application • Low frequency low noise amplifier • HF amplefier Outline SPAK 1 23 1. Emitter 2. Collector 3. Base 2SA1337 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to base voltage VCBO –55 V Collector to emitter voltage VCEO –50 V Emitter to base voltage VEBO –5 V Collector current IC –100 mA Collector power dissipation PC 300 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Collector to base breakdown voltage V(BR)CBO –55 — — V I C = –10 µA, IE = 0 Collector to emitter breakdown V(BR)CEO voltage –50 — — V I C = –1 mA, RBE = ∞ Emitter to base breakdown voltage V(BR)EBO –5 — — V I E = –10 µA, IC = 0 Collector cutoff current I CBO — — –0.5 µA VCB = –18 V, IE = 0 Emitter cutoff current I EBO — — –0.5 µA VEB = –2 V, IC = 0 100 — 320 1 DC current transfer ratio hFE* Base to emitter voltage VBE — — –0.75 V VCE = –12 V, IC = –2 mA Collector to emitter saturation voltage VCE(sat) — — –0.2 V I C = –10 mA, IB = –1 mA Gain bandwidth product fT — 200 — MHz VCE = –12 V, IC = –2 mA Collector output capacitance Cob — — 4.5 pF VCB = –10 V, IE = 0, f = 1 MHz Noise figure NF — 1.0 5.0 dB VCE = –6 V, IC = –0.1 mA, Rg = 1 kΩ, f = 1 kHz Note: 1. The 2SA1337 is grouped by hFE as follows. B C 100 to 200 160 to 320 See characteristic curves of 2SA1031. 2 VCE = –12 V, IC = –2 mA 2SA1337 Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 300 200 100 0 100 150 50 Ambient Temperature Ta (°C) 3 Unit: mm 2.2 Max 0.6 0.6 Max 0.45 ± 0.1 14.5 Min 1.8 Max 3.2 Max 4.2 Max 0.4 ± 0.1 1.27 1.27 2.54 Hitachi Code JEDEC EIAJ Weight (reference value) SPAK — — 0.10 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. 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